TABLE OF CONTENTS
Chapter 1 Introduction ................................................................................................................... 2
1.1 TSoM Design Package ........................................................................................................................ 2
1.2 Getting Help ........................................................................................................................................ 2
Chapter 2 Board Specification ......................................................................................................... 3
2.1 Layout and Components ..................................................................................................................... 3
2.2 Block Diagram .................................................................................................................................... 3
2.3 Mechanical Specifications .................................................................................................................. 5
2.4 Power Requirement ............................................................................................................................. 5
Chapter 3 System Interface ............................................................................................................. 7
3.1 Device Configuration .......................................................................................................................... 7
3.2 Clock System .................................................................................................................................... 10
3.3 Reset System ..................................................................................................................................... 11
3.4 260-pin Edge Connector ................................................................................................................... 11
Chapter 4 HPS Fabric Components ............................................................................................... 13
4.1 USB 2.0 ............................................................................................................................................. 13
4.2 Gigabit Ethernet ................................................................................................................................ 14
4.3 eMMC ............................................................................................................................................... 15
4.4 HPS 3.3V GPIO ................................................................................................................................ 16
4.5 DDR3 ................................................................................................................................................ 18
Chapter 5 FPGA Fabric Components ............................................................................................. 21
5.1 DDR3 ................................................................................................................................................ 21
5.2 FPGA IOs on 260-Pin Edge Connector ............................................................................................ 23