NXP UM11933 User manual

Brand: NXP

Model: UM11933

Type: User manual

The NXP UM11933 RPi-CAM-MIPI board is a versatile camera accessory board designed to connect various camera sensors to the i.MX 93 EVK board. With its MIPI-CSI interface and ON Semiconductor IAS compatibility, it offers flexibility for integrating different imaging solutions. The board features a 1/4-inch 1.0 Megapixel AR0144 CMOS sensor by default, capturing images with an active pixel array of 1280H x 800V. Notably, the on-board ISP chip can be bypassed, allowing for use with a wide range of SoCs. The RPi-CAM-MIPI connects to the i.MX9 EVK board via a 22P/0.

UM11933

RPi-CAM-MIPI Board User Manual

Rev. 1 — 4 July 2023 User manual

Document Information

Information Content

Keywords RPi-CAM-MIPI, AR0144, i.MX93, MCIMX93-EVK, IAS, Raspberry PI

Abstract The RPi-CAM-MIPI accessory board is a MIPI-CSI camera module adapter, AR0144 CMOS

image sensor with ON Semiconductor IAS interface by default, which features 1/4-inch 1.0 Mp

with an active-pixel array of 1280H x 800V. The bypassable on-board ISP chip allows it to be used

with a wide range of SoCs. This accessory board connects to the i.MX9 EVK board through the

22P/0.5mm Pitch FPC cable.

NXP Semiconductors UM11933

RPi-CAM-MIPI Board User Manual

1 RPi-CAM-MIPI overview

The RPi-CAM-MIPI kit is an MIPI CSI camera adapter board designed to connect different kinds of camera

sensors with the ON Semiconductor IAS interface. The bypassable on-board ISP (ON Semiconductor AP1302)

chip allows it to be used with a wide range of SoCs.

This document includes the RPi-CAM-MIPI introduction and board setup and configurations and provides

detailed information on the overall design and usage of the RPi-CAM-MIPI board from a hardware system

perspective.

1.1 Acronyms and abbreviations

Table 1 lists and explains the acronyms and abbreviations used in this document.

Term Description

BGA Ball Grid Array

CSI-2 Camera Serial Interface 2

DNP Do Not Populate

HS High-Speed

I2C Inter-Integrated Circuit

FD Flexible Data rate

GPIO General-Purpose Input/Output

ISP In-System Programming

LDO Low Dropout Regulator

MIPI Mobile Industry Processor Interface

LED Light-Emitting Diode

Table 1. Acronyms and abbreviations

1.2 Related documentation

Table 2 lists and explains the additional documents and resources that you can refer to for more information on

the RPi-CAM-MIPI board. Some of the documents listed below may be available only under a Non-Disclosure

Agreement (NDA). To request access to these documents, contact your local Field Applications Engineer (FAE)

or sales representative.

Document Description Link / how to access

i.MX 93 Applications Processor

Reference Manual

This document is intended for system software and

hardware developers and application programmers

who want to develop products with the i.MX 93

MPU.

IMX93RM

i.MX 93 Industrial Application

Processors Data Sheet

This document provides information about electrical

characteristics, hardware design considerations,

and ordering information.

IMX93IEC

i.MX93 Hardware Developer's

Guide

This document aims to help hardware engineers

design and to test their i.MX 93 processor-based

designs. It provides information about board layout

recommendations and design checklists to ensure

IMX93HDG

Table 2. Related documentation

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Document Description Link / how to access

first-pass success and avoidance of board bring-up

problems.

Table 2. Related documentation...continued

1.3 Board kit contents

Table 3 lists the items included in the RPi-CAM-MIPI board kit.

Item description Quantity

RPi-CAM-MIPI 1

AR0144 CMOS sensor 1

22-pin / 0.5-mm pitch FPC cable 1

RPI-CAM-MINISAS 1

Table 3. Board kit contents

1.4 Block diagram

Figure 1 shows the RPI-CAM-MIPI block diagram.

Figure 1. RPI-CAM-MIPI block diagram

1.5 Board pictures

Figure 2 and Figure 3 show the top-side and bottom-side view of the RPi-CAM-MIPI board, AR0144 camera,

and FPC cable. RPI-CAM-MINISAS is the converter board which can support a 22-pin FPC connector

converted to a MiniSAS connector, or a MiniSAS connector converted to a 22-pin FPC connector.

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Figure 2. RPI-CAM-MIPI BOTTOM view

Figure 3. RPI-CAM-MIPI TOP view

Figure 4 shows the connection between the RPi-CAM-MIPI board and the MCIMX93-EVK board.

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Figure 4. RPI-CAM-MIPI connection with MCIMX93-EVK

1.6 Board features

Table 4 lists the features of RPI-CAM-MIPI.

Board feature Target processor feature

used

Description

Interfacing with

the main board

- A 22-pin connector is used for the RPI-CAM-MIPI board. A 22-pin / 0.5-

mm FPC cable is used between RPI-CAM-MIPI and the main board.

Power 3.3 V The RPI-CAM-MIPI board can be powered by 3.3 V from the

motherboard.

I2C I2C RPI-CAM-MIPI is configured through the I2C interface on the

motherboard.

MIPI CSI MIPI CSI •It is compliant with MIPI-CSI2 specification v1.2.

•Four MIPI CSI data lanes plus one clock lane are used.

IO0/IO1 GPIO •The default IO0 is used as a reset signal for the RPI-CAM-MIPI

board.

•IO1 is configured as a camera MCLK signal, but on-board 27 MHz is

used as the MCLK by default.

Table 4. MCIMX93-EVK features

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1.7 Connectors

See Figure 4 for the connector position on the board. Table 5 describes the RPI-CAM-MIPI board connectors.

Connector Description Connector type Reference section

J1 RPi interface connected with motherboard 22-pin FPC connector Section 2.1

J2 IAS-compatible interface for camera B2B 34-pin connector Section 2.2

Table 5. RPI-CAM-MIPI connectors

1.8 Flash LEDs

The RPI-CAM-MIPI board has a Light-Emitting Diode (LED) D3, which can be used as a camera flash LED or

as a torch.

2 RPI-CAM-MIPI functional description

This chapter describes the features and functions of the RPI-CAM-MIPI board. The chapter is divided into the

following sections:

•Section 2.1

•Section 2.2

•Section 2.3

•Section 2.4

2.1 22-pin RPi interface

A 22-pin FPC/FFC connector is designed on the RPI-CAM-MIPI board. The pin definition on the connector is

compatible with the Raspberry PI camera 22-pin interface. The detailed definition list is in Table 6.

Pin # Net name Description

1 VDD_3V3 3.3 V power input

2 I2C_SDA I2C SDA signal

3 I2C_SCL I2C SCL signal

4 GND Ground

5 IO1 (CSI_MCLK) GPIO1 default used as MCLK input

6 IO0 (CSI_nRST) GPIO0 default used as Reset input

7 GND Ground

8 CMF_CSI_DP3 MIPI serial data, lane 3, differential P

9 CMF_CSI_DN3 MIPI serial data, lane 3, differential N

10 GND Ground

11 CMF_CSI_DP2 MIPI serial data, lane 2, differential P

12 CMF_CSI_DN2 MIPI serial data, lane 2, differential N

13 GND Ground

14 CMF_CSI_CKP MIPI serial clock differential P

15 CMF_CSI_CKN MIPI serial clock differential N

Table 6. 22-pin RPi interface definition

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Pin # Net name Description

16 GND Ground

17 CMF_CSI_DP1 MIPI serial data, lane 1, differential P

18 CMF_CSI_DN1 MIPI serial data, lane 1, differential N

19 GND Ground

20 CMF_CSI_DP0 MIPI serial data, lane 0, differential P

21 CMF_CSI_DN0 MIPI serial data, lane 0, differential N

22 GND Ground

Table 6. 22-pin RPi interface definition...continued

2.2 Camera interface IAS

A 34-pin board-to-board connector is designed for the camera sensor connection. The PIN definition follows

the ON Semiconductor Imager Access System (IAS) specification. Table 7 shows the pin assignment for the

connectivity of a standard IAS camera module. These pins use Hirose BM20B(0.8)-30DP-0.4V(51).

Pin # Pin name Pin #

1 GPIO1/VDD_AF/Vpp GPI3/SADDR/ VDD_AF 34

2 GND GND 33

3 GND MCLK 32

4 DATA1_P/SLVS0_P GND 31

5 DATA1_N/SLVS0_N DATA2_P/SLVS1_P 30

6 GND DATA2_N/SLVS1_N 29

7 CP_P GND 28

8 CP_N DATA3_P/SLVS2_P 27

9 DGND DATA3_N/SLVS2_N 26

10 DATA4_P/SLVS3_P GND 25

11 DATA4_N/SLVS3_N DVDD 24

12 GND DVDD 23

13 VDDIO SDA 22

14 SCL RESET/XSHUTDOWN 21

15 GPIO0/Flash GPI2/Trigger 20

16 GND GND 19

17 VAA VAA 18

Table 7. 34-pin IAS interface definition

The following are the IAS pinning notes:

•The pinning is designed to offer three supply rails for the sensor. Follow the sensor data sheet for exact

voltage requirements.

•Digital supply, typically in the range from 1.0 V to 1.2 V.

•I/O supply, typically in the range of 1.8 V.

•Analog supply, typically in the range from 2.5 V to 3.0 V.

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•Pin# 1 (VDD_AF/VPP/GPIO1).

•If the module has a VCM for AF, pin #1 is used as VDD_AF (2.8 V).

•If the module requires an external VPP to program the OTPM, pin #1 is used as the VPP. For the Vpp value,

see the individual sensor datasheet.

•If the module has GPIO1, pin #1 is used as GPIO1.

•Pin #34 (VDD_AF/SADDR/GPI3).

•If the module has a VCM for AF, pin #34 is used as VDD_AF (2.8 V). In this case, if the sensor has an SADDR

pin, it must be grounded inside the module (default I2C slave address).

•If the sensor has an SADDR pin, pin #34 is the SADDR.

•If the sensor has a GPI3, pin #34 is the GPI3.

•For sensors selected for IAS modules, it has either SADDR or GPI3.

•Pin #15 is optional for GPIO0 and flash pin.

•Pin #20 is optional for GPI2 and trigger pin.

•At this time, there are no maximum power draw requirements for IAS modules. Any total power usage below

500 mW should cause no problem. The total power draw between 500 mW and 1 W should be reviewed

with the target system (adapter boards and end-reference platform). For modules that draw more than 1

W of power, consider using additional external supply with a direct connection to the module or a specially

designed adapter (header) board.

2.2.1 Power design

The RPI-CAM-MIPI board includes four power regulators and one LED driver.

Power Description Value

DVDD Digital power supply 1.05 V / 1.2 V

VAA Analog power supply 2.7 V / 2.8 V

VDDIO I/O power supply 1.8 V

VDD_AF Voice Coil Motor (VCM) power supply 2.8 V

Table 8. Camera sensor power rails

All the power regulators are controlled by enable signals, which come from the ADP5585ACPZ-01-R7 I2C GPIO

expander. The power-up sequence is different for different camera sensors. Figure 5 shows an example of the

ON Semiconductor AR0144 sensor power-up sequence.

Figure 5. AR0144 power-up sequence

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Symbol Definition Min Typ Max Unit

t1VAA/VAA_PIX to VDD_IO 0 10 – μs

t2VDD_IO to VDD/VDD_PHY 0 10 – μs

tXXtal Settle Time – 30 – ms

t3Hard Reset 1 – – ms

t4 Internal Initialization 160000 – – EXTCLKs

t5PLL Lock Time 1 – – ms

Table 9. Power-up sequence

2.2.2 ISP

The ON Semiconductor AP1302 (U9) external ISP chipset is supported on the RPI-CAM-MIPI board. An

external ISP can be bypassed by software configuration through the ISP_BYP control signal.

2.3 15-pin RPi camera usage

The RPI-CAM-MIPI board can be connected with different motherboards with the Raspberry PI camera-

compatible interface. There are two types Raspberry PI camera interfaces; the 15-pin / 1.0-mm FPC/FFC

connector and the 22-pin / 0.5-mm FPC/FFC connector. If a 15-pin connector is supported on the motherboard,

a 22-pin to 15-pin cable can be used.

image6.emf

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placeholderImage_0012.svg

image6.emf

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placeholderImage_0012.svg

Figure 6. 15-pin to 22-pin signals

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Figure 7. 15-pin to 22-pin FPC/FFC cable example

2.4 I2C devices on RPI-CAM-MIPI

All the I2C devices on RPI-CAM-MIPI are shown in Table 10.

Part Device I2C address

(7-bit) Port Speed Voltage Description

U9 AP1302CSSL00SMGA0 0x3C

(0b'0111100x) RPi-I2C 1 MHz Fm+ /

3.4 MHz HS 1.8 V External ISP

U103 ADP5585ACPZ-00- R7 0x34

(0b'0110100x) RPi-I2C 1 MHz Fm+ 3.3 V I2C GPIO expander

Sensor #1 AR0144 0x10

(0b'0010000x) RPi-I2C 400 KHz 1.8 V 1/4-inch 1.0 Mp GS

Sensor #2 AR0430 0x36

(0b'0110110x) RPi-I2C 1 MHz Fm+ 1.8 V 1/3.1-inch 4 Mp ERS

Sensor #3 AR1335 0x36

(0b'0110110x) RPi-I2C 1 MHz Fm+ 1.8 V 1/3.2-inch 13 Mp ERS

Table 10. I2C devices on base board

3 PCB information

The RPI-CAM-MIPI board is made with a standard six-layer HDI technology. The material is FR-4 and the PCB

stack-up information is shown in Figure 8 and Figure 9.

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Figure 8. RPI-CAM-MIPI board stack-up information

Figure 9. RPI-CAM-MIPI PCB stack-up

4 Getting started

4.1 Connecting the RPI-CAM-MIPI board

The RPI-CAM-MIPI board can be connected to the MCIMX93-EVK board via a FPC cable. The connection

between them is shown in Figure 4.

The AR0144 camera sensor should be connected to J1 on the RPI-CAM-MIPI board, as shown in Figure 2.

4.2 Getting the pre-built images

The pre-built binary images for the MCIMX93-EVK board are available starting with Linux BSP 6.1.1_1.0.0. The

RPI-CAM-MIPI drivers are integrated into the pre-built binary images.

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The pre-built binary images can be downloaded from the NXP IMXLINUX webpage. See the i.MX Linux User's

Guide (document IMXLUG) for how to flash the pre-built images and booting the Linux OS.

4.3 Getting the AP1302 firmware

Perform the following steps to get the AP1302 firmware:

1. Download the "ap1302_60fps_ar0144_27M_2Lane_awb_tuning.bin" file from the ON Semiconductor github

page by following the README.

2. Rename it to "ap1302.fw".

3. After booting the Linux OS, copy the file to the target board under "/lib/firmware/imx/camera" and reboot.

4.4 Running the camera module

If everything goes well, you will see the following log after booting the Linux OS:

root@imx93evk:~# dmesg | grep -E 'ap1302|mx8-img-md'

[ 2.736674] ap1302_mipi 2-003c: AP1302 Chip ID is 0x265

[ 2.741981] ap1302_mipi 2-003c: Direct firmware load for imx/camera/ap1302.fw

failed with error -2

[ 2.743187] ap1302_mipi 2-003c: AP1302 is found

[ 2.750958] ap1302_mipi 2-003c: Falling back to sysfs fallback for: imx/camera/

ap1302.fw

[ 8.816815] ap1302_mipi 2-003c: Load firmware successfully.

[ 10.220972] mx8-img-md: Registered mxc_isi.0.capture as /dev/video0

[ 10.230961] mxc-md 42800000.bus:camera: Entity type for entity ap1302_mipi

2-003c was not initialized!

[ 10.243897] mx8-img-md: Registered sensor subdevice: ap1302_mipi 2-003c (1)

[ 10.252757] mx8-img-md: created link [mxc_isi.0] => [mxc_isi.0.capture]

[ 10.260716] mx8-img-md: created link [mxc-mipi-csi2.0] => [mxc_isi.0]

[ 10.269078] mx8-img-md: created link [ap1302_mipi 2-003c] => [mxc-mipi-csi2.0]

See Section 5.3 to perform some camera test cases.

5 Software introduction

The drivers for the RPi-CAM-MIPI board are developed by NXP and are already integrated into the Linux BSP

for the i.MX application processors. In the default Linux BSP release, it can only support sourcing an image

stream from the AR0144 camera sensor with the RPi-CAM-MIPI board. The on-board ISP AP1302 (firmware

required) is enabled by default.

5.1 Driver source code

The driver source code is available from the NXP Linux kernel repository.

•AP1302 + AR0144 camera sensor V4L2 driver: "drivers/media/i2c/ap1302.c"

•ADP5585 I2C GPIO expander driver: "drivers/mfd/adp5585.c", "drivers/gpio/gpio-adp5585.c", and "drivers/

pwm/pwm-adp5585.c"

The AP1302 firmware can be downloaded from the ON Semiconductor github page.

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5.2 Device tree configuration

This section contains the example device tree for the RPi-CAM-MIPI board. It contains two I2C devices:

ADP5585 GPIO expander and AP1302 (AR0144 connected) camera module.

arch/arm64/boot/dts/freescale/imx93-11x11-evk.dts

&lpi2c3

{

adp5585_isp: mfd-isp@34

{

compatible = "adi,adp5585";

reg = <0x34>;

status = "okay";

adp5585gpio_isp: gpio-isp@34

{

compatible = "adp5585-gpio";

gpio-controller;

#gpio-cells = <2>;

};

adp5585pwm_isp: pwm-isp@34

{

compatible = "adp5585-pwm";

#pwm-cells = <3>;

};

ap1302: ap1302_mipi@3c

{

compatible = "onsemi,ap1302";

reg = <0x3c>;

reset-gpios = <&adp5585gpio 0 GPIO_ACTIVE_LOW>;

isp_en-gpios = <&adp5585gpio_isp 2 GPIO_ACTIVE_HIGH>;

DVDD-supply = <&reg_dvdd_1v2>;

VDDIO-supply = <&reg_vddio_1v8>;

AVDD-supply = <&reg_avdd_2v8>;

status = "okay";

port

{

ar1302_mipi_ep: endpoint

{

remote-endpoint = <&mipi_csi_ep>;

};

The ADP5585 GPIO expander is used to configure the power supplies' voltages, control the power-up

sequence, and enable or bypass the on-board ISP AP1302. The example configuration for AP1302 (enabled)

and AR0144 is below. It is implemented following the Linux regulator framework. If you want to connect

another camera sensor to the RPi-CAM-MIPI board, these regulators must be configured to match the power

requirement of the selected camera sensor.

reg_dvdd_sel: regulator-dvdd_sel

{

compatible = "regulator-fixed";

regulator-name = "DVDD_SEL";

gpio = <&adp5585gpio_isp 0 GPIO_ACTIVE_HIGH>;

enable-active-high;

startup-delay-us = <2000>;

};

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reg_dvdd_1v2: regulator-dvdd

{

compatible = "regulator-fixed";

regulator-name = "DVDD_1V2";

gpio = <&adp5585gpio_isp 6 GPIO_ACTIVE_HIGH>;

regulator-min-microvolt = <1200000>;

regulator-max-microvolt = <1200000>;

enable-active-high;

vin-supply = <&reg_dvdd_sel>;

};

reg_vdd_3v3: regulator-vdd

{

compatible = "regulator-fixed";

regulator-name = "VDD_3V3";

gpio = <&adp5585gpio_isp 5 GPIO_ACTIVE_HIGH>;

regulator-min-microvolt = <3300000>;

regulator-max-microvolt = <3300000>;

startup-delay-us = <4000>;

enable-active-high;

};

reg_vddio_1v8: regulator-vddo

{

compatible = "regulator-fixed";

regulator-name = "VDDIO_1V8";

gpio = <&adp5585gpio_isp 9 GPIO_ACTIVE_HIGH>;

regulator-min-microvolt = <1800000>;

regulator-max-microvolt = <1800000>;

startup-delay-us = <4000>;

enable-active-high;

vin-supply = <&reg_vdd_3v3>;

};

reg_vaa_sel: regulator-vaa_sel

{

compatible = "regulator-fixed";

regulator-name = "VAA_SEL";

gpio = <&adp5585gpio_isp 1 GPIO_ACTIVE_HIGH>;

enable-active-high;

};

reg_avdd_2v8: regulator-avdd

{

compatible = "regulator-fixed";

regulator-name = "AVDD_2V8";

gpio = <&adp5585gpio_isp 7 GPIO_ACTIVE_HIGH>;

regulator-min-microvolt = <2800000>;

regulator-max-microvolt = <2800000>;

enable-active-high;

vin-supply = <&reg_vaa_sel>;

};

5.3 How to use the camera module

The AP1302 + AR0144 camera driver is developed following the V4L2 framework in NXP Linux BSP. You can

use the "media-ctl", "v4l2-ctl", and "gst-launch" command-line utilities to do some camera use cases.

•Get the topology of the capture subsystem:

$ media-ctl -p

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•List the video devices:

$ v4l2-ctl --list-devices

•List the supported pixel formats:

$ v4l2-ctl -d0 --list-formats

ioctl: VIDIOC_ENUM_FMT

Type: Video Capture Multiplanar

[0]: 'RGBP' (16-bit RGB 5-6-5)

[1]: 'RGB3' (24-bit RGB 8-8-8)

[2]: 'BGR3' (24-bit BGR 8-8-8)

[3]: 'YUYV' (YUYV 4:2:2)

[4]: 'YUV4' (32-bit A/XYUV 8-8-8-8)

[5]: 'NV12' (Y/CbCr 4:2:0)

[6]: 'NM12' (Y/CbCr 4:2:0 (N-C))

[7]: 'YM24' (Planar YUV 4:4:4 (N-C))

[8]: 'XR24' (32-bit BGRX 8-8-8-8)

[9]: 'AR24' (32-bit BGRA 8-8-8-8)

•List the supported image resolutions:

$ v4l2-ctl -d0 --list-framesizes YUYV

ioctl: VIDIOC_ENUM_FRAMESIZES

Size: Discrete 1920x1080

Size: Discrete 1280x800

Size: Discrete 1280x720

Size: Discrete 640x480

•Capture the camera data and save them to a file using the "v4l2-ctl" command. The supported pixel formats

and resolutions are listed above. Here is an example to capture the 1280x800 YUYV camera data:

$ v4l2-ctl -d0 --set-fmt-video=width=1280,height=800,pixelformat=YUYV --stream-

mmap=4 --stream-count=10 --stream-to=test.yuv

•Capture the camera data, preview them on screen or save them to a file using the "gstreamer" commands:

# preview on screen

$ gst-launch-1.0 -v v4l2src device=/dev/video0 ! "video/x-

raw,format=YUY2,width=1280,height=800" ! queue ! waylandsink

# save 10 frames to file

$ gst-launch-1.0 -v v4l2src device=/dev/video0 num-buffers=10 ! "video/x-

raw,format=YUY2,width=1280, height=800" ! queue ! filesink location=test.yuv

6 Revision history

Table 11 summarizes the revisions to this document.

Revision number Date Substantive changes

1 4 July 2023 Initial release

Table 11. Revision history

7 Note about the source code in the document

Example code shown in this document has the following copyright and BSD-3-Clause license:

permitted provided that the following conditions are met:

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1. Redistributions of source code must retain the above copyright notice, this list of conditions and the

following disclaimer.

2. Redistributions in binary form must reproduce the above copyright notice, this list of conditions and the

following disclaimer in the documentation and/or other materials must be provided with the distribution.

3. Neither the name of the copyright holder nor the names of its contributors may be used to endorse or

promote products derived from this software without specific prior written permission.

THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND ANY

EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES

OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT

SHALL THE COPYRIGHT HOLDER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT,

INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED

TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR

BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN

CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN

ANY WAY OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH

DAMAGE.

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8 Legal information

8.1 Definitions

Draft — A draft status on a document indicates that the content is still

under internal review and subject to formal approval, which may result

in modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included in a draft version of a document and shall have no

liability for the consequences of use of such information.

8.2 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability

towards customer for the products described herein shall be limited in

accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Suitability for use in non-automotive qualified products — Unless

this data sheet expressly states that this specific NXP Semiconductors

product is automotive qualified, the product is not suitable for automotive

use. It is neither qualified nor tested in accordance with automotive testing

or application requirements. NXP Semiconductors accepts no liability for

inclusion and/or use of non-automotive qualified products in automotive

equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without NXP Semiconductors’ warranty

of the product for such automotive applications, use and specifications, and

(b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document, including

the legal information in that document, is for reference only. The English

version shall prevail in case of any discrepancy between the translated and

English versions.

Security — Customer understands that all NXP products may be subject to

unidentified vulnerabilities or may support established security standards or

specifications with known limitations. Customer is responsible for the design

and operation of its applications and products throughout their lifecycles

to reduce the effect of these vulnerabilities on customer’s applications

and products. Customer’s responsibility also extends to other open and/or

proprietary technologies supported by NXP products for use in customer’s

applications. NXP accepts no liability for any vulnerability. Customer should

regularly check security updates from NXP and follow up appropriately.

Customer shall select products with security features that best meet rules,

regulations, and standards of the intended application and make the

ultimate design decisions regarding its products and is solely responsible

for compliance with all legal, regulatory, and security related requirements

concerning its products, regardless of any information or support that may be

provided by NXP.

NXP has a Product Security Incident Response Team (PSIRT) (reachable

at [email protected]) that manages the investigation, reporting, and solution

release to security vulnerabilities of NXP products.

NXP B.V. - NXP B.V. is not an operating company and it does not distribute

or sell products.

8.3 Trademarks

Notice: All referenced brands, product names, service names, and

trademarks are the property of their respective owners.

NXP — wordmark and logo are trademarks of NXP B.V.

i.MX — is a trademark of NXP B.V.

User manual Rev. 1 — 4 July 2023

17 / 18

NXP Semiconductors UM11933

RPi-CAM-MIPI Board User Manual

Contents

1 RPi-CAM-MIPI overview ......................................2

1.1 Acronyms and abbreviations ............................. 2

1.2 Related documentation ......................................2

1.3 Board kit contents ..............................................3

1.4 Block diagram ....................................................3

1.5 Board pictures ................................................... 3

1.6 Board features ................................................... 5

1.7 Connectors .........................................................6

1.8 Flash LEDs ........................................................ 6

2 RPI-CAM-MIPI functional description ................6

2.1 22-pin RPi interface ...........................................6

2.2 Camera interface IAS ........................................ 7

2.2.1 Power design .....................................................8

2.2.2 ISP ..................................................................... 9

2.3 15-pin RPi camera usage ..................................9

2.4 I2C devices on RPI-CAM-MIPI ........................ 10

3 PCB information ................................................10

4 Getting started .................................................. 11

4.1 Connecting the RPI-CAM-MIPI board ..............11

4.2 Getting the pre-built images ............................ 11

4.3 Getting the AP1302 firmware .......................... 12

4.4 Running the camera module ........................... 12

5 Software introduction ....................................... 12

5.1 Driver source code .......................................... 12

5.2 Device tree configuration .................................13

5.3 How to use the camera module .......................14

6 Revision history ................................................ 15

7 Note about the source code in the

document ........................................................... 15

8 Legal information .............................................. 17

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 4 July 2023

Document identifier: UM11933

NXP UM11933 User manual

NXP UM11933 User manual

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