AIC HA401-LB User manual

UM_HA401-LB2_v4.2_031620

HA401-LB

Storage Barebone

User's Manual

Contents

Table of Contents

Preface �� i

Safety Instructions �� ii

About This Manual �� iv

Chapter 1� Product Features ��1

1�1 Box Contents ��1

1.2 Specications��2

1�3 Features ��3

Chapter 2� Hardware Setup ��7

2�1 Central Processing Unit (CPU) ��7

2.1.1 Removing the processor ....................................................................................7

2.1.2 Installing the processor ......................................................................................9

2.1.3 CPU Heatsink ................................................................................................... 13

2�2 System Memory ��14

2.2.1 DIMM Installation Order .................................................................................. 15

2.2.2 DIMM Installation ............................................................................................ 17

2�3 Removing and Installing the Top Cover ��18

2�4 Removing and Installing the Power Supply Unit Module �� 19

2.4.1 Removing the Power Supply Unit .................................................................. 19

2.4.2 Installing the Power Supply Unit .................................................................... 19

2�5 Removing and Installing the Fan Module ��20

2.5.1 Removing the Fan ............................................................................................ 20

2.5.2 Installing the Fan Module ................................................................................ 21

2�6 Installing/ Removing the Hard Disk Drive ��22

2.6.1 Installing the Hard Disk Drive ......................................................................... 22

2.6.2 Installing the Hard Disk Drive Tray ................................................................. 23

2.6.3 Installing the Hard Disk Drive WITH the Interposer ....................................... 24

2.6.4 Installing the Hard Disk Drive WITHOUT the Interposer ................................ 25

2�7 Removing and Installing the HDD Backplane Module ��26

2.7.1 Removing the HDD Backplane ........................................................................ 26

2.7.2 Installing the HDD Backplane ........................................................................ 26

2�8 Installing and Removing the Solid State Drive ��27

2.8.1 Installing the Solid State Drive ........................................................................ 27

2�9 Removing and Installing the HDD Backplane Module ��28

2.9.1 Installing the PCIe Card ................................................................................... 28

2.9.2 Removing the PCIe Card .................................................................................. 30

2�10 Removing and Installing the RJ45 Module ��31

2.10.1 Installing the RJ45 Module ........................................................................... 31

2.10.2 Congure the LAN Setting ............................................................................. 32

2.11 Congure the Internal SAS Port Setting ��33

2.12 Congure the Expander JBOD Enclosure Setting ��34

2.13 Congure the PCIe Function Setting ��35

2�14 Tool-less Blade Slide Installation Instruction ��36

Chapter 3� Hardware Settings �� 42

3�1 Motherboard Block Diagram ��42

3�2 Content List ��43

3�3 Motherboard Layout ��44

3�4 Connector and Jumper ��45

3�5 System LEDs ��53

3.5.1 Front Panel LED ............................................................................................... 53

3.5.2 Rear Panel LED ................................................................................................ 54

3.5.3 Internal LEDs .................................................................................................... 55

3�6 HDD Backplane ��56

3.6.1 Placement ........................................................................................................ 56

3.6.2 Connector Location ......................................................................................... 58

3.6.3 Drive Slot Map .................................................................................................. 59

3�7 Expander Board ��60

3.7.1 Placement ........................................................................................................ 60

3.7.2 Connector Location ......................................................................................... 61

3.7.3 Connector and Jumper .................................................................................... 62

3.7.4 LEDs ................................................................................................................. 64

3.7.5 Jumper ............................................................................................................. 65

Chapter 4. BIOS Conguration Settings �� 66

4�1 Navigation Keys ��66

4�2 BIOS Setup ��67

4.2.1 BIOS Menu ....................................................................................................... 67

4.2.2 BIOS Basic Utility ............................................................................................. 67

4.2.3 BIOS Update ..................................................................................................... 70

4�3 Main �� 72

4.3.1 Main .................................................................................................................. 72

4�4 Advanced ��73

4.4.1 Peripheral Conguration ................................................................................. 73

4.4.2 PCH SATA Conguration ................................................................................ 74

4.4.3 PCH SSATA Conguration ............................................................................... 74

4.4.4 Video Conguration ......................................................................................... 74

4.4.5 USB Conguration .......................................................................................... 75

4.4.6 PCH Chipset Conguration ............................................................................ 75

4.4.7 Processor Conguration ................................................................................. 75

4.4.8 Advanced Power Management Conguration .............................................. 76

4.4.9 Common RefCode Conguration .................................................................... 76

4.4.10 QPI Conguration ......................................................................................... 77

4.4.11 Memory Conguration .................................................................................. 78

4.4.12 IIO Conguration ............................................................................................ 79

4.4.13 Console Redirection ...................................................................................... 81

4.4.14 System Event Log .......................................................................................... 81

4.4.15 SPS ME ICC Conguration ............................................................................ 81

4.4.16 H2O IPMI Conguration ................................................................................ 81

4.4.17 OEMBoard Function ....................................................................................... 82

4�5 Security �� 83

4.5.1 Set Supervisor password ................................................................................ 83

4�6 Power ��84

Contents

4.6.1 Power ............................................................................................................... 84

4�7 Boot ��85

4.7.1 Boot .................................................................................................................. 85

Chapter 5. BMC Conguration Settings �� 87

5�1 Method 1 (Use the BIOS Setup) ��87

5�2 Method 2 (Use a Dos Tool - Syscheck) ��88

5�3 Connect to BMC ��89

5�4 Web UI ��90

5.4.1 Dashboard ........................................................................................................ 90

5.4.2 Field Replaceable Unit(FRU) ........................................................................... 91

5.4.3 Server Health ................................................................................................... 92

5.4.4 Conguration ................................................................................................... 93

5.4.5 Remote Control ................................................................................................ 97

5.4.6 Auto Video Recording ..................................................................................... 99

5.4.7 Maintenance .................................................................................................. 100

5�5 Updating BMC Firmware ��102

Chapter 6� Technical Support �� 103

Contents

This document contains proprietary information about

AIC products and is not to be disclosed or used except in

accordance with applicable agreements.

Document Release History

Release Date Version Update Content

2017 1 Release to the public.

June

2018

4 Update

January

2019

4.1

1. New Cover

2. BIOS section update.

March

2020

4.2

Datasheet

QIG

i

Copyright

No part of this publication may be reproduced, stored in a retrieval system, or

transmitted in any form or by any means, electronic, mechanical, photo-static, recording

or otherwise, without the prior written consent of the manufacturer.

Trademarks

All products and trade names used in this document are trademarks or registered

trademarks of their respective holders.

Changes

The material in this document is for information purposes only and is subject to change

without notice.

Warning

1. A shielded-type power cord is required in order to meet FCC emission limits and also

to prevent interference to the nearby radio and television reception. It is essential

that only the supplied power cord be used.

2. Use only shielded cables to connect I/O devices to this equipment.

3. You are cautioned that changes or modifications not expressly approved by the

party responsible for compliance could void your authority to operate the equipment.

Disclaimer

AIC shall not be liable for technical or editorial errors or omissions contained herein.

The information provided is provided "as is" without warranty of any kind. To the

extent permitted by law, neither AIC or its afliates, subcontractors or suppliers will be

liable for incidental, special or consequential damages including downtime cost; lost

profits; damages relating to the procurement of substitute products or services; or

damages for loss of data, or software restoration. The information in this document

is subject to change without notice.

Preface

ii

Before getting started, please read the following important cautions:

• All cautions and warnings on the equipment or in the manuals should be noted.

• Most electronic components are sensitive to electrical static discharge. Therefore, be

sure to ground yourself at all times when installing the internal components.

• Use a grounding wrist strap and place all electronic components in static-shielded

devices. Grounding wrist straps can be purchased in any electronic supply store.

• Be sure to turn off the power and then disconnect the power cords from your system

before performing any installation or servicing. A sudden surge of power could

damage sensitive electronic components.

• Do not open the system’s top cover. If opening the cover for maintenance is a must,

only a trained technician should do so. Integrated circuits on computer boards are

sensitive to static electricity. Before handling a board or integrated circuit, touch

an unpainted portion of the system unit chassis for a few seconds. This will help to

discharge any static electricity on your body.

• Place this equipment on a stable surface when install. A drop or fall could cause injury.

• Please keep this equipment away from humidity.

• Carefully mount the equipment into the rack, in such manner, that it won’t be

hazardous due to uneven mechanical loading.

• This equipment is to be installed for operation in an environment with maximum

ambient temperature below 35°C.

• The openings on the enclosure are for air convection to protect the equipment from

overheating. DO NOT COVER THE OPENINGS.

• Never pour any liquid into ventilation openings. This could cause fire or electrical

shock.

• Make sure the voltage of the power source is within the specication on the label when

connecting the equipment to the power outlet. The current load and output power of

loads shall be within the specication.

• This equipment must be connected to reliable grounding before using. Pay special

attention to power supplied other than direct connections, e.g. using of power strips.

• Place the power cord out of the way of foot traffic. Do not place anything over the

power cord. The power cord must be rated for the product, voltage and current marked

on the product’s electrical ratings label. The voltage and current rating of the cord

should be greater than the voltage and current rating marked on the product.

Safety Instructions

iii

Chapter 1. Product FeaturesHA401-LB2 User Manual

• If the equipment is not used for a long time, disconnect the equipment from mains to

avoid being damaged by transient over-voltage.

• Never open the equipment. For safety reasons, only qualied service personnel should

open the equipment.

• If one of the following situations arise, the equipment should be checked by service

personnel:

1. The power cord or plug is damaged.

2. Liquid has penetrated the equipment.

3. The equipment has been exposed to moisture.

4. The equipment does not work well or will not work according to its user manual.

5. The equipment has been dropped and/or damaged.

6. The equipment has obvious signs of breakage.

7. Please disconnect this equipment from the AC outlet before cleaning. Do not

use liquid or detergent for cleaning. The use of a moisture sheet or cloth is

recommended for cleaning.

• Module and drive bays must not be empty! They must have a dummy cover.

Thank you for selecting and purchasing the HA401-LB2.

This user's manual is provided for professional technicians to perform easy hardware

setup, basic system congurations, and quick software startup. This document pellucidly

presents a brief overview of the product design, device installation, and rmware settings

for HA401-LB2. For the latest version of this user's manual, please refer to the AIC website:

http://www.aicipc.com/tw/productdetail/51044.

Chapter 1 Product Features

HA401-LB2 is a flexible storage server barebone that is specifically designed to

accommodate diverse corporations and enterprises for managing heavy workloads and

multiple applications.

Chapter 2 Hardware Setup

This chapter displays an easy installation guide for assembling the hardware in this

product. Utmost caution for proceeding to set up the hardware is highly advised. Most of

the components are highly fragile and vulnerable to exterior influence. Do not endanger

the device by placing the device in an unstable environment.

Chapter 3 Hardware Settings

This chapter provides information on connectors, jumpers, and LED descriptions. These

descriptions assist users to congure different settings and functions of the motherboard,

as well as to conrm the location of each connector and jumper.

Chapter 4 BIOS Conguration Settings

This chapter introduces the key features of BIOS, including the descriptions and option

keys for diverse functions. These details provide users to effortlessly navigate and

congure the input/output devices.

Chapter 5 BMC Conguration Settings

This chapter illustrates the diverse functions of IPMI BMC, including the details on logging

into the web page and assorted denitions. These descriptions are helpful in conguring

various functions through Web GUI without entering the BIOS setup. For more information

of BMC congurations, please refer to IPMI BMC (Aspeed2500) User's Manual for a more

detailed description.

Chapter 6 Technical Support

For more information or suggestion, please contact the nearest AIC corporation

representative in your district or visit the AIC website: http://www.aicipc.com/en. It is our

greatest honor to provide the best service for our customers.

About This Manual

iv

1

Chapter 1. Product FeaturesHA401-LB2 User Manual

Chapter 1� Product Features

HA401-LB2 is a high density storage server that includes mother board, chassis, power

supply, and HDD backplane. For more information about our product, please visit our

website at http://www.aicipc.com/en.

Before removing the subsystem from the shipping carton, visually inspect the physical

condition of the shipping carton. Exterior damage to the shipping carton may indicate

that the contents of the carton are damaged. If any damage is found, do not remove

the components; contact the dealer where the subsystem was purchased for further

instructions. Before continuing, rst unpack the subsystem and verify that the number

of components in the shipping carton is accurate and in good condition

1�1 Box Contents

This product contains the components listed below.

Please conrm the number and the condition of the components before

installation.

• System

(includes power supply, fan

& hard disk drive tray)

• Power cord (vary per region)

• 28" Slide rail x 1 set (optional)

• Rear handle (uninstalled)

Product features are subject to change without notice�

2

Chapter 1. Product FeaturesHA401-LB2 User Manual

1.2 Specications

Dimensions

(W x D x H)

mm : 437 x 698.5 x 177.8

inches : 17.2 x 27.5 x 7

Motherboard

(per node)

AIC Server Board Libra

Processor

(per node)

Processor

Support

• Two Intel® Xeon® Processors

E5-2600 v3/v4 product family

• Supports CPU TDP up to 140W

Supported QPI 9.6 GT/s, 8 GT/s, 7.2 GT/s

Socket Type Socket R3 (FCLGA2011-3)

Chipset Support

(per node)

Intel® C612 Chipset

System Memory

(per node)

• 16 DIMM slots across 8 memory channels

(4 memory channels per CPU; 2DPC)

- 512GB DDR4 2400/2133 RDIMM DRx4

- 128GB DDR4 2400/2133 RDIMM SRx4

- 1024GB DDR4 2400/2133 LRDIMM QRx4

- 2048GB DDR4 2400/2133 LRDIMM 3DS 8Rx4

Front Panel

System power on/off

LEDs

A

• Power (Secondary)

• Warning

B

• Power (Primary)

• Warning

Drive Bays

External 3.5" hot swap

24 (LSI interposer board required

when using SATA drives)

Internal 2.5" 2+2 (7mm per node)

Backplane 1 x 24-port 12Gb SAS backplane

Expander Board

(per node)

• 3 x PCIe v3.0 x16 slots

• 3 x PCIe v3.0 x8 slots

Expansion Slots

(per node)

PCIe 3.0

• 2 x16 slots (LP)

• 1 x16 slot (x8 mode w/ IOC SKU) (LP)

• 3 x8 slots (LP)

System BIOS

BIOS Type

• Insyde UEFI BIOS

• SPI (Serial Peripheral Interface)

FLASH Interface

BIOS

Features

• ACPI

• PXE

• WOL

• AC loss recovery

• IPMI 2.0 KCS

interface

• SMBIOS

• Serial console

redirection

• BIOS Boot

• BIOS Recovery

Mode

• SRIOV

• iSCSI

• TPM

• PCIe NTB

On-board

Devices

SATA

Built-in SATA controller with RAID support

on Intel® C612 Chipset

• 8 x 7pin SATA connectors

• 1 x M.2 with SATA/PCIe X4 support

IPMI

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Processor

• Baseboard Management Controller

• Intelligent Platform Interface 2.0 (IPMI 2.0)

• iKVM, Media Redirection, IPMI over LAN,

Serial over LAN

• SMASH Support

Network

Controllers

• Intel® Ethernet Controller X540-BT2 dual

port 10GbE, 10GBASE-T, PCIe v2.1, x8

Optional: Intel® Ethernet Controller I350-BT2,

dual port GbE, PCIe v2.0

• Intel® Ethernet Controller I210-AT, single

port GbE controller, PCIe v2.1

• Intel® Ethernet Network Connection

I217-LM, single port GbE, 1Gbps

• Realtek® RTL8201EL single port 10/100

Mbps Ethernet PHYceiver for dedicated

BMC port

Graphics

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Processor

• PCIe VGA/2D Controller

• 1920x1200@60Hz 32bpp

Rear I/O

(per node)

SAS

2 x SFF8644

LAN

• 2 x RJ45

• 1 x RJ45 (dedicated BMC port)

• 2 x RJ45 cabled from two internal 2x5

box pin-header (optional accessory)

USB

2 x USB 3.0 Type A

VGA

1 x external DB-15 VGA port

Serial Port

1 x external DB-9 COM port

Power Supply

1100W 1+1 redundant power supply 80+ Platinum

• AC INPUT : 100-120V,50/60Hz,12A

DC OUTPUT : 850W

• AC INPUT : 200-240V,50/60Hz,8A

DC OUTPUT : 1100W

1200W 1+1 redundant power supply (BTO)

• AC INPUT : 110~240V,47-63Hz,15-7.5A

System Cooling

(per node)

4 x 60x56mm easy swap fans

System

Management

• IPMI 2.0

• KVM over IP

• Media redirection

• Temperature, fan, voltage,

PSU sensor monitor

• System temperature

• SNMP support

• System ID /

System fail indicator

• Remote power

on/off/reset

• SEL message alarm

through mail

• Intel NM

Environmental

• Storage temperature : -10ºC(14ºF) ~ 60ºC(140ºF)

• Operating temperature : 0ºC(32ºF) ~ 35ºC(95ºF)

• Storage operating humidity : 5%~95% non-condensing

Gross Weight

(w/ PSU & Rail)

kgs : 50

lbs : 110.2

Packaging

Dimensions

(W x D x H)

mm : 657 x 940 x 468

inches : 25.9 x 37 x 18.4

Mounting

Standard 28" slide rail

3

Chapter 1. Product FeaturesHA401-LB2 User Manual

HA401-LB2 is a reliable 4U storage server barebone with 24 hotswap drives bays at the

front and 2+2 internal drives. This product is designed to accommodate the AIC-patented

serverboard, Libra, which supports two Intel® Xeon® Processors E5-2600 v3/v4 and 16

DDR4 DIMM to offer greater perfomance, efciency, and utility for our customers. Featur-

ing Intel® C612 Series Chipset, which is emphasized for its accelerated speed and expan-

sion, this product enhances these advantages by integrating flexible IO usage and system

expansion into to provide greater bandwidth and utilization.

In addition to the noteworthy features of the barebone, HA401-LB provides immediate

and efcient management with Onboard Baseboard Management Controller and greater I/

O extension. Featuring IPMI 2.0 and Aspeed AST2400 Advanced PCIe Graphics, the server

board offers support for iKVM, Media Redirection, Smash Support, IPMI over LAN, and Se-

rial over LAN.

• High-availability storage server optimized for mission-critical, enterprise-level storage

applications

• Fully redundant, fault-tolerant system supporting hot swappable compute nodes and

storage drives

• Two compute nodes, Active-Active conguration, each supporting two Intel Xeon

Processors E5-2600 v3/v4 product family

• 10GbE, PCIe NTB or SAS link between nodes for communication and fail-over

• Built-in Broadcom SAS3x48R SAS/SATA expander per node

• Intel® Trusted Platform Module (TPM) header to support Intel® Trusted Execution

Technology (TXT)

• 6 x PCIe 3.0 slots

1�3 Features

4

Chapter 1. Product FeaturesHA401-LB2 User Manual

Front Panel

5

Chapter 1. Product FeaturesHA401-LB2 User Manual

Rear Panel

1100W 1+1

redundant

power

supply 80+

Platinum

6

Chapter 1. Product FeaturesHA401-LB2 User Manual

Major Components

1100W

7

Chapter 2. Hardware SetupHA401-LB2 User Manual

Chapter 2� Hardware Setup

2�1 Central Processing Unit (CPU)

2�1�1 Removing the processor

Step 1 Remove the heatsink. The heatsink is attached to the server board or

-processor socket with captive fasteners. Use a #2 Phillips* screwdriver

to loosen the screws x 4 located on the heatsink corners diagonally using

the following procedure (1a) to (1b).

(1a) Use a #2 Phillips* screwdriver and start with screw 1 and loosen it

by giving it two rotations and stop (see letter A).

CAUTION

Do not full loosen.

(1b) Proceed to screw 2 and loosen it by giving it two rotations and

stop (see letter B). Similarly, loosen screws 3 and 4. Repeat steps A and

B by giving each screw two rotations each time until all the screws are

loosened.

(1c) Lift the heatsink upward (see letter C).

R

E

MOVE

REMOV

E

LGA20

11-3

** SUPPLIER IDENTI

FI

C

A

TION HERE **

INSTALL PROCESSOR B

EFOR

E

REMOVING COVER

SA

V

E AN

D

REPLACE

COVER

IF P

ROCESSOR IS REMOVE

D

Processor

Socket

2

3

1

4

A

B

C

8

Chapter 2. Hardware SetupHA401-LB2 User Manual

Step 2 Unlatch the CPU Load Plate by following procedures (2a) to (2b).

(2a) Push the lever handle labeled “OPEN 1st” (see letter A) down and towards

the CPU socket. Rotate the lever handle upward.

(2b) Repeat the steps for the second lever handle (see letter B).

Step 3 Open the load plate.

(3a) Rotate the right lever handle down until it releases the Load Plate (see

letter A).

(3b) While holding down the lever handle, lift open the Load Plate with your

hand (see letter B).

Step 4 Remove the processor from the socket.

NOTE

-Remove the processor by carefully lifting it out of the socket. Take care not to drop

the processor and not touching any pins inside the socket.

-Install the socket cover if a replacement processor is not going to be installed.

REMOVE

LGA2011-3

** SUPPLIER IDENTIFIC

ATION HERE **

INSTALL PROCESSOR BEFORE

REMOVING COVER

SAVE AND REPLACE COVER

IF PROCESSOR IS REMOVED

A

REMOVE

LGA2011-3

** SUPPLIER IDENTIFIC

ATION HERE **

INSTALL PROCESSOR BEFORE

REMOVING COVER

SAVE AND REPLACE COVER

IF PROCESSOR IS REMOVED

B

REMOVE

REM

OVE

LGA2011-3

** S

UPPLIER ID

ENT

IFIC

ATION HERE

**

INSTALL PROCESSOR BEFORE

REMOVING COVER

SAVE AND REPLACE COVER

IF PROCESSOR IS REMOVED

A

9

Chapter 2. Hardware SetupHA401-LB2 User Manual

2�1�2 Installing the processor

CAUTION

Processor must be appropriate: you may damage the server board if you install a

processor that is inappropriate for your server.

CAUTION

ESD and handling processors: reduce the risk of electrostatic discharge (ESD) damage

to the processor by doing the following:

(1) Touch the metal chassis before touching the processor or server board. Keep part

of your body in contact with the metal chassis to dissipate the static charge while

handling the processor.

(2) Avoid moving around unnecessarily.

10

Chapter 2. Hardware SetupHA401-LB2 User Manual

Step 1 Remove the processor from its package by following procedures (1a) to

(1b).

(1a) Carefully remove the protective cover from the backside of the

CPU. Take care not to touch any CPU contacts (see letter A).

(1b) Orient the processor with the socket so that the processor cutouts

match the four orientation posts on the socket (see letter B). Verify

the location of a gold key at the corner of the processor (see letter C).

Carefully place (Do NOT drop) the CPU into the socket.

CAUTION

The pins inside the CPU socket are extremely sensitive other than the CPU. No object

should make contact with the pins inside the CPU socket. A damaged CPU socket pin

may render the socket inoperable and will produce erroneous CPU or other system

errors if used.

CAUTION

The underside of the processor has components that may damage the socket pins if

installed improperly. The processor must align correctly with the socket opening before

installation. Do not drop the processor into the socket.

CAUTION

When possible, a CPU insertion tool shoule be used when installing the CPU.

A

C

B

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