Diebold Nixdorf BEETLE M1350 Operating instructions

S Motherboard (with UEFI BIOS)

Operator Manual

01750346115 C

Customer/Partner Use

This document is property of Diebold Nixdorf and is intended for customer/partner use. A written

license agreement with Diebold Nixdorf is not required to use this material.

Table of Contents

1 Symbols ...................................................................................................................................... 1-1

2 Important notes.......................................................................................................................... 2-1

3 Warranty ..................................................................................................................................... 3-1

4 ESD (Electrostatic Sensitive Devices) ..................................................................................... 4-1

5 Specifications of Sx-Motherboard............................................................................................ 5-1

6 Motherboard Variants................................................................................................................ 6-1

6.1 Sx Motherboard ................................................................................................................. 6-1

6.1.1 Front view ........................................................................................................... 6-1

6.1.2 Back view............................................................................................................ 6-2

7 Block diagram ............................................................................................................................ 7-1

7.1 Sx-Motherboard................................................................................................................. 7-1

8 Central Processing Unit ............................................................................................................ 8-1

8.1 System Memory................................................................................................................. 8-2

8.2 Jumpers............................................................................................................................. 8-3

8.3 Connectors ........................................................................................................................ 8-5

8.3.1 Rear Panel Connectors ...................................................................................... 8-5

8.3.2 Internal Connectors ............................................................................................ 8-6

8.4 RAID .................................................................................................................................. 8-11

8.5 Enabling of RAID1 setting in BIOS .................................................................................... 8-12

9 BIOS Setup Program ................................................................................................................. 9-1

9.1 Entering BIOS Setup at startup ......................................................................................... 9-1

9.2 Entering BIOS Setup after POST ...................................................................................... 9-1

9.3 Self-Recovering BIOS (after BIOS Update)....................................................................... 9-1

9.3.1 How does the Self-Recovering BIOS work? ....................................................... 9-1

9.4 BIOS Menu Screen............................................................................................................ 9-2

10 Information ................................................................................................................................. 10-1

11 Main............................................................................................................................................. 11-1

12 Advanced.................................................................................................................................... 12-1

12.1 CPU Configuration............................................................................................................. 12-3

12.2 Power & Performance........................................................................................................ 12-4

12.2.1 CPU-Power Management Control ...................................................................... 12-5

12.2.1.1 View/Configure Turbo Options ........................................................ 12-7

12.2.1.2 Config TDP Configurations.............................................................. 12-9

12.2.1.3 CPU VR Settings............................................................................. 12-12

12.2.1.4 Power Limit 3 Settings..................................................................... 12-13

12.3 SATA And RST Configuration ........................................................................................... 12-14

12.3.1 Software Feature Mask Configuration ................................................................ 12-16

12.4 Graphics Configuration...................................................................................................... 12-17

12.5 PCH-FW Configuration...................................................................................................... 12-18

01750346115 C

ii

Table of Contents

12.5.1 Firmware Update Configuration.......................................................................... 12-19

12.5.2 PTT Configuration............................................................................................... 12-20

12.6 Thermal Configuration ....................................................................................................... 12-21

12.6.1 CPU Thermal Configuration................................................................................ 12-22

12.7 AMT Configuration............................................................................................................. 12-24

12.7.1 CIRA Configuration............................................................................................. 12-25

12.7.2 ASF Configuration .............................................................................................. 12-26

12.7.3 Secure Erase Configuration................................................................................ 12-27

12.7.4 OEM Flags Settings............................................................................................ 12-28

12.7.5 MEBx Resolution Settings .................................................................................. 12-29

12.8 Trusted Computing ............................................................................................................ 12-30

12.9 Super IO Configuration...................................................................................................... 12-32

12.9.1 Serial Port 1 Configuration.................................................................................. 12-33

12.9.2 Serial Port 2 Configuration.................................................................................. 12-34

12.9.3 Serial Port 3 Configuration.................................................................................. 12-35

12.10 USB Configuration............................................................................................................. 12-36

12.11 CSM Configuration ............................................................................................................ 12-37

12.12 NVMe Configuration .......................................................................................................... 12-38

12.13 Wifi/Bluetooth Configuration .............................................................................................. 12-39

12.14 Network Stack Configuration ............................................................................................. 12-40

13 Chipset........................................................................................................................................ 13-1

13.1 System Agent (SA) Configuration...................................................................................... 13-2

13.1.1 Memory Configuration ........................................................................................ 13-3

13.2 PCH-IO Configuration........................................................................................................ 13-4

13.2.1 USB Configuration .............................................................................................. 13-5

13.2.2 Security Configuration ........................................................................................ 13-6

13.3 MCU Configuration ............................................................................................................ 13-7

13.4 Multi IO HUB Configuration ............................................................................................... 13-9

13.5 POS Port Configuration ..................................................................................................... 13-10

14 PC Health .................................................................................................................................... 14-1

15 Power .......................................................................................................................................... 15-1

16 Security....................................................................................................................................... 16-1

16.1 Secure Boot....................................................................................................................... 16-2

17 Boot............................................................................................................................................. 17-1

17.1 UEFI USB Lan Drive BBS Priorities................................................................................... 17-2

17.2 UEFI Hard Disk Drive BBS Priorities ................................................................................. 17-3

17.3 UEFI NETWORK Drive BBS Priorities............................................................................... 17-4

18 Save & Exit ................................................................................................................................. 18-1

19 Certifications of the Manufacturer ........................................................................................... 19-1

20 Recycling .................................................................................................................................... 20-1

01750346115 C

iii

1

1 Symbols

DANGER

This warning note describes a hazard with a high degree of risk, which, if not avoided,

will result in death or grave bodily injury.

WARNING

This warning note describes a hazard with a medium degree of risk, which, if not

avoided, will result in death or grave bodily injury.

CAUTION

This warning note describes a hazard with a low degree of risk, which, if not avoided,

will result in death or grave bodily injury.

NOTE

This note provides application tips and information that help prevent errors and material

damage.

01750346115 C

1-1

2

2 Important notes

Take note of the following precautions before you install motherboard components or change any moth-

erboard settings.

Unplug the power cord from the wall socket before touching any component.

Before handling components, use a grounded wrist strap or touch a safely grounded object or a metal

object, such as the power supply case, to avoid damaging them due to static electricity.

Hold components by the edges to avoid touching the ICs on them.

Whenever you uninstall any component, place it on a grounded antistatic pad or in the bag that came

with the component.

Before you install or remove any component, always remove the AC power by unplugging the power

cord from the power outlet. Failure to do so may cause severe damage to the motherboard, peripherals,

or components.

01750346115 C

2-1

3

3 Warranty

Generally Diebold Nixdorf guarantees a warranty engagement for 12 months beginning with the date of

delivery. This warranty engagement covers all damages which occur despite a normal use of the prod-

uct.

Damages because of improper or insufficient maintenance, improper use of the product or unauthorized

modifications of the product, inadequate location or surroundings will not be covered by the warranty.

For further information on the stipulation consult your contract.

All parts of the product which are subject to wear and tear are not included in the warranty engagement.

For detailed warranty arrangements please consult your contract documents.

NOTE

Please contact your local service provider for all questions concerning your service con-

tract.

01750346115 C

3-1

4

4 ESD (Electrostatic Sensitive Devices)

NOTE

Electrostatic sensitive devices (ESD) may be marked with this sticker.

When you handle components fitted with ESDs, you must observe the following points under all circum-

stances:

Make sure that the device is de-energized before connecting, removing or installing components with

ESD.

Always use the antistatic equipment.

Unplug the power before inserting or removing components containing ESDs.

While working with ESDs you must discharge yourself by using an ESD wrist strap or grounding cable to

connect yourself at all times to the earth connector of power socket or a grounded object.

Place all components containing ESDs on a static-safe base.

The equipment and tools you use must be free of static charges.

Always hold boards with ESDs by their edges. Do not touch the components.

Never touch pins or conductors on boards fitted with ESDs.

01750346115 C

4-1

5

5 Specifications of Sx-Motherboard

Model Name S1.0-WHL-AIO S2.0-WHL-AIO S3.0-WHL-AIO

Processor (Whiskey Lake) Celeron 4305UE i3-8145UE i5-8365UE

Number of Cores 2 2 4

Number of Threads 2 4 8

Base Frequency 2.0GHz 2.2 GHz 1.6 GHz

Burst Frequency 2.0GHz 3.9 GHz 4.1 GHz

Integrated Graphics Intel UHD Graphics 610 Intel UHD Graphics 620

TDP 15W

Memory socket DDR4 1866/2133 MT/s SODIMM up to 32GB

Network

Wired Intel WGI 219

Realtek RTL8153 (Multi-I/O Hub)

Wireless/Bluetooth Intel Wireless-AC 9462 / 9560 (M.2 2230 E-Key)

Super IO NCT 5523D

Primary Display 15.6” TFT, 1920x1080, 6-bit+FRC

M.2 2280 Socket M-Key SATA SSD

User I/O Ports 2x USB 2.0, 2x USB 3.0,

1x 24V DC Input

Cash drawer

LAN

1x USB-C/DP (USB1)

- PD: 5V/3A, 12V/3A, 24V/4A

01750346115 C

5-1

Specifications of Sx-Motherboard

- USB 3.0 (5Gb)

- DP 1.2 (4096x2304 @60Hz)

1x USB-C/DP (USB2)

- PD: 5V/3A, 12V/3A

- USB 3.0 (5Gb)

- DP 1.2 (4096x2304 @60Hz)

2x COM port

TPM 2.0 Support TPM Daughter board interface

01750346115 C

5-2

6

6 Motherboard Variants

6.1

6.1 Sx Motherboard

6.1.1

6.1.1 Front view

Figure6-1: Sx motherboard, front view, (Whiskey Lake)

1CMOS clear 2RTC battery

3Heat sink 4Docking board interface

5Thermal pad 6Connection for TSE/MF module

7TPM option

01750346115 C

6-1

Motherboard Variants

6.1.2

6.1.2 Back view

Figure6-2: Sx motherboard, back view, (Whiskey Lake)

1SODIMM socket 2WLAN module

3M.2 2280 socket 4M.2 2280 socket

01750346115 C

6-2

7

7 Block diagram

7.1

7.1 Sx-Motherboard

01750346115 C

7-1

8

8 Central Processing Unit

The motherboard comes with soldered on 8th Generation Intel® Core™ i5/ i3 or Celeron® processor.

Figure8-1: Motherboard with single pipe heat sink

Figure8-2: Motherboard with 2 pipe heat sink

01750346115 C

8-1

Central Processing Unit

8.1

8.1 System Memory

This motherboard comes with single Double Data Rate 4 (DDR4) Small Outline Dual Inline Memory

Module (SO-DIMM) socket. The figure below illustrates the location of the DDR4 SO-DIMM socket.

01750346115 C

8-2

Central Processing Unit

8.2

8.2 Jumpers

• Clear RTC RAM (3-pin CLRTC)

This header allows you to clear the CMOS RTC RAM data.

Figure8-3: Motherboard with single pipe heat sink

01750346115 C

8-3

Central Processing Unit

Figure8-4: Motherboard with 2 pipe heat sink

To erase the RTC RAM:

• Turn OFF the computer and unplug the power cord.

• Move the jumper cap from pins 1-2 (default) to pins 2-3. Keep the cap on pins 2-3 for about 5~10

seconds, then move the cap back to pins 1-2.

• Plug the power cord and turn ON the computer.

• Hold down the <Del> key during the boot process and enter BIOS setup to reenter data.

NOTE

You do not need to clear the RTC when the system hangs due to overclocking. For sys-

tem failure due to overclocking, use the CPU Parameter Recall (C.P.R) feature. Shut

down and reboot the system so the BIOS can automatically reset parameter settings to

default values.

This jumper will just load BIOS defaults, and will not clear BIOS password.

01750346115 C

8-4

Central Processing Unit

8.3

8.3 Connectors

8.3.1

8.3.1 Rear Panel Connectors

Port label Description of port

1LAN RJ45 LAN port

2USB2 USB 3.0 (Type C with DP and PD 5/12V)

3COM1 RJ50 powered COM port (5V/12V)

4COM2 RJ50 powered COM port (5V/12V)

5USB3/4 USB 2.0 (Type A)

6USB5/6 USB 3.0 (Type A)

724V IN Connection to power (24V DC Input)

8USB1 USB 3.0 (Type C with DP and PD 5/12/24V)

Power source/sink function

9CASH RJ12 (Cash drawer)

LAN Port LED Indications

NOTE

USB 3.1 Gen 2 devices can only be used for data storage.

We strongly recommend that you connect USB 3.1 Gen 2 devices to USB

3.1 Gen 2 ports for faster and better performance from your USB 3.1 Gen 2 devices.

Due to the design of the Intel® 300 series chipset, all USB devices connected to the

USB 2.0 and USB 3.1 Gen 2 ports are controlled by the xHCI controller. Some legacy

USB devices must update their firmware for better compatibility.

01750346115 C

8-5

Central Processing Unit

8.3.2

8.3.2 Internal Connectors

1. TPM connector (10-pin TPM)

This connector supports a Trusted Platform Module (TPM) system, which can securely store keys, digital

certificates, passwords, and data. A TPM system also helps enhance network security, protects digital

identities, and ensures platform integrity.

Figure8-5: Motherboard with single pipe heat sink

01750346115 C

8-6

Central Processing Unit

Figure8-6: Motherboard with 2 pipe heat sink

01750346115 C

8-7

Central Processing Unit

2. Connection for TSE/MF module

Figure8-7: Motherboard with single pipe heat sink

Figure8-8: Motherboard with 2 pipe heat sink

01750346115 C

8-8

Page is loading ...

Diebold Nixdorf BEETLE M1350, BEETLE A1050, BEETLE A1150 Operating instructions

Related papers

Other documents