Lantronix Open-Q™ 820 Development Kit User guide

Open-Q™ 820 Development Kit for

Qualcomm™ APQ8096 Processor

User Guide

Part Number PMD-00052

Revision A August 2020

Open-Q™ 820 Dev Kit User Guide 2

Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc

Purchase an Open-Q Development Kit Based on Qualcomm™ APQ8096 Series Processor and

Software License Agreement for the Open-Q Development Kit Based on Qualcomm™ APQ8096

Series Processor, which you or the legal entity you represent, as the case may be, accepted and

agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation.

(“Agreement”). You may use this document, which shall be considered part of the defined term

“Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-

Q Development Kit under the Agreement. Distribution of this document is strictly prohibited without

the express written permission of Intrinsyc Technologies Corporation and its respective licensors,

which they can withhold, condition or delay in its sole discretion.

Lantronix is a trademark of Lantronix, Inc., registered in the United States and other countries.

Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other

countries.

Qualcomm® and Snapdragon are trademarks of Qualcomm® Incorporated, registered in the United

States and other countries. Qualcomm APQ8096 is a product of Qualcomm Technologies, Inc. and/or

its subsidiaries. Other product and brand names used herein may be trademarks or registered

trademarks of their respective owners.

This document contains technical data that may be subject to U.S. and international export, re-export,

or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

Contacts

Lantronix, Inc.

7535 Irvine Center Drive, Suite 100

Irvine, CA 92618, USA

Toll Free: 800-526-8766

Phone: 949-453-3990

Fax: 949-453-3995

IES Customer Support Portal

https://helpdesk.intrinsyc.com

Lantronix Technical Support

http://www.lantronix.com/support

Sales Offices

For a current list of our domestic and international sales offices, go to the Lantronix web site at

http://www.lantronix.com/about-us/contact/

Open-Q™ 820 Dev Kit User Guide 3

Revision History

Date

Rev.

Comments

December 2015

1.0

Initial release.

Intrinsyc document number: ITC-01IMP1200-UG-001

January 2016

1.1

Second draft ready for release

February 2016

1.2

Third draft ready for release

April 2016

1.3

Replaced PMI8994 with PMI8996

June 2016

1.4

WLAN PCB antenna information

July 2016

1.5

Prepared for public release

August 2016

1.6

Updated display sections

November 2016

1.7

Updated PCI section 3.9.16

December 2016

1.8

Reformatted document and reorganized headings

Updated automation connector, power header, display

section

February 2017

1.9

Added information on GPS antenna

July 2018

2.0

Added information on WiFi/BT certification

Updated WiFi / BT Antenna numbering

Updated Table 3.8.21-1

August 2020

A

Initial Lantronix document. Added Lantronix document part

number, Lantronix logo, branding, contact information, and

links.

For the latest revision of this product document, please go to: http://tech.intrinsyc.com

.

Open-Q™ 820 Dev Kit User Guide 4

Contents

1. Introduction 6

1.1 Purpose _____________________________________________________________ 6

1.2 Scope ______________________________________________________________ 6

1.3 Intended Audience ____________________________________________________ 6

2. Documents 7

2.1 Applicable Documents _________________________________________________ 7

2.2 Reference Documents _________________________________________________ 7

2.3 Terms and Acronyms __________________________________________________ 7

3. Open-Q™ 820 Development Kit 11

3.1 Introduction _________________________________________________________ 11

3.2 Development Platform Notice ___________________________________________ 11

3.3 Anti-Static Handling Procedures _________________________________________ 11

3.4 Kit Contents ________________________________________________________ 11

3.5 Hardware Identification Label ___________________________________________ 12

3.6 System Block Diagram ________________________________________________ 13

3.7 Open-Q 820 SOM ____________________________________________________ 13

3.7.1 SOM Mechanical Properties _________________________________________ 14

3.7.2 SOM Block Diagram _______________________________________________ 14

3.7.3 Hardware Specification_____________________________________________ 15

3.7.4 SOM RF Specification for WIFI, BT, GPS ______________________________ 17

3.8 Open-Q™ Carrier Board _______________________________________________ 19

3.8.1 Dip switch S10 Configuration Options _________________________________ 19

3.8.2 Open-Q™ 820 Carrier Board Expansion Connectors _____________________ 20

3.8.3 Open-Q Power Specification ________________________________________ 23

3.8.4 Power Probe Header J86 ___________________________________________ 24

3.8.5 Debug Serial UART Header J61 _____________________________________ 25

3.8.6 Debug Serial UART Over USB J22 ___________________________________ 26

3.8.7 JTAG Header J51 _________________________________________________ 26

3.8.8 Sensor IO Expansion Header J53 ____________________________________ 27

3.8.9 NFC Expansion Header J52 (EXP1) __________________________________ 29

3.8.10 Education / GPIO header J54 (EXP2) ________________________________ 31

3.8.11 ANC Headset Jack J27 ___________________________________________ 32

3.8.12 Audio Inputs Expansion Header J50 _________________________________ 33

3.8.13 Audio Outputs Expansion Header J26 ________________________________ 34

3.8.14 On Board PCB WLAN Antennas ____________________________________ 35

3.8.15 External and on Board PCB GPS Antenna ____________________________ 36

3.8.16 Open-Q Display _________________________________________________ 36

3.8.17 HDMI Connector J25 _____________________________________________ 37

Open-Q™ 820 Dev Kit User Guide 5

3.8.18 Display Connector J2 _____________________________________________ 37

3.8.19 PCI Express 1X Slot J30 __________________________________________ 41

3.8.20 Mini PCI Express Connector J72 ____________________________________ 41

3.8.21 Camera Connectors ______________________________________________ 43

3.8.22 Power Header via 20 Pin Connector J60 ______________________________ 47

3.8.23 Automation Connector Header J59 __________________________________ 49

3.8.24 Ethernet AVB Expansion Header J73 ________________________________ 50

3.8.25 VIP Expansion Header J71 ________________________________________ 50

Open-Q™ 820 Dev Kit User Guide 6

1. Introduction

1.1 Purpose

The purpose of this user guide is to provide primary technical information on the Open-Q™ 820 Development

Kit based on the Qualcomm™ APQ8096 Processor

For more background information on this development kit, visit:

https://www.lantronix.com/products/open-q-820-development-kit/

1.2 Scope

This document will cover the following items on the Open-Q 820:

• Block Diagram and Overview

• Hardware Features

• Configuration

• SOM

• Carrier Board

• Display Board for LCD (Optional)

1.3 Intended Audience

This document is intended for users who would like to develop custom applications on the Open-Q 820

Development Kit.

Documents

Open-Q™ 820 Dev Kit User Guide 7

2. Documents

This section lists the supplementary documents for the Open-Q 820 development kit.

2.1 Applicable Documents

Reference

Title

A-1

Intrinsyc Purchase and Software License Agreement for the Open-Q

Development

Kit

2.2 Reference Documents

Reference

Title

R-1

Hardware Document Set for the Qualcomm APQ8096 based Open-Q

Development Kit

R-2

Open-Q 820 Schematics (SOM, Carrier)

R-3

Open-Q 820 Dev Kit SOM Tech Note 13

R-4

ITCNFA324 Module Certification OEM Integrator Instructions

2.3 Terms and Acronyms

Term and acronyms

Definition

AMIC

Analog Microphone

ANC

Audio Noise Cancellation

B2B

Board to Board

BLSP

Bus access manager Low Speed Peripheral (Serial

interfaces like UART / SPI / I2C/ UIM)

BT LE

Bluetooth Low Energy

CSI

Camera Serial Interface

DSI

MIPI Display Serial Interface

EEPROM

Electrically Erasable Programmable Read only

memory

eMMC

Embedded Multimedia Card

FCC

US Federal Communications Commission

Documents

Open-Q™ 820 Dev Kit User Guide 8

Term and acronyms

Definition

FWVGA

Full Wide Video Graphics Array

GPS

Global Positioning system

HDMI

High Definition Media Interface

HSIC

High Speed Inter Connect Bus

JTAG

Joint Test Action Group

LNA

Low Noise Amplifier

MIPI

Mobile Industry processor interface

MPP

Multi-Purpose Pin

NFC

Near Field Communication

RF

Radio Frequency

SATA

Serial ATA

SLIMBUS

Serial Low-power Inter-chip Media Bus

SOM

System On Module

SPMI

System Power Management Interface (Qualcomm

PMIC / baseband proprietary protocol)

SSBI

Single wire serial bus interface (Qualcomm

proprietary mostly PMIC / Companion chip and

baseband processor protocol)

UART

Universal Asynchronous Receiver Transmitter

UFS

Universal Flash Storage

UIM

User Identity module

USB

Universal Serial Bus

USB HS

USB High Speed

USB SS

USB Super Speed

Documents

Open-Q™ 820 Dev Kit User Guide 9

List of Figures

Figure 1 Assembled Open-Q 820 Development Kit ______________________________________ 12

Figure 2 Open-Q 820 Block Diagram _________________________________________________ 13

Figure 3 Open-Q 820 SOM ________________________________________________________ 14

Figure 4 SOM Block Diagram _______________________________________________________ 15

Figure 5 J21 12V DC Power Jack ____________________________________________________ 24

Figure 6 J86 Power Probe Header ___________________________________________________ 24

Figure 7 J61 3.3V TTL Debug UART _________________________________________________ 25

Figure 8 J22 Debug UART Over USB _________________________________________________ 26

Figure 9 J51 JTAG Header _________________________________________________________ 26

Figure 10 J53 Sensor Expansion Header ______________________________________________ 27

Figure 11 J55 Gen-10 Sensor Connector (Samtec QSH-030 series) _________________________ 29

Figure 12 J52 NFC Expansion Header (EXP1) __________________________________________ 29

Figure 13 J54 Education / GPIO Header _______________________________________________ 31

Figure 14 ANC Headphone Jack _____________________________________________________ 32

Figure 15 J50 Audio Inputs Expansion Header __________________________________________ 33

Figure 16 J26 Audio Outputs Expansion Header ________________________________________ 34

Figure 17 On Board PCB Antennas __________________________________________________ 36

Figure 18 Display Board Block Diagram _______________________________________________ 39

Figure 19 Display Board Default Configuration __________________________________________ 40

Figure 20 J30 PCIe Connector ______________________________________________________ 41

Figure 21 J72 Mini PCIe Connector __________________________________________________ 42

Figure 22 J72 Mounting Holes for Mini PCIe Connector ___________________________________ 42

Figure 23 Camera Connectors (J5,J4,J3) ______________________________________________ 43

Figure 24 J60 Power Connector _____________________________________________________ 47

Figure 25 J59 Automation Connector Header ___________________________________________ 49

List of Tables

Table 3.7-1 Open-Q Hardware Features _______________________________________________ 16

Table 3.8-1 Dip Switch HW / SW Configuration _________________________________________ 19

Table 3.8-2 Carrier Board Expansion Options and Their Usage _____________________________ 20

Table 3.8-3 Power Header J86 Pin-out ________________________________________________ 25

Table 3.8-4 Debug UART Header J61 Pin-out __________________________________________ 25

Table 3.8-5 JTAG Header J51 Pin out ________________________________________________ 27

Table 3.8-6 Sensor Expansion Header J53 Pin out ______________________________________ 28

Table 3.8-7 NFC Expansion Header J52 Pin out ________________________________________ 30

Table 3.8-8 Education Connector Expansion Header J54 Pin out ___________________________ 31

Table 3.8-9 Audio Inputs Expansion Header J50 Pin out __________________________________ 33

Table 3.8-10 Audio Outputs Expansion Header J26 Pin out ________________________________ 35

Table 3.8.21-1. MIPI CSI Camera Connector Pin outs (J5,J4,J3) ___________________________ 43

Documents

Open-Q™ 820 Dev Kit User Guide 10

Table 3.8.21-2. MIPI CSI Camera Use Cases __________________________________________ 47

Table 3.8.22-1. Power Header J60 Pin-out _____________________________________________ 48

Table 3.8.23-1. General System J59 Pin Out ___________________________________________ 49

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 11

3. Open-Q™ 820 Development Kit

3.1 Introduction

The Open-Q 820 provides a quick reference or evaluation platform for Qualcomm’s latest 820 series -

Qualcomm APQ8096 processor. This kit is suited for Android / Linux application developers, OEMs, consumer

manufacturers, hardware component vendors, video surveillance, robotics, camera vendors, and flash chip

vendors to evaluate, optimize, test and deploy applications that can utilize the Qualcomm 820 series

technology.

3.2 Development Platform Notice

This development platform contains RF/digital hardware and software intended for engineering development,

engineering evaluation, or demonstration purposes only and is meant for use in a controlled environment. This

device is not being placed on the market, leased or sold for use in a residential environment or for use by the

general public as an end user device.

This development platform is not intended to meet the requirements of a commercially available consumer

device including those requirements specified in the European Union directives applicable for Radio devices

being placed on the market, FCC equipment authorization rules or other regulations pertaining to consumer

devices being placed on the market for use by the general public.

This development platform may only be used in a controlled user environment where operators have obtained

the necessary regulatory approvals for experimentation using a radio device and have appropriate technical

training. The device may not be used by members of the general population or other individuals that have not

been instructed on methods for conducting controlled experiments and taking necessary precautions for

preventing harmful interference and minimizing RF exposure risks. Additional RF exposure information can be

found on the FCC website at http://www.fcc.gov/oet/rfsafety/

3.3 Anti-Static Handling Procedures

The Open-Q 820 Development Kit has exposed electronics and chipsets. Proper anti-static precautions

should be employed when handling the kit, including but not limited to:

• Using a grounded anti-static mat

• Using a grounded wrist or foot strap

3.4 Kit Contents

The Open-Q 820 Development Kit includes the following:

• Open-Q™ 820 SOM with the Qualcomm APQ8096 processor or main CPU board

• Mini-ITX form-factor carrier board

• 4.5” FWVGA (480x854) 16.7 M LCD (Additional Accessory)

• AC power adapter and HDMI cable

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 12

Figure 1 Assembled Open-Q 820 Development Kit

The development kit comes with Android 6.0 (Marshmallow) software pre-programmed on the CPU board

(SOM). Please contact Lantronix for availability of camera modules, sensor boards, and other accessories:

sales@lantronix.com

3.5 Hardware Identification Label

Labels are present on the CPU board and the mini-ITX form-factor carrier board. The following information is

conveyed on these two boards:

CPU board:

• Serial Number

• WIFI MAC address [optional]

Refer to https://tech.intrinsyc.com/projects/serialnumber/wiki

for more details about locating the serial

number, as this will be needed to register the development kit. To register a development kit, please visit:

https://tech.intrinsyc.com/account/register.

Mini-ITX form-factor carrier board:

• Serial Number

Note: Please retain the SOM and carrier board serial number for warranty purposes.

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 13

3.6 System Block Diagram

The Open-Q 820 development platform consists of three major components

• Open-Q 820 SOM

• Carrier board for I/O and connecting with external peripherals

• Display Adapter Board (additional accessory)

The following diagram explains the interconnectivity and peripherals on the development kit.

5

`

APQ8096

LPDDR4

3GB

(PoP)

PMi8996

PM8996

eMMC 5.1

16 to 64GB

4-bit SDIO

4L DSI

SPI/I2C

USB HS

USB SS

HDMI

QCA6174

WiFi/BT

GPS

WGR7640

WCD9335

Codec

SOM

Carrier Board

SLIMBUS

IQ + SSBI

Display & Touch

Connector

4L DSI

CSI 0

CSI 1

CSI 2

Audio

Exp

. Connectors

3 x DMICs

3 x AMICs

1 x HPH

Headset

conn.

(ANC)

DC

Jack

GPS

Antenna

SMA

(optional)

USB HS

USB2

LEDs

RGB

BPLSs / MPPs / GPIOs

Sensor

Connector

SSCs / GPIOs / IRQs

3 x AMICs

4 x Line-out

DSI 0

DSI 1

/3

Controls

USB1

SLOT

I2S

I2C

EXP2

(NFC)

Connector

UIM

PCIe0

GPIO’s

CCI0/

1

MIC BIAS

UFS

32 to 64GB

UFS

2 lanes

UFS

EXP1

(EDU)

Connector

BT/WiFi

Antennae

(2.5/5GHz)

Display Adapter

coax

PCM

UART

3.8V BUCK

VBAT

SPMI

SDC2

SDC1

8

-bit SDIO

Touchscreen

SPI/I2C

HDMI

RST/Vol -

POWER

VOL +

GENERAL

JTAG

UART

Sound wire

PCIe1

Type uAB

USB

HUB

PCIe2

PCIe 2.1

Type uB

(for Debug)

Mini card

I2S

CSI

4L

CSI 4L

GPIOs/INTs

TTL to

USB

QSPI QSPI

Automation

Conn

BOOT CONFIG

GPIO127

Figure 2 Open-Q 820 Block Diagram

3.7 Open-Q 820 SOM

The SOM provides the basic common set of features with minimal integration efforts for end users.

It contains the following:

• Qualcomm APQ8096 main application processor

• LPDDR4 up to 1866MHz 3GB RAM (POP)

• PMi8996 + PM8996 – PMIC for Peripheral LDOs, Boost Regulators

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 14

• QCA6174 Atheros Wi-Fi + BT combo chip over PCIe, UART, PCM

• 32 GB UFS 2.0.

• WGR7640 RF Front End

• WCD9335 Audio Codec

Figure 3 Open-Q 820 SOM

3.7.1 SOM Mechanical Properties

Area

34.44 cm

2

(42 mm x 82 mm)

Interface

314-pins MXM Gen-III edge connector & 100-pins

SOM to carrier board connector (B2B Connector).

Thermal

A top side heat sink is installed by default.

Shielding

A top side shield can for the GPS front end is

installed by default.

3.7.2 SOM Block Diagram

The Open-Q 820 SOM measuring 42mm x 82mm is where all the processing occurs. It is connected to the

carrier via a 314-pin MXM Gen-III edge connector. The purpose of this edge connector is to bring out

essential signals such that other peripherals can interface with the platform.

The SOM requires a board-to-board connector in addition to the MXM Gen III connector. This connector is

responsible for bringing out the audio signals to the carrier board whereas the MXM connector exposes all

other pin features supported by the SOC.

82mm

42mm

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 15

5

`

APQ8096

LPDDR4

3GB

(PoP)

PMi8996

PM8996

eMMC 5.1

16 to 64GB

4-bit SDIO

4L DSI

SPI/I2C

USB HS

USB SS

HDMI

QCA6174

WiFi/BT

GPS

WGR7640

WCD

9335

Codec

Open-Q™ 820

System on Module

Carrier Board

SLIMBUS

IQ

+ SSBI

4L DSI

CSI 0

CSI 1

CSI 2

USB HS

USB2

BPLSs / MPPs / GPIOs

SSCs / GPIOs / IRQs

DSI 0

DSI 1

Controls

USB

1

I2S

I2C

UIM

PCIe0

GPIO’s

CCI0/1

UFS

32 to 64GB

UFS

2 lanes

UFS

PCM

UART

SPMI

SDC2

SDC1

8-bit SDIO

SPI/I2C

HDMI

JTAG

UART

PCIe1

PCIe2

PCIe 2.1

I2S

CSI

4L

CSI 4L

GPIOs/INTs

QSPI

BOOT CONFIG

RF

Power Circuit

LEDs

RGBMPP

3 X DMICs

MIC BIAS

6 X AMICs

2 X LINE-OUT

SOUND WIRE

2 X HPH

Carrier Board

Figure 4 SOM Block Diagram

3.7.3 Hardware Specification

The Open-Q™ 820 SOM platform encompasses the following hardware features:

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 16

Table 3.7-1 Open-Q Hardware Features

Subsystem /

Connectors

Feature Set

Description

Specification

Chipset

APQ8096

Qualcomm® APQ8096

Processor

Qualcomm® Kyro CPU,

quad core, 64-bit ARM V8

compliant processor,

2.2GHz

PMIC (PM8996 &

PMi8996)

Qualcomm® PMIC,

Companion PMIC for

APQ8096 processor

NA

Memory

3GB LPDDR4

Memory POP

Up to 1866MHz LPDDR4

POP on CPU BGA chip.

Supports via 4x16bit

channels

32 GB UFS

Primary Storage for platform.

Mainly used for storing SW

applications and user data

etc.

Toshiba UFS on board. Can

support up to 64GB. Can

have the option of using both

UFS and eMMC.

Connectivity

Wi-Fi 2.4 GHz/

5GHz via QCA6174

– SDIO

Wi-Fi Atheros QCA6174 Wi-

Fi + BT Combo Chip

802.11a/b/g/n/ac 2.4/5.0

GHz via QCA6174 over

PCIe0.

Full 2x2 antenna

configuration

BT 2.4 GHz via

QCA6174 – UART /

PCM

Wi-Fi Atheros 6174

Wi-Fi + BT Combo Chip

Support BT 4.1 + HS and

backward compatible with

BT 1.x, 2.x + EDR

GPS via WGR7640

– SSBI Qualcomm

Proprietary Protocol

GPS Frontend

GPS/ GLONASS/

COMPASS

RF Interfaces

2xWLAN / BT

Connect to antenna on carrier

board via coax cable

2.4/ 5 GHz

1x GPS

Connect to antenna on carrier

board via coax cable

GPS/ GLONASS/

COMPASS

Audio Interfaces

1 x Headset Output

Headset/ headphone output

Analog differential output

2 x Loud-speaker

2 x loud-speaker output

Digital output

1 x Earpiece output

Earpiece output

Analog differential output

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 17

Subsystem /

Connectors

Feature Set

Description

Specification

3 x analog MICs

Analog MIC input

Analog differential input

3 x digital MICs

Digital MIC input

Digital input

Interfaces

3 x MIPI CSI

Camera Connectors

CSI0, CSI1, CSI2

MIPI Alliance Specification

v1.0

2 x USB HS & 1 x

USB SS

1 x dual stack type A USB2.0

via USB HUB for front USB

(from USB1 line), 1 x micro

AB USB 3.0 via switch (from

USB1 line), 1 x micro B USB

2.0 (from USB2 line)

USB3.1 & USB2.0

1 x MIPI DSI (DSI0

& DSI1) + Touch

100-pin display

Connector

100- pin display connector.

Interfaces with Intrinysc

Display Adapter Board

MIPI Alliance Specification

v1.01. MIPI D-PHY

Specification v0.65, v0.81,

v0.90, v1.01

3 X PCIe

PCIe 0 PCIe signal to Wi-Fi

module. PCIe 1, 2 routed out

of SOM

PCI Express Specification,

Rev 2.1

Connectors

1 x MXM SOM

connector

Connector for SOM

314 pin edge connector

1 x SOM to Carrier

board to board

connector

B2B connector for SOM and

carrier board

100 pin board to board

connector

3.7.4 SOM RF Specification for WIFI, BT, GPS

The SOM includes the following radio interfaces:

o ANT1: Wi-Fi antenna 1 + BT

o ANT2: Wi-Fi antenna 2

o WGR7640: For GPS RF Front end

Antenna 1: The antenna 1 connector is for one of the two Wi-Fi antennas as well as the single Bluetooth

antenna. Antenna connector ANT1 is connected to the carrier board antenna via a coaxial cable.

Antenna 2: The antenna 2 connector is for the second Wi-Fi antenna. This antenna connector is also

connected to a carrier board PCB antenna via a coaxial cable.

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 18

Note that two dual-band (2.4GHz + 5GHz) antennas are required to be connected to achieve full performance

of the Wi-Fi interface. If only Bluetooth is being used, then only a single 2.4GHz antenna connected to ANT1

is necessary.

The SOM WiFi/BT module has received regulatory certifications (see FCC ID: 2AFDI-ITCNFA324 for details).

Please note that the on board PCB antennas were not the antennas used for the SOM WiFi/BT module

certification. Refer to the certification documents for the WiFi/ BT module (see R-4) for information regarding

the test configurations used for certification. Deviating from the documented configuration may trigger the

need for re-certification.

For details on connecting the WiFi module to the on board PCB antennas on the carrier board, refer to section

3.8.14 below.

WGR7640: GPS Front End WGR7640 is the primary GPS radio interface used on the Open-Q 820

development kit. This provides the RF capabilities for GNSS functions.

The following are the operating frequencies for WGR7640

GPS: 1574.42 MHz – 1576.42 MHz

GLONASS: 1598 MHz to 1606 MHz

For more information about connecting a GPS antenna to the development kit see section 3.8.15

below.

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 19

3.8 Open-Q™ Carrier Board

The Open-Q 820 Carrier board is a Mini-ITX form factor board with various connectors used for connecting

different peripherals. The following are the mechanical properties of the carrier board:

Dimensions

289 cm

2

(170mm x 170mm)

Form Factor

Mini-ITX

Major Interfaces

SOM: 314 pin FOXCONN connector

SOM: 100 pin board to board connector

Display: 100 pin carrier board connector

Thermal

Thermal pad is placed between the SOM and carrier

board

3.8.1 Dip switch S10 Configuration Options

There is a DIP switch S10 on the top side of the Open-Q™ 820 carrier board. The 8-bit switch allows the user

to control the system configuration and boot options. Table 3.8-1 below outlines the pin outs and connections

of these DIP switches.

Table 3.8-1 Dip Switch HW / SW Configuration

Function

DIP

Switch Description Notes

FORCED_USB_BOOT S10-1

Toggles between FORCE USB boot and EDL

mode. Enables FOCE USB (GPIO 57) when

DIP switch turned on

Default out of the box configuration is OFF

which is the EDL mode

Note: FORCE USB boot option not

supported by Lantronix

JTAG_PS_HOLD S10-2

Enables the JTAG_PS_HOLD mode when DIP

switch turned on

Default out of the box configuration is OFF

Note: Lantronix does not provide software

support for JTAG

BOOT_CONFIG[3] S10-3

Enables APQ boot configuration 3 when DIP

switch turned on. Controlled by APQ GPIO104

See schematic for boot configuration options.

NOTE: Some boot configurations are not

supported on the development kit. Default out of the box configuration is ON

BOOT_CONFIG[2] S10-4

Enables APQ boot configuration 2 when DIP

switch turned on. Controlled by APQ-GPIO103 Default out of the box configuration is OFF

BOOT_CONFIG[1] S10-5

Enables APQ boot configuration 1 when DIP

switch turned on. Controlled by APQ-GPIO

102

Default out of the box configuration is OFF

Open-Q™ 820 Development Kit

Open-Q™ 820 Dev Kit User Guide 20

Function

DIP

Switch Description Notes

WATCHDOG _DISABLE S10-6

Enables WATCHDOG_DISABLE when DIP

switch turned on. Controlled by APQ-GPIO

101

Default out of the box configuration is OFF

N/C

S10-7

NA

GPS_ANT_SEL S10-8

Option to select which antenna to use for GPS.

When DIP switch ON GPS external antenna is

being used (SMA connector). When switch

OFF, GPS printed antenna is being used (on-

board)

Default out of the box configuration is OFF

Warning!: Before making any changes to the dip switch, make sure to note down the previous configuration.

The default switch settings are below.

3.8.2 Open-Q™ 820 Carrier Board Expansion Connectors

Table 3.8-2 lists the connectors, expansions and their usages on the carrier board:

Table 3.8-2 Carrier Board Expansion Options and Their Usage

Domain

Description

Specification

Usage

Power

AC / Barrel charger

12 V DC Power Supply

5 A

Power Supply

Power connector

20 pin header

For providing extra current to

camera connectors when

needed (ie: when high

performance cameras used)

Debug Serial via USB

Debug Serial UART console over

USB for development

Vertical USB Micro B connector

Development Serial

Connector for debug output

via USB

JTAG

OS / Firmware /QFROM

Programming / Debugging JTAG

Standard 20-pin connector,

ARM and OpenDSP – Lauterbach

QFROM / eMMC / Platform

EEPROM programming

ARM / Open DSP debugging

Note : JTAG is not supported

Buttons

General Purpose SW button

SMD Button

Additional button for general

purpose

Power Button

SMD Button

Power Button for Suspend /

Resume and Power off

Volume Keys

Volume + key

SMD Button

Volume +Key

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Lantronix Open-Q™ 820 Development Kit User guide

Lantronix Open-Q™ 820 Development Kit User guide

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