AIC HA201-AP User manual

UM_HA201-AP_v.1_032717

HA201-AP

Storage Server Barebone

User's Manual

contents

CONTENTS

PREFACE ��i

SAFETY INSTRUCTIONS �� ii

Chapter 1� Product Introduction �� 1

1�1 Box Content ��1

1.2 Specications ��2

1�3 General Information ��3

Chapter 2� Hardware Installation �� 7

2�1 Removing and Installing top cover �� 7

2�2 System Memory ��8

2�3 Removing and Installing the canister Top cover �� 11

2�4 Installing/ Removing a Solid State Drive �� 12

2�5 Removing and Installing a Fan Module �� 13

2�6 Removing/Installing a Drive Tray/ Hard Drive/ Drive Slot Map �� 14

2�7 Removing and Installing the HDD backplane Module �� 18

2�8 Removing and Installing the Power Supply �� 19

2�9 Removing and Installing the PCIe Card �� 20

2�10 Tool-less Blade Slide Installation introduction �� 22

Chapter 3� Motherboard Settings �� 26

3�1 Motherboard block diagram �� 26

3�2 Motherboard Layout ��27

3�3 Motherboard Content List �� 28

3�4 Internal Connectors/Jumpers �� 29

3�5 LEDs �� 37

Chapter 4. BIOS Conguration and Settings �� 40

4�1 Method 1 (Use the BIOS setup) �� 40

4�2 Method 2 (Use a Dos tool - Syscheck) �� 43

4�3 BMC web-browser-MegaRAC® GUI Overview �� 45

4�4 Using MegaRAC SP-X ��51

Chapter 5� Backplane Overview �� 53

contents

5�1 Backplane ��53

Chapter 6� Technical Support �� 57

This document contains proprietary information about

AIC products and is not to be disclosed or used except in

accordance with applicable agreements.

i

PREFACE

• Copyright

No part of this publication may be reproduced, stored in a retrieval system,

or transmitted in any form or by any means, electronic, mechanical, photo-

static, recording or otherwise, without the prior written consent of the

manufacturer.

• Trademarks

All products and trade names used in this document are trademarks or

registered trademarks of their respective holders.

• Changes

The material in this document is for information purposes only and is subject

to change without notice.

• Warning

1. A shielded-type power cord is required in order to meet FCC emission

limits and also to prevent interference to the nearby radio and television

reception. It is essential that only the supplied power cord be used.

2. Use only shielded cables to connect I/O devices to this equipment.

3. You are cautioned that changes or modications not expressly approved

by the party responsible for compliance could void your authority to

operate the equipment.

• Disclaimer

AIC shall not be liable for technical or editorial errors or omissions

contained herein. The information provided is provided "as is" without

warranty of any kind. To the extent permitted by law, neither AIC or its

affiliates, subcontractors or suppliers will be liable for incidental, special or

consequential damages including downtime cost; lost profits; damages

relating to the procurement of substitute products or services; or damages

for loss of data, or software restoration. The information in this document is

subject to change without notice.

ii

SAFETY INSTRUCTIONS

• Before getting started, please read the following important cautions:

• All cautions and warnings on the equipment or in the manuals should be

noted.

• Most electronic components are sensitive to electrical static discharge.

Therefore, be sure to ground yourself at all times when installing the

internal components.

• Use a grounding wrist strap and place all electronic components in

static-shielded devices. Grounding wrist straps can be purchased in any

electronic supply store.

• Be sure to turn off the power and then disconnect the power cords from

your system before performing any installation or servicing. A sudden

surge of power could damage sensitive electronic components.

• Do not open the system’s top cover. If opening the cover for

maintenance is a must, only a trained technician should do so.

Integrated circuits on computer boards are sensitive to static electricity.

Before handling a board or integrated circuit, touch an unpainted

portion of the system unit chassis for a few seconds. This will help to

discharge any static electricity on your body.

• Place this equipment on a stable surface when install. A drop or fall

could cause injury.

• Please keep this equipment away from humidity.

• Carefully mount the equipment into the rack, in such manner, that it

won’t be hazardous due to uneven mechanical loading.

• This equipment is to be installed for operation in an environment with

maximum ambient temperature below 35°C.

• The openings on the enclosure are for air convection to protect the

equipment from overheating. DO NOT COVER THE OPENINGS.

• Never pour any liquid into ventilation openings. This could cause re or

electrical shock.

• Make sure the voltage of the power source is within the specification

on the label when connecting the equipment to the power outlet. The

current load and output power of loads shall be within the specication.

• This equipment must be connected to reliable grounding before using.

Pay special attention to power supplied other than direct connections,

e.g. using of power strips.

iii

• Place the power cord out of the way of foot trafc. Do not place anything

over the power cord. The power cord must be rated for the product, voltage

and current marked on the product’s electrical ratings label. The voltage

and current rating of the cord should be greater than the voltage and

current rating marked on the product.

• If the equipment is not used for a long time, disconnect the equipment from

mains to avoid being damaged by transient over-voltage.

• Never open the equipment. For safety reasons, only qualified service

personnel should open the equipment.

• If one of the following situations arise, the equipment should be checked by

service personnel:

1. The power cord or plug is damaged.

2. Liquid has penetrated the equipment.

3. The equipment has been exposed to moisture.

4. The equipment does not work well or will not work according to its user

manual.

5. The equipment has been dropped and/or damaged.

6. The equipment has obvious signs of breakage.

7. Please disconnect this equipment from the AC outlet before cleaning.

Do not use liquid or detergent for cleaning. The use of a moisture sheet or

cloth is recommended for cleaning.

• Module and drive bays must not be empty! They must have a dummy cover.

Product features and specications are subject to change without notice.

CAUTION :

risk of explosion if battery is replaced by an incorrect type.

dispose of used batteries according to the instructions.

After performing any installation or servicing, make sure the

enclosure are lock and screw in position, turn on the power.

1

HA201-AP User's Manual

Chapter 1 Product Introduction

1�1 Box Content

Chapter 1� Product Introduction

Before removing the subsystem from the shipping carton, visually inspect the

physical condition of the shipping carton. Exterior damage to the shipping

carton may indicate that the contents of the carton are damaged. If any

damage is found, do not remove the components; contact the dealer where

the subsystem was purchased for further introduction. Before continuing, rst

unpack the subsystem and verify that the contents of the shipping carton are

all there and in good condition.

• Enclosure( Power supply, fan, 24 HDD tray included)

• RS232 cablex 1pcs • Power cord x 2sets • Screws kit x 1set

• Slide rail x 1set

If any items are missing, please contact your authorized reseller or sales representative.

2

HA201-AP User's Manual

Chapter 1 Product Introduction

1.2 Specications

Dimensions

(W x D x H)

(with chassis ears)

mm : 632 x 435 x 8 8

inches : 24.9 x 17.1 x 3.5

Motherboard

(per node)

AIC Server Board Apollo

Processor

(per node)

Processor

Support

One Intel® Xeon® Processor D-1500 product

family

Socket Type SoC (System-on-a-Chip)

Chipset Support

(per node)

SoC (System-on-a-Chip)

System Memory

(per node)

• 4 DIMM slots

Up to 128GB DDR4 2133/1866MHz ECC UDIMM

Front Panel

System power on/off

LE Ds

A

• Power (Primary)

• Warning

B

• Power (Secondary)

• Warning

Drive Bays

External

3.5" hot swap 8

2.5" hot swap 8

Internal 2.5" 2

Backplane

1 x 16-port 12Gb SAS dual-loop backplane

Expansion Slots

(per node)

PCIe 3.0 1 x8 FHHL

Riser Card

(included)

(per node)

RC-PE1U09-TY 1x PCIe X8

System BI OS

BIOS Type

• Insyde

• SPI (Serial Peripheral Interface)

FLASH Interface

BIOS

Features

• ACPI

• PXE

• WOL

• AC loss recovery

• IPMI 2.0 KCS interface

• SMBIOS

• Serial console redirection

• BIOS Boot Specification

• BIOS Recovery Mode

• SRIOV

• PCIe Hotplug

• iSCSI

• TPM

On-board

Devices

SATA

PCH on-chip solution supports 6 x SATA

6.0Gb (one of the SATAs shares with M.2

SATA interface)

1 x NGFF (M.2 B-key) slot supports PCI-e

Gen.2 x1/x2 & SATA co-design

IPMI

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Processor

Network

Controllers

• 2 x Springville_I210 Gigabit MAC/PHY

supports Giga LAN @Rear I/O

• 2 x Springville_I210 Gigabit MAC/PHY

supports Giga LAN @AirMax

• 2 x integrated Magnolia Park + Cortina

CS4227 PHY support dual ports 10G

SFP+

Graphics

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Processor

• PCIe VGA/2D Controller

• 1920x1200@60Hz 32bpp

Rear I/O

(per node)

LAN

2 x 10G SFP+ (double-stack)

2 x RJ45 GigaLAN (double-stack)

1 x RJ45 (BMC management port)

USB

2 x USB 3.0 Type A

VGA

1 x DB-15 (shares with onboard pin header)

Serial Port

1 x DB-9 COM1

Others

2 x mini-SAS HD (SFF-8644)

Power Supply

600W 1+1 redundant power supply

System Cooling

(per node)

3 x 40x56mm dual rotor fans

System

Management

• Baseboard Management Controller

• Intelligent Platform Interface 2.0 (IPMI 2.0)

• iKVM, Media Redirection, IPMI over LAN, Serial over LAN

• SMASH Support

Environmental

Specifications

• Temperature: 0°C - 35°C

• Humidity: 5% - 95% non-condensing

Gross Weight

(w/ PSU & Rail)

kgs : 26

lbs : 57.3

Packaging

Dimensions

(W x D x H)

mm : 965 x 590 x 330

inches : 40 x 23.2 x 13

Mounting

Standard

3

HA201-AP User's Manual

Chapter 1 Product Introduction

1�3 General Information

HA201-AP, a 2U Storage Server Barebone, ach supporting one Intel®

Xeon-D® Processor and up to 128GB of DDR4 memory. HA201-AP has a

8 x 2.5” hot swap HDD bays as system drive bays. It is a perfect building

block for Storage Servers.

• Front Panel

8 x 2.5" hot swap drive bays

8 x 3.5" hot swap drive bays

• LED Indicator and Switch

4

HA201-AP User's Manual

Chapter 1 Product Introduction

• Rear Panel

Supports 1 x8 FHHL PCIe 3.0 slots (per node)

Dual server board controller canisters

600W 1+1 redundant power supply

5

HA201-AP User's Manual

Chapter 1 Product Introduction

• Top View of HA201-AP system

Two compute nodes, Active-Active conguration, each supporting

one Intel® Xeon-D® Processor and up to 128GB of DDR4 memory

6

HA201-AP User's Manual

Chapter 1 Product Introduction

• TOP View Of Controller Canister

Broadcom/LSI SAS3008

12G 8port SAS IOC

Broadcom/LSI SAS3x36/3x28

12G SAS Expander

BroadWell-DE SoC

(Xeon D1500 series)

HA201-AP User's Manual

7

Chapter 2 Hardware Installation

7

2�1 Removing and Installing top cover

There are four screws on the each upper surface of the cover.

Chapter 2� Hardware Installation

This section demonstrates maintenance procedures in replacing a

defective part once the HA201-TP UM appliance is installed and is

operational

Chapter 2 Hardware Installation

HA201-AP User's Manual

8

2�2 System Memory

This server board supports up to eight DDR4 speeds of

1333/1600/1867/2133/2400 Registered ECC RDIMM and UDIMM.

J29

JSFP+

JPWR2

JPWR1

JBAT

MH1

MH7

LED1

JVBATT_I2C

J1

JCOM

JSPI_BIOS

SPI_BMC

JPMBUS

U28

JLPC_DP

J20

J22

JCMOS

TP15

R362

R379

R387

R200

R119

R186

R96

R619

R620

LED6

LED12

LED11

LED10

LED9

LED14

LED13

LED20

LED21

LED18

LED17

LED19

LED4

LED2

LED5

LED3

JBUZZER

J28

JBMC_DIS

JEXP_RST

J24

J17

JSPKR

J18

J3

J4

JNTB

JBMC_RST

J7

J6

JPG_LOCK

J25

JDOM_PWR

JINTRUDER

J2

EC39

EC29

JBMC_I2C1

C795

C794

C793

C471

C472

C473

C786

C164

C165

C159

C158

C166 C199

C198

C201

C367C358 C388

C390

C389C378

C356

C368C357

C366

C393

C415

C401

C403 C411

C400C395

C394

C301C295

C296 C304C286

C283

C305C298 C313

C282

C346C331

C330 C345

C332 C348

C377

C56

C36

C184

C178

C183

C440

JBMC_I2C10

JBMC_DP

JUSB_MB

J23

JLCM

U30

J15

J16

J21

J14

J5

JBMC_GPIO

JSGPIO

J9

J8

J10

JPCH_GPIO

J26

U13

U12

SATA2

SATA1

SATA3

SATA5

SATA6

SATA4

JCOM1

J13

J19

J11 J12

JCOM4

CN6CN5

JVGA_INT

JUSB_INT

JUSB

JFRNT_SSI

U15

JRJ45

CN3 CN4

JRJ45_USB

CN1 CN2

U11

CN12CN11CN8CN7

JCPU_XDP

U6

JNGFF

JDIMMB0

JDIMMA0

JDIMMA1

JDIMMB1

U16

U61

AB

AA

SAS IOC STATUS LED

Ver:B

Thermal Sensor

SAS EXP MDIO

SAS EXP SGPIO

J22:SAS EXP UART

J20:SAS IOC UART

BATTERY MODE

J18:FLASH DESCRIPTOR SECURITY OVERRIDE

J7:ME FORCE RECOVERY MODE

J6:BIOS RECOVERY MODE

J17:NO REBOOT

FAN6 CONN

FAN5 CONN

FAN4 CONN

FAN3 CONN

FAN2 CONN

FAN1 CONN

PCIE HOT-PLUG SMB

SAS IOC SGPIOSAS IOC ICE

SAS IOC ACTIVITY

SAS IOC ERROR

SAS EXP HEART BIT LED

NGFF ACTIVITY LED

UID LED

LED18:SAS IOC ERROR LED

LED17:SAS IOC HEART BIT LED

BMC HEART BIT LED

LED7:RSMRST PG LED

LED8:SYSTEM PG LED

Sensor

Therma

l

External-2

Inlet Thermal Sensor

SAS EXP Thermal Sensor

Thermal Sensor

SAS IOC

VR Thermal Sensor

DIMM Thermal Sensor

Thermal Sensor

External-1

Rear I/O

BMC Thermal Sensor

BROADWELL-DE

CS4227

LSISAS3008

AST2400

RTL8201

I210

Apollo

K

N'

M'

D'

V

A/W:UPBD01-B

1

P/N:MB-UPBD0

1

B48-STI4T07T00B000

HA201-AP User's Manual

9

Chapter 2 Hardware Installation

2.2.1 Populate DIMMs in the following order:

DIMM Number DIMM arrangement

JCPU0

JDIMM_B1

1 DIMMs

2 DIMMs

3 DIMMs

4 DIMMs

CHA CHB

JDIMM_B1

JCPU0

JDIMM_A1

JDIMM_B1

JCPU0

CHA CHB

JDIMM_B1

JDIMM_B0

JDIMM_B1

JDIMM_B0

JDIMM_A1

JDIMM_A0

JDIMM_A1

JDIMM_B0

JDIMM_B1

JDIMM_A0

JDIMM_A1

JDIMM_B0

JDIMM_B1

Chapter 2 Hardware Installation

HA201-AP User's Manual

10

2.2.2 DIMM Installation Procedure

Unlock a DIMM socket by pressing the retaining clips outward.

Insert module vertically and press down until it snaps into place.

Note: DIMM notch and socket bump must align as shown.

DIMM notch

HA201-AP User's Manual

11

Chapter 2 Hardware Installation

2�3 Removing and Installing the canister Top cover

2.3.1 Removing the top cover

1. Unscrew the thumbscrew using your ngers or a Phillips head

screwdriver. Be careful to retain the thumbscrew.

2. Carefully lift the top cover upward and set aside.

Chapter 2 Hardware Installation

HA201-AP User's Manual

12

2�4 Installing/ Removing a Solid State Drive

2.4.1

Installing a Solid State Drive

1. Remove the screws holding the bracket kit into place, then

remove the bracket kit itself (Installing a total of 4 screws). See

the characters

u

.

2. Place the SSD into its a bracket kit, line it up with the holes on

either side,then screw it in (Installing a total of 8 screws for 2 x

SSD’s). See the characters

v

.

u

v

HA201-AP User's Manual

13

Chapter 2 Hardware Installation

2�5 Removing and Installing a Fan Module

2.5.1 Removing a fan module

Grabbing and removing the fan module from the fan slot.

AIRFLOW

NOTE: The heat sink’s fans should be blowing toward the rear end

of the chassis. If one of the fans is facing the wrong direction,

please remove the heat sink and reinstall it so that it is facing

the correct direction.

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AIC HA201-AP User manual

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