Sanyo VPC-TH1EXBL User manual

SERVICE MANUAL

Contents

1. OUTLINE OF CIRCUIT DESCRIPTION ............................... 3

2. DISASSEMBLY ................................................................... 12

3. ELECTRICAL ADJUSTMENT ............................................. 18

4. USB STORAGE INFORMATION REGISTRATION ............ 24

5. TROUBLESHOOTING GUIDE............................................ 25

6. PARTS LIST........................................................................ 26

CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS........... C1

CAUTION : Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the

manufacturer.

Discard used batteries according to the manufacturer’s instructions.

NOTE : 1. Parts order must contain model number, part number, and description.

2. Substitute parts may be supplied as the service parts.

3. N. S. P. : Not available as service parts.

Design and specification are subject to change without notice.

SG314/U, EX, GX, U2, EX2, GX2, U3, EX3, GX3, U4 (R)

REFERENCE No. SM5310773

FILE NO.

Dual Camera

RoHS

•This product does not contain any hazardous substances prohibited by the RoHS

Directive.

WARNING

•You are requested to use RoHS compliant parts for maintenance or repair.

•You are requested to use lead-free solder.

(This product has been manufactured using lead-free solder. Be sure to follow the

warning given on page 2 when carrying out repair work.)

VPC-TH1

(Product Code : 168 173 02)

(U.S.A.) (Canada) (Taiwan) (General)

VPC-TH1EX

(Product Code : 168 173 03)

(Europe) (U.K.) (South America)

(China) (Australia) (Hong Kong)

(Russia) (Middle East) (Africa)

(General) (Korea) (Taiwan)

VPC-TH1GX

(Product Code : 168 173 04)

(South America) (China)

(Australia) (Hong Kong)

(General) (Korea) (Taiwan)

VPC-TH1R

(Product Code : 168 173 06)

(U.S.A.) (Canada) (Taiwan) (General)

VPC-TH1EXR

(Product Code : 168 173 07)

(Europe) (U.K.) (South America)

(China) (Australia) (Hong Kong)

(Russia) (Middle East) (Africa)

(General) (Korea) (Taiwan)

VPC-TH1GXR

(Product Code : 168 173 08)

(South America) (China)

(Australia) (Hong Kong)

(General) (Korea) (Taiwan)

VPC-TH1BL

(Product Code : 168 173 10)

(U.S.A.) (Canada) (Taiwan) (General)

VPC-TH1EXBL

(Product Code : 168 173 11)

(Europe) (U.K.) (South America)

(China) (Australia) (Hong Kong)

(Russia) (Middle East) (Africa)

(General) (Korea) (Taiwan)

VPC-TH1GXBL

(Product Code : 168 173 12)

(South America) (China)

(Australia) (Hong Kong)

(General) (Korea) (Taiwan)

VPC-ZH1R

(Product Code : 168 173 13)

(U.S.A.) (Canada)

– 2 –

WARNING

Do not use solder containing lead.

This product has been manufactured using lead-free solder in

order to help preserve the environment.

Because of this, be sure to use lead-free solder when carrying

out repair work, and never use solder containing lead.

Lead-free solder has a melting point that is 30 - 40°C (86 -

104°F) higher than solder containing lead, and moreover it does

not contain lead which attaches easily to other metals. As a

result, it does not melt as easily as solder containing lead, and

soldering will be more difficult even if the temperature of the

soldering iron is increased.

The extra difficulty in soldering means that soldering time will

increase and damage to the components or the circuit board

may easily occur.

Because of this, you should use a soldering iron and solder

that satisfy the following conditions when carrying out repair

work.

Soldering iron

Use a soldering iron which is 70 W or equivalent, and which

lets you adjust the tip temperature up to 450°C (842°F). It

should also have as good temperature recovery characteris-

tics as possible.

Set the temperature to 350°C (662°F) or less for chip compo-

nents, to 380°C (716°F) for lead wires and similar, and to 420°C

(788°F) when installing and removing shield plates.

The tip of the soldering iron should have a C-cut shape or a

driver shape so that it can contact the circuit board as flat or in

a line as much as possible.

Solder

Use solder with the metal content and composition ratio by

weight given in the table below. Do not use solders which do

not meet these conditions.

Lead-free solder is available for purchase as a service tool.

Use the following part number when ordering:

Part name: Lead-free solder with resin (0.5 mm dia., 500 g)

Part number: VJ8-0270

Metal content

Tin (Sn) Silver (Ag)

Copper (Cu)

Composition

ratio by weight

96.5 %

3.0 %

0.5 %

Note:

If replacing existing solder containing lead with lead-free sol-

der in the soldered parts of products that have been manufac-

tured up until now, remove all of the existing solder at those

parts before applying the lead-free solder.

The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of

special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part

designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.

PRODUCT SAFETY NOTICE

– 3 –

1. OUTLINE OF CIRCUIT DESCRIPTION

1-1. CMOS CIRCUIT DESCRIPTION

1. IC Configuration

The CMOS peripheral circuit block basically consists of the

following ICs.

IC911 (MT9J001I12STCV)

CMOS imager

CDS, AGC, ADC built-in

H driver, V driver, serial communication circuit built-in

2. IC911 (CMOS)

[Structure]

The electric charges which are generated when each pixel is

optically converted are in turn converted into signal voltages

by the FD amplifier, and they are then transmitted by the built-

in H driver and V driver. The signals are sampled and ampli-

fied by the CDS and PGA circuits at the point they are output,

and then they are AD converted and output. The output uses

the 12 bit LVDS interface.

1/2.3-inch positive pixel array CMOS-type fixed imaging ele-

ment

Effective pixels 3856 (H) X 2764 (V)

– 4 –

1-2. CP1 and VF1 CIRCUIT DESCRIPTION

1. Circuit Description

1-1. Digital clamp

The optical black section of the extracts averaged values from

the subsequent data to make the black level of the output

data uniform for each line. The optical black section averaged

value for each line is taken as the sum of the value for the

previous line multiplied by the coefficient k and the value for

the current line multiplied by the coefficient 1-k.

1-2. Signal processor

1. γ correction circuit

This circuit performs (gamma) correction in order to maintain

a linear relationship between the light input to the camera

and the light output from the picture screen.

2. Color generation circuit

This circuit converts the image sensor into RGB signals.

3. Matrix circuit

This circuit generates the Y signals, R-Y signals and B-Y sig-

nals from the RGB signals.

4. Horizontal and vertical aperture circuit

This circuit is used gemerate the aperture signal.

1-3. AE/AWB and AF computing circuit

The AE/AWB carries out computation based on a 64-segment

screen, and the AF carries out computations based on a 6-

segment screen.

1-4. SDRAM controller

This circuit outputs address, RAS, CAS and CS data for con-

trolling the SDRAM. It also refreshes the SDRAM.

1-5. Communication control

1. SDIO

This is the interface for the 8-bit microprocessor.

1-6. Digital encorder

It generates chroma signal from color difference signal.

2. Outline of Operation

When the shutter opens, the reset signals (ASIC and CPU)

and the serial signals (“take a picture” commands) from the

8-bit microprocessor are input and operation starts.

The picture data from CMOS passes through the A/D and

CDS, and is then input to the ASIC as digital data. The AF,

AE, AWB, shutter, and AGC value are computed from this

data, and three exposures are made to obtain the optimum

picture. The data which has already been stored in the SDRAM

is read by the CPU and color generation is carried out. Each

pixel is interpolated from the surrounding data as being ei-

ther R, G, and B primary color data to produce R, G and B

data. At this time, correction of the lens distortion which is a

characteristic of wide-angle lenses is carried out. After AWB

and γ processing are carried out, a matrix is generated and

aperture correction is carried out for the Y signal, and the

data is then compressed by JPEG and is then written to card

memory (SD card).

When the data is to be output to an external device, it is taken

data from the memory and output via the USB I/F. When played

back on the LCD and monitor, data is transferred from memery

to the SDRAM, and the image is then elongated so that it is

displayed over the SDRAM display area.

3. LCD Block

The LCD display circuit is located on the CP1 board and VF1

board, and consists of components such as a power circuit.

The signals from the ASIC are 8-bit digital signals, that is

input to the LCD directly. The 8-bit digital signals are con-

verted to RGB signals inside the LCD driver circuit . This LCD

has a 3-wire serial, and functions such as the brightness and

image quality are controlled.

Because the LCD closes more as the difference in potential

between the VCOM (common polar voltage: AC) and the R,

G and B signals becomes greater, the display becomes darker;

if the difference in potential is smaller, the element opens and

the LCD become brighter.

In addition, the timing pulses for signals other than the video

signals are also input from the ASIC directory to the LCD.

– 5 –

5. Video Clip Recording and Playback

5-1. Recording

The signal from the camera block is input to IC101 (ASIC). The

data that is input to the ASIC is input to SDRAM, and converts

this data to encoded MPEG4 data, after which it is written in

sequence onto the SD card as streaming data. At this time,

the audio signals that are input to the built-in microphone are

converted into digital data by the audio CODEC IC of IC183,

and they are then input to ASIC. The audio data is then en-

coded (AAC), and then it is written in sequence onto the SD

card together as streaming data with the image signals de-

scribed above.

5-2. Playback

The data is read from the SD card, and the encoded data is

decoded into image data where it is displayed by the LCD or

on a TV monitor. At the same time, the audio data is also de-

coded, and is input to IC182 as digital data. D/A conversion is

carried out at IC182, and the sound is then output to the speaker

or to the LINE OUT terminal.

6. Audio CODEC Circuit (IC182)

The audio signals from the microphone are converted into 16-

bit digital data. AD conversion is carried out at a maximum

sampling frequency of 48 kHz.

During audio playback, the 16-bit digital data is converted into

analog signals and these drive headphone through the speaker

or line out system and headphone amplifier. DA conversion is

carried out at a maximum sampling frequency of 48 kHz.

4. Lens drive block

4-1. Focus drive

The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK

and LENS_EN) which are output from the ASIC (IC101) are

used to drive (FOCUS A +, FOCUS A -, FOCUS B + and FO-

CUS B -) by the motor driver IC (IC951), and are then used to

microstep-drive the stepping motor for focusing operation. De-

tection of the standard focusing positions is carried out by

means of the photointerruptor (F_SENSE) inside the lens block.

4-2. Zoom drive

The 16-bit serial data signals (LENS_SDI) and (LENS_SCLK

and LENS_EN) which are output from the ASIC (IC101) are

used to drive (ZOOM A +, ZOOM A -, ZOOM B + and ZOOM B

-) by the motor driver IC (IC951), and are then used to

microstep-drive the stepping motor for zooming operation. De-

tection of the standard zooming positions is carried out by

means of the photointerruptor (F_SENSE) inside the lens block.

4-3. Iris drive

The drive method is a galvanometer type without braking coil.

The output from the Hall sensor inside the lens is amplified by

the Hall amplifier circuit inside the IC951 lens drive IC, and the

difference between the current and target aperture determined

by the resulting output and the exposure amout (16 bit serial

signal (LENS_SDI) and (LENS_SCLK and LENS_EN)) output

from the ASIC (IC101) is input to the servo amplifier circuit

(IC951) to keep the aperture automatically controlled (DRIVE+

and DRIVE -) to the target aperture.

4-4. Shutter drive

Reverse voltage is applied to the above aperture drive coil to

operate the shutter. When the shutter operates, the SHUTTER

+ signal that is output from the ASIC (IC101) becomes high

(input to SHUTTER of IC951) and the shutter operates.

– 6 –

1-3. PWA POWER CIRCUIT DESCRIPTION

1. Outline

This is the main power circuit, and is comprised of the follow-

ing blocks.

Switching controller (IC501)

Motor system power output (L5301)

Digital 3.25 V power output (L5002)

Digital 1.2 V power output (L5003)

Backlight power output (Q5007, L5007)

Digital and CMOS 1.8 V power output (IC504, L5006)

CMOS analog 2.8 V power output (IC503, L5005)

2. Switching Controller (IC501)

This is the basic circuit which is necessary for controlling the

power supply for a PWM-type switching regulator, and is pro-

vided with seven built-in channels, only CH1 (motor system),

CH2 (digital 3.25 V), CH3 (digital 1.2 V) and CH7 (backlight)

are used.

Each power supply output is received, and the PWM duty is

varied so that each one is maintained at the correct voltage

setting level.

Feedback for the backlight power (CH7) is provided to the

both ends voltage of registance so that regular current can

be controlled to be current that was setting.

2-1. Short-circuit protection circuit

If output is short-circuited for the length of time determined

by the condenser which is connected to Pin (A6) of IC501, all

output is turned off. To reset, momentarily set the control sig-

nal (P ON) to repeat control, or temporarily disconnect the

input power supply.

3. Motor System Power Output

BOOST 5 V is output. Feedback for the 5.0 V output is pro-

vided to the switching controller (Pin (B7) of IC501) so that

PWM control can be carried out.

4. Digital 3.25 V Power Output

VDD3 is output. Feedback for the VDD3 is provided to the

swiching controller (Pin (F3) of IC501) so that PWM control

can be carried out.

5. Digital 1.2 V Power Output

VDD 1.2 is output. Feedback for the 1.2 V is provided to the

switching controller (Pin (C3) of IC501) so that PWM control

to be carried out.

6. Backlight Power Supply output

Regular current is being transmitted to LED for LCD back-

light. Feedback for the both ends voltage of registance that is

being positioned to in series LED are provided to the switch-

ing controller (Pin (C4) of IC501) so that PWM control to be

carried out.

7. Digital and CMOS 1.8 V Power Output

VDD 1.8 is output. Feedback for the VDD 1.8 is provided to

the switching controller (Pin (3) of IC504) so that PWM con-

trol to be carried out.

8. CMOS Analog 2.8 V Power Output

VAA 2.8 is output. Feedback for the VAA 2.8 is provided to the

switching controller (Pin (3) of IC503) so that PWM control to

be carried out.

– 7 –

1-4. ST1 STROBE CIRCUIT DESCRIPTION

1. Charging Circuit

When UNREG power is supplied to the charge circuit and the

CHG signal from microprocessor becomes High (3.3 V), the

charging circuit starts operating and the main electorolytic

capacitor is charged with high-voltage direct current.

However, when the CHG signal is Low (0 V), the charging

circuit does not operate.

1-1. Charge switch

When the CHG signal switches to Hi, IC541 starts charging

operation.

1-2. Power supply filter

C5401 constitutes the power supply filter. They smooth out

ripples in the current which accompany the switching of the

oscillation transformer.

1-3. Oscillation circuit

This circuit generates an AC voltage (pulse) in order to in-

crease the UNREG power supply voltage when drops in cur-

rent occur. This circuit generates a drive pulse with a frequency

of approximately 200-300 kHz, and drive the oscillation trans-

former.

1-4. Oscillation transformer

The low-voltage alternating current which is generated by the

oscillation control circuit is converted to a high-voltage alter-

nating current by the oscillation transformer.

1-5. Rectifier circuit

The high-voltage alternating current which is generated at

the secondary side of T5401 is rectified to produce a high-

voltage direct current and is accumulated at electrolytic ca-

pacitor C5412.

1-6. Charge monitoring circuit

The functions programmed in the IC541 monitor oscillations

and estimate the charging voltage. If the voltage exceeds the

rated value, charging automatically stops. Then, the

ZCHG_DONE signal is changed to Lo output and a "charging

stopped" signal is sent to the microcomputer.

2. Light Emission Circuit

When FLCTL signal is input from the ASIC, the stroboscope

emits light.

2-1. Emission control circuit

When the FLCLT signal is input to the emission control cir-

cuit, Q5402 switches on and preparation is made to the light

emitting. Moreover, when a FLCLT signal becomes Lo, the

stroboscope stops emitting light.

2-2. Trigger circuit

The Q5402 is turned ON by the FLCLT signal and light emis-

sion preparation is preformed. Simultaneously, high voltage

pulses of several kV are emitted from the trigger coil and ap-

plied to the light emitter.

2-3. Light emitting element

When the high-voltage pulse form the trigger circuit is ap-

plied to the light emitting part, currnet flows to the light emit-

ting element and light is emitted.

Beware of electric shocks.

– 8 –

1-5. SYA CIRCUIT DESCRIPTION

1. Configuration and Functions

For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor

(IC301), and controls camera system condition (mode).

The 8-bit microprocessor handles the following functions.

1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control

46

NOT USED

-

See next page →

Signal

1

2

3

4

5

6

7

8

9

11~14

15

16

17

18

19

20

24

26

27

28

29

33

34

35

36

37

38

39

42~44

47

40

45

ASIC_SCK

ZCARD

ZBACKUPCTL

CHG_CNT

HOT LINE

GREEN_LED

RED_LED

ST_CHG_ON

VDD2

SCAN IN4~1

ZUSB_DET

HDMI_HPD

ZCHG_DONE

TIMEOUT

BAT_UTX

BAT_URX

USB_ON

NOT USED

MRST

SW3.2ON

PON2

PLLEN

ERR

VSS3

VDD3

RDSEL

CLK (SFW)

DATA0 (SFW)

DC_IN

SCAN OUT2~0

ZOOM_SW_AD

ZAV_JACK

I/O

O

I

O

I

O

-

I

O

I

O

I

-

I

O

I

Outline

Serial clock output (CL required)

Card detection (SW3.2 V required)

Backup battery charge control

Camera charge permission

Hot line request from ASIC

Switch unit LED (green) (H= lighting)

Switch unit LED (red) (H= lighting)/ combine with UTX (CL required)

-

Keyscan input 4~1

USB power detection terminal (L= detection)

HDMI hot plug detection

Main condensor charge voltage detection

Charge done detection

Battery power detection IC UART sending

USB charge ON/OFF

(TGVD delete)

System reset (MRST)

SW 3.2 V power (L= 3.2 V)

Digital system power start-up signal

PLL enable signal

Charge error detection

-

Debugger select terminal

Debug CN

DC jack insertion detection (SW3.2 V required)

Keyscan output 2~0

Zoom key AD input

-

Cable detection

Battery power detection IC UART recieving

10

VSS2

-

21 SCAN_IN0

I

Keyscan input 0

22 PANEL_OPEN

I

Panel open detection (MR sensor)

23 KEY 2nd

I

S2 key input

Strobo charge control (H= charge)

25 NOT USED

I

(HDMI_INT delete)

30 NOT USED

I (I2CSDATA delete)

31 P ON

O Digital system power start-up signal

32 NAND_RESET

O OneNAND reset

41 HINGE

I

Panel rotation detection

– 9 –

Fig. 5-1 Internal Bus Communication System

2. Internal Communication Bus

The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the

camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the

camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication

between the 8-bit microprocessor, ASIC and SPARC lite circuits.

Table 5-1. 8-bit Microprocessor Port Specification

8-bit

Microprocessor

ASIC

SREQ

ASIC_SDO

ASIC_SDI

ASIC_SCK

MRST

PLLEN

60

61

50

-

S1 key input

51

KEY_1st

I

-

56

NOT USED - -

VSS1

BATTERY

I UNREG voltage detection

58

59

ZSREQ

I

Serial communication request signal (CL required)

XOUT O 4M oscillation output

VDD1

-

49

BAT_OFF

I

Battery OFF detection signal input

52

ZBOOT_COMREQ

I/O

ZBOOT output

53

ZRESET

I

SBM reset input

54

XCIN

I

32 k oscillation input

55

XCOUT

O

32 k oscillation output

57

XIN I

4M oscillation input

48

BAT_TMP

I

Battery temperature detection

Serial data output (CL required)

Camera temperature detection

62

INT_TEMP I

63

ASIC_SDI O

64

ASIC_SDO

I

Serial data input (CL required)

3. Key Operaiton

For details of the key operation, refer to the instruction manual.

Table 5-2. Key Operation

0

123

SCAN

OUT

SCAN

IN

PLAY

RIGHT

UP

1

2

VREC

TEST -

-

LEFT

PW_TEST

MENU

DOWN

-

4

SET

-

POWER

– 10 –

ASIC,

memory

CMOS

8 bit CPU

Power voltage

Power OFF

Play back

LCD finder

3.3 V 1.0 V 1.8 V

2.8 V (A)

2.8 V (D), 1.8 V (D)

3.2 V

OFF

32KHz

OFF

32KHz

ON

4 MHz

ON

OFF

4 MHz

Table 5-3. Camera Mode

Note) 4 MHz = Main clock operation, 32 kHz = Sub clock operation

4. Power Supply Control

The 8-bit microprocessor controls the power supply for the overall system.

The following is a description of how the power supply is turned on and off. When the battery is attached or DC IN input, a

regulated 3.2 V (power off: 2.4 V) voltage is normally input to the 8-bit microprocessor (IC301) by IC302, so that clock counting

and key scanning is carried out even when the power switch is turned off, so that the camera can start up again. When the battery

is removed and DC IN does not input, the 8-bit microprocessor operates in sleep mode using the backup battery. At this time, the

8-bit microprocessor only carries out clock counting, and waits in standby for the battery to be attached again or DC IN input.

When a switch is operated, the 8-bit microprocessor supplies power to the system as required.

The 8-bit microprocessor first set the P ON signal at pin (31) and the P ON2 signal at pin (29) to high, and then turns on the DC/

DC converter. After this, low signal is output from pin (27) so that the ASIC is set to the reset condition. After this these pins set

to high, and set to active condition. Once it is completed, the ASIC returns to the reset condition, all DC/DC converters are turned

off and the power supply to the whole system is halted.

Power switch ON - Auto power OFF

CAMERA

– 11 –

MEMO

– 12 –

B

D

A

D

E

C

E

A

C

F

G

I

G

H

I

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

3

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

52

a

b

c

a

b

c

A

B

A

B

A

B

2. DISASSEMBLY

2-1. REMOVAL OF CABINET BOTTOM, CABINET TOP, CABINET BACK, TB4 BOARD AND CABINET FRONT

NOTE: Discharge a strobe capacitor with the

discharge jig (VJ8-0188) for electric shock prevention.

When assembling,

tighten the screws order.

a → b → c

When assembling,

assemble order.

A → B

When assembling,

tighten the screws order.

a → b → c

When assembling,

assemble order.

A → B

When assembling,

assemble order.

A → B

– 13 –

1. Cover battery

2. Spacer bottom

3. Spacer LCD

4. Spacer LCD front

5. Screw 1.7 x 7

6. Three screws 1.7 x 3

7. Screw 1.7 x 3

8. Three screws 1.7 x 4

9. Remove the cabi bottom from the main body.

10. Screw 1.7 x 3

11. Holder strap front

12. Spacer blind

13. Screw 1.7 x 3

14. Holder strap back

15. Two screws 1.7 x 4

16. Stand

17. Remove the solder.

18. Screw 1.7 x 3

19. Screw 1.7 x 3

20. Cabinet top

21. Spacer cabi front

22. Flexible pwb CP1 & TB4

23. Cover SD

24. Screw 1.7 x 3

25. Two screws 1.7 x 3

26. Two screws 1.7 x 3

27. Remove the cabinet back from the main body.

28. Cover DC

29. Three screws 1.7 x 4

30. Holder back

31. Two screws 1.7 x 4

32. TB4 board

33. FPC

34. Unit, zoom

35. Flexible pwb CP1 & TB4

36. Button select

37. Holder button bas

38. Button menu

39. Button rec play

40. Button movie

41. Button shutter

42. Spacer mic

43. Remove the solder.

44. Two screws 1.7 x 4

45. Holder bottom

46. Spacer shield wire

47. Connector

48. Two screws 1.7 x 2

49. Dec joint

50. Two screws 1.7 x 4

51. Screw 1.7 x 3

52. Two screws 1.7 x 3

53. Compl, cabinet front

54. Screw 1.7 x 3

55. Screw 1.7 x 3

42. Spacer mic

53. Compl, cabinet front

Note:

Do not tuck the

lead wires.

46. Spacer shield wire

– 14 –

F

D

I

B

H

B

A

E

C

A

G

C

I

E

H

J

F

J

K

G

1

a

b

c

a

b

c

2

3

4

5

d

6

c

7

b

8

a

9

10

11

12

13

14

15

16

17

18

22

20, 24

21

19

23

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

2-2. REMOVAL OF TB1 BOARD, LENS, ST1 BOARD, CP1 BOARD AND TB3 BOARD

When assembling,

tighten the screws order.

a → b → c → d

When assembling,

tighten the screws order.

a → b → c

When assembling,

tighten the screws order.

a → b → c

– 15 –

1. Three screws 1.7 x 3

2. Connector

3. TB1 board

4. Three screws 1.7 x 2.5

5. Two screws 1.7 x 3

6. Screw 1.7 x 4

7. Screw 1.7 x 3

8. Two screws 1.7 x 3

9. Heat sink CMOS

10. Holder TB1

11. Spacer CA

12. Screw 1.7 x 2.5

13. Holder CA

14. FPC

15. Connector

16. Two screws 1.7 x 4

17. Two screws 1.7 x 4

18. Holder lens chassis

19. Holder lens

20. Remove the lens part.

21. Holder lens

22. Spacer lens bottom

23. Three screws 1.4 x 3.5

24. Lens

25. Screw 1.7 x 2

26. Heat sink tape CMOS

27. Holder heat CMOS TB1

28. Assy, flexible pwb CA1 + mounting lens

29. Two screws 1.7 x 7

30. Screw 1.7 x 3

31. Connector

32. ST1 board

33. Spacer ST1

34. Remove the solder.

35. Assy, lamp

36. Cover triger

37. Remove the solder.

38. Spacer con ST1

39. Flexible pwb CP1 & TB3

40. Four screws 1.7 x 3

41. CP1 board

42. Flexible pwb CP1 & TB3

43. Heat sink rub ASIC

44. Screw 1.4 x 2

45. Earth jack

46. Two screws 1.7 x 3

47. Chassis bottom

26. Heat sink tape CMOS

35. Assy lamp dressing method

35. Assy lamp soldering order

39, 42. Flexible pwb CP1 & TB3

48. Three screws 1.7 x 2.5

49. TB3 board

50. Chassis right

– 16 –

A

B

A

B

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

2-3. REMOVAL OF TB2 BOARD, VF1 BOARD AND LCD

1. Screw 1.7 x 2

2. Screw 1.7 x 3

3. Holder wire

4. Spacer holder joint

5. Two screws 1.7 x 3

6. Holder joint

7. Cabinet right

8. Button power

9. Cover joint

10. Two screws 1.7 x 3

11. Cover LCD back

12. Remove the solder.

13. Connector

14. Assy, joint

15. Screw 1.7 x 2

16. TB2 board

17. Spacer LCD FPC

18. FPC

19. Two screws 1.7 x 3

4. Spacer holder joint

3. Holder wire

20. VF1 board

21. Spacer pwb

22. Holder LCD

23. LCD

24. Cover LCD front

When assembling,

assemble order.

A → B

When assembling,

assemble order.

A → B

17. Spacer LCD FPC

– 17 –

2-4. BOARD LOCATION

TB4 board

TB1 board

TB3 board

CP1 board

ST1 board

TB2 board

VF1 board

– 18 –

3. ELECTRICAL ADJUSTMENT

3-1. Table for Servicing Tools

J-9: Fluorescent tube viewer: HAKUBA light viewer 5700

Download the calibration software and the firmware

from the following URL.

http://www.digital-sanyo.com/overseas/service/

Place the DscCalDi.exe file, camapi32.dll file and

QrCodeInfo.dll file together into a folder of your

choice.

3-2. Equipment

1. AC adaptor

2. PC (IBM R -compatible PC, Windows 2000 or XP or Vista)

3-3. Adjustment Items and Order

1. Optical Axis Adjustment

2. Lens Adjustment (Infinity)

3. Lens Adjustment (1m)

4. AWB Adjustment

5. CMOS White Point Defect Detect Adjustment

6. CMOS Black Point And White Point Defect Detect Adjust-

ment In Lighted

Note: If the lens, board and changing the part, it is necessary

to adjust again. Item 1-6 adjustments should be carried out in

sequence.

*Adjustment environment

Temperature: 25 ± 10 degrees, Humidity: 55 ± 25 %

3-4. Setup

1. System requirements

Windows 2000 or XP or Vista

IBM R -compatible PC with pentium processor

USB port

40 MB RAM

Hard disk drive with at least 15 MB available

VGA or SVGA monitor with at least 256-color display

2. Pattern box

Turn on the switch and wait for 30 minutes for aging to take

place before using Color Pure. It is used after adjusting the

chroma meter (VJ8-0192) adjust color temperature to 3100 ±

20 K and luminosity to 900 ± 20 cd/m

2

. Be careful of handling

the lump and its circumference are high temperature during

use and after power off for a while.

3. Computer screen during adjustment

3-5. Connecting the camera to the computer

1. Use the supplied dedicated USB interface cable to connect

the camera to the computer.

2. Turn on the camera.

3. Choose the “COMPUTER”, and press the SET button.

Next, choose the “CARD READER”, and press the SET

button.

Ref. No.

Name

Part code

J-1

J-2

J-3

VJ8-0190

Pattern box

Calibration software

J-4

Number

1

Chroma meter

VJ8-0192

1

Spare lump (pattern box)

VJ8-0191

J-5

J-1 J-3

J-4

J-5

1

Discharge jig

VJ8-0188

J-6

1

Collimator

VJ8-0260

J-7

1

Spare lump (collimator)

VJ8-0282

J-8

1

Siemens star chart

J-8

Firmware

Data

AWB

Focus

UV Matrix

R Bright

RGB Offset

Tint

B Bright

Gain

Phase

LCD

Calibration

Upload

PAF Cal.

LCD Type

H AFC Test

VCOMDC

VCOMPP

Cal Data

Cal Mode

OK

EVF

USB storage

Get

Set

VID

Set

PID

Set

Serial

Set

Rev.

Set

Setting

Language

Video Mode

VCO

Factory Code

Hall Cal.

Backrush pulse :

Set

Get

J-9

1

Fluorescent tube viewer

– 19 –

3-8. Adjust Specifications

1. Optical Axis Adjustment

Preparation:

POWER switch: ON

Note:

Do not vibrate during the adjustment.

Adjustment method:

1. Set a distance of 1.0-3.0 cm between the camera lens and

the white part of fluorescent tube viewer.

(Do not enter any light.)

2. Double-click on the DscCalDi.exe.

3. Input “251” to the “CalMode”, and click the OK.

4. Adjustment value will appear on the screen.

5. Click the OK.

2. Lens Adjustment (Infinity)

3-6. The adjustment item which in necessary in part exchange

COMPL PWB CP1

Factory

Cord

Setting

Language

Setting

COMPL PWB VF1

COMPL PWB ST1

COMPL PWB TB1

Reset

Setting

COMPL PWB TB4

Lens

Adjust-

ment

(1 m)

AWB

Adjust-

ment

USB

storage

information

registration

CMOS

White Point

Defect

Detect

Adjustment

CMOS Black

Point And

White Point

Defect Detect

Adjustment

In Lighted

: Be sure to carry out the necessary adjustments after replacing the unit.

: Adjustment is possible from the menu setting screen of the camera and by using the calibration software.

COMPL PWB TB2

COMPL PWB TB3

Lens

Adjust-

ment

(Infinity)

ASSY, FLEXIBLE PWB CA1

3-7. Updating the firmware

Check the firmware version immediately after the CP1 board has been replaced. If an old version is being used, interfer-

ence and errors in operation may also occur. If an old version is being used, update it with a newer version.

Refer to

3-13. Firmware uploading procedure. (Page 23)

Optical

Axis

Adjust-

ment

Camera

Collimator

Camera

1.0~3.0 cm

Fluorescent

tube viewer

– 20 –

Preparation:

POWER switch: ON

If using a ready-made collimator, set to infinity.

Note:

Do not vibrate during the adjustment.

If readjusting after it has already been adjusted, wait for 15

minutes or more for the unit to cool down first.

Adjustment method:

1. Set the camera so that it becomes center of the siemens

star chart in the collimator (zoom wide and tele).

(Set a distance of 0.5-1.0 cm between camera lens and

collimator lens. Do not touch the each lens.)

2. Set the camera so that it becomes center of the screen in

the collimator.

3. Double-click on the DscCalDi.exe.

4. Select “Infinity Cal.” on the LCD “Test”, and click the “Ye s ”.

5. Lens infinity adjustment value will appear on the screen.

6. Click the OK.

3. Lens Adjustment (1m) is carried out after this adjust-

ment.

Adjustment value determination is effectuated using below val-

ues.

The adjustment values fulfill the conditions below, they are de-

termined as within specifications.

Adjustment value determination

PZ_SW: ZSW

ZSW: adjustment value of zoom PI switch position

(-52<=ZSW<=34)

AF_I_WIDE: ZIW

ZIW: infinity adjustment value of focus at zoom position

wide (–77<=ZIW<=78)

AF_I_MID1: ZIM1

ZIM1: infinity adjustment value of focus at zoom position

middle1 (–96<=ZIM1<=96)

AF_I_MID2: ZIM2

ZIM2: infinity adjustment value of focus at zoom position

middle2 (–115<=ZIM2<=114)

AF_I_MID3: ZIM3

ZIM3: infinity adjustment value of focus at zoom position

middle3 (–138<=ZIM3<=137)

AF_I_MID4: ZIM4

ZIM4: infinity adjustment value of focus at zoom position

middle4 (–194<=ZIM4<=195)

AF_I_MID5: ZIM5

ZIM5: infinity adjustment value of focus at zoom position

middle5 (–237<=ZIM5<=238)

AF_I_MID6: ZIM6

ZIM6: infinity adjustment value of focus at zoom position

middle6 (–288<=ZIM6<=287)

AF_I_MID7: ZIM7

ZIM7: infinity adjustment value of focus at zoom position

middle7 (–348<=ZIM7<=348)

AF_I_MID8: ZIM8

ZIM8: infinity adjustment value of focus at zoom position

middle8 (–471<=ZIM8<=470)

AF_I_TELE: ZIT

ZIT: infinity adjustment value of focus at zoom position

tele (–200<=ZIT<=598)

IRIS_GAIN: g

g: adjustment value of gain (-128<=g<=127)

IRIS_OFFSET: o

o: adjustment value of offset (-128<=o<=127)

3. Lens Adjustment (1m)

Preparation:

POWER switch: ON

Adjustment condition:

Siemens star chart (A3)

Fluorescent light illumination with no flicker

Illumination above the subject should be 700 lux ± 10%.

Note:

Do not vibrate during the adjustment.

If readjusting after it has already been adjusted, wait for 15

minutes or more for the unit to cool down first.

Camera

100 0.5 cm

Siemens

star chart

Dsc Calibration

x

OK

Infinity calibration :

PZ_SW: -20

AF_I_WIDE: 24

AF_I_MID1: 23

AF_I_MID2: 23

AF_I_MID3: 23

AF_I_MID4: 14

AF_I_MID5: 5

AF_I_MID6: -4

AF_I_MID7: 17

AF_I_MID8: -14

AF_I_TELE: 7

IRIS_GAIN: -110

IRIS_OFFSET: -3

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