Lantronix Open-Q™ 626 µSOM Development Kit User guide

Brand: Lantronix

Model: Open-Q™ 626 µSOM Development Kit

Type: User guide

Open-Q™ 626 Development Kit

User Guide

Part Number PMD-00037

Revision A August 2020

Open-Q™ 626 Dev Kit User Guide 2

Your use of this document is subject to and governed by those terms and conditions in the

LICENSE AND PURCHASE TERMS AND CONDITIONS FOR INTRINSYC DEVELOPMENT

PLATFORM KITS, which you or the legal entity you represent, as the case may be, accepted and

agreed to when purchasing a Development Kit from Intrinsyc Technologies Corporation

(“Agreement”). You may use this document, which shall be considered part of the defined term

“Documentation” for purposes of the Agreement, solely in support of your permitted use of the

Development Kit under the Agreement. Distribution of this document is strictly prohibited without

the express written permission of Intrinsyc Technologies Corporation and its respective licensors,

which they can withhold, condition or delay in its sole discretion.

Lantronix is a trademark of Lantronix, Inc., registered in the United States and other countries.

Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other

countries.

Qualcomm® is a trademark of Qualcomm® Incorporated, registered in the United States and

other countries. Other product and brand names used herein may be trademarks or registered

trademarks of their respective owners.

This document contains technical data that may be subject to U.S. and international export, re-

export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly

prohibited.

Contacts

Lantronix, Inc.

7535 Irvine Center Drive, Suite 100

Irvine, CA 92618, USA

Toll Free: 800-526-8766

Phone: 949-453-3990

Fax: 949-453-3995

IES Customer Support Portal

https://helpdesk.intrinsyc.com

Lantronix Technical Support

http://www.lantronix.com/support

Sales Offices

For a current list of our domestic and international sales offices, go to the Lantronix web site at

http://www.lantronix.com/about-us/contact/

Open-Q™ 626 Dev Kit User Guide 3

Revision History

Date

Rev.

Comments

September 2017

1.0

Initial release.

Intrinsyc document number: ITC-01RND1278-UG-001

October 2017

1.1

Cleaned up typos, updated photos, added sections:

• Getting Started

• Battery config switches

• Optional Accessories

August 2020

Initial Lantronix document.

Added Lantronix document part number, Lantronix logo,

branding, contact information, and links.

For the latest revision of this product document, please go to: http://tech.intrinsyc.com

Open-Q™ 626 Dev Kit User Guide 4

Contents

1 Introduction 6

1.1 Purpose ___________________________________________________________ 6

1.2 Scope _____________________________________________________________ 6

1.3 Intended Audience ___________________________________________________ 6

2 Documents 7

2.1 Applicable Documents ________________________________________________ 7

2.2 Reference Documents ________________________________________________ 7

2.4 Terms and Acronyms _________________________________________________ 8

2.5 List of Figures ______________________________________________________ 10

2.6 List of Tables ______________________________________________________ 10

3 Open-Q 626 Development Kit 11

3.1 Introduction _______________________________________________________ 11

3.2 Development Platform Notice __________________________________________ 11

3.3 Anti-Static Handling Procedures _______________________________________ 11

3.4 Kit Contents _______________________________________________________ 11

3.5 Software __________________________________________________________ 13

3.6 Hardware Identification Label __________________________________________ 14

3.7 Optional Accessories ________________________________________________ 14

3.8 Getting Started with the Development Kit ________________________________ 14

3.8.1 Configuration Switch Settings ______________________________________ 14

3.8.2 Powering up the Open-Q 626 Development Kit _________________________ 14

3.8.3 Display Options _________________________________________________ 15

3.9 Development Kit Block Diagram ________________________________________ 16

3.10 Open-Q 626 SOM __________________________________________________ 17

3.10.1 SOM Mechanical Properties ______________________________________ 17

3.10.2 SOM Block Diagram _____________________________________________ 17

3.10.3 Hardware Specification __________________________________________ 18

3.10.4 SOM RF Antenna Interfaces for WIFI/BT and GPS _____________________ 20

3.11 Open-Q 626 Carrier Board ____________________________________________ 22

3.11.1 Dip switch S10 Configuration Options _______________________________ 22

3.11.2 Battery Power Configuration Switch Options __________________________ 23

3.11.3 Carrier Board Expansion Connectors _______________________________ 23

3.11.4 DC Power Input J21 _____________________________________________ 27

3.11.5 Battery Header J300 ____________________________________________ 28

3.11.6 Power Probe Header J86 _________________________________________ 29

3.11.7 Debug Serial UART over USB J22 _________________________________ 29

3.11.8 Sensor IO Expansion Header J53 __________________________________ 30

3.11.9 MISC GPIO header J54 __________________________________________ 32

Open-Q™ 626 Dev Kit User Guide 5

3.11.10 Audio Headset Jack J27 ________________________________________ 34

3.11.11 Audio Input Expansion Header J50 ________________________________ 34

3.11.12 Audio Output Expansion Header J26 _______________________________ 36

3.11.13 On-board PCB WLAN Antenna ___________________________________ 37

3.11.14 Carrier Board GPS Front-end and Antenna Options ___________________ 38

3.11.15 Open-Q Display _______________________________________________ 38

3.11.16 HDMI Connector J25 ___________________________________________ 39

3.11.17 Display Connector J2 ___________________________________________ 39

3.11.18 Camera Connectors ____________________________________________ 41

3.11.19 Power Header via 20 Pin Connector J60 ____________________________ 47

3.11.20 USB 2.0 Client Port Operation ____________________________________ 48

3.11.21 USB 3.0 Interface Operation _____________________________________ 50

Open-Q™ 626 Dev Kit User Guide 6

1 Introduction

1.1 Purpose

The purpose of this user guide is to provide primary technical information on the Open-Q™ 626 Development

Kit based on the Qualcomm™ 626 (APQ8053-Pro) Processor.

For more background information on this development kit, visit:

https://www.lantronix.com/products/open-q-

626-usom-development-kit/

1.2 Scope

This document will cover the following items on the Open-Q 626 Development Kit:

• Block Diagram and Overview

• Hardware Features

• Configuration

• SOM

• Carrier Board

• Display Board for LCD (Optional)

1.3 Intended Audience

This document is intended for users who would like to develop custom applications on the Lantronix Open-Q

626 Development Kit.

2: Documents

Open-Q™ 626 Dev Kit User Guide 7

2 Documents

This section lists the supplementary documents for the Open-Q 626 development kit.

2.1 Applicable Documents

Reference

Title

A-1

Intrinsyc Purchase and Software License Agreement for the Open-Q

Development

Kit

2.2 Reference Documents

Reference

Title

R-1

Open-Q 626 Schematics (SOM, Carrier)

R-2

Open-Q 626 Dev Kit SOM Tech Note

2: Documents

Open-Q™ 626 Dev Kit User Guide 8

2.3 Terms and Acronyms

Term and acronyms

Definition

AMIC

Analog Microphone

ANC

Audio Noise Cancellation

B2B

Board to Board

BLSP

Bus access manager Low Speed Peripheral (Serial

interfaces like UART / SPI / I2C/ UIM)

BT LE

Bluetooth Low Energy

CSI

Camera Serial Interface

DSI

MIPI Display Serial Interface

EEPROM

Electrically Erasable Programmable Read only

memory

eMMC

Embedded Multimedia Card

FCC

US Federal Communications Commission

FWVGA

Full Wide Video Graphics Array

GPS

Global Positioning system

HDMI

High Definition Media Interface

HSIC

High Speed Inter Connect Bus

JTAG

Joint Test Action Group

LNA

Low Noise Amplifier

MIPI

Mobile Industry processor interface

MPP

Multi-Purpose Pin

NFC

Near Field Communication

Radio Frequency

SATA

Serial ATA

SLIMBUS

Serial Low-power Inter-chip Media Bus

SOM

System on Module

2: Documents

Open-Q™ 626 Dev Kit User Guide 9

Term and acronyms

Definition

SPMI

System Power Management Interface

(Qualcomm® PMIC / baseband proprietary

protocol)

SSBI

Single wire serial bus interface (Qualcomm®

proprietary mostly PMIC / Companion chip and

baseband processor protocol)

UART

Universal Asynchronous Receiver Transmitter

UFS

Universal Flash Storage

UIM

User Identity module

USB

Universal Serial Bus

USB HS

USB High Speed

USB SS

USB Super Speed

2: Documents

Open-Q™ 626 Dev Kit User Guide 10

2.4 List of Figures

Figure 1 Open-Q 626 Development Kit ................................................................................................ 12

Figure 2 Open-Q 626 + Carrier Board Block Diagram ......................................................................... 16

Figure 3 Open-Q 626 SOM ................................................................................................................. 17

Figure 4 SOM Block Diagram ............................................................................................................... 18

Figure 5 SOM RF Antenna Connectors ............................................................................................... 21

Figure 6 12V DC Power Jack (J21) ...................................................................................................... 27

Figure 7 Battery Header (J300) ............................................................................................................ 28

Figure 8 Power Probe Header (J86) .................................................................................................... 29

Figure 9 Debug UART over USB (J22) ................................................................................................ 29

Figure 10 Sensor Expansion Header (J23) .......................................................................................... 30

Figure 11 MISC GPIO header (J54) ..................................................................................................... 32

Figure 12 Audio Headset Jack (J27) .................................................................................................... 34

Figure 13 Audio Input Expansion Header (J50) ................................................................................... 34

Figure 14 Audio Output Expansion Header (J26) ................................................................................ 36

Figure 15 On-board PCB Trace Antenna for Wi-Fi/BT ......................................................................... 37

Figure 16 HDMI Type A Connector (J25) ............................................................................................. 39

Figure 17 100-Pin Display Connector (J2) ........................................................................................... 39

Figure 18 Display Board Default Configuration .................................................................................... 41

Figure 19 Camera Connectors (J5, J4, J3) .......................................................................................... 42

Figure 20 Power Connector (J60) ........................................................................................................ 47

Figure 21 USB2.0 for ADB (J2500) ...................................................................................................... 48

Figure 22 USB Type C to USB 2.0 Cable ............................................................................................ 49

Figure 23 Example USB Type C Memory Stick ................................................................................... 50

Figure 24 USB Type C to Type C Cable .............................................................................................. 50

Figure 25 USB Type C to USB 3.0 Type A Cable ................................................................................ 50

2.5 List of Tables

Table 3.1 Open-Q 626 Development Kit Hardware Features .............................................................. 18

Table 3.2 Dip Switch HW / SW configuration ....................................................................................... 22

Table 3.3 Carrier Board Expansion Options and Usage ...................................................................... 23

Table 3.4 Battery Header Pin Descriptions .......................................................................................... 28

Table 3.5 SOM Power Probe Header ................................................................................................... 29

Table 3.6 Sensor Expansion Header J53 Pin out ................................................................................ 30

Table 3.7 GPIO Header Power Outputs ............................................................................................... 32

Table 3.8 MISC GPIO Header J54 Pin Out .......................................................................................... 33

Table 3.9 Audio Input Expansion Header J50 Pin out ......................................................................... 35

Table 3.10 Audio Output Expansion Header J26 Pin out ..................................................................... 36

Table 3.11 GPS Antenna Selection Switch .......................................................................................... 38

Table 3.12 Display Connector Power Outputs ..................................................................................... 40

Table 3.13 MIPI CSI Camera Connector Pinouts (J5, J4, J3) .............................................................. 43

Table 3.14. MIPI CSI Camera Use Cases ............................................................................................ 46

Table 3.15 Power Header Pin-out ........................................................................................................ 47

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 11

3 Open-Q 626 Development Kit

3.1 Introduction

The Open-Q 626 provides a quick reference or evaluation platform for Qualcomm’s 626 chipset. This kit is suited

for Android / Linux application developers, OEMs, consumer manufacturers, hardware component vendors,

video surveillance, robotics, camera vendors, and flash chip vendors to evaluate, optimize, test and deploy

applications that can utilize the Qualcomm® 626 series technology.

3.2 Development Platform Notice

This development platform contains RF/digital hardware and software intended for engineering development,

engineering evaluation, or demonstration purposes only and is meant for use in a controlled environment. This

device is not being placed on the market, leased or sold for use in a residential environment or for use by the

general public as an end user device.

This development platform is not intended to meet the requirements of a commercially available consumer

device including those requirements specified in the European Union directives applicable for Radio devices

being placed on the market, FCC equipment authorization rules or other regulations pertaining to consumer

devices being placed on the market for use by the general public.

This development platform may only be used in a controlled user environment where operators have obtained

the necessary regulatory approvals for experimentation using a radio device and have appropriate technical

training. The device may not be used by members of the general population or other individuals that have not

been instructed on methods for conducting controlled experiments and taking necessary precautions for

preventing harmful interference and minimizing RF exposure risks. Additional RF exposure information can be

found on the FCC website at http://www.fcc.gov/oet/rfsafety/

3.3 Anti-Static Handling Procedures

The Open-Q 626 Development Kit has exposed electronics and chipsets. Proper anti-static precautions should

be employed when handling the kit, including but not limited to:

• Using a grounded anti-static mat

• Using a grounded wrist or foot strap

3.4 Kit Contents

The Open-Q 626 Development Kit includes the following:

o Open-Q 626 System on Module (SOM) with the Qualcomm APQ8053-Pro processor

o Open-Q 626 Mini-ITX form-factor carrier board

o 4.5” FWVGA (480x854) 16.7 M LCD (optional accessory)

o AC power adapter

o HDMI cable.

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 12

See the diagram and list below for locations of the key components, interfaces, and controls.

Figure 1 Open-Q 626 Development Kit

List of features highlighted in above photo:

1. WLAN PCB Antenna

2. Audio output expansion header

3. Volume + button

4. General Purpose button

5. Audio input expansion header

6. 12V DC input jack

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 13

7. Power source switch

8. Battery connector

9. Battery charge config switch

10. HDMI video output

11. 3.5 mm headset jack

12. Power header

13. USB Type-C connector

14. Debug UART (USB MicroB)

15. GPS ext. ant. SMA connector

16. GPS PCB Antenna (on bottom)

17. MIPI camera 2 connector

18. Micro SD slot (on bottom)

19. MIPI camera 1 connector

20. MIPI camera 0 connector

21. Sensor board header

22. Configuration DIP switches

23. 3 x LEDs

24. SOM power measurement header

25. GPIO expansion header

26. Volume - button

27. Power button

28. MIPI DSI LCD/touchscreen connector to interface with LAntronix display adapter

29. 16GB eMMC flash memory

30. APQ8053 CPU

31. 2GB LPDDR3 RAM memory

32. GPS antenna connector U.FL

33. WLAN antenna connector U.FL

34. Open-Q 626 System on Module (SOM)

3.5 Software

The development kit comes with Android software pre-programmed on the SOM. Please see the Lantronix

support site for further information about the software like Release Notes, Programmer’s Guide and other

available software versions. The support site is at: http://tech.intrinsyc.com

and registration of your

development kit is required.

The software version number can be checked in the “Android settings -> About Phone -> Build Number”, and

cross-referenced with the release notes to confirm which features are supported and what known issues there

are with the specific software release you have.

To register your development kit, please visit: https://tech.intrinsyc.com/account/register

and you will require

the serial number from the SOM as described in the next section.

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 14

3.6 Hardware Identification Label

Labels are present on the SOM and the carrier board. The following information is conveyed on these two

boards:

SOM: Serial number, WIFI MAC address

Carrier board: Serial number

Note: Please retain the SOM and carrier board serial numbers for warranty purposes.

Refer to http://tech.intrinsyc.com/projects/serialnumber/wiki

for more details about locating the serial number,

as this is needed to register your development kit on the Lantronix support site.

3.7 Optional Accessories

1. LCD / Touchscreen

2. 13MP Camera module

Please see the Lantronix website/store or contact Lantronix for availability of camera modules, sensor boards,

and other accessories:

www.shop.intrinsyc.com

sales@lantronix.com

3.8 Getting Started with the Development Kit

This section explains how to set up the Open-Q 626 Development Kit and start using it.

3.8.1 Configuration Switch Settings

1. S10 DIP switches - The configuration DIP switches (S10) are by default in the OFF position and this is

the correct position for normal boot and operation. For more details about the configuration switch

settings see section 3.9.1.

2. S300 power switch – this switch should be set to the “BUCK” position to operate the board from the

12V power input. To operate from battery power, see sections 3.11.2 and 3.11.5 for more details.

3. S1 battery configuration DIP switch – All S1 DIP switches are ON by default and should be left in that

position for normal operation from the 12V power input.

3.8.2 Powering up the Open-Q 626 Development Kit

To power-up the board, perform the following steps below:

1. At a static-safe workstation, remove the development kit board carefully from the anti-static bag.

2. If not using the optional LCD display, connect the HDMI output from the development kit to an HDMI

monitor.

3. Connect the Power Adapter to the 12V DC Jack and then press and hold the power button until you

see the Lantronix logo appear on the display (~3 seconds).

4. If using an HDMI monitor then plug a USB mouse into the USB Type-C connector to navigate the UI

on the HDMI display.

5. If using the optional LCD display you can navigate using the touchscreen on the display.

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 15

3.8.3 Display Options

The Open-Q 626 Development Kit can be used with either the optional LCD touch panel, which mounts onto

the carrier board, or with an external HDMI monitor. The LCD functions as the Android primary display and the

HDMI is the secondary display and mirrors the primary. This is the default setting and no configuration change

is required to use either display. The HDMI output can be used with or without the LCD panel installed.

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 16

3.9 Development Kit Block Diagram

The Open-Q 626 development platform consists of the Open-Q 626 SOM and the Carrier Board. The following

block diagram shows the interconnectivity and peripherals on the development kit.

Open

-Q 626 Dev Kit

Open

-Q

626 SOM

GPIO

PMI8952

PMIC

SPMI

4 lane

Control / SPI / I

lane

CCI

UART

SPMI

8953

PMIC/Codec

GPIO

Camera

Conn 0

DC Input

Conn

Battery

connector

Power &

Batt Chg

Circuits

Pwr

Switches

& LEDs

UART / SPI / I

C / GPIO

Debug UART

microUSB

Display

connector

WiFi / BT

WCN3680B

IQ + SSBI

4 lane

Control / SPI / I

HDMI

Output

Conn

4 lane

CCI

Camera

Conn 1

UART / SPI / I

C / GPIO

CCI

Camera

Conn 2

UART / SPI / I

C / GPIO

USB3

Type C

connector

3.5mm

Headset

Jack

µSD

socket

SDIO

Sensor Header

UART

/ SPI / I

C / GPIO

APQ8053

eMMC

flash

LPDDR3

RAM

DSI 0

UART

USB 0

SDC2

BLSP

SDC1 EBI

PDM

DSI-HDMI

Bridge

BLSP/GPIO

USB

Switch

For TypeC

USB SS

SW select

Audio

Input Header

Audio I

WiFi/BT Ant

Conn

WCN

baseband

FTDI

Serial USB

VBUS

To Battery

Charge

Circuits

I2S Audio

4 Lane

BLSP

CSI 2

BLSP

CSI 1

BLSP

CSI 0

DSI 1

I2S Audio Out

Audio Inputs

GPIO Expansion Header

BLSP/GPIO

From PMIC

GPIO/MPP

WRG7640

GNSS

Receiver

GNSS Ant Conn

IQ + CNTL

PCB Trace

Antenna

PCB Trace

Antenna

.FL

U.FL

GNSS

Front-end

Boot Mode

Switches

JTAG

TPs

SOM Power

Probe

Pwr

Coin

Cell

Boot

Mode

Audio

Output Header

Audio Outputs

SMA

Antenna

Conn

Figure 2 Open-Q 626 + Carrier Board Block Diagram

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 17

3.10 Open-Q 626 SOM

This section describes some details of the SOM. The SOM provides the basic common set of features with

minimal integration efforts for end users.

It contains the following:

• Qualcomm 626 (APQ8053-Pro) main application processor

• LPDDR3 up to 933MHz (1866Mbps) 2GB RAM

• PMI8952 + PM8953 – power management, battery charging, regulators, audio codec,

housekeeping

• WCN3680B Wi-Fi + BT combo chip

• 16GB eMMC v5.0 Flash Memory.

• WGR7640 GPS Receiver Front End

Figure 3 Open-Q 626 SOM

3.10.1 SOM Mechanical Properties

Size

50 mm x 25 mm (12.5 cm

)

Interface

3 x 100-pins Hirose DF40 connectors

(B2B Connector).

Shielding

Top side shields for the WiFi/BT & GPS

front ends are installed by default.

3.10.2 SOM Block Diagram

The Open-Q 626 SOM measuring 50mm x 25mm is where all the processing occurs. It is connected to the

carrier board via three 100 pin Hirose DF40 connectors. The purpose of these connectors is to bring out

essential signals such that other peripherals can be connected to the platform.

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 18

Open-

626 SOM

GPIO

PMI8952

PMIC

MIPI DSI0 4 lane

Control / SPI / I

MIPI CSI0 4 lane

CCI_I²C

UART

SPMI

PM8953

PMIC/Codec

GPIO

UART / SPI / I

C / GPIO

WiFi / BT

WCN3680B

IQ + SSBI

MIPI DSI1 4 lane

Control / SPI / I

MIPI CSI1 4 lane

CCI_I²C

UART / SPI / I

C / GPIO

CCI_I²C

UART / SPI / I

C / GPIO

USB HS

USB SS

SDIO

UART / SPI / I

C / GPIO

eMMC

flash

LPDDR3

RAM

BLSP/GPIO

Audio I/O

WiFi/BT Ant

Conn

I²S Audio

MIPI CSI2 4 Lane

WRG7640

GNSS

Receiver

GNSS Ant Conn

IQ + CNTL

U.FL

Boot Mode Switches

JTAG

TPs

Pwr

Coin Cell Batt

APQ

8053

DSI 0

UART

USB

SDC2

BLSP

SDC1 EBI

PDM

WCN

baseband

BLSP

CSI 2

BLSP

CSI 1

BLSP

CSI 0

DSI 1

I2S Audio Out

JTAG

Boot

Mode

BLSP/GPIO

Figure 4 SOM Block Diagram

3.10.3 Hardware Specification

The Open-Q 626 platform has the following hardware features:

Table 3.1 Open-Q 626 Development Kit Hardware Features

Subsystem /

Connectors

Feature Set

Description

Specification

Chipset

APQ8053-Pro

Qualcomm® 626 Processor

Octa-core, 64-bit ARM Cortex-

A53 up to 2.2GHz.

Adreno 506 GPU

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 19

Subsystem /

Connectors

Feature Set

Description

Specification

Hexagon 546 DSP

PMIC (PM8953 &

PMI8952)

Qualcomm® PMIC,

companion power

management chips for

APQ8053-Pro processor

Memory

2GB LPDDR3

DDR3 Low Power Memory

Up to 1866MHz LPDDR3 BGA

chip. Supports via 4x16bit

channels

16 GB eMMC

Primary Storage for platform.

Mainly used for storing SW

applications and user data

etc.

eMMC v5.0 on board.

Connectivity

Wi-Fi 2.4 GHz/

5GHz

Qualcomm WCN3680B Wi-Fi

+ BT Combo Chip

802.11a/b/g/n/ac 2.4/5.0 GHz

1X1

BT 2.4 GHz

Qualcomm WCN3680B Wi-Fi

+ BT Combo Chip

Supports BT 4.2 + BR/EDR +

BLE.

GPS via WGR7640

GPS Frontend

GPS, GLONASS, COMPASS

RF Interfaces

1x WLAN / BT

Connect to antenna on

carrier board via coax cable

2.4/ 5 GHz

1x GPS

Connect to antenna on

carrier board via coax cable

GPS/GLONASS/COMPASS

Interfaces

3x MIPI CSI

Camera Connectors

CSI0, CSI1, CSI2

MIPI Alliance Specification

v1.0

1x USB 3.0 HS/SS

1 x USB Type C receptacle

with USB 3.0/2.0

USB3.0/2.0

1x MIPI DSI (DSI0

& DSI1) + Touch

100-pin display

Connector

100- pin display connector.

Interfaces with Lantronix

Display Adapter Board

MIPI Alliance Specification

v1.01. MIPI D-PHY

Specification v0.65, v0.81,

v0.90, v1.01

1x HDMI output

HDMI transmitter output

video and embedded 2-

channel audio

148.5 MHz maximum TMDS

output clock frequency

3: Open-Q 626 Development Kit

Open-Q™ 626 Dev Kit User Guide 20

Subsystem /

Connectors

Feature Set

Description

Specification

supports video resolutions up

to 1080p at 60Hz.

2-channel audio up to 192kHz

1x µSD Socket

Accepts µSD memory card.

Push-push type socket.

SDIO Card Specification

version 3.0.

Secure Digital: Physical Layer

Specification version 3.0.

1x 3.5mm Headset

Jack

4 conductor jack

Stereo audio output and mono

microphone input

2x Audio I/O

Headers

1x Header for audio input

expansion: 2x10 pin, 0.1in

1x Header for audio output

expansion: 2x10 pin, 0.1in

1x Header for audio input

expansion: 2x analog

microphone and 1x digital

microphone, and Power.

1x Header for audio output

expansion: Line out, speaker

out, earpiece out, and Power.

1x GPIO

Expansion Header

1x Header for GPIO

expansion: 2x10 pin 0.1in

GPIO, SPI, UART, MI²S, and

Power.

1x Sensor

Expansion Header

1x Header for sensor

expansion: 2x12pin, 0.1in

Accelerometer, Gyro,

Magnetometer, Touchscreen,

I²C, SPI, and Power.

1x Debug UART

USB microB

FT232RQ Serial to USB bridge

Connector

3 x board to board

connector

Connectors to interface with

carrier board

Hirose DF40C series 100pin

connector

3.10.4 SOM RF Antenna Interfaces for WIFI/BT and GPS

The SOM includes the following two antenna interfaces:

o WiFi/BT: U.FL type coaxial connector for WCN3680B Wi-Fi/BT Combo Chip

o GPS: U.FL type coaxial connector for WGR7640 GPS RF Front end

Page is loading ...

Lantronix Open-Q™ 626 µSOM Development Kit User guide

Lantronix Open-Q™ 626 µSOM Development Kit User guide

Lantronix Open-Q™ 626 µSOM Development Kit User guide

Related papers

Other documents