Application sheet
SpeedUp
Tile / natural stone
Strongboard tile and laminate
1
2
3
4
5
1 Ceramic tiles / natural stone inclusive adhesive ≥ 12 mm
2 Strongboard tile and laminate 5 mm
3 SpeedUp heat panel + FH composite pipe 30 mm
4 Support batten (30mm)
5 Additional insulation EPS 035 DEO 20 mm
6 SpeedUp perimeter insulation
7 If necessary moisture barrier
Floor nish ≥ 8 mm Tile size: 10 x 10 cm minimum; 40 x 60 cm maximum;
natural stone thickness: 10 mm or more; joint width: 3 mm or
more
Construction height ≥ 67 mm Height including oor nish
Weight ~ 38 kg / m² Weight including oor nish
Thermal resistance R 1,43 m²K / W The minimum thermal resistance requirement of DIN EN 1264
is fullled. For water table ≤ 5 m the R-value must be increased.
Always follow the planning data.
Thermal transmission coecient U 0,63 W / m²K In renovations and building extensions up to 50 m² U-value = 0.5
W/m²K must be maintained.
Design load ≤ 2,0 kN / m² Sum of point loads not exceeding rated design load;
Point load (≥ 20 cm²) ≤ 2,0 kN Special attention must be given to especially heavy items (e.g.
aquaria).
Impact subsonic noise reduction NA dB
Application area
Residential spaces, hallways and attic spaces in residential buildings and hotel rooms.
Corresponds to categories A1, A2 and A3 of DIN 1055-3. Oce spaces, hallways in oce
buildings, medical oces, stations and spaces with human occupancy, and commercial
spaces with oor areas up to 50 m² in residential or oce buildings. Corresponds to
categories B1, D1 and D2 of DIN 1055-3.
Requirements & special features
A level, smooth and structurally sound surface is necessary for full surface contact with
the heating elements (elevated requirements according to DIN 18202 Table 3, row 4).
Structural sealing according to DIN 18195 must be placed beneath the oor panel in
case of structures facing the ground, and otherwise on the unnished oor. Wooden
joist oor, free from twist eects, free of deection Supply / return panels and cut panels
(insulation panels or SpeedUp panels) must be glued to the substrate and to each other.
Strongboard is only approved for use with Danfoss components. Lay tiles using the
combined method with Mapei adhesive and Elastorapid (see installation instructions).
Observe all installation instructions and manufacturer’s instructions.
Additional insulation
20 mm EPS 035 DEO 200 kPa; existing buildings: 40 mm XPS 035 500 kPa; for more details
please see additional Insulation summary.
Construction
According to EnEV, EN 1264, DIN 1055, 18195 and 18202
Construction number 84
Technical Data Floors/ceilings facing unheated rooms or the ground
6
7
© Danfoss 11/2008
VA.CR.R1.02
Danfoss HES
