ASRock Rack E3C256D4I-2T User manual

E3C256D4I-2T

User Manual

Version 1.0

Published July 2021

Version 1.0

Published August 2022

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or

translated in any language, in any form or by any means, except duplication of

documentation by the purchaser for backup purpose, without written consent of

ASRock Rack Inc.

Products and corporate names appearing in this documentation may or may not

be registered trademarks or copyrights of their respective companies, and are used

only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished

for informational use only and subject to change without notice, and should not

be constructed as a commitment by ASRock Rack. ASRock Rack assumes no

responsibility for any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock Rack does not provide

warranty of any kind, either expressed or implied, including but not limited to

the implied warranties or conditions of merchantability or tness for a particular

purpose.

In no event shall ASRock Rack, its directors, ocers, employees, or agents be liable

for any indirect, special, incidental, or consequential damages (including damages

for loss of prots, loss of business, loss of data, interruption of business and the

like), even if ASRock Rack has been advised of the possibility of such damages

arising from any defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that

may cause undesired operation.

is equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC Rules. ese limits are designed to provide

reasonable protection against harmful interference in a residential installation. is

equipment generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment o and on, the

user is encouraged to try to correct the interference by one or more of the following

measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit dierent from that to which the

receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

INTEL END USER SOFTWARE LICENSE AGREEMENT

IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.

LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware

only in its unmodied and binary form, (with the accompanying documentation, the

“Soware”) for Licensee’s personal use only, and not commercial use, in connection with

Intel-based products for which the Soware has been provided, subject to the following

conditions:

(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree

to prevent unauthorized copying of the Soware.

(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.

(c) Licensee may not sublicense the Soware.

(d) e Soware may contain the soware and other intellectual property of third party

suppliers, some of which may be identied in, and licensed in accordance with, an enclosed

license.txt le or other text or le.

(e) Intel has no obligation to provide any support, technical assistance or updates for the

Soware.

OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware

remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected

by the laws of the United States and other countries, and international treaty provisions.

Licensee may not remove any copyright notices from the Soware. Except as otherwise

expressly provided above, Intel grants no express or implied right under Intel patents,

copyrights, trademarks, or other intellectual property rights. Transfer of the license termi-

nates Licensee’s right to use the Soware.

DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of

any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,

WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR-

POSE.

LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS

WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF

BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG-

ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN

IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT

obligate Licensee to provide Intel with comments or suggestions regarding the Soware.

However, if Licensee provides Intel with comments or suggestions for the modication,

correction, improvement or enhancement of (a) the Soware or (b) Intel products or

processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide,

perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under

Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments

and suggestions.

TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license

at any time if Licensee is in breach of any of its terms or conditions. Upon termination,

Licensee will immediately destroy or return to Intel all copies of the Soware.

THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License

Agreement and has the right to enforce all of its terms.

U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as

dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial

computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent

with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide

the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,

2200 Mission College Blvd., Santa Clara, CA 95054.

EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will

export/re-export the Soware, directly or indirectly, to any country for which the U.S.

Department of Commerce or any other agency or department of the U.S. Government

or the foreign government from where it is shipping requires an export license, or other

governmental approval, without rst obtaining any such required license or approval. In

the event the Soware is exported from the U.S.A. or re-exported from a foreign destina-

tion by Licensee, Licensee will ensure that the distribution and export/re-export or import

of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.

Export Administration Regulations and the appropriate foreign government.

APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will

be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws

principles. e Parties to this Agreement exclude the application of the United Nations

Convention on Contracts for the International Sale of Goods (1980). e state and federal

courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising

out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue

in those courts. A Party that obtains a judgment against the other Party in the courts iden-

tied in this section may enforce that judgment in any court that has jurisdiction over the

Parties.

Licensee’s specic rights may vary from country to country.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance

controlled in Perchlorate Best Management Practices (BMP) regulations passed by the

California Legislature. When you discard the Lithium battery in California, USA, please

follow the related regulations in advance.

“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/

perchlorate”

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian Consumer

Law. You are entitled to a replacement or refund for a major failure and compensation for

any other reasonably foreseeable loss or damage caused by our goods. You are also entitled

to have the goods repaired or replaced if the goods fail to be of acceptable quality and the

failure does not amount to a major failure. If you require assistance please call ASRock

Rack Tel : +886-2-55599600 ext.123 (Standard International call charges apply)

ASRock Rack INC. hereby declares that this device is in compliance with the essential

requirements and other relevant provisions of related UKCA Directives. Full text of UKCA

declaration of conformity is available at: http://www.asrockrack.com

ASRock Rack INC. hereby declares that this device is in compliance with the essential re-

quirements and other relevant provisions of related Directives. Full text of EU declaration

of conformity is available at: http://www.asrockrack.com

ASRock Rack follows the green design concept to design and manufacture our products,

and makes sure that each stage of the product life cycle of ASRock Rack product is in line

with global environmental regulations. In addition, ASRock Rack disclose the relevant

information based on regulation requirements.

Please refer to https://www.asrockrack.com/general/about.asp?cat=Responsibility for

information disclosure based on regulation requirements ASRock Rack is complied with:

DO NOT throw the motherboard in municipal waste. is product has been

designed to enable proper reuse of parts and recycling. is symbol of the

crossed out wheeled bin indicates that the product (electrical and electronic

equipment) should not be placed in municipal waste. Check local regulations

for disposal of electronic products.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Unique Features 5

1.4 Motherboard Layout 6

1.5 Onboard LED Indicators 8

1.6 I/O Panel 9

1.7 Block Diagram 11

Chapter 2 Installation 12

2.1 Screw Holes 12

2.2 Pre-installation Precautions 12

2.3 Installing the CPU 13

2.4 Installing the CPU Fan and Heatsink 15

2.5 Installation of Memory Modules (DIMM) 16

2.6 Expansion Slot (PCI Express Slot) 17

2.7 Jumper Setup 18

2.8 Onboard Headers and Connectors 19

2.9 ATX PSU / DC-IN Power Connections 24

2.10 Unit Identication purpose LED/Switch 25

2.11 Driver Installation Guide 25

2.12 Dual LAN and Teaming Operation Guide 26

2.13 M.2_SSD (NGFF) Module Installation Guide (M2_1) 27

Chapter 3 UEFI Setup Utility 28

3.1 Introduction 28

3.1.1 UEFI Menu Bar 28

3.1.2 Navigation Keys 29

3.2 Main Screen 30

3.3 Advanced Screen 33

3.3.1 CPU Conguration 34

3.3.2 DRAM Conguration 37

3.3.3 Chipset Conguration 38

3.3.4 Storage Conguration 40

3.3.5 NVMe Conguration 41

3.3.6 ACPI Conguration 42

3.3.7 Super IO Conguration 43

3.3.8 Serial Port Console Redirection 44

3.3.9 H/W Monitor 47

3.3.10 Intel SPS Conguration 48

3.3.11 Driver Health 49

3.3.12 Tls Auth Conguration 50

3.3.13 Instant Flash 51

3.4 Server Mgmt 52

3.4.1 BMC Network Conguration 54

3.4.2 System Event Log 56

3.4.4 BMC Tools 57

3.5 Security 58

3.5.1 Key Management 59

3.6 Boot Screen 63

3.7 Event Logs 65

3.8 Exit Screen 66

Chapter 4 Software Support 67

4.1 Download and Install Operating System 67

4.2 Download and Install Software Drivers 67

4.3 Contact Information 67

Chapter 5 Troubleshooting 68

5.1 Troubleshooting Procedures 68

5.2 Technical Support Procedures 70

5.3 Returning Merchandise for Service 70

E3C256D4I-2T

PB 1

English

Chapter 1 Introduction

ank you for purchasing ASRock Rack E3C256D4I-2T motherboard, a reliable

motherboard produced under ASRock Rack’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock Rack’s

commitment to quality and endurance.

In this manual, chapter 1 and 2 contains introduction of the motherboard and step-

by-step guide to the hardware installation. Chapter 3 and 4 contains the conguration

guide to BIOS setup and information of the Support CD.

1.1 Package Contents

• ASRock Rack E3C256D4I-2T Motherboard

(Mini ITX Form Factor: 6.7-in x 6.7-in, 17.02 cm x17.02 cm)

• Quick Installation Guide

• 1 x SATA Power Cable (80cm)

• 1 x ATX 4P to 24P Power Cable

• 1 x Oculink to 4 SATA Cable (60cm)

• 1 x Oculink to 4 SATA Cable (60cm) (Optional)

• 1 x I/O Shield

• 1 x Screw for M.2 Socket

If any items are missing or appear damaged, contact your authorized dealer.

Because the motherboard specications and the BIOS soware might be updated, the con-

tent of this manual will be subject to change without notice. In case any modications of

this manual occur, the updated version will be available on ASRock Rack website without

further notice. You may nd the latest memory and CPU support lists on ASRock Rack

website as well. ASRock Rack’s Website: www.ASRockRack.com

If you require technical support related to this motherboard, please visit our website for

specic information about the model you are using.

http://www.asrockrack.com/support/

2 3

English

1.2 Specications

E3C256D4I-2T

Physical Status

Form Factor mini-ITX

Dimension 6.7" x 6.7"

Processor System

CPU Supports Intel® Xeon® E-2300 and 10th Gen Intel® Pentium®

series processors

Socket Single Socket H5 (LGA1200)

ermal Design

Power (TDP)

95W

Chipset Intel® C256

System Memory

Supported

DIMM Quantity

4 DIMM slots (2DPC)

Supported Type DDR4 288-pin ECC/non-ECC SODIMM

Max. Capacity

per DIMM

ECC/non-ECC SODIMM: up to 32GB

Max. Frequency ECC/non-ECC SODIMM: max. 2933MHz (1DPC) / max.

2133MHz (2DPC) [TBD]

Voltage 1.2V

PCIe Expansion Slots (SLOT7 close to CPU)

SLOT7 PCIe4.0* x16 [CPU]

Note *SLOT7 supports PCIe3.0 only when installing 10th Gen Intel® Pentium® Series

Processors

Other PCIe Expansion Connectors

M.2 slot 1 M-key* (PCIe4.0 x4); support 2280 form factor [CPU]

OCuLink 2 OCuLink (PCIe3.0 x4 or 4 SATA 6Gb/s) [PCH]

Note *M.2 will not fuction when installing 10th Gen Intel® Pentium® Series Proces-

sors

SATA/SAS Storage

PCH Built-in

Storage

Intel® C256 (Up to 8 SATA 6Gb/s; RAID 0/1/5/10):

2 OCuLink

Ethernet

Additional

Ethernet

Controller

2 RJ45 (10GbE) by Intel® X550

USB

Connectors/

headers

External:

2 Type-A (USB3.2 Gen1)

Internal:

1 header (19-pin, 2 USB3.2 Gen1)

E3C256D4I-2T

2 3

English

Graphics

Controller ASPEED AST2500:

1 DB15 (VGA)

Security

TPM 1 (13-pin, SPI)

Rear I/O

UID button/

LED

1 UID button w/ LED

Video output 1 DB15 (VGA)

USB 2 Type A (USB3.2 Gen1)

RJ45 2 RJ45(10GbE), 1 dedicated IPMI

Hardware Monitor

Temperature CPU, MB, TR1 Temperature Sensing

Fan Fan Tachometer

CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU

Temperature)

Fan Multi-Speed Control

Voltage VCORE,VCCSA,VCCM,VCCST_SFR, 3.3V, 5V, 12V, +1.05V_

PCH_AUX,+BAT, 3VSB, 5VSB,VCCIO,+2.5V_VPP

Server Management

BMC Controller ASPEED AST2500: iKVM, vMedia support

IPMI Dedicated

GLAN

1 RJ45 Dedicated IPMI LAN port by Realtek RTL8211E

System BIOS

BIOS type AMI 256Mb SPI Flash ROM

Features Plug and Play, ACPI 6.2 and above compliance wake up events,

SMBIOS 3.3 and above, ASRock Rack Instant Flash

Internal Connectors/Headers

PSU connector 1 (4-pin, ATX PSU signal) w/ ATX 24-pin adapter cable, 1 (8-

pin, ATX 12V) support 12V DC-in

Other power

connector

1 (4-pin) for HDD power when using 12V DC-in power source

Auxiliary panel

header

1 (9-pin): chassis intrusion, system fault LED, LAN1/LAN2

activity LED, locate

System panel

header

1 (9-pin): power switch, reset switch, system power LED, HDD

activity LED

COM header 1

Fan header 3 (4-pin)

ermal sensor

header

1

TPM header 1 (13-pin, SPI)

SGPIO header 2

SMbus header 1

4 5

English

PMbus header 1

IPMB header 1

Clear CMOS 1 (contact pads)

Others 1 NC-SI (9-pin)

LED Indicators

Standby Power

LED

1 (5VSB)

Fan Fail LED 3

BMC Heartbeat

LED

1

Support OS

OS Microso® Windows®

- Server 2019 (64 bit)

- Server 2022 (64 bit)

Linux®

- RedHat Enterprise Linux Server 8.4 (64 bit) / Server 8.2

(64 bit)

- CentOs 8.5 (64 bit) / 8.2 (64 bit)

- Ubuntu 20.10 (64 bit) / Ubuntu 21.04 (64 bit)

Hypervisor:

- VMWare® ESXi 7.0U2a / vSphere 7.0U2b

- VMWare® ESXi 7.0U3 / vSphere 7.0U3

* Supports UEFI BOOT only.

* Please refer to our website for the latest OS support list.

Enviroment

Operating

temperature

10 - 35°C (50 - 95 degF)

Non-operating

temperature

-40 - 70°C (-40 - 158degF)

NOTE: Please refer to our website for the latest specications.

is motherboard supports Wake from on Board LAN. To use this function, please make

sure that the “Wake on Magic Packet from power o state” is enabled in Device Manager

> Intel® Ethernet Connection > Power Management. And the “PCI Devices Power On” is

enabled in UEFI SETUP UTILITY > Advanced > ACPI Conguration. Aer that, onboard

LAN1&2 can wake up S5 under OS.

If you install Intel® LAN utility or Marvell SATA utility, this motherboard may fail Win-

dows® Hardware Quality Lab (WHQL) certication tests. If you install the drivers only, it

will pass the WHQL tests.

E3C256D4I-2T

4 5

English

1.3 Unique Features

ASRock Rack Instant Flash is a BIOS ash utility embedded in Flash ROM. is con-

venient BIOS update tool allows you to update system BIOS without entering operat-

ing systems rst like MS-DOS or Windows®. With this utility, you can press the <F6>

key during the POST or the <F2> key to enter into the BIOS setup menu to access

ASRock Rack Instant Flash. Just launch this tool and save the new BIOS le to your

USB ash drive, oppy disk or hard drive, then you can update your BIOS only in a

few clicks without preparing an additional oppy diskette or other complicated ash

utility. Please be noted that the USB ash drive or hard drive must use FAT32/16/12

le system.

6 7

English

1.4 Motherboard Layout

PCIE7

17.0cm (6.7 in)

VGA1

RoHS

USB 3.2 Gen1

T: USB_1

B: USB_2

USB3_3_4

SATA_SGPIO1

E3C256D4I-2T

CLRMOS1

3

ATX12V2

Super

I/O

Intel

C256

COM1

1

OCU1

FAN1

C 1

M2_1

T

CMOS Battery

1

BMC

12

16 15

13

9

10

12

11

7

8

5

6

27

25

17

19

CHASSIS_ID0

22

SPI_TPM_J1

1

11

T 1

SEC_OR1

21

20

23

1

PSU_SMB1

1

26

UID1

IPMI_LAN

1

DDR4_A1 (64 bit, 260-pin module)

DDR4_A2 (64 bit, 260-pin module)

DDR4_B1 (64 bit, 260-pin module)

DDR4_B2 (64 bit, 260-pin module)

ATX4PIN1

SATAPWR1

1

OCU2

1

BMC_SMB_1IPMB_1

LAN1 LAN2

(NCSI)

Intel

X550

1

NCSI1

FAN2 FAN3

4

ITX_AUX_PANEL1

1

14

HDLED RESET

PLED PWRBTN

PANEL1

1

R

1

BIOS

ROM

IPMI_LED1

18

24

E3C256D4I-2T

6 7

English

No. Description

1 2 x 260-pin DDR4 SO-DIMM Slots (DDR4_A1, DDR4_B1)

2 2 x 260-pin DDR4 SO-DIMM Slots (DDR4_A2, DDR4_B2)

3 Micro-Fit Power Connector (ATX4PIN1)

4 ATX 12V Power Connector (ATX12V2)

5 PSU SMBus Header (PSU_SMB1)

6 SATA Power Connector (SATAPWR1)

7 Clear CMOS Pad (CLRMOS1)

8System Fan Connector (FAN2)

9System Fan Connector (FAN3)

10 OCuLink x4 Connector (OCU1)

11 Auxiliary Panel Header (ITX_AUX_PANEL1)

12 System Panel Header (PANEL1)

13 SATA SGPIO Connector (SATA_SGPIO1)

14 USB 3.2 Gen1 Header (USB3_3_4)

15 ermal Sensor Header (TR1)

16 Security Override Jumper (SEC_OR1)

17 OCuLink x4 Connector (OCU2)

18 PCI Express 4.0 x16 Slot (PCIE7)

19 BMC SMBus Header (BMC_SMB_1)

20 Intelligent Platform Management Bus Header (IPMB_1)

21 COM Port Header (COM1)

22 System Fan Connector (FAN1)

23 Chassis ID Jumper (CHASSIS_ID0)

24 IPMI LAN LED Header (IPMI_LED1)

25 SPI TPM Header (SPI_TPM_J1)

26 M.2 Socket (M2_1) (Type 2280)

27 NCSI Header (NCSI1)

8 9

English

1.5 Onboard LED Indicators

11

DDR4_A1 (64 bit, 260-pin module)

DDR4_A2 (64 bit, 260-pin module)

DDR4_B1 (64 bit, 260-pin module)

DDR4_B2 (64 bit, 260-pin module)

1

2

3

4

RoHS

E3C256D4I-2T

1

5

No. Item Status Description

1 SB_PWR1_LED Green STB PWR ready

2FAN_LED2 Red FAN2 failed

3FAN_LED3 Red FAN3 failed

4BMC_LED1 Green BMC heartbeat LED

5FAN_LED1 Red FAN1 failed

E3C256D4I-2T

8 9

English

1.6 I/O Panel

2

5

163

4

No. Description No. Description

1 USB 3.2 Gen1 Ports (USB3_1_2) 4 10G LAN RJ-45 Port (LAN_2)**

2 LAN RJ-45 Port (IPMI_LAN)* 5 VGA Port (VGA1)

3 10G LAN RJ-45 Port (LAN_1)** 6 UID Switch (UID1)

LAN Port LED Indications

*ere are two LEDs on each LAN port. Please refer to the table below for the LAN port

LED indications.

Dedicated IPMI LAN Port LED Indications

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection or

no link

Blinking Yellow Data Activity Yellow 100Mbps connection

On Link Green 1Gbps connection

ACT/LINK LED

SPEED LED

LAN Port

10 11

English

**ere are two LEDs on each LAN port. Please refer to the table below for the LAN port

LED indications.

LAN Port LED Indications

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 100Mbps connection or no

link

Blinking Yellow Data Activity Orange 1Gbps connection

On Link Green 10Gbps connection

ACT/LINK LED

SPEED LED

LAN Port

E3C256D4I-2T

10 11

English

1.7 Block Diagram

PCI-E X16 SLOT 7

Ch ann el A

INTEL

C256

PCH-H

Ch ann el B

HSIO 26 -29

BMC

AST2500

(HSIO 6)

RGB

ESPI

DDR4

256MB

PWM

RTL8211E

RGM II RGM I

I

FAN1

FAN2

FAN3

USB3.2 Gen1 5 Gb/s

USB3.2 Gen1

2 rear po rts Type AHSIO 0-1

HSIO 4-5

USB 3.2 Gen1

2 Fron t ports USB3.2 Gen1 5 Gb/s

Rear VGA

Port

AUX panel

header I2C

Oculink 1

INTEL X550

(LAN1 NCSI)

10G-Bas eT x 2

(LAN1 NCSI)

PCIE3.0 / SATA 3 6Gb/s

Oculink 2 PCIE3.0 / SATA 3 6Gb/s

HSIO 18-21

HSIO 22-25

SIO

NCT5585D-B

PCI Ex4 100MHz

M.2_1 PCI-E Gen4 BUS

80 Port

Switch SPI FLASH

SYSTEM BIOS

SPI TPM Header

ESPI

SPI

INTEL

Processor

LGA-1200 Pi n Socket

DDR4 SODIMM

1DPC for 2900/

2DPC for 2133

MNG RJ45

DDR4 SODIMM

1DPC for 2900/

2DPC for 2133

12 13

English

Chapter 2 Installation

This is a mini ITX form factor (6.7'' x 6.7'', 17.02 cm x 17.02 cm) motherboard. Before

you install the motherboard, study the conguration of your chassis to ensure that the

motherboard ts into it.

2.1 Screw Holes

Place screws into the holes indicated by circles to secure the motherboard to the chassis.

Do not over-tighten the screws! Doing so may damage the motherboard.

2.2 Pre-installation Precautions

Take note of the following precautions before you install motherboard components or

change any motherboard settings.

1. Unplug the power cord from the wall socket before touching any components.

2. To avoid damaging the motherboard’s components due to static electricity, NEVER

place your motherboard directly on the carpet or the like. Also remember to use a

grounded wrist strap or touch a safety grounded object before you handle the compo-

nents.

3. Hold components by the edges and do not touch the ICs.

4. Whenever you uninstall any component, place it on a grounded anti-static pad or in

the bag that comes with the component.

5. When placing screws into the screw holes to secure the motherboard to the chassis,

please do not over-tighten the screws! Doing so may damage the motherboard.

Before you install or remove any component, ensure that the power is switched o or the

power cord is detached from the power supply. Failure to do so may cause severe damage to

the motherboard, peripherals, and/or components.

Make sure to unplug the power cord before installing or removing the motherboard. Failure

to do so may cause physical injuries to you and damages to motherboard components.

Page is loading ...

ASRock Rack E3C256D4I-2T User manual

ASRock Rack E3C256D4I-2T User manual

Related papers

Other documents