MPC8540 PowerQUICC III Integrated Host Processor Reference Manual, Rev. 1
xx Freescale Semiconductor
Contents
Paragraph
Number Title
Page
Number
13.3.1.11 Transfer Error Check Disable Register (LTEDR)................................................13-27
13.3.1.12 Transfer Error Interrupt Enable Register (LTEIR) .............................................. 13-28
13.3.1.13 Transfer Error Attributes Register (LTEATR).....................................................13-29
13.3.1.14 Transfer Error Address Register (LTEAR).......................................................... 13-30
13.3.1.15 Local Bus Configuration Register (LBCR).........................................................13-31
13.3.1.16 Clock Ratio Register (LCRR).............................................................................. 13-32
13.4 Functional Description................................................................................................. 13-33
13.4.1 Basic Architecture.................................................................................................... 13-34
13.4.1.1 Address and Address Space Checking ................................................................ 13-34
13.4.1.2 External Address Latch Enable Signal (LALE) .................................................. 13-35
13.4.1.3 Data Transfer Acknowledge (TA) .......................................................................13-36
13.4.1.4 Data Buffer Control (LBCTL)............................................................................. 13-37
13.4.1.5 Atomic Operation ................................................................................................ 13-37
13.4.1.6 Parity Generation and Checking (LDP)............................................................... 13-38
13.4.1.7 Bus Monitor......................................................................................................... 13-38
13.4.2 General-Purpose Chip-Select Machine (GPCM).....................................................13-38
13.4.2.1 Timing Configuration .......................................................................................... 13-39
13.4.2.2 Chip-Select Assertion Timing .............................................................................13-44
13.4.2.2.1 Programmable Wait State Configuration......................................................... 13-44
13.4.2.2.2 Chip-Select and Write Enable Negation Timing.............................................13-44
13.4.2.2.3 Relaxed Timing ............................................................................................... 13-45
13.4.2.2.4 Output Enable (LOE
) Timing.......................................................................... 13-48
13.4.2.2.5 Extended Hold Time on Read Accesses..........................................................13-48
13.4.2.3 External Access Termination (LGTA
)................................................................. 13-49
13.4.2.4 Boot Chip-Select Operation................................................................................. 13-50
13.4.3 SDRAM Machine.................................................................................................... 13-51
13.4.3.1 Supported SDRAM Configurations.....................................................................13-51
13.4.3.2 SDRAM Power-On Initialization ........................................................................13-52
13.4.3.3 Intel PC133 and JEDEC-Standard SDRAM Interface Commands..................... 13-52
13.4.3.4 Page Hit Checking ............................................................................................... 13-53
13.4.3.5 Page Management................................................................................................ 13-54
13.4.3.6 SDRAM Address Multiplexing ........................................................................... 13-54
13.4.3.7 SDRAM Device-Specific Parameters.................................................................. 13-55
13.4.3.7.1 Precharge-to-Activate Interval......................................................................... 13-55
13.4.3.7.2 Activate-to-Read/Write Interval...................................................................... 13-56
13.4.3.7.3 Column Address to First Data Out—CAS
Latency......................................... 13-56
13.4.3.7.4 Last Data In to Precharge—Write Recovery...................................................13-56
13.4.3.7.5 Refresh Recovery Interval (RFRC) ................................................................. 13-57
13.4.3.7.6 External Address and Command Buffers (BUFCMD).................................... 13-57
13.4.3.8 SDRAM Interface Timing ................................................................................... 13-58