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1.00-08132015-112400
USER MANUAL
AMOS-3005
Fanless and Ultra Compact
Embedded System
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE
Copyright
Copyright © 2015 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language,
in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written
permission of VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respective holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no
warranties, implied or otherwise, in regard to this document and to the products described in this document. The information
provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA
Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra
device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document.
The information and product specifications within this document are subject to change at any time, without notice and without
obligation to notify any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior
notice.
Regulatory Compliance
FCC
FCCFCC
FCC-
--
-A Radio Frequency Interference Statement
A Radio Frequency Interference StatementA Radio Frequency Interference Statement
A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his
personal expense.
Notice 1
Notice 1Notice 1
Notice 1
The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
Notice 2
Notice 2Notice 2
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Notice 3
Notice 3Notice 3
Notice 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts
or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before
placing an order.
Battery Recycling and Disposal
Only use the appropriate battery specified for this product.
Do not re-use, recharge, or reheat an old battery.
Do not attempt to force open the battery.
Do not discard used batteries with regular trash.
Discard used batteries according to local regulations.
Safety Precautions
Always read the safety instructions carefully.
Keep this User's Manual for future reference.
All cautions and warnings on the equipment should be noted.
Keep this equipment away from humidity.
Lay this equipment on a reliable flat surface before setting it up.
Make sure the voltage of the power source and adjust properly 110/220V before connecting
the equipment to the power inlet.
Place the power cord in such a way that people cannot step on it.
Always unplug the power cord before inserting any add-on card or module.
If any of the following situations arises, get the equipment checked by authorized service
personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment has not worked well or you cannot get it work according to User's
Manual.
The equipment has dropped and damaged.
The equipment has obvious sign of breakage.
Do not leave this equipment in an environment unconditioned or in a storage temperature
above 70°C (158°F). The equipment may be damaged.
Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
Do not place anything over the power cord.
Do not cover the ventilation holes. The openings on the enclosure protect the equipment
from overheating.
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Box Contents
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1Q
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Q12A1
12A112A1
12A1
1 x AMOS-3005 system unit
1 x AC-to-DC adapter, 2-pole Phoenix plug to DC jack
1 x Screw pack for mounting
1 x Screw pack for Mini PCIe module
1 x Thermal pad for mSATA module
4 x Rubber foot for desktop mounting
1 x Syringe (0.5cc) of thermal grease
Ordering Information
Part Number
Part NumberPart Number
Part Number
Description
DescriptionDescription
Description
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Q12A1
12A112A1
12A1 Fanless Embedded System with 1.2 GHz VIA Eden X4 processor,
1 x HDMI, 1 x VGA, 2 x USB 3.0, 2 x Lockable USB 2.0, 2 x Gigabit
Ethernet port, 2 x COM, 1 x Digital I/O, 2 x Audio jacks, and DC-In
9V~36V
Optional Accessories
External AC
External ACExternal AC
External AC-
--
-to
toto
to-
--
-DC Adapter and Power Cord
DC Adapter and Power CordDC Adapter and Power Cord
DC Adapter and Power Cord
Model Number
Model NumberModel Number
Model Number
Description
DescriptionDescription
Description
99G63-020316 AC-to-DC adapter, 2-pole Phoenix connector, DC 12V/5A, 60W
99G33-02032C Power cord, 180cm, USA type
99G33-02033C Power cord, 180cm, Europe type
99G33-02034C Power cord with PSE mark, 180cm for Japan market
Wireless Accessories
Wireless AccessoriesWireless Accessories
Wireless Accessories
Model Number
Model NumberModel Number
Model Number
Description
DescriptionDescription
Description
EMIO-1533-00A2 VNT9271 IEEE 802.11b/g/n USB Wi-Fi module with assembly kit
EMIO-2550-00A1 Ublox 3.75G HSPA/UMTS mobile broadband full size mini PCIe
module with GPS and SIM card socket
EMIO-2550-01A1 Ublox 3.75G HSPA/UMTS mobile broadband full size mini PCIe
module
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Table of Contents
1.
1.1.
1.
Product Overview
Product OverviewProduct Overview
Product Overview................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................ 1
11
1
1.1.
Key Features................................................................................................... 1
1.1.1.
Powered by VIA
®
Eden X4 Processor................................................ 1
1.1.2.
Fanless and Ruggedized Chassis Design............................................ 1
1.1.3.
Networking Support............................................................................... 2
1.1.4.
Empowered Multimedia Capabilities................................................. 2
1.1.5.
Optimize integration with multiple I/O access................................ 2
1.1.6.
SIM Card Socket ...................................................................................... 2
1.1.7.
Storage Expansion .................................................................................. 2
1.1.8.
Wide Range of Power Sources ............................................................ 2
1.1.9.
Wide Range of Operating Temperatures........................................... 2
1.1.10.
Shock Resistant ........................................................................................ 2
1.1.11.
Multiple Mounting Solutions................................................................ 3
1.1.12.
Embedded OS ready ............................................................................. 3
1.2.
Product Specifications................................................................................. 4
1.3.
Layout Diagram ............................................................................................. 8
1.4.
Dimensions .................................................................................................... 9
2.
2.2.
2.
External I/O Pin Descriptions and Functionality
External I/O Pin Descriptions and FunctionalityExternal I/O Pin Descriptions and Functionality
External I/O Pin Descriptions and Functionality................................
................................................................
.............................................
..........................
............. 10
1010
10
2.1.
Front Panel I/O............................................................................................. 10
2.1.1.
Power Button ......................................................................................... 10
2.1.2.
LED Indicators........................................................................................ 10
2.1.3.
COM Connector.................................................................................... 11
2.1.4.
Lockable USB 2.0 Port ......................................................................... 12
2.2.
Rear Panel I/O .............................................................................................. 13
2.2.1.
LAN Port (Gigabit Ethernet) ............................................................... 13
2.2.2.
USB 3.0 Ports.......................................................................................... 14
2.2.3.
HDMI
®
Port ............................................................................................ 15
2.2.4.
VGA Connector..................................................................................... 16
2.2.5.
Audio Jacks............................................................................................. 17
2.2.6.
DC-In Power Input Connector ........................................................... 17
2.2.7.
Digital I/O Connector .......................................................................... 18
3.
3.3.
3.
Onboard Connector and Pin Header
Onboard Connector and Pin HeaderOnboard Connector and Pin Header
Onboard Connector and Pin Header ................................
................................................................
..............................................................
............................................................
.............................. 19
1919
19
3.1.
USB 2.0 Pin Header.................................................................................... 19
3.2.
WLAN Connector....................................................................................... 20
3.3.
Mini PCIe Slot.............................................................................................. 21
3.4.
SIM Card socket.......................................................................................... 22
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3.5.
mSATA slot ................................................................................................. 22
3.6.
DDR3 SODIMM Socket ............................................................................. 23
4.
4.4.
4.
Onboard Jumpers
Onboard JumpersOnboard Jumpers
Onboard Jumpers ................................
................................................................
................................................................
................................................................
..............................................................
............................................................
.............................. 24
2424
24
4.1.
COM Voltage Select Jumpers................................................................. 25
4.1.1.
JCOMV1 Voltage Select Jumper....................................................... 25
4.1.2.
JCOMV2 Voltage Select Jumper....................................................... 26
4.2.
USB 2.0 Power Type Select Jumper....................................................... 27
5.
5.5.
5.
Hardware Installation
Hardware InstallationHardware Installation
Hardware Installation ................................
................................................................
................................................................
................................................................
........................................................
................................................
........................ 29
2929
29
5.1.
Installing the DDR3 SODIMM memory ................................................. 29
5.2.
Removing the DDR3 SODIMM memory................................................ 34
5.3.
Installing the mSATA flash drive module ............................................ 35
5.4.
Reinstalling the EMIO-2004 daughterboard ........................................ 38
5.5.
Inserting the SIM card................................................................................ 39
5.6.
Installing the 3G/GPS/Wi-Fi mini PCIe module....................................... 40
5.7.
Installing the WLAN (Wi-Fi) USB module............................................ 45
5.8.
Installing the Rubber Feet ........................................................................ 48
5.9.
Installing the AMOS-3005........................................................................ 49
5.9.1.
Mounting the AMOS-3005 on Wall/Table ..................................... 49
5.9.2.
Mounting the AMOS-3005 behind the monitor ............................ 50
6.
6.6.
6.
BIOS Setup
BIOS SetupBIOS Setup
BIOS Setup................................
................................................................
................................................................
................................................................
................................................................
................................................................
..........................................
....................
.......... 53
5353
53
6.1.
Entering the BIOS Setup Utility............................................................... 53
6.2.
Control Keys................................................................................................ 53
6.3.
Getting Help................................................................................................ 53
6.4.
System Overview........................................................................................ 54
6.4.1.
BIOS Information................................................................................... 54
6.4.2.
Memory Information............................................................................. 54
6.4.3.
System Language................................................................................... 55
6.4.4.
System Date............................................................................................ 55
6.4.5.
System Time ........................................................................................... 55
6.5.
Advanced Settings ..................................................................................... 56
6.5.1.
ACPI Settings.......................................................................................... 57
6.5.2.
S5 RTC Wake Settings.......................................................................... 58
6.5.3.
CPU Configuration ................................................................................ 59
6.5.4.
SATA Configuration.............................................................................. 60
6.5.5.
USB Configuration................................................................................. 61
6.5.6.
F71869 Super IO Configuration ......................................................... 63
6.5.7.
F71869 H/W Monitor ........................................................................... 64
6.5.8.
Clock Generator Configuration.......................................................... 65
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6.6.
Chipset Settings .......................................................................................... 66
6.6.1.
DRAM Configuration ............................................................................ 67
6.6.2.
Video Configuration ............................................................................. 69
6.6.3.
PMU_ACPI Configuration .................................................................... 70
6.6.4.
HDAC Configuration ............................................................................ 71
6.6.5.
Others Configuration............................................................................ 72
6.7.
Boot Settings ............................................................................................... 74
6.7.1.
Boot Configuration................................................................................ 74
6.7.2.
Boot Option Priorities .......................................................................... 75
6.8.
Security Settings ......................................................................................... 76
6.8.1.
Security Settings .................................................................................... 76
6.9.
Save & Exit ................................................................................................... 77
6.9.1.
Save Changes and Exit ......................................................................... 77
6.9.2.
Discard Changes and Exit.................................................................... 77
6.9.3.
Save Changes and Reset...................................................................... 77
6.9.4.
Discard Changes and Reset................................................................. 78
6.9.5.
Save Changes ......................................................................................... 78
6.9.6.
Discard Changes.................................................................................... 78
6.9.7.
Save as User Defaults........................................................................... 78
6.9.8.
Restore User Defaults .......................................................................... 78
7.
7.7.
7.
Software and Technical Supports
Software and Technical SupportsSoftware and Technical Supports
Software and Technical Supports ................................
................................................................
................................................................
................................................................
....................................
........
.... 79
7979
79
7.1.
Microsoft and Linux Support ................................................................... 79
7.1.1.
Driver Installation.................................................................................. 79
7.2.
Technical Supports and Assistance........................................................ 79
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Lists of Figures
Figure 1: Front side panel................................................................................................ 8
Figure 2: Rear side panel ................................................................................................. 8
Figure 3: Front side view dimensions............................................................................ 9
Figure 4: Top side view dimensions.............................................................................. 9
Figure 5: Power button diagram .................................................................................. 10
Figure 6: LED indicator diagrams ................................................................................. 10
Figure 7: COM connector diagram.............................................................................. 11
Figure 8: USB 2.0 lockable port diagram................................................................... 12
Figure 9: LAN port diagram .......................................................................................... 13
Figure 10: USB 3.0 port diagram .................................................................................. 14
Figure 11: HDMI
®
port diagram ................................................................................... 15
Figure 12: VGA connector diagram............................................................................. 16
Figure 13: Audio jack receptacle stack diagram....................................................... 17
Figure 14: DC-In connector diagram........................................................................... 17
Figure 15: Digital I/O connector diagram .................................................................. 18
Figure 16: USB 2.0 pin header diagram ...................................................................... 19
Figure 17: WLAN USB connector diagram ................................................................ 20
Figure 18: Mini PCIe slot diagram................................................................................ 21
Figure 19: SIM Card socket diagram............................................................................ 22
Figure 20: mSATA slot diagram ................................................................................... 22
Figure 21: DDR3 SODIMM socket ............................................................................... 23
Figure 22: Jumper settings example............................................................................ 24
Figure 23: JCOMV1 voltage select jumper diagram ............................................... 25
Figure 24: JCOMV2 voltage select jumper diagram ............................................... 26
Figure 25: USB 2.0 power type select jumper diagram.......................................... 27
Figure 26: Unscrewing the front and rear panel plates.......................................... 29
Figure 27: Removing the front and rear panel plates ............................................. 30
Figure 28: Removing the bottom cover plate........................................................... 30
Figure 29: Unscrewing EMIO-2004 daughter board................................................ 31
Figure 30: Removing EMIO-2004 daughter board ................................................... 31
Figure 31: Peeling off the memory thermal pad protective cover....................... 32
Figure 32: Installing SODIMM memory module ...................................................... 32
Figure 33: Disengaging the SODIMM locking clips................................................. 34
Figure 34: Removing the memory module ................................................................ 34
Figure 35: Applying the mSATA thermal pad .......................................................... 35
Figure 36: Peeling off the protective plastic cover of mSATA thermal pad ..... 35
Figure 37: Inserting the mSATA module.................................................................... 36
Figure 38: Securing the mSATA module ................................................................... 36
Figure 39: Applying thermal grease on mSATA heatsink ...................................... 37
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Figure 40: Reinstalling EMIO-2004 daughterboard ................................................. 38
Figure 41: Securing EMIO-2004 daughterboard....................................................... 38
Figure 42: Inserting the SIM card ................................................................................. 39
Figure 43: Installing the 3G/GPS/Wi-Fi module ....................................................... 40
Figure 44: Securing the 3G/GPS/Wi-Fi module ........................................................ 40
Figure 45: Removing the 3G antenna hole cover..................................................... 41
Figure 46: Removing the GPS antenna hole cover................................................... 41
Figure 47: Removing the Wi-Fi antenna hole cover................................................. 41
Figure 48: Installing the 3G antenna ........................................................................... 42
Figure 49: Installing the GPS antenna ......................................................................... 43
Figure 50: Installing the Wi-Fi antenna ....................................................................... 43
Figure 51: Connecting Wi-Fi antenna cable to mini RF connector....................... 44
Figure 52: Installing WLAN USB module................................................................... 45
Figure 53: Connecting WLAN USB board-to-board cable .................................... 45
Figure 54: Removing the WLAN USB antenna hole cover..................................... 46
Figure 55: Installing the WLAN USB antenna ........................................................... 46
Figure 56: Connecting WLAN USB antenna cable to mini RF connector........... 47
Figure 57: Installing the rubber feet............................................................................ 48
Figure 58: Mounting the AMOS-3005 system........................................................... 49
Figure 59: Installing VESA mounting plate................................................................ 50
Figure 60: Installing AMOS-3005 to the VESA mounting plate ........................... 51
Figure 61: Illustration of the Main menu screen....................................................... 54
Figure 62: Illustration of the Advanced Settings screen......................................... 56
Figure 63: Illustration of the ACPI Settings screen .................................................. 57
Figure 64: Illustration of the S5 RTC Wake Settings screen................................... 58
Figure 65: Illustration of CPU Configuration screen ................................................ 59
Figure 66: Illustration of SATA Configuration screen ............................................. 60
Figure 67: Illustration of USB Configuration screen ................................................ 61
Figure 68: Illustration of F71869 Super IO Configuration screen......................... 63
Figure 69: Illustration of F71869 H/W Monitor ........................................................ 64
Figure 70: Illustration of Clock Generator Configuration screen ......................... 65
Figure 71: Illustration of Chipset Settings screen..................................................... 66
Figure 72: Illustration of DRAM Configuration screen ............................................ 67
Figure 73: Illustration of Video Configuration screen............................................. 69
Figure 74: Illustration of PMU_ACPI Configuration screen .................................... 70
Figure 75: Illustration of HDAC Configuration screen ............................................ 71
Figure 76: Illustration of Others Configuration screen ........................................... 72
Figure 77: Illustration of Boot Settings screen.......................................................... 74
Figure 78: Illustration of Security Settings screen.................................................... 76
Figure 79: Illustration of Save & Exit screen.............................................................. 77
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Lists of Tables
Table 1: COM connector pinout ................................................................................. 11
Table 2: USB 2.0 lockable port pinout ...................................................................... 12
Table 3: LAN port pinout.............................................................................................. 13
Table 4: LAN port LED color definition..................................................................... 13
Table 5: USB 3.0 ports pinout ...................................................................................... 14
Table 6: HDMI
®
port pinout......................................................................................... 15
Table 7: VGA connector pinout .................................................................................. 16
Table 8: Audio jack receptacle description.............................................................. 17
Table 9: DC-In connector pinout................................................................................. 17
Table 10: Digital I/O connector pinout...................................................................... 18
Table 11: USB 2.0 pin header pinout.......................................................................... 19
Table 12: WLAN USB connector pinout.................................................................... 20
Table 13: JCOMV1 voltage select jumper settings................................................. 25
Table 14: JCOMV2 voltage select jumper settings................................................. 26
Table 15: USB 2.0 power type select jumper settings ........................................... 27
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1.
1.1.
1. Product Overview
Product OverviewProduct Overview
Product Overview
The AMOS-3005 industrial system is an ultra compact design for various
industrial and embedded applications such as automation, Human Machine
Interface, transportation, energy management and etc.. The AMOS-3005 is
based on the EITX form factor, and powered by high performance 1.2 GHz
VIA Eden X4 processor.
A completely fanless system, the AMOS-3005 features a ruggedized and
qualified thermal performance design that is able to withstand a wide
operating temperature range, and makes it ideal for extreme operating
environment. The system’s housing is made of a heavy-duty steel body chassis
and a robust aluminum alloy top cover that provides high stability which can
withstand shock and vibration.
The AMOS-3005 has multiple I/O and connectivity features such as the VGA
connector and the HDMI port that enable dual independent displays, two
Gigabit Ethernet (RJ-45) ports, two lockable USB 2.0 ports, two USB 3.0 ports,
two configurable COM connectors (with 5V/12V selector), and DIO connector.
In addition, it supports one DDR3 1333 SODIMM socket (supports up to 8 GB
of memory), on-board SIM card socket, mSATA slot for mSATA storage drive
and one mini PCIe slot for 3G/GPS or Wi-Fi connectivity. An optional WLAN
USB (Wi-Fi) connectivity is also available which can be supported through on-
board WLAN connector.
1.1. Key Features
1.1.1. Powered by VIA
®
Eden X4 Processor
The VIA Eden™ X4 processor is a 64-bit superscalar x86 quad core processor
packed into an ultra compact NanoBGA2 package. The VIA Eden™ X4
processor delivers a superb performance on multi-tasking, multimedia,
playback, productivity, internet browsing in a lower power budget that makes
it ideal for embedded system application.
1.1.2. Fanless and Ruggedized Chassis Design
The AMOS-3005 features fanless operation. It has a ruggedized, compact
heavy-duty steel and aluminum alloy chassis that does double duty as a
thermal solution. It is designed to ensure maximum reliability and stability that
makes it suitable to install in critical environment.
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1.1.3. Networking Support
The AMOS-3005 is equipped with two RJ-45 ports that support high speed
Gigabit Ethernet. Its wireless networking options give the system a freedom of
3G, GPS and Wi-Fi through mini PCie slot, and onboard WLAN connector for
WLAN USB (Wi-Fi) connectivity.
1.1.4. Empowered Multimedia Capabilities
Built-in 3D/2D performance graphics engine with MPEG-2, VC-1 and H.264
decoding accelerator.
1.1.5. Optimize integration with multiple I/O access
Front and rear I/O access enables the AMOS-3005 system to easily access to
peripherals, support various applications, easy integration, quick setup and
easy maintenance.
1.1.6. SIM Card Socket
The AMOS-3005 has a built-in SIM card socket that can support active SIM
card from mobile phone service providers for 3G communication.
1.1.7. Storage Expansion
The mSATA slot enables the AMOS-3005 to have flexible storage of mSATA
flash drive.
1.1.8. Wide Range of Power Sources
The AMOS-3005 supports a wide range of input power from DC 9V ~ 36V.
The flexibility of power input enables the system to be deployable for various
automation environments.
1.1.9. Wide Range of Operating Temperatures
The AMOS-3005 carries a qualified thermal performance design which allows
a wide range of operating temperature from 0°C to 60°C, suitable for critical
applications.
1.1.10. Shock Resistant
The AMOS-3005 is shock resistant to 50G for maximum reliability.
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1.1.11. Multiple Mounting Solutions
The AMOS-3005 supports multiple methods for mounting the chassis securely.
It can be mounted to a table, wall, and any flat surface or to VESA mountable
surfaces with the optional VESA mounting kit.
1.1.12. Embedded OS ready
It is 100% compatible with several operating systems including Microsoft
Windows 7, Microsoft Windows 8, Microsoft Windows 8.1, Microsoft
Windows Embedded Standard 7 and Linux.
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1.2. Product Specifications
Computing System
Computing SystemComputing System
Computing System
Processor
ProcessorProcessor
Processor
1.2 GHz VIA Eden X4
1066 MHz front side bus
2MB L2 cache
System Chipset
System ChipsetSystem Chipset
System Chipset
VIA VX11 Media System Processor
BIOS
BIOSBIOS
BIOS
AMI BIOS
32Mbit flash memory
System Power Management
System Power ManagementSystem Power Management
System Power Management
ACPI 3.0 compliant
System Monitoring
System MonitoringSystem Monitoring
System Monitoring
Wake-on LAN, Keyboard power-on, Timer power-on, System power
management, AC power failure recovery, Watchdog timer
System Memory
System MemorySystem Memory
System Memory
Technology
TechnologyTechnology
Technology
One SODIMM socket supporting DDR3 1333 SDRAM
Maximum Capacity
Maximum CapacityMaximum Capacity
Maximum Capacity
Supports up to 8GB memory size
Graphics
GraphicsGraphics
Graphics
Controller
ControllerController
Controller
Integrated VIA Chrome™ 640 DX11 3D/2D video processor with MPEG-2,
WMV9, VC1, and H.264 video decoding accelerator
Display Memory
Display MemoryDisplay Memory
Display Memory
Optimized Unified Memory Architecture (UMA), supports 256MB to 512MB
frame buffer using system memory
UMA supporting CRT/HDMI
CRT
CRTCRT
CRT Interface
Interface Interface
Interface
Supports one VGA connector
10-bit true-color RAMDAC up to 350MHz pixel rate with gamma correction
capability
Supports CRT resolution up to 2048 x 1536 pixels
HDMI
HDMIHDMI
HDMI
®
Interface
Interface Interface
Interface
Supports one HDMI
®
port (Type C connector)
Video pixel encoded in RGB 4:4:4/YCbCr 4:4:4/YCbCr 4:2:2 formats
Pixel rate up to 340 MHz
Supports 1x, 2x, 4x pixel-repetition, complies with CEA-861-D
Dual View
Dual ViewDual View
Dual View
Dual independent display of:
HDMI
®
+ VGA at different resolution, pixel depths, and refresh rate
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Storage
StorageStorage
Storage
Interface
InterfaceInterface
Interface
Supports one mSATA slot
Ethernet
EthernetEthernet
Ethernet
Controller
ControllerController
Controller
Two Realtek RTL8111G PCIe Gigabit Ethernet controllers
Interface
InterfaceInterface
Interface
Supports dual Gigabit Ethernet (RJ-45) ports
Supports Wake On LAN (WOL)
Supports Pre-boot Execution Environment (PXE)
High Definition Audio
High Definition AudioHigh Definition Audio
High Definition Audio
Controller
ControllerController
Controller
VIA VT2021 High Definition Audio Codec
Interface
InterfaceInterface
Interface
Supports Line-Out and Mic-In audio jacks
USB 3.0
USB 3.0USB 3.0
USB 3.0
Controller
ControllerController
Controller
Integrated USB controller built-in in VX11 chipset
Interface
InterfaceInterface
Interface
Supports two USB 3.0 ports
USB 2.0
USB 2.0USB 2.0
USB 2.0
Controller
ControllerController
Controller
Integrated USB controller built-in in VIA VX11 chipset
Interface
InterfaceInterface
Interface
Supports two USB 2.0 ports (lockable USB ports for secure connection)
5VSUS or +5V power selection by jumper VUSB_SEL1 for USB 2.0 ports and
onboard USB pin header
Reserved onboard USB pin header
Serial
SerialSerial
Serial
Controller
ControllerController
Controller
Onboard Fintek Super I/O F71869ED controller
Interface
InterfaceInterface
Interface
Two COM connectors
BIOS selectable to support adjust functionality of RS-232/422/485 mode
of COM1 and COM2 connectors
5V/12V power selection by jumper JCOMV1 and JCOMV2 for COM1 and
COM2 connectors
Digital I/O (
Digital I/O (Digital I/O (
Digital I/O (GPIO
GPIOGPIO
GPIO)
))
)
Interface
InterfaceInterface
Interface
Supports one Digital I/O connector
8-bit Digital I/O (4GPI+4GPO)
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Mini PCIe
Mini PCIe Mini PCIe
Mini PCIe slot
slotslot
slot
Controller
ControllerController
Controller
PCIe x1 Controller built-in VX11chipset
Integrated USB 2.0 Host Controller built-in VX11 chipset
Interface
InterfaceInterface
Interface
One mSATA slot for mSATA module
One mini PCIe slot for 3G/GPS/Wi-Fi module
Supports three external antenna for 3G, GPS and Wi-Fi
SIM Card
SIM Card SIM Card
SIM Card socket
socketsocket
socket
Interface
InterfaceInterface
Interface
Supports one onboard SIM card socket
I/O
I/O I/O
I/O Pan
PanPan
Panel
elel
el Connectors
Connectors Connectors
Connectors
Front Panel I/O
Front Panel I/O Front Panel I/O
Front Panel I/O
One Power On/Off button
One Green LED indicator (Power status)
One Red LED indicator (SSD/HDD activity status)
Two COM connectors
COM1 and COM2 (supports RS-232/422/485)
Two lockable USB 2.0 ports (USB0 and USB1)
Three reserved antenna hole for 3G, GPS and WiFi interface
Rear
RearRear
Rear
Panel
PanelPanel
Panel
I/O
I/OI/O
I/O
Two RJ-45 ports (Gigabit Ethernet)
Two USB 3.0 ports
One HDMI
®
port (Type-C connector)
One VGA connector
One DIO connector (for 8-bit GPIO)
One DC-In power (2-pole Phoenix 3.81mm) connector
Two 3.5 Ø audio jacks (as Line-Out and Mic-In)
Bottom
Bottom Bottom
Bottom Side
SideSide
Side
Removable bottom cover plate to access the following:
SODIMM memory socket
Mini PCIe slot
mSATA slot
SIM card socket
Onboard USB pin header (JUSB2_1)
Watchdog Timer
Watchdog TimerWatchdog Timer
Watchdog Timer
Output
OutputOutput
Output
System reset
Interval
IntervalInterval
Interval
Programmable 1 ~ 255 sec.
Power Supply
Power SupplyPower Supply
Power Supply
Input Voltage
Input VoltageInput Voltage
Input Voltage
9V
DC
~ 36V
DC
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Mechanical Characteristics
Mechanical CharacteristicsMechanical Characteristics
Mechanical Characteristics
Construction
ConstructionConstruction
Construction
Aluminum top cover
Dual removable front and real metal face plates
Removable bottom metal plate cover
Mounting
MountingMounting
Mounting
Wall mountable
VESA mountable
Dimensions (Le
Dimensions (LeDimensions (Le
Dimensions (Length x Width x Height)
ngth x Width x Height)ngth x Width x Height)
ngth x Width x Height)
150.5 mm x 109.8 mm x 48.09 mm
Weight
WeightWeight
Weight
1.4 Kg.
Environmental Specification
Environmental SpecificationEnvironmental Specification
Environmental Specification
Operating Temperature
Operating TemperatureOperating Temperature
Operating Temperature
0°C ~ 60°C (with industrial mSATA flash drive)
Storage Temperature
Storage TemperatureStorage Temperature
Storage Temperature
-20°C ~ 70°C
Relative Humidity
Relative HumidityRelative Humidity
Relative Humidity
10% ~ 90% @ 45°C, non-condensing
Vibrat
VibratVibrat
Vibration
ionion
ion Loading During Operation (with mSATA flash drive)
Loading During Operation (with mSATA flash drive) Loading During Operation (with mSATA flash drive)
Loading During Operation (with mSATA flash drive)
3Grms, IEC 60068-2–64, random, 5–500Hz, 1 Oct./min, 1hr/axis
Shock
ShockShock
Shock During Operation (with mSATA flash drive)
During Operation (with mSATA flash drive) During Operation (with mSATA flash drive)
During Operation (with mSATA flash drive)
50G, IEC 60068-2–27, half size, 11ms duration
EMC Approved
EMC ApprovedEMC Approved
EMC Approved
CE, FCC
Software Compatibility
Software CompatibilitySoftware Compatibility
Software Compatibility
Op
OpOp
Operating System
erating Systemerating System
erating System
Microsoft Windows 8
Microsoft Windows 8.1
Microsoft Windows 7
Microsoft Windows Embedded Standard 7
Linux
Note:
Note:Note:
Note:
As the operating temperature provided in the specifications is a result of the test performed in VIA’s
chamber, a number of variables can influence this result. Please note that the working temperature may
vary depending on the actual situation and environment. It is highly suggested to execute a solid
testing and take all the variables into consideration when building the system. Please ensure that the
system runs well under the operating temperature in terms of application.
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1.3. Layout Diagram
Figure
Figure Figure
Figure 1
11
1:
: :
: Front
FrontFront
Front
side panel
side panelside panel
side panel
Figure
Figure Figure
Figure 2
22
2:
: :
: Rear side panel
Rear side panelRear side panel
Rear side panel
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1.4. Dimensions
Figure
Figure Figure
Figure 3
33
3:
: :
: Front
FrontFront
Front side view dimensions
side view dimensions side view dimensions
side view dimensions
Figure
Figure Figure
Figure 4
44
4: Top side view dimensions
: Top side view dimensions: Top side view dimensions
: Top side view dimensions
/
