Sanyo VPC-TH1EXBL User manual

Type
User manual
SERVICE MANUAL
Contents
1. OUTLINE OF CIRCUIT DESCRIPTION ............................... 3
2. DISASSEMBLY ................................................................... 12
3. ELECTRICAL ADJUSTMENT ............................................. 18
4. USB STORAGE INFORMATION REGISTRATION ............ 24
5. TROUBLESHOOTING GUIDE............................................ 25
6. PARTS LIST........................................................................ 26
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS........... C1
CAUTION : Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
NOTE : 1. Parts order must contain model number, part number, and description.
2. Substitute parts may be supplied as the service parts.
3. N. S. P. : Not available as service parts.
Design and specification are subject to change without notice.
SG314/U, EX, GX, U2, EX2, GX2, U3, EX3, GX3, U4 (R)
REFERENCE No. SM5310773
FILE NO.
Dual Camera
RoHS
This product does not contain any hazardous substances prohibited by the RoHS
Directive.
WARNING
You are requested to use RoHS compliant parts for maintenance or repair.
You are requested to use lead-free solder.
(This product has been manufactured using lead-free solder. Be sure to follow the
warning given on page 2 when carrying out repair work.)
VPC-TH1
(Product Code : 168 173 02)
(U.S.A.) (Canada) (Taiwan) (General)
VPC-TH1EX
(Product Code : 168 173 03)
(Europe) (U.K.) (South America)
(China) (Australia) (Hong Kong)
(Russia) (Middle East) (Africa)
(General) (Korea) (Taiwan)
VPC-TH1GX
(Product Code : 168 173 04)
(South America) (China)
(Australia) (Hong Kong)
(General) (Korea) (Taiwan)
VPC-TH1R
(Product Code : 168 173 06)
(U.S.A.) (Canada) (Taiwan) (General)
VPC-TH1EXR
(Product Code : 168 173 07)
(Europe) (U.K.) (South America)
(China) (Australia) (Hong Kong)
(Russia) (Middle East) (Africa)
(General) (Korea) (Taiwan)
VPC-TH1GXR
(Product Code : 168 173 08)
(South America) (China)
(Australia) (Hong Kong)
(General) (Korea) (Taiwan)
VPC-TH1BL
(Product Code : 168 173 10)
(U.S.A.) (Canada) (Taiwan) (General)
VPC-TH1EXBL
(Product Code : 168 173 11)
(Europe) (U.K.) (South America)
(China) (Australia) (Hong Kong)
(Russia) (Middle East) (Africa)
(General) (Korea) (Taiwan)
VPC-TH1GXBL
(Product Code : 168 173 12)
(South America) (China)
(Australia) (Hong Kong)
(General) (Korea) (Taiwan)
VPC-ZH1R
(Product Code : 168 173 13)
(U.S.A.) (Canada)
– 2 –
WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40°C (86 -
104°F) higher than solder containing lead, and moreover it does
not contain lead which attaches easily to other metals. As a
result, it does not melt as easily as solder containing lead, and
soldering will be more difficult even if the temperature of the
soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450°C (842°F). It
should also have as good temperature recovery characteris-
tics as possible.
Set the temperature to 350°C (662°F) or less for chip compo-
nents, to 380°C (716°F) for lead wires and similar, and to 420°C
(788°F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or in
a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Lead-free solder is available for purchase as a service tool.
Use the following part number when ordering:
Part name: Lead-free solder with resin (0.5 mm dia., 500 g)
Part number: VJ8-0270
Metal content
Tin (Sn) Silver (Ag)
Copper (Cu)
Composition
ratio by weight
96.5 %
3.0 %
0.5 %
Note:
If replacing existing solder containing lead with lead-free sol-
der in the soldered parts of products that have been manufac-
tured up until now, remove all of the existing solder at those
parts before applying the lead-free solder.
The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of
special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part
designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.
PRODUCT SAFETY NOTICE
– 3 –
1. OUTLINE OF CIRCUIT DESCRIPTION
1-1. CMOS CIRCUIT DESCRIPTION
1. IC Configuration
The CMOS peripheral circuit block basically consists of the
following ICs.
IC911 (MT9J001I12STCV)
CMOS imager
CDS, AGC, ADC built-in
H driver, V driver, serial communication circuit built-in
2. IC911 (CMOS)
[Structure]
The electric charges which are generated when each pixel is
optically converted are in turn converted into signal voltages
by the FD amplifier, and they are then transmitted by the built-
in H driver and V driver. The signals are sampled and ampli-
fied by the CDS and PGA circuits at the point they are output,
and then they are AD converted and output. The output uses
the 12 bit LVDS interface.
1/2.3-inch positive pixel array CMOS-type fixed imaging ele-
ment
Effective pixels 3856 (H) X 2764 (V)
– 4 –
1-2. CP1 and VF1 CIRCUIT DESCRIPTION
1. Circuit Description
1-1. Digital clamp
The optical black section of the extracts averaged values from
the subsequent data to make the black level of the output
data uniform for each line. The optical black section averaged
value for each line is taken as the sum of the value for the
previous line multiplied by the coefficient k and the value for
the current line multiplied by the coefficient 1-k.
1-2. Signal processor
1. γ correction circuit
This circuit performs (gamma) correction in order to maintain
a linear relationship between the light input to the camera
and the light output from the picture screen.
2. Color generation circuit
This circuit converts the image sensor into RGB signals.
3. Matrix circuit
This circuit generates the Y signals, R-Y signals and B-Y sig-
nals from the RGB signals.
4. Horizontal and vertical aperture circuit
This circuit is used gemerate the aperture signal.
1-3. AE/AWB and AF computing circuit
The AE/AWB carries out computation based on a 64-segment
screen, and the AF carries out computations based on a 6-
segment screen.
1-4. SDRAM controller
This circuit outputs address, RAS, CAS and CS data for con-
trolling the SDRAM. It also refreshes the SDRAM.
1-5. Communication control
1. SDIO
This is the interface for the 8-bit microprocessor.
1-6. Digital encorder
It generates chroma signal from color difference signal.
2. Outline of Operation
When the shutter opens, the reset signals (ASIC and CPU)
and the serial signals (“take a picture” commands) from the
8-bit microprocessor are input and operation starts.
The picture data from CMOS passes through the A/D and
CDS, and is then input to the ASIC as digital data. The AF,
AE, AWB, shutter, and AGC value are computed from this
data, and three exposures are made to obtain the optimum
picture. The data which has already been stored in the SDRAM
is read by the CPU and color generation is carried out. Each
pixel is interpolated from the surrounding data as being ei-
ther R, G, and B primary color data to produce R, G and B
data. At this time, correction of the lens distortion which is a
characteristic of wide-angle lenses is carried out. After AWB
and γ processing are carried out, a matrix is generated and
aperture correction is carried out for the Y signal, and the
data is then compressed by JPEG and is then written to card
memory (SD card).
When the data is to be output to an external device, it is taken
data from the memory and output via the USB I/F. When played
back on the LCD and monitor, data is transferred from memery
to the SDRAM, and the image is then elongated so that it is
displayed over the SDRAM display area.
3. LCD Block
The LCD display circuit is located on the CP1 board and VF1
board, and consists of components such as a power circuit.
The signals from the ASIC are 8-bit digital signals, that is
input to the LCD directly. The 8-bit digital signals are con-
verted to RGB signals inside the LCD driver circuit . This LCD
has a 3-wire serial, and functions such as the brightness and
image quality are controlled.
Because the LCD closes more as the difference in potential
between the VCOM (common polar voltage: AC) and the R,
G and B signals becomes greater, the display becomes darker;
if the difference in potential is smaller, the element opens and
the LCD become brighter.
In addition, the timing pulses for signals other than the video
signals are also input from the ASIC directory to the LCD.
– 5 –
5. Video Clip Recording and Playback
5-1. Recording
The signal from the camera block is input to IC101 (ASIC). The
data that is input to the ASIC is input to SDRAM, and converts
this data to encoded MPEG4 data, after which it is written in
sequence onto the SD card as streaming data. At this time,
the audio signals that are input to the built-in microphone are
converted into digital data by the audio CODEC IC of IC183,
and they are then input to ASIC. The audio data is then en-
coded (AAC), and then it is written in sequence onto the SD
card together as streaming data with the image signals de-
scribed above.
5-2. Playback
The data is read from the SD card, and the encoded data is
decoded into image data where it is displayed by the LCD or
on a TV monitor. At the same time, the audio data is also de-
coded, and is input to IC182 as digital data. D/A conversion is
carried out at IC182, and the sound is then output to the speaker
or to the LINE OUT terminal.
6. Audio CODEC Circuit (IC182)
The audio signals from the microphone are converted into 16-
bit digital data. AD conversion is carried out at a maximum
sampling frequency of 48 kHz.
During audio playback, the 16-bit digital data is converted into
analog signals and these drive headphone through the speaker
or line out system and headphone amplifier. DA conversion is
carried out at a maximum sampling frequency of 48 kHz.
4. Lens drive block
4-1. Focus drive
The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK
and LENS_EN) which are output from the ASIC (IC101) are
used to drive (FOCUS A +, FOCUS A -, FOCUS B + and FO-
CUS B -) by the motor driver IC (IC951), and are then used to
microstep-drive the stepping motor for focusing operation. De-
tection of the standard focusing positions is carried out by
means of the photointerruptor (F_SENSE) inside the lens block.
4-2. Zoom drive
The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK
and LENS_EN) which are output from the ASIC (IC101) are
used to drive (ZOOM A +, ZOOM A -, ZOOM B + and ZOOM B
-) by the motor driver IC (IC951), and are then used to
microstep-drive the stepping motor for zooming operation. De-
tection of the standard zooming positions is carried out by
means of the photointerruptor (F_SENSE) inside the lens block.
4-3. Iris drive
The drive method is a galvanometer type without braking coil.
The output from the Hall sensor inside the lens is amplified by
the Hall amplifier circuit inside the IC951 lens drive IC, and the
difference between the current and target aperture determined
by the resulting output and the exposure amout (16 bit serial
signal (LENS_SDI) and (LENS_SCLK and LENS_EN)) output
from the ASIC (IC101) is input to the servo amplifier circuit
(IC951) to keep the aperture automatically controlled (DRIVE+
and DRIVE -) to the target aperture.
4-4. Shutter drive
Reverse voltage is applied to the above aperture drive coil to
operate the shutter. When the shutter operates, the SHUTTER
+ signal that is output from the ASIC (IC101) becomes high
(input to SHUTTER of IC951) and the shutter operates.
– 6 –
1-3. PWA POWER CIRCUIT DESCRIPTION
1. Outline
This is the main power circuit, and is comprised of the follow-
ing blocks.
Switching controller (IC501)
Motor system power output (L5301)
Digital 3.25 V power output (L5002)
Digital 1.2 V power output (L5003)
Backlight power output (Q5007, L5007)
Digital and CMOS 1.8 V power output (IC504, L5006)
CMOS analog 2.8 V power output (IC503, L5005)
2. Switching Controller (IC501)
This is the basic circuit which is necessary for controlling the
power supply for a PWM-type switching regulator, and is pro-
vided with seven built-in channels, only CH1 (motor system),
CH2 (digital 3.25 V), CH3 (digital 1.2 V) and CH7 (backlight)
are used.
Each power supply output is received, and the PWM duty is
varied so that each one is maintained at the correct voltage
setting level.
Feedback for the backlight power (CH7) is provided to the
both ends voltage of registance so that regular current can
be controlled to be current that was setting.
2-1. Short-circuit protection circuit
If output is short-circuited for the length of time determined
by the condenser which is connected to Pin (A6) of IC501, all
output is turned off. To reset, momentarily set the control sig-
nal (P ON) to repeat control, or temporarily disconnect the
input power supply.
3. Motor System Power Output
BOOST 5 V is output. Feedback for the 5.0 V output is pro-
vided to the switching controller (Pin (B7) of IC501) so that
PWM control can be carried out.
4. Digital 3.25 V Power Output
VDD3 is output. Feedback for the VDD3 is provided to the
swiching controller (Pin (F3) of IC501) so that PWM control
can be carried out.
5. Digital 1.2 V Power Output
VDD 1.2 is output. Feedback for the 1.2 V is provided to the
switching controller (Pin (C3) of IC501) so that PWM control
to be carried out.
6. Backlight Power Supply output
Regular current is being transmitted to LED for LCD back-
light. Feedback for the both ends voltage of registance that is
being positioned to in series LED are provided to the switch-
ing controller (Pin (C4) of IC501) so that PWM control to be
carried out.
7. Digital and CMOS 1.8 V Power Output
VDD 1.8 is output. Feedback for the VDD 1.8 is provided to
the switching controller (Pin (3) of IC504) so that PWM con-
trol to be carried out.
8. CMOS Analog 2.8 V Power Output
VAA 2.8 is output. Feedback for the VAA 2.8 is provided to the
switching controller (Pin (3) of IC503) so that PWM control to
be carried out.
– 7 –
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1. Charging Circuit
When UNREG power is supplied to the charge circuit and the
CHG signal from microprocessor becomes High (3.3 V), the
charging circuit starts operating and the main electorolytic
capacitor is charged with high-voltage direct current.
However, when the CHG signal is Low (0 V), the charging
circuit does not operate.
1-1. Charge switch
When the CHG signal switches to Hi, IC541 starts charging
operation.
1-2. Power supply filter
C5401 constitutes the power supply filter. They smooth out
ripples in the current which accompany the switching of the
oscillation transformer.
1-3. Oscillation circuit
This circuit generates an AC voltage (pulse) in order to in-
crease the UNREG power supply voltage when drops in cur-
rent occur. This circuit generates a drive pulse with a frequency
of approximately 200-300 kHz, and drive the oscillation trans-
former.
1-4. Oscillation transformer
The low-voltage alternating current which is generated by the
oscillation control circuit is converted to a high-voltage alter-
nating current by the oscillation transformer.
1-5. Rectifier circuit
The high-voltage alternating current which is generated at
the secondary side of T5401 is rectified to produce a high-
voltage direct current and is accumulated at electrolytic ca-
pacitor C5412.
1-6. Charge monitoring circuit
The functions programmed in the IC541 monitor oscillations
and estimate the charging voltage. If the voltage exceeds the
rated value, charging automatically stops. Then, the
ZCHG_DONE signal is changed to Lo output and a "charging
stopped" signal is sent to the microcomputer.
2. Light Emission Circuit
When FLCTL signal is input from the ASIC, the stroboscope
emits light.
2-1. Emission control circuit
When the FLCLT signal is input to the emission control cir-
cuit, Q5402 switches on and preparation is made to the light
emitting. Moreover, when a FLCLT signal becomes Lo, the
stroboscope stops emitting light.
2-2. Trigger circuit
The Q5402 is turned ON by the FLCLT signal and light emis-
sion preparation is preformed. Simultaneously, high voltage
pulses of several kV are emitted from the trigger coil and ap-
plied to the light emitter.
2-3. Light emitting element
When the high-voltage pulse form the trigger circuit is ap-
plied to the light emitting part, currnet flows to the light emit-
ting element and light is emitted.
Beware of electric shocks.
– 8 –
1-5. SYA CIRCUIT DESCRIPTION
1. Configuration and Functions
For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor
(IC301), and controls camera system condition (mode).
The 8-bit microprocessor handles the following functions.
1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control
46
NOT USED
-
See next page
Pin
Signal
1
2
3
4
5
6
7
8
9
11~14
15
16
17
18
19
20
24
26
27
28
29
33
34
35
36
37
38
39
42~44
47
40
45
ASIC_SCK
ZCARD
ZBACKUPCTL
CHG_CNT
HOT LINE
GREEN_LED
RED_LED
ST_CHG_ON
VDD2
SCAN IN4~1
ZUSB_DET
HDMI_HPD
ZCHG_DONE
TIMEOUT
BAT_UTX
BAT_URX
USB_ON
NOT USED
MRST
SW3.2ON
PON2
PLLEN
ERR
VSS3
VDD3
RDSEL
CLK (SFW)
DATA0 (SFW)
DC_IN
SCAN OUT2~0
ZOOM_SW_AD
ZAV_JACK
I/O
O
I
O
O
I
O
O
O
-
I
I
I
I
I
O
I
O
O
O
O
O
O
I
-
-
I
I
I
I
O
I
I
Outline
Serial clock output (CL required)
Card detection (SW3.2 V required)
Backup battery charge control
Camera charge permission
Hot line request from ASIC
Switch unit LED (green) (H= lighting)
Switch unit LED (red) (H= lighting)/ combine with UTX (CL required)
-
Keyscan input 4~1
USB power detection terminal (L= detection)
HDMI hot plug detection
Main condensor charge voltage detection
Charge done detection
Battery power detection IC UART sending
USB charge ON/OFF
(TGVD delete)
System reset (MRST)
SW 3.2 V power (L= 3.2 V)
Digital system power start-up signal
PLL enable signal
Charge error detection
-
-
Debugger select terminal
Debug CN
Debug CN
DC jack insertion detection (SW3.2 V required)
Keyscan output 2~0
Zoom key AD input
-
Cable detection
Battery power detection IC UART recieving
10
VSS2
-
-
21 SCAN_IN0
I
Keyscan input 0
22 PANEL_OPEN
I
Panel open detection (MR sensor)
23 KEY 2nd
I
S2 key input
Strobo charge control (H= charge)
25 NOT USED
I
(HDMI_INT delete)
30 NOT USED
I (I2CSDATA delete)
31 P ON
O Digital system power start-up signal
32 NAND_RESET
O OneNAND reset
41 HINGE
I
Panel rotation detection
– 9 –
Fig. 5-1 Internal Bus Communication System
2. Internal Communication Bus
The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the
camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the
camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication
between the 8-bit microprocessor, ASIC and SPARC lite circuits.
Table 5-1. 8-bit Microprocessor Port Specification
8-bit
Microprocessor
ASIC
SREQ
ASIC_SDO
ASIC_SDI
ASIC_SCK
MRST
PLLEN
60
61
50
-
S1 key input
51
KEY_1st
I
-
56
NOT USED - -
VSS1
BATTERY
I UNREG voltage detection
58
59
ZSREQ
I
Serial communication request signal (CL required)
XOUT O 4M oscillation output
VDD1
-
-
49
BAT_OFF
I
Battery OFF detection signal input
52
ZBOOT_COMREQ
I/O
ZBOOT output
53
ZRESET
I
SBM reset input
54
XCIN
I
32 k oscillation input
55
XCOUT
O
32 k oscillation output
57
XIN I
4M oscillation input
48
BAT_TMP
I
Battery temperature detection
Serial data output (CL required)
Camera temperature detection
62
INT_TEMP I
63
ASIC_SDI O
64
ASIC_SDO
I
Serial data input (CL required)
3. Key Operaiton
For details of the key operation, refer to the instruction manual.
Table 5-2. Key Operation
0
0
123
SCAN
OUT
SCAN
IN
PLAY
RIGHT
UP
1
2
VREC
TEST -
-
LEFT
PW_TEST
MENU
DOWN
-
4
SET
-
POWER
– 10 –
ASIC,
memory
CMOS
8 bit CPU
Power voltage
Power OFF
Play back
LCD finder
3.3 V 1.0 V 1.8 V
2.8 V (A)
2.8 V (D), 1.8 V (D)
3.2 V
OFF
OFF
32KHz
OFF
OFF
32KHz
ON
ON
4 MHz
ON
OFF
4 MHz
Table 5-3. Camera Mode
Note) 4 MHz = Main clock operation, 32 kHz = Sub clock operation
4. Power Supply Control
The 8-bit microprocessor controls the power supply for the overall system.
The following is a description of how the power supply is turned on and off. When the battery is attached or DC IN input, a
regulated 3.2 V (power off: 2.4 V) voltage is normally input to the 8-bit microprocessor (IC301) by IC302, so that clock counting
and key scanning is carried out even when the power switch is turned off, so that the camera can start up again. When the battery
is removed and DC IN does not input, the 8-bit microprocessor operates in sleep mode using the backup battery. At this time, the
8-bit microprocessor only carries out clock counting, and waits in standby for the battery to be attached again or DC IN input.
When a switch is operated, the 8-bit microprocessor supplies power to the system as required.
The 8-bit microprocessor first set the P ON signal at pin (31) and the P ON2 signal at pin (29) to high, and then turns on the DC/
DC converter. After this, low signal is output from pin (27) so that the ASIC is set to the reset condition. After this these pins set
to high, and set to active condition. Once it is completed, the ASIC returns to the reset condition, all DC/DC converters are turned
off and the power supply to the whole system is halted.
Power switch ON - Auto power OFF
CAMERA
– 11 –
MEMO
– 12 –
B
B
D
A
D
E
C
E
A
C
F
F
G
I
G
H
H
I
1
2
3
4
5
6
7
8
8
9
10
11
12
13
14
15
16
17
18
3
19
20
21
21
22
23
24
25
26
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
52
a
b
c
a
b
c
A
B
A
B
A
B
2. DISASSEMBLY
2-1. REMOVAL OF CABINET BOTTOM, CABINET TOP, CABINET BACK, TB4 BOARD AND CABINET FRONT
NOTE: Discharge a strobe capacitor with the
discharge jig (VJ8-0188) for electric shock prevention.
When assembling,
tighten the screws order.
a b c
When assembling,
assemble order.
A B
When assembling,
tighten the screws order.
a b c
When assembling,
assemble order.
A B
When assembling,
assemble order.
A B
13
1. Cover battery
2. Spacer bottom
3. Spacer LCD
4. Spacer LCD front
5. Screw 1.7 x 7
6. Three screws 1.7 x 3
7. Screw 1.7 x 3
8. Three screws 1.7 x 4
9. Remove the cabi bottom from the main body.
10. Screw 1.7 x 3
11. Holder strap front
12. Spacer blind
13. Screw 1.7 x 3
14. Holder strap back
15. Two screws 1.7 x 4
16. Stand
17. Remove the solder.
18. Screw 1.7 x 3
19. Screw 1.7 x 3
20. Cabinet top
21. Spacer cabi front
22. Flexible pwb CP1 & TB4
23. Cover SD
24. Screw 1.7 x 3
25. Two screws 1.7 x 3
26. Two screws 1.7 x 3
27. Remove the cabinet back from the main body.
28. Cover DC
29. Three screws 1.7 x 4
30. Holder back
31. Two screws 1.7 x 4
32. TB4 board
33. FPC
34. Unit, zoom
35. Flexible pwb CP1 & TB4
36. Button select
37. Holder button bas
38. Button menu
39. Button rec play
40. Button movie
41. Button shutter
42. Spacer mic
43. Remove the solder.
44. Two screws 1.7 x 4
45. Holder bottom
46. Spacer shield wire
47. Connector
48. Two screws 1.7 x 2
49. Dec joint
50. Two screws 1.7 x 4
51. Screw 1.7 x 3
52. Two screws 1.7 x 3
53. Compl, cabinet front
54. Screw 1.7 x 3
55. Screw 1.7 x 3
42. Spacer mic
53. Compl, cabinet front
Note:
Do not tuck the
lead wires.
46. Spacer shield wire
14
F
D
D
I
B
H
B
A
E
C
A
G
C
I
E
H
J
F
J
K
K
G
1
a
b
c
a
b
c
2
3
4
5
d
d
6
c
7
b
8
a
a
9
10
11
12
13
14
15
16
16
17
18
22
20, 24
21
19
19
23
23
23
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
40
41
42
43
44
45
46
46
47
48
49
50
2-2. REMOVAL OF TB1 BOARD, LENS, ST1 BOARD, CP1 BOARD AND TB3 BOARD
When assembling,
tighten the screws order.
a b c d
When assembling,
tighten the screws order.
a b c
When assembling,
tighten the screws order.
a b c
15
1. Three screws 1.7 x 3
2. Connector
3. TB1 board
4. Three screws 1.7 x 2.5
5. Two screws 1.7 x 3
6. Screw 1.7 x 4
7. Screw 1.7 x 3
8. Two screws 1.7 x 3
9. Heat sink CMOS
10. Holder TB1
11. Spacer CA
12. Screw 1.7 x 2.5
13. Holder CA
14. FPC
15. Connector
16. Two screws 1.7 x 4
17. Two screws 1.7 x 4
18. Holder lens chassis
19. Holder lens
20. Remove the lens part.
21. Holder lens
22. Spacer lens bottom
23. Three screws 1.4 x 3.5
24. Lens
25. Screw 1.7 x 2
26. Heat sink tape CMOS
27. Holder heat CMOS TB1
28. Assy, flexible pwb CA1 + mounting lens
29. Two screws 1.7 x 7
30. Screw 1.7 x 3
31. Connector
32. ST1 board
33. Spacer ST1
34. Remove the solder.
35. Assy, lamp
36. Cover triger
37. Remove the solder.
38. Spacer con ST1
39. Flexible pwb CP1 & TB3
40. Four screws 1.7 x 3
41. CP1 board
42. Flexible pwb CP1 & TB3
43. Heat sink rub ASIC
44. Screw 1.4 x 2
45. Earth jack
46. Two screws 1.7 x 3
47. Chassis bottom
26. Heat sink tape CMOS
35. Assy lamp dressing method
35. Assy lamp soldering order
39, 42. Flexible pwb CP1 & TB3
48. Three screws 1.7 x 2.5
49. TB3 board
50. Chassis right
16
A
A
A
B
A
B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
19
20
21
22
23
24
2-3. REMOVAL OF TB2 BOARD, VF1 BOARD AND LCD
1. Screw 1.7 x 2
2. Screw 1.7 x 3
3. Holder wire
4. Spacer holder joint
5. Two screws 1.7 x 3
6. Holder joint
7. Cabinet right
8. Button power
9. Cover joint
10. Two screws 1.7 x 3
11. Cover LCD back
12. Remove the solder.
13. Connector
14. Assy, joint
15. Screw 1.7 x 2
16. TB2 board
17. Spacer LCD FPC
18. FPC
19. Two screws 1.7 x 3
4. Spacer holder joint
3. Holder wire
20. VF1 board
21. Spacer pwb
22. Holder LCD
23. LCD
24. Cover LCD front
When assembling,
assemble order.
A B
When assembling,
assemble order.
A B
17. Spacer LCD FPC
17
2-4. BOARD LOCATION
TB4 board
TB1 board
TB3 board
CP1 board
ST1 board
TB2 board
VF1 board
– 18 –
3. ELECTRICAL ADJUSTMENT
3-1. Table for Servicing Tools
J-9: Fluorescent tube viewer: HAKUBA light viewer 5700
Download the calibration software and the firmware
from the following URL.
http://www.digital-sanyo.com/overseas/service/
Place the DscCalDi.exe file, camapi32.dll file and
QrCodeInfo.dll file together into a folder of your
choice.
3-2. Equipment
1. AC adaptor
2. PC (IBM R -compatible PC, Windows 2000 or XP or Vista)
3-3. Adjustment Items and Order
1. Optical Axis Adjustment
2. Lens Adjustment (Infinity)
3. Lens Adjustment (1m)
4. AWB Adjustment
5. CMOS White Point Defect Detect Adjustment
6. CMOS Black Point And White Point Defect Detect Adjust-
ment In Lighted
Note: If the lens, board and changing the part, it is necessary
to adjust again. Item 1-6 adjustments should be carried out in
sequence.
*Adjustment environment
Temperature: 25 ± 10 degrees, Humidity: 55 ± 25 %
3-4. Setup
1. System requirements
Windows 2000 or XP or Vista
IBM R -compatible PC with pentium processor
USB port
40 MB RAM
Hard disk drive with at least 15 MB available
VGA or SVGA monitor with at least 256-color display
2. Pattern box
Turn on the switch and wait for 30 minutes for aging to take
place before using Color Pure. It is used after adjusting the
chroma meter (VJ8-0192) adjust color temperature to 3100 ±
20 K and luminosity to 900 ± 20 cd/m
2
. Be careful of handling
the lump and its circumference are high temperature during
use and after power off for a while.
3. Computer screen during adjustment
3-5. Connecting the camera to the computer
1. Use the supplied dedicated USB interface cable to connect
the camera to the computer.
2. Turn on the camera.
3. Choose the “COMPUTER”, and press the SET button.
Next, choose the “CARD READER”, and press the SET
button.
Ref. No.
Name
Part code
J-1
J-2
J-3
VJ8-0190
Pattern box
Calibration software
J-4
Number
1
1
1
Chroma meter
VJ8-0192
1
Spare lump (pattern box)
VJ8-0191
J-5
J-1 J-3
J-4
J-5
1
Discharge jig
VJ8-0188
J-6
1
Collimator
VJ8-0260
J-7
1
Spare lump (collimator)
VJ8-0282
J-8
1
Siemens star chart
J-8
Firmware
Data
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
PAF Cal.
LCD Type
H AFC Test
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
J-9
1
Fluorescent tube viewer
19
3-8. Adjust Specifications
1. Optical Axis Adjustment
Preparation:
POWER switch: ON
Note:
Do not vibrate during the adjustment.
Adjustment method:
1. Set a distance of 1.0-3.0 cm between the camera lens and
the white part of fluorescent tube viewer.
(Do not enter any light.)
2. Double-click on the DscCalDi.exe.
3. Input 251 to the CalMode, and click the OK.
4. Adjustment value will appear on the screen.
5. Click the OK.
2. Lens Adjustment (Infinity)
3-6. The adjustment item which in necessary in part exchange
COMPL PWB CP1
Factory
Cord
Setting
Language
Setting
COMPL PWB VF1
COMPL PWB ST1
COMPL PWB TB1
Reset
Setting
COMPL PWB TB4
Lens
Adjust-
ment
(1 m)
AWB
Adjust-
ment
USB
storage
information
registration
CMOS
White Point
Defect
Detect
Adjustment
CMOS Black
Point And
White Point
Defect Detect
Adjustment
In Lighted
: Be sure to carry out the necessary adjustments after replacing the unit.
: Adjustment is possible from the menu setting screen of the camera and by using the calibration software.
COMPL PWB TB2
COMPL PWB TB3
Lens
Adjust-
ment
(Infinity)
ASSY, FLEXIBLE PWB CA1
3-7. Updating the firmware
Check the firmware version immediately after the CP1 board has been replaced. If an old version is being used, interfer-
ence and errors in operation may also occur. If an old version is being used, update it with a newer version.
Refer to
3-13. Firmware uploading procedure. (Page 23)
Optical
Axis
Adjust-
ment
Camera
Collimator
Camera
1.0~3.0 cm
Fluorescent
tube viewer
20
Preparation:
POWER switch: ON
If using a ready-made collimator, set to infinity.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Adjustment method:
1. Set the camera so that it becomes center of the siemens
star chart in the collimator (zoom wide and tele).
(Set a distance of 0.5-1.0 cm between camera lens and
collimator lens. Do not touch the each lens.)
2. Set the camera so that it becomes center of the screen in
the collimator.
3. Double-click on the DscCalDi.exe.
4. Select Infinity Cal. on the LCD Test, and click the Ye s .
5. Lens infinity adjustment value will appear on the screen.
6. Click the OK.
3. Lens Adjustment (1m) is carried out after this adjust-
ment.
Adjustment value determination is effectuated using below val-
ues.
The adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
PZ_SW: ZSW
ZSW: adjustment value of zoom PI switch position
(-52<=ZSW<=34)
AF_I_WIDE: ZIW
ZIW: infinity adjustment value of focus at zoom position
wide (77<=ZIW<=78)
AF_I_MID1: ZIM1
ZIM1: infinity adjustment value of focus at zoom position
middle1 (96<=ZIM1<=96)
AF_I_MID2: ZIM2
ZIM2: infinity adjustment value of focus at zoom position
middle2 (115<=ZIM2<=114)
AF_I_MID3: ZIM3
ZIM3: infinity adjustment value of focus at zoom position
middle3 (138<=ZIM3<=137)
AF_I_MID4: ZIM4
ZIM4: infinity adjustment value of focus at zoom position
middle4 (194<=ZIM4<=195)
AF_I_MID5: ZIM5
ZIM5: infinity adjustment value of focus at zoom position
middle5 (237<=ZIM5<=238)
AF_I_MID6: ZIM6
ZIM6: infinity adjustment value of focus at zoom position
middle6 (288<=ZIM6<=287)
AF_I_MID7: ZIM7
ZIM7: infinity adjustment value of focus at zoom position
middle7 (348<=ZIM7<=348)
AF_I_MID8: ZIM8
ZIM8: infinity adjustment value of focus at zoom position
middle8 (471<=ZIM8<=470)
AF_I_TELE: ZIT
ZIT: infinity adjustment value of focus at zoom position
tele (200<=ZIT<=598)
IRIS_GAIN: g
g: adjustment value of gain (-128<=g<=127)
IRIS_OFFSET: o
o: adjustment value of offset (-128<=o<=127)
3. Lens Adjustment (1m)
Preparation:
POWER switch: ON
Adjustment condition:
Siemens star chart (A3)
Fluorescent light illumination with no flicker
Illumination above the subject should be 700 lux ± 10%.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Camera
100 0.5 cm
Siemens
star chart
Dsc Calibration
x
OK
Infinity calibration :
PZ_SW: -20
AF_I_WIDE: 24
AF_I_MID1: 23
AF_I_MID2: 23
AF_I_MID3: 23
AF_I_MID4: 14
AF_I_MID5: 5
AF_I_MID6: -4
AF_I_MID7: 17
AF_I_MID8: -14
AF_I_TELE: 7
IRIS_GAIN: -110
IRIS_OFFSET: -3
Copy
  • Page 1 1
  • Page 2 2
  • Page 3 3
  • Page 4 4
  • Page 5 5
  • Page 6 6
  • Page 7 7
  • Page 8 8
  • Page 9 9
  • Page 10 10
  • Page 11 11
  • Page 12 12
  • Page 13 13
  • Page 14 14
  • Page 15 15
  • Page 16 16
  • Page 17 17
  • Page 18 18
  • Page 19 19
  • Page 20 20
  • Page 21 21
  • Page 22 22
  • Page 23 23
  • Page 24 24
  • Page 25 25
  • Page 26 26
  • Page 27 27
  • Page 28 28
  • Page 29 29
  • Page 30 30
  • Page 31 31
  • Page 32 32
  • Page 33 33
  • Page 34 34
  • Page 35 35
  • Page 36 36
  • Page 37 37
  • Page 38 38
  • Page 39 39
  • Page 40 40
  • Page 41 41
  • Page 42 42
  • Page 43 43
  • Page 44 44
  • Page 45 45
  • Page 46 46
  • Page 47 47
  • Page 48 48
  • Page 49 49
  • Page 50 50
  • Page 51 51
  • Page 52 52
  • Page 53 53
  • Page 54 54
  • Page 55 55
  • Page 56 56
  • Page 57 57
  • Page 58 58
  • Page 59 59
  • Page 60 60
  • Page 61 61
  • Page 62 62
  • Page 63 63

Sanyo VPC-TH1EXBL User manual

Type
User manual

Ask a question and I''ll find the answer in the document

Finding information in a document is now easier with AI