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Lantronix Open-Q™ 626 µSOM Development Kit User guide

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Open-Q™ 626 Development Kit
User Guide
Part Number PMD-00037
Revision A August 2020
Open-Q™ 626 Dev Kit User Guide 2
Your use of this document is subject to and governed by those terms and conditions in the
LICENSE AND PURCHASE TERMS AND CONDITIONS FOR INTRINSYC DEVELOPMENT
PLATFORM KITS, which you or the legal entity you represent, as the case may be, accepted and
agreed to when purchasing a Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part of the defined term
“Documentation” for purposes of the Agreement, solely in support of your permitted use of the
Development Kit under the Agreement. Distribution of this document is strictly prohibited without
the express written permission of Intrinsyc Technologies Corporation and its respective licensors,
which they can withhold, condition or delay in its sole discretion.
Lantronix is a trademark of Lantronix, Inc., registered in the United States and other countries.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other
countries.
Qualcomm® is a trademark of Qualcomm® Incorporated, registered in the United States and
other countries. Other product and brand names used herein may be trademarks or registered
trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-
export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly
prohibited.
© 2020 Lantronix, Inc. All rights reserved.
Contacts
Lantronix, Inc.
7535 Irvine Center Drive, Suite 100
Irvine, CA 92618, USA
Toll Free: 800-526-8766
Phone: 949-453-3990
Fax: 949-453-3995
IES Customer Support Portal
https://helpdesk.intrinsyc.com
Lantronix Technical Support
http://www.lantronix.com/support
Sales Offices
For a current list of our domestic and international sales offices, go to the Lantronix web site at
http://www.lantronix.com/about-us/contact/
Open-Q™ 626 Dev Kit User Guide 3
Revision History
Date
Rev.
Comments
September 2017
1.0
Initial release.
Intrinsyc document number: ITC-01RND1278-UG-001
October 2017
1.1
Cleaned up typos, updated photos, added sections:
• Getting Started
• Battery config switches
• Optional Accessories
August 2020
A
Initial Lantronix document.
Added Lantronix document part number, Lantronix logo,
branding, contact information, and links.
For the latest revision of this product document, please go to: http://tech.intrinsyc.com
.
Open-Q™ 626 Dev Kit User Guide 4
Contents
1 Introduction 6
1.1 Purpose ___________________________________________________________ 6
1.2 Scope _____________________________________________________________ 6
1.3 Intended Audience ___________________________________________________ 6
2 Documents 7
2.1 Applicable Documents ________________________________________________ 7
2.2 Reference Documents ________________________________________________ 7
2.4 Terms and Acronyms _________________________________________________ 8
2.5 List of Figures ______________________________________________________ 10
2.6 List of Tables ______________________________________________________ 10
3 Open-Q 626 Development Kit 11
3.1 Introduction _______________________________________________________ 11
3.2 Development Platform Notice __________________________________________ 11
3.3 Anti-Static Handling Procedures _______________________________________ 11
3.4 Kit Contents _______________________________________________________ 11
3.5 Software __________________________________________________________ 13
3.6 Hardware Identification Label __________________________________________ 14
3.7 Optional Accessories ________________________________________________ 14
3.8 Getting Started with the Development Kit ________________________________ 14
3.8.1 Configuration Switch Settings ______________________________________ 14
3.8.2 Powering up the Open-Q 626 Development Kit _________________________ 14
3.8.3 Display Options _________________________________________________ 15
3.9 Development Kit Block Diagram ________________________________________ 16
3.10 Open-Q 626 SOM __________________________________________________ 17
3.10.1 SOM Mechanical Properties ______________________________________ 17
3.10.2 SOM Block Diagram _____________________________________________ 17
3.10.3 Hardware Specification __________________________________________ 18
3.10.4 SOM RF Antenna Interfaces for WIFI/BT and GPS _____________________ 20
3.11 Open-Q 626 Carrier Board ____________________________________________ 22
3.11.1 Dip switch S10 Configuration Options _______________________________ 22
3.11.2 Battery Power Configuration Switch Options __________________________ 23
3.11.3 Carrier Board Expansion Connectors _______________________________ 23
3.11.4 DC Power Input J21 _____________________________________________ 27
3.11.5 Battery Header J300 ____________________________________________ 28
3.11.6 Power Probe Header J86 _________________________________________ 29
3.11.7 Debug Serial UART over USB J22 _________________________________ 29
3.11.8 Sensor IO Expansion Header J53 __________________________________ 30
3.11.9 MISC GPIO header J54 __________________________________________ 32
Open-Q™ 626 Dev Kit User Guide 5
3.11.10 Audio Headset Jack J27 ________________________________________ 34
3.11.11 Audio Input Expansion Header J50 ________________________________ 34
3.11.12 Audio Output Expansion Header J26 _______________________________ 36
3.11.13 On-board PCB WLAN Antenna ___________________________________ 37
3.11.14 Carrier Board GPS Front-end and Antenna Options ___________________ 38
3.11.15 Open-Q Display _______________________________________________ 38
3.11.16 HDMI Connector J25 ___________________________________________ 39
3.11.17 Display Connector J2 ___________________________________________ 39
3.11.18 Camera Connectors ____________________________________________ 41
3.11.19 Power Header via 20 Pin Connector J60 ____________________________ 47
3.11.20 USB 2.0 Client Port Operation ____________________________________ 48
3.11.21 USB 3.0 Interface Operation _____________________________________ 50
Open-Q™ 626 Dev Kit User Guide 6
1 Introduction
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™ 626 Development
Kit based on the Qualcomm™ 626 (APQ8053-Pro) Processor.
For more background information on this development kit, visit:
https://www.lantronix.com/products/open-q-
626-usom-development-kit/
1.2 Scope
This document will cover the following items on the Open-Q 626 Development Kit:
• Block Diagram and Overview
• Hardware Features
• Configuration
• SOM
• Carrier Board
• Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the Lantronix Open-Q
626 Development Kit.
2: Documents
Open-Q™ 626 Dev Kit User Guide 7
2 Documents
This section lists the supplementary documents for the Open-Q 626 development kit.
2.1 Applicable Documents
Reference
Title
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development
Kit
2.2 Reference Documents
Reference
R-1
R-2
2: Documents
Open-Q™ 626 Dev Kit User Guide 8
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial
interfaces like UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only
memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SOM
System on Module
2: Documents
Open-Q™ 626 Dev Kit User Guide 9
Term and acronyms
Definition
SPMI
System Power Management Interface
(Qualcomm® PMIC / baseband proprietary
protocol)
SSBI
Single wire serial bus interface (Qualcomm®
proprietary mostly PMIC / Companion chip and
baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed
2: Documents
Open-Q™ 626 Dev Kit User Guide 10
2.4 List of Figures
Figure 1 Open-Q 626 Development Kit ................................................................................................ 12
Figure 2 Open-Q 626 + Carrier Board Block Diagram ......................................................................... 16
Figure 3 Open-Q 626 SOM ................................................................................................................. 17
Figure 4 SOM Block Diagram ............................................................................................................... 18
Figure 5 SOM RF Antenna Connectors ............................................................................................... 21
Figure 6 12V DC Power Jack (J21) ...................................................................................................... 27
Figure 7 Battery Header (J300) ............................................................................................................ 28
Figure 8 Power Probe Header (J86) .................................................................................................... 29
Figure 9 Debug UART over USB (J22) ................................................................................................ 29
Figure 10 Sensor Expansion Header (J23) .......................................................................................... 30
Figure 11 MISC GPIO header (J54) ..................................................................................................... 32
Figure 12 Audio Headset Jack (J27) .................................................................................................... 34
Figure 13 Audio Input Expansion Header (J50) ................................................................................... 34
Figure 14 Audio Output Expansion Header (J26) ................................................................................ 36
Figure 15 On-board PCB Trace Antenna for Wi-Fi/BT ......................................................................... 37
Figure 16 HDMI Type A Connector (J25) ............................................................................................. 39
Figure 17 100-Pin Display Connector (J2) ........................................................................................... 39
Figure 18 Display Board Default Configuration .................................................................................... 41
Figure 19 Camera Connectors (J5, J4, J3) .......................................................................................... 42
Figure 20 Power Connector (J60) ........................................................................................................ 47
Figure 21 USB2.0 for ADB (J2500) ...................................................................................................... 48
Figure 22 USB Type C to USB 2.0 Cable ............................................................................................ 49
Figure 23 Example USB Type C Memory Stick ................................................................................... 50
Figure 24 USB Type C to Type C Cable .............................................................................................. 50
Figure 25 USB Type C to USB 3.0 Type A Cable ................................................................................ 50
2.5 List of Tables
Table 3.1 Open-Q 626 Development Kit Hardware Features .............................................................. 18
Table 3.2 Dip Switch HW / SW configuration ....................................................................................... 22
Table 3.3 Carrier Board Expansion Options and Usage ...................................................................... 23
Table 3.4 Battery Header Pin Descriptions .......................................................................................... 28
Table 3.5 SOM Power Probe Header ................................................................................................... 29
Table 3.6 Sensor Expansion Header J53 Pin out ................................................................................ 30
Table 3.7 GPIO Header Power Outputs ............................................................................................... 32
Table 3.8 MISC GPIO Header J54 Pin Out .......................................................................................... 33
Table 3.9 Audio Input Expansion Header J50 Pin out ......................................................................... 35
Table 3.10 Audio Output Expansion Header J26 Pin out ..................................................................... 36
Table 3.11 GPS Antenna Selection Switch .......................................................................................... 38
Table 3.12 Display Connector Power Outputs ..................................................................................... 40
Table 3.13 MIPI CSI Camera Connector Pinouts (J5, J4, J3) .............................................................. 43
Table 3.14. MIPI CSI Camera Use Cases ............................................................................................ 46
Table 3.15 Power Header Pin-out ........................................................................................................ 47
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 11
3 Open-Q 626 Development Kit
3.1 Introduction
The Open-Q 626 provides a quick reference or evaluation platform for Qualcomm’s 626 chipset. This kit is suited
for Android / Linux application developers, OEMs, consumer manufacturers, hardware component vendors,
video surveillance, robotics, camera vendors, and flash chip vendors to evaluate, optimize, test and deploy
applications that can utilize the Qualcomm® 626 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering development,
engineering evaluation, or demonstration purposes only and is meant for use in a controlled environment. This
device is not being placed on the market, leased or sold for use in a residential environment or for use by the
general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available consumer
device including those requirements specified in the European Union directives applicable for Radio devices
being placed on the market, FCC equipment authorization rules or other regulations pertaining to consumer
devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have obtained
the necessary regulatory approvals for experimentation using a radio device and have appropriate technical
training. The device may not be used by members of the general population or other individuals that have not
been instructed on methods for conducting controlled experiments and taking necessary precautions for
preventing harmful interference and minimizing RF exposure risks. Additional RF exposure information can be
found on the FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 626 Development Kit has exposed electronics and chipsets. Proper anti-static precautions should
be employed when handling the kit, including but not limited to:
• Using a grounded anti-static mat
• Using a grounded wrist or foot strap
3.4 Kit Contents
The Open-Q 626 Development Kit includes the following:
o Open-Q 626 System on Module (SOM) with the Qualcomm APQ8053-Pro processor
o Open-Q 626 Mini-ITX form-factor carrier board
o 4.5” FWVGA (480x854) 16.7 M LCD (optional accessory)
o AC power adapter
o HDMI cable.
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 12
See the diagram and list below for locations of the key components, interfaces, and controls.
Figure 1 Open-Q 626 Development Kit
List of features highlighted in above photo:
1. WLAN PCB Antenna
2. Audio output expansion header
3. Volume + button
4. General Purpose button
5. Audio input expansion header
6. 12V DC input jack
1
3
4
8
11
13
17
19
21
15
2
5
9
12
25
6
16
7
14
20
28
29
31
33
32
30
27
22
10
23
34
26
24
18
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 13
7. Power source switch
8. Battery connector
9. Battery charge config switch
10. HDMI video output
11. 3.5 mm headset jack
12. Power header
13. USB Type-C connector
14. Debug UART (USB MicroB)
15. GPS ext. ant. SMA connector
16. GPS PCB Antenna (on bottom)
17. MIPI camera 2 connector
18. Micro SD slot (on bottom)
19. MIPI camera 1 connector
20. MIPI camera 0 connector
21. Sensor board header
22. Configuration DIP switches
23. 3 x LEDs
24. SOM power measurement header
25. GPIO expansion header
26. Volume - button
27. Power button
28. MIPI DSI LCD/touchscreen connector to interface with LAntronix display adapter
29. 16GB eMMC flash memory
30. APQ8053 CPU
31. 2GB LPDDR3 RAM memory
32. GPS antenna connector U.FL
33. WLAN antenna connector U.FL
34. Open-Q 626 System on Module (SOM)
3.5 Software
The development kit comes with Android software pre-programmed on the SOM. Please see the Lantronix
support site for further information about the software like Release Notes, Programmer’s Guide and other
available software versions. The support site is at: http://tech.intrinsyc.com
and registration of your
development kit is required.
The software version number can be checked in the “Android settings -> About Phone -> Build Number”, and
cross-referenced with the release notes to confirm which features are supported and what known issues there
are with the specific software release you have.
To register your development kit, please visit: https://tech.intrinsyc.com/account/register
and you will require
the serial number from the SOM as described in the next section.
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 14
3.6 Hardware Identification Label
Labels are present on the SOM and the carrier board. The following information is conveyed on these two
boards:
SOM: Serial number, WIFI MAC address
Carrier board: Serial number
Note: Please retain the SOM and carrier board serial numbers for warranty purposes.
Refer to http://tech.intrinsyc.com/projects/serialnumber/wiki
for more details about locating the serial number,
as this is needed to register your development kit on the Lantronix support site.
3.7 Optional Accessories
1. LCD / Touchscreen
2. 13MP Camera module
Please see the Lantronix website/store or contact Lantronix for availability of camera modules, sensor boards,
and other accessories:
www.shop.intrinsyc.com
sales@lantronix.com
3.8 Getting Started with the Development Kit
This section explains how to set up the Open-Q 626 Development Kit and start using it.
3.8.1 Configuration Switch Settings
1. S10 DIP switches - The configuration DIP switches (S10) are by default in the OFF position and this is
the correct position for normal boot and operation. For more details about the configuration switch
settings see section 3.9.1.
2. S300 power switch – this switch should be set to the “BUCK” position to operate the board from the
12V power input. To operate from battery power, see sections 3.11.2 and 3.11.5 for more details.
3. S1 battery configuration DIP switch – All S1 DIP switches are ON by default and should be left in that
position for normal operation from the 12V power input.
3.8.2 Powering up the Open-Q 626 Development Kit
To power-up the board, perform the following steps below:
1. At a static-safe workstation, remove the development kit board carefully from the anti-static bag.
2. If not using the optional LCD display, connect the HDMI output from the development kit to an HDMI
monitor.
3. Connect the Power Adapter to the 12V DC Jack and then press and hold the power button until you
see the Lantronix logo appear on the display (~3 seconds).
4. If using an HDMI monitor then plug a USB mouse into the USB Type-C connector to navigate the UI
on the HDMI display.
5. If using the optional LCD display you can navigate using the touchscreen on the display.
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 15
3.8.3 Display Options
The Open-Q 626 Development Kit can be used with either the optional LCD touch panel, which mounts onto
the carrier board, or with an external HDMI monitor. The LCD functions as the Android primary display and the
HDMI is the secondary display and mirrors the primary. This is the default setting and no configuration change
is required to use either display. The HDMI output can be used with or without the LCD panel installed.
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 16
3.9 Development Kit Block Diagram
The Open-Q 626 development platform consists of the Open-Q 626 SOM and the Carrier Board. The following
block diagram shows the interconnectivity and peripherals on the development kit.
Open
-Q 626 Dev Kit
Open
-Q
tm
626 SOM
GPIO
PMI8952
PMIC
SPMI
4 lane
Control / SPI / I
2
C
4
lane
CCI
UART
SPMI
PM
8953
PMIC/Codec
GPIO
Camera
Conn 0
DC Input
Conn
Battery
connector
Power &
Batt Chg
Circuits
Pwr
Switches
& LEDs
UART / SPI / I
2
C / GPIO
Debug UART
microUSB
Display
connector
WiFi / BT
WCN3680B
IQ + SSBI
4 lane
Control / SPI / I
2
C
HDMI
Output
Conn
4 lane
CCI
Camera
Conn 1
UART / SPI / I
2
C / GPIO
CCI
Camera
Conn 2
UART / SPI / I
2
C / GPIO
HS
SS
USB3
Type C
connector
3.5mm
Headset
Jack
µSD
socket
SDIO
Sensor Header
UART
/ SPI / I
2
C / GPIO
APQ8053
eMMC
flash
LPDDR3
RAM
DSI 0
UART
USB 0
SDC2
BLSP
SDC1 EBI
PDM
DSI-HDMI
Bridge
BLSP/GPIO
USB
3
Switch
For TypeC
USB SS
SW select
Audio
Input Header
Audio I
/O
WiFi/BT Ant
Conn
WCN
baseband
FTDI
Serial USB
VBUS
To Battery
Charge
Circuits
I2S Audio
4 Lane
BLSP
CSI 2
BLSP
CSI 1
BLSP
CSI 0
DSI 1
I2S Audio Out
Audio Inputs
GPIO Expansion Header
BLSP/GPIO
From PMIC
GPIO/MPP
WRG7640
GNSS
Receiver
GNSS Ant Conn
IQ + CNTL
PCB Trace
Antenna
PCB Trace
Antenna
U
.FL
U.FL
U.FL
U.FL
GNSS
Front-end
Boot Mode
Switches
JTAG
JTAG
TPs
SOM Power
Probe
Pwr
Pwr
Coin
Cell
Boot
Mode
Audio
Output Header
Audio Outputs
SMA
Antenna
Conn
Figure 2 Open-Q 626 + Carrier Board Block Diagram
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 17
3.10 Open-Q 626 SOM
This section describes some details of the SOM. The SOM provides the basic common set of features with
minimal integration efforts for end users.
It contains the following:
• Qualcomm 626 (APQ8053-Pro) main application processor
• LPDDR3 up to 933MHz (1866Mbps) 2GB RAM
• PMI8952 + PM8953 – power management, battery charging, regulators, audio codec,
housekeeping
• WCN3680B Wi-Fi + BT combo chip
• 16GB eMMC v5.0 Flash Memory.
• WGR7640 GPS Receiver Front End
Figure 3 Open-Q 626 SOM
3.10.1 SOM Mechanical Properties
Size
50 mm x 25 mm (12.5 cm
2
)
Interface
3 x 100-pins Hirose DF40 connectors
(B2B Connector).
Shielding
Top side shields for the WiFi/BT & GPS
front ends are installed by default.
3.10.2 SOM Block Diagram
The Open-Q 626 SOM measuring 50mm x 25mm is where all the processing occurs. It is connected to the
carrier board via three 100 pin Hirose DF40 connectors. The purpose of these connectors is to bring out
essential signals such that other peripherals can be connected to the platform.
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 18
Open-
Q
626 SOM
GPIO
PMI8952
PMIC
MIPI DSI0 4 lane
Control / SPI / I
2
C
MIPI CSI0 4 lane
CCI_I²C
UART
SPMI
PM8953
PMIC/Codec
GPIO
UART / SPI / I
2
C / GPIO
WiFi / BT
WCN3680B
IQ + SSBI
MIPI DSI1 4 lane
Control / SPI / I
2
C
MIPI CSI1 4 lane
CCI_I²C
UART / SPI / I
2
C / GPIO
CCI_I²C
UART / SPI / I
2
C / GPIO
USB HS
USB SS
SDIO
UART / SPI / I
2
C / GPIO
eMMC
flash
LPDDR3
RAM
BLSP/GPIO
Audio I/O
WiFi/BT Ant
Conn
I²S Audio
MIPI CSI2 4 Lane
WRG7640
GNSS
Receiver
GNSS Ant Conn
IQ + CNTL
U.FL
U.FL
Boot Mode Switches
JTAG
TPs
Pwr
Coin Cell Batt
APQ
8053
DSI 0
UART
USB
0
SDC2
BLSP
SDC1 EBI
PDM
WCN
baseband
BLSP
CSI 2
BLSP
CSI 1
BLSP
CSI 0
DSI 1
I2S Audio Out
JTAG
Boot
Mode
BLSP/GPIO
Figure 4 SOM Block Diagram
3.10.3 Hardware Specification
The Open-Q 626 platform has the following hardware features:
Table 3.1 Open-Q 626 Development Kit Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
APQ8053-Pro
Qualcomm® 626 Processor
Octa-core, 64-bit ARM Cortex-
A53 up to 2.2GHz.
Adreno 506 GPU
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 19
Subsystem /
Connectors
Feature Set
Description
Specification
Hexagon 546 DSP
PMIC (PM8953 &
PMI8952)
Qualcomm® PMIC,
companion power
management chips for
APQ8053-Pro processor
NA
Memory
2GB LPDDR3
DDR3 Low Power Memory
Up to 1866MHz LPDDR3 BGA
chip. Supports via 4x16bit
channels
16 GB eMMC
Primary Storage for platform.
Mainly used for storing SW
applications and user data
etc.
eMMC v5.0 on board.
Connectivity
Wi-Fi 2.4 GHz/
5GHz
Qualcomm WCN3680B Wi-Fi
+ BT Combo Chip
802.11a/b/g/n/ac 2.4/5.0 GHz
1X1
BT 2.4 GHz
Qualcomm WCN3680B Wi-Fi
+ BT Combo Chip
Supports BT 4.2 + BR/EDR +
BLE.
GPS via WGR7640
GPS Frontend
GPS, GLONASS, COMPASS
RF Interfaces
1x WLAN / BT
Connect to antenna on
carrier board via coax cable
2.4/ 5 GHz
1x GPS
Connect to antenna on
carrier board via coax cable
GPS/GLONASS/COMPASS
Interfaces
3x MIPI CSI
Camera Connectors
CSI0, CSI1, CSI2
MIPI Alliance Specification
v1.0
1x USB 3.0 HS/SS
1 x USB Type C receptacle
with USB 3.0/2.0
USB3.0/2.0
1x MIPI DSI (DSI0
& DSI1) + Touch
100-pin display
Connector
100- pin display connector.
Interfaces with Lantronix
Display Adapter Board
MIPI Alliance Specification
v1.01. MIPI D-PHY
Specification v0.65, v0.81,
v0.90, v1.01
1x HDMI output
HDMI transmitter output
video and embedded 2-
channel audio
148.5 MHz maximum TMDS
output clock frequency
3: Open-Q 626 Development Kit
Open-Q™ 626 Dev Kit User Guide 20
Subsystem /
Connectors
Feature Set
Description
Specification
supports video resolutions up
to 1080p at 60Hz.
2-channel audio up to 192kHz
1x µSD Socket
Accepts µSD memory card.
Push-push type socket.
SDIO Card Specification
version 3.0.
Secure Digital: Physical Layer
Specification version 3.0.
1x 3.5mm Headset
Jack
4 conductor jack
Stereo audio output and mono
microphone input
2x Audio I/O
Headers
1x Header for audio input
expansion: 2x10 pin, 0.1in
1x Header for audio output
expansion: 2x10 pin, 0.1in
1x Header for audio input
expansion: 2x analog
microphone and 1x digital
microphone, and Power.
1x Header for audio output
expansion: Line out, speaker
out, earpiece out, and Power.
1x GPIO
Expansion Header
1x Header for GPIO
expansion: 2x10 pin 0.1in
GPIO, SPI, UART, MI²S, and
Power.
1x Sensor
Expansion Header
1x Header for sensor
expansion: 2x12pin, 0.1in
Accelerometer, Gyro,
Magnetometer, Touchscreen,
I²C, SPI, and Power.
1x Debug UART
USB microB
FT232RQ Serial to USB bridge
Connector
3 x board to board
connector
Connectors to interface with
carrier board
Hirose DF40C series 100pin
connector
3.10.4 SOM RF Antenna Interfaces for WIFI/BT and GPS
The SOM includes the following two antenna interfaces:
o WiFi/BT: U.FL type coaxial connector for WCN3680B Wi-Fi/BT Combo Chip
o GPS: U.FL type coaxial connector for WGR7640 GPS RF Front end
/