AIC SB121-PH User manual

Category
Chassis components
Type
User manual
UM_SB121-PH_v.5_05280218
SB121-PH
Storage Server Barebone
User's Manual
contents
CONTENTS
PREFACE ������������������������������������������������������������������������������������������� i
SAFETY INSTRUCTIONS �������������������������������������������������������������������� ii
CHAPTER OVERVIEW ��������������������������������������������������������������������� iv
Chapter 1� Product Features ������������������������������������������������������� 1
1�1 Box Content ����������������������������������������������������������������������������������������1
1.2 Specications �������������������������������������������������������������������������������������2
1�3 Features �����������������������������������������������������������������������������������������������3
Chapter 2� Hardware Setup �������������������������������������������������������� 7
2�1 Central Processing Unit (CPU) �����������������������������������������������������������7
2�2 System Memory ��������������������������������������������������������������������������������14
2�3 Removing and Installing the Chassis Top Cover ���������������������������18
2�4 Removing and Installing the Disk Drive ������������������������������������������19
2�5 Removing and Installing the Fan Module ��������������������������������������20
2�6 Removing and Installing the Power Supply Unit Module ��������������22
2�7 Replacing the PCIe Card and Riser Assembly ������������������������������23
2�8 Tool-less Blade Slide Installation �����������������������������������������������������26
Chapter 3� Motherboard Settings ��������������������������������������������� 30
3�1 Motherboard Block Diagram ����������������������������������������������������������30
3�2 Motherboard Layout ������������������������������������������������������������������������31
3�3 Motherboard Content List ����������������������������������������������������������������32
3�4 Internal Connectors/Jumpers ��������������������������������������������������������33
3�5 System LEDs ��������������������������������������������������������������������������������������40
Chapter 4. BIOS Conguration Settings ����������������������������������� 43
4�1 BIOS Setup �����������������������������������������������������������������������������������������43
4�2 Updating BIOS �����������������������������������������������������������������������������������45
contents
Chapter 5. BMC Conguration Settings ����������������������������������� 47
5�1 Method 1 (Use the BIOS Setup) �������������������������������������������������������47
5�2 Method 2 (Use a Dos Tool - Syscheck) ������������������������������������������50
5�3 Connect to BMC �������������������������������������������������������������������������������52
5�4 Updating BMC Firmware ������������������������������������������������������������������57
Chapter 6� Hardware Information �������������������������������������������� 58
6�1 Backplane �����������������������������������������������������������������������������������������58
6�2 Drive Slot Map �����������������������������������������������������������������������������������61
Chapter 7� Technical Support��������������������������������������������������� 62
Copyright © 2016 AIC, Inc� All Rights Reserved�
This document contains proprietary information about AIC products
and is not to be disclosed or used except in accordance with
applicable agreements.
i
PREFACE
Copyright
No part of this publication may be reproduced, stored in a retrieval system, or transmitted
in any form or by any means, electronic, mechanical, photo-static, recording or otherwise,
without the prior written consent of the manufacturer.
Trademarks
All products and trade names used in this document are trademarks or
registered trademarks of their respective holders.
Changes
The material in this document is for information purposes only and is subject to change
without notice.
Warning
1. A shielded-type power cord is required in order to meet FCC emission limits and also
to prevent interference to the nearby radio and television reception. It is essential that
only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. You are cautioned that changes or modifications not expressly approved by the party
responsible for compliance could void your authority to operate the equipment.
Disclaimer
AIC shall not be liable for technical or editorial errors or omissions contained herein. The
information provided is provided "as is" without warranty of any kind. To the extent
permitted by law, neither AIC or its affiliates, subcontractors or suppliers will be liable for
incidental, special or consequential damages including downtime cost; lost profits; damages
relating to the procurement of substitute products or services; or damages for loss of data,
or software restoration. The information in this document is subject to change without
notice.
ii
SAFETY INSTRUCTIONS
Before getting started, please read the following important cautions:
All cautions and warnings on the equipment or in the manuals should be noted.
Most electronic components are sensitive to electrical static discharge. Therefore, be
sure to ground yourself at all times when installing the internal components.
Use a grounding wrist strap and place all electronic components in static-shielded
devices. Grounding wrist straps can be purchased in any electronic supply store.
Be sure to turn off the power and then disconnect the power cords from your system
before performing any installation or servicing. A sudden surge of power could damage
sensitive electronic components.
Do not open the system’s top cover. If opening the cover for maintenance is a must,
only a trained technician should do so. Integrated circuits on computer boards are
sensitive to static electricity. Before handling a board or integrated circuit, touch
an unpainted portion of the system unit chassis for a few seconds. This will help to
discharge any static electricity on your body.
Place this equipment on a stable surface when install. A drop or fall could cause injury.
Please keep this equipment away from humidity.
Carefully mount the equipment into the rack, in such manner, that it won’t be
hazardous due to uneven mechanical loading.
This equipment is to be installed for operation in an environment with maximum
ambient temperature below 35°C.
The openings on the enclosure are for air convection to protect the equipment from
overheating. DO NOT COVER THE OPENINGS.
Never pour any liquid into ventilation openings. This could cause fire or electrical
shock.
Make sure the voltage of the power source is within the specification on the label
when connecting the equipment to the power outlet. The current load and output
power of loads shall be within the specification.
This equipment must be connected to reliable grounding before using. Pay special
attention to power supplied other than direct connections, e.g. using of power strips.
Place the power cord out of the way of foot traffic. Do not place anything over the
power cord. The power cord must be rated for the
iii
product, voltage and current marked on the products electrical ratings label. The voltage
and current rating of the cord should be greater than the voltage and current rating marked
on the product.
If the equipment is not used for a long time, disconnect the equipment from mains to avoid
being damaged by transient over-voltage.
Never open the equipment. For safety reasons, only qualified service personnel should
open the equipment.
If one of the following situations arise, the equipment should be checked by service
personnel:
1. The power cord or plug is damaged.
2. Liquid has penetrated the equipment.
3. The equipment has been exposed to moisture.
4. The equipment does not work well or will not work according to its user manual.
5. The equipment has been dropped and/or damaged.
6. The equipment has obvious signs of breakage.
7. Please disconnect this equipment from the AC outlet before cleaning. Do not use liquid
or detergent for cleaning. The use of a moisture sheet or cloth is recommended for
cleaning.
Module and drive bays must not be empty! They must have a dummy cover.
Product features and specifications are subject to change without notice.
CAUTION :
risk of explosion if battery is replaced by an incorrect type.
dispose of used batteries according to the instructions.
After performing any installation or servicing, make sure the
enclosure are lock and screw in position, turn on the power.
iv
SB121-PH User's Manual
Chapter 1 Product Features
CHAPTER OVERVIEW
Chapter 1 Product Features
SB121-PH is a flexible storage server barebone that is specifically designed to
accommodate diverse corporations and enterprises for managing heavy workloads
and multiple applications.
Chapter 2 Hardware Setup
This chapter displays an easy installation guide for assembling the hardware in this
product. Utmost caution for proceeding to set up the hardware is highly advised.
Most of the components are highly fragile and vulnerable to exterior inuence. Do
not endanger the device by placing the device in an unstable environment.
Chapter 3 Motherboard Settings
This chapter elaborates the overall layout of the motherboard that had been
designed for the the server, which include multifarious connectors, jumpers, and
LED descriptions. These descriptions assist in configuring various settings in the
motherboard.
Chapter 5 BIOS Configuration Settings
This chapter introduces the key features of BIOS, including the descriptions and
option keys for discrete functions. These details provide users to maintain and
congure input/output devices.
Chapter 5 BMC Configuration Settings
This chapter illustrates the diverse functions of IPMI BMC, including the details on
logging into the web page and assorted denitions. These descriptions are helpful
in conguring various functions through Web GUI without entering the BIOS setup.
For more information about BMC configurations, please refer to IPMI BMC
(Aspeed2400) User's Manual for a more detailed description.
Chapter 6 Hardware Information
This chapter elaborates the overall layout of the hardware for this product,
including information for various connectors and LEDs. These elaborations are
useful in conguring your hardware.
Chapter 6 Technical Support
For more information or suggestion, please verify and contact the nearest AIC
corporation representative in your district by email or phone or visit the AIC
website. It is our pleasure to oer the best service for our customers.
1
Chapter 1 Product Features
SB121-PH User's Manual
1�1 Box Content
Before removing the subsystem from the shipping carton, visually inspect the physical
condition of the shipping carton. Exterior damage to the shipping carton may indicate that the
contents of the carton are damaged. If any damage is found, do not remove the components;
contact the dealer where the subsystem was purchased for further instructions. Before
continuing, first unpack the subsystem and verify that the number and quality in the shipping
carton is correct and in good condition.
Enclosure( Power supply, fan, 10 x 2.5'' HDD tray included)
Power cord Screws kit x 1set
Slide rail x 1set
PACKAGE CONTENT MAY VARY PER REGION.
Chapter 1� Product Features
2.5" HDD Tray
2
Chapter 1 Product Introduction
1.2 Specications
Dimensions
(W x D x H)
mm : 438 x 787.4 x 44.4
inches : 17.2 x 31 x 1.75
Motherboard
AIC Server Board Phoenix
Processor
Processor
Support
product family
QPI Speeds 9.6 GT/s, 8.0 GT/s, 7.2 GT/s
Socket Type Socket R3 (FCLGA2011-3)
Chipset Support
System Memory
(4 memory channels per CPU; 2 channels with 2DPC and
2 channels with 1DPC)
- 384GB DDR4 2133/1866 RDIMM DRx4
- 96GB DDR4 2133/1866 RDIMM SRx4
- 768GB DDR4 2133/1866 LRDIMM QRx4
- 1536GB DDR4 2133/1866 LRDIMM 3DS 8Rx4
Front Panel
LEDs
Drive Bays
External 2.5" hot swap 10
Backplane
1 x 10-port 6Gb SAS backplane with 3 SFF-8087 connectors
Expansion Slots PCIe 3.0 4 x8
Riser Card
(included)
PSG-RC-TO1U-40-110
System BIOS
BIOS Type
FLASH Interface
BIOS
Features
interface
redirection
Mode
Rear I/O
LAN
2 x 10GbE SFP+
2 x RJ45
USB
2 x USB 3.0 Type A
VGA
1 x DB-15
Serial Port
1 x DB-9
Power Supply
System Cooling
6 x 40x56mm 21500/18000 rpm hot swap fan modules
System
Management
Environmental
non-condensing
Gross Weight
(w/ PSU & Rail)
kgs : 24
lbs : 53
Packaging
Dimensions
(W x D x H)
mm : 590 x 1130 x 273
inches : 23.2 x 44.5 x 10.7
Mounting
Standard 28" tool-less slide rail
On-board
Devices
SATA
Built-in SATA controller with RAID support on
IPMI
Aspeed AST2400 Advanced PCIe Graphics &
Remote Management Processor
Serial over LAN
Network
Controllers
dual port, SFP+, PCIe v2.0 (5.0GT/s)
single port GbE controller, PCIe v2.1,
2.5 GT/s, x1
I217-LM, single port GbE, 1 Gbps
Graphics
Aspeed AST2400 Advanced PCIe Graphics &
Remote Management Processor
3
Chapter 1 Product Features
SB121-PH User's Manual
1�3 Features
SB121-PH is a reliable 1U storage server barebone with 12 hotswap drives bays. This
product is designed to accommodate the AIC-patented serverboard, Phoenix, which
supports two Intel® Xeon® Processors E5-2600 v3 and v4 processors and 12 DDR4
DIMM to oer greater perfomance, eciency, and ulity for our customers. Featur-
ing Intel® C612 Series Chipset, which is emphasized for its maximized bandwidth and
stablility, this product enhances these advantages by integrang exible IO usage and
system expansion into to provide greater bandwidth and ulizaon.
In addion to the noteworthy features of the barebone, SB121-PH provides immedi-
ate and ecient management with Onboard Baseboard Management Controller and
greater I/O extension. Featuring IPMI 2.0 and Aspeed AST2400 Advanced PCIe Graph-
ics, the server board oers support for iKVM, Media Redirecon,Smash Support, IPMI
over LAN, and Serial over LAN.
1U 10-Bay storage server with the exceptionally high storage density
Supports two Intel® Xeon® Processors E5-2600 v3/v4 product family
With Intel® C612 Series Chipset to provide 5+ years product life cycle
Flexible IO usage with Max IO™ to support up to 4 COTS PCIe 3.0 cards in a 1U
Onboard Baseboard Management Controller for system management and
IPMI control
Two 10GbE SFP+ ports
Front-to-back airflow and hot swap redundant fans to provide optimal thermal
conditions
Customizable to meet your requirements
4
SB121-PH User's Manual
Chapter 1 Product Features
Front Panel
2 x 2.5'' OS Drive Bays
5
Chapter 1 Product Features
SB121-PH User's Manual
Rear Panel
6
SB121-PH User's Manual
Chapter 1 Product Features
Major Components
Expansion add-on card
AIC Server Board Phoenix
650W 1+1 redundant
6 x 40 x 56mm hot swap fans
External 2.5” hot swap x 10
7
Chapter 2 Hardware Setup
SB121-PH User's Manual
2�1 Central Processing Unit (CPU)
2.1.1 Removing the Central Processing Unit
Step 1 Remove the heatsink. The heatsink is attached to the server board or
processor socket with captive fasteners. Use a #2 Phillips* screwdriver to
loosen the screws x 4 located on the heatsink corners diagonally using the
following procedure (1a) to (1b).
(1a) Use a #2 Phillips* screwdriver and start with screw 1 and loosen it by
giving it two rotations and stop (see letter A).
(1b) Proceed to screw 2 and loosen it by giving it two rotations and stop (see
letter B). Similarly, loosen screws 3 and 4. Repeat steps A and B by giving
each screw two rotations each time until all the screws are loosened.
(1c) Lift the heatsink upward (see letter C).
Chapter 2� Hardware Setup
R
EM
OVE
REMOVE
LGA20
11-3
** SUPPLIER IDENTI
FI
C
A
TION HERE **
INSTALL PROCESSOR B
EFOR
E
REMOVING COVER
SAVE AN
D
REPLACE
COVER
IF P
ROCESSOR IS REMOVE
D
Processor
Socket
2
3
1
4
A
B
C
IMPORTANT :
Do not fully loosen.
Chapter 2 Hardware Setup
8
SB121-PH User's Manual
REMOVE
REMOVE
LGA2011-3
** SUPPLIER IDENTIFIC
ATION HERE **
INSTALL PROCESSOR BEFORE
REMOVING COVER
SAVE AND REPLACE COVER
IF PROCESSOR IS REMOVED
A
REMOVE
REMOVE
LGA2011-3
** SUPPLIER IDENTIFIC
ATION HERE **
INSTALL PROCESSOR BEFORE
REMOVING COVER
SAVE AND REPLACE COVER
IF PROCESSOR IS REMOVED
B
Step 2 Unlatch the CPU Load Plate by following procedures (2a) to (2b).
(2a) Push the lever handle labeled “OPEN 1st” (see letter A)
down and towards the CPU socket. Rotate the lever handle upward.
(2b) Repeat the steps for the second lever handle (see letter B).
Step 3 Open the load plate.
(3a) Rotate the right lever handle down until it releases the Load Plate
(see letter A).
(3b) While holding down the lever handle, lift open the Load Plate with
your hand (see letter B).
Step 4 Remove the processor from the socket.
B
REMOVE
REMOVE
LGA2011-3
** SUPPLIER IDENTIFIC
ATION HERE **
INSTALL PROCESSOR BEFORE
REMOVING COVER
SAVE AND REPLACE COVER
IF PROCESSOR IS REMOVED
A
NOTE :
Remove the processor by carefully lifting it out of the socket, taking care
NOT to drop the processor and not touching any pins inside the socket.
Install the socket cover if a replacement processor is not going to be installed.
9
Chapter 2 Hardware Setup
SB121-PH User's Manual
2.1.2 Installing the Processor
CAUTION :
Processor must be appropriate: You may damage the server board if
you install a processor that is inappropriate for your server.
CAUTION :
ESD and handling processors: Reduce the risk of electrostatic
discharge (ESD) damage to the processor by doing the following:
(1) Touch the metal chassis before touching the processor or
server board. Keep part of your body in contact with the metal
chassis to dissipate the static charge while handling the processor.
(2) Avoid moving around unnecessarily.
Chapter 2 Hardware Setup
10
SB121-PH User's Manual
Step 1 Remove the processor from its package by following procedures (1a) to
(1b).
(1a) Carefully remove the protective cover from the backside of the CPU.
taking care not to touch any CPU contacts (see letter A).
(1b) Orient the processor with the socket so that the processor cutouts match
the four orientation posts on the socket (see letter B). Verify the location
of a gold key at the corner of the processor (see letter C). Carefully place
(Do NOT drop) the CPU into the socket.
CAUTION :
The pins inside the CPU socket are extremely sensitive. Other than
the CPU, no object should make contact with the pins inside the
CPU socket. A damaged CPU socket pin may render the socket inoperable,
and will produce erroneous CPU or other system errors if used.
NOTE :
The underside of the processor has components that may damage the
socket pins if installed improperly. The processor must align correctly
with the socket opening before installation. DO NOT DROP the
processor into the socket.
NOTE :
When possible, a CPU insertion tool should be used when installing the
CPU.
A
B
C
11
Chapter 2 Hardware Setup
SB121-PH User's Manual
Step 2 Remove the socket cover from the load plate.
Step 3 Close the load plate.
Step 4 Secure the Load Plate.
(4a) Push downward on the locking lever on the CLOSE 1st side (see letter A).
Slide the tip of the lever under the notch in the load plate (see letter B).
Make sure the load plate tab engages under the socket lever when fully
closed.
(4b) Repeat the steps to latch the locking lever on the other side (see letter C).
Latch the levers in the order as demonstrated.
NOTE :
The socket cover should be saved and re-used should the processor
need to be removed at anytime in the future.
Save the
protective
cover.
A
B
C
Chapter 2 Hardware Setup
12
SB121-PH User's Manual
Step 5 Installing the heatsink on top of the processor.
(5a) If present, remove the protective film covering the thermal interface
material on the bottom side of the heatsink (see letter A).
(5b) Align the heatsink fins to the front and back of the chassis for correct
airflow. The airflow goes from front-to-back of the chassis (see letter B).
(5c) Each heatsink has four captive fasteners and should be tightened
diagonally using the following procedure:
(5c-1) Using a #2 Phillips* screwdriver, start with screw 1 and engage
screw threads by giving it two rotations and stop (see letter C) (Do
not fully tighten).
(5c-2) Proceed to screw 2 and engage screw threads by giving it two
rotations and stop (see letter D). Similarly, engage screws 3 and 4.
(5c-3) Repeat steps C and D by giving each screw two rotations each time
until each screw is lightly tightened up to a maximum of 8 inch-lbs
torque (see letter E).
NOTE :
The processor heatsink for CPU1 and CPU2 is different. FXXCA91X91HS is
for CPU1, while FXXEA91X91HS2 is for CPU2. Mislocating the heatsink
will cause serious thermal damage.
C
Processor
Socket
AIRFLOW
Chassis Front
2
3
1
4
A
B
TIM
D
CAUTION:
Do not over-tighten fasteners.
E
  • Page 1 1
  • Page 2 2
  • Page 3 3
  • Page 4 4
  • Page 5 5
  • Page 6 6
  • Page 7 7
  • Page 8 8
  • Page 9 9
  • Page 10 10
  • Page 11 11
  • Page 12 12
  • Page 13 13
  • Page 14 14
  • Page 15 15
  • Page 16 16
  • Page 17 17
  • Page 18 18
  • Page 19 19
  • Page 20 20
  • Page 21 21
  • Page 22 22
  • Page 23 23
  • Page 24 24
  • Page 25 25
  • Page 26 26
  • Page 27 27
  • Page 28 28
  • Page 29 29
  • Page 30 30
  • Page 31 31
  • Page 32 32
  • Page 33 33
  • Page 34 34
  • Page 35 35
  • Page 36 36
  • Page 37 37
  • Page 38 38
  • Page 39 39
  • Page 40 40
  • Page 41 41
  • Page 42 42
  • Page 43 43
  • Page 44 44
  • Page 45 45
  • Page 46 46
  • Page 47 47
  • Page 48 48
  • Page 49 49
  • Page 50 50
  • Page 51 51
  • Page 52 52
  • Page 53 53
  • Page 54 54
  • Page 55 55
  • Page 56 56
  • Page 57 57
  • Page 58 58
  • Page 59 59
  • Page 60 60
  • Page 61 61
  • Page 62 62
  • Page 63 63
  • Page 64 64
  • Page 65 65
  • Page 66 66
  • Page 67 67
  • Page 68 68
  • Page 69 69
  • Page 70 70

AIC SB121-PH User manual

Category
Chassis components
Type
User manual

Ask a question and I''ll find the answer in the document

Finding information in a document is now easier with AI