Gemalto MagIC3 X-series Maintenance Manual

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X-series - MAINTENANCE MANUAL

INTRODUCTION

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Point of Sales Terminals

MagIC

3

X-series

MAINTENANCE MANUAL

Version 2.0 - June 2009

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COPYRIGHT AND PROPRIETARY LEGENDS

These materials contain confidential and proprietary information in the nature of, for

example, trade secrets and know-how, and are not to be distributed or divulged to third

parties, or duplicated in whole or in part without prior written permission from Gemalto E-

Payment, and are subject to use, copying, and disclosure restrictions contained in a

agreement with Gemalto E-Payment.

These materials are to be used only for the intended purpose agreed upon in the related

contract with Gemalto E-Payment. IN NO EVENT SHALL GEMALTO E-PAYMENT BE

LIABLE FOR SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES IN CONNECTION

WITH OR ARISING FROM THE USE OF THIS DOCUMENT OR ANY PROGRAMS

CONTAINED HEREIN. GEMALTO E-PAYMENT EXPRESSLY DISCLAIMS ANY

WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE IN

RELATION TO THIS DOCUMENT OR ANY PROGRAMS CONTAINED HEREIN.

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MODIFICATION SHEET

Date Version Modifications

Q1 / 2007 1.0 > 1.2 Draft

April 2007 1.3 Release

June 2009 2.0 Global update of the documents

Mainly (but not only) :

*

II-1.4, II-2.14, II-3.0 (new).

*

III- MI5, MI6, MI8, MI9, MI12B (new), MI14, MI15 (new).

* LITHIUM_BAT voltage threshold replacement.

Merge of old documents as follows :

22000-00-MAN-I-07003 / 04 / 05 become 22000-00-MAN-I-09004

22000-00-MAN-I-07006 become 22000-00-MAN-I-09005

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Table of contents

INTRODUCTION...................................................................................................................5

1. Scope.............................................................................................................................5

1.1 References................................................................................................................ 5

1.2 MagIC

3

Diag software...............................................................................................5

1.3 Abbreviations used ...................................................................................................5

I) - DESCRIPTION ................................................................................................................6

2. System Product Architecture design..............................................................................6

2.1 Technical overview ...................................................................................................6

2.2 Physical Architecture ................................................................................................8

3. Software Architecture...................................................................................................15

II) - TROUBLESHOOTING..................................................................................................17

1. Introduction ..................................................................................................................17

1.1 Methodology ........................................................................................................... 17

1.2 Safety regulation..................................................................................................... 17

1.3 Special tools and test equipment............................................................................ 17

1.4 Procedure ............................................................................................................... 18

2. Troubleshooting Instructions........................................................................................19

2.1 POWER SUPPLY failure......................................................................................... 19

2.2 DISPLAY failure...................................................................................................... 20

2.3 KEYBOARD failure................................................................................................. 21

2.4 PRINTER failure ..................................................................................................... 22

2.5 MAGNETIC READER failure .................................................................................. 23

2.6 CUSTOMER SMART CARD READER failure........................................................ 24

2.7 SAM READER (SIM-sized) failure.......................................................................... 25

2.8 2

nd

FULL-SIZE READER failure.............................................................................. 25

2.9 MODEM failure ....................................................................................................... 26

2.10 RS232 failure.......................................................................................................... 26

2.11 PINPAD INTERFACE failure................................................................................... 27

2.12 ETHERNET failure.................................................................................................. 27

2.13 USB failure.............................................................................................................. 28

2.14 SECURITY ALERT / LITHIUM BATTERY failure................................................... 29

3. SECURITY ALERT – How to interprete SP Status information....................................33

3.1 SP STATUS ticket information................................................................................ 34

3.2 UKSR/SECIRQ values meanings ........................................................................... 35

3.3 Interpreting UKSR/SECIRQ values......................................................................... 35

III) - MAINTENANCE …………………………………………………………..…… ….……... RI[01]

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INTRODUCTION

1. Scope

This document relates to the MagIC

3

X-series. The aim of this manual is to give necessary

technical information and procedures to carry out all maintenance activities needed during

the life span of the MagIC

3

X-series.

This guide is divided in 3 parts:

• I) Description, consisting in a detailed description of the Terminal and its

equipment.

• II) Troubleshooting, explaining how to find the root cause of failures.

• III) Maintenance, containing replacement procedures for all parts that can be

exchanged during Maintenance level 2 operation.

It mainly makes reference to the Maintenance software MagIC

3

-Diag RI[02].

1.1 References

RI[01] : 22000-00-MAN-I-09005 Part III - MAINTENANCE

RI[02] : 15200-00-MAN-S-07001 Maintenance software, MagIC

3

-Diag User Manual

1.2 MagIC

3

Diag software

You have to use MagIC

3

Diag version 1.5 minimum to test X-series. This software tool

is available on the MPO site.

1.3 Abbreviations used

AM Application Manager

MMS MagIC Management System

MP Main processor

TMS Terminal Management System

OS Operating System

PCB Printed Circuit Board

POS Point Of Sale

SAM Security Application Module

SIM Subscriber Identification Module

SMD Surface Mounted Device

SP Secure Processor

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I) - DESCRIPTION

2. System Product Architecture design

2.1 Technical overview

MagIC3 X-series product is based on dual micro-processor architecture, the secure

microcontroller to manage security purposes, the main processor as application

manager.

MagIC3 X-series architecture is mainly made of 2 electronic boards, the 3

rd

board is

optional to support the 2

nd

full size reader :

• The Keyboard board supports devices such keypad rubber membrane, keyboard

LED backlight, SCR connector and Magnetic stripe connector with its physical

interface. These devices are interfaced with the Main board through 2

elastomeric connectors.

• Main board handles all the MagIC3 X-series peripherals, they are interfaced to a

dual micro-processor architecture. All communication port connectors are located

on the Main board.

• The 2

nd

full size reader board is an option, that, when in place in the Terminal, is

connected to the Main board.

MagIC3 X-series is made of following devices:

• 32-bit RISC core ARM, as SP (Secure Processor)

• 32-bit RISC core ARM9, as MP (Main Processor)

• 4 Mb Flash, 8 Mb / 16 Mb SDRAM, 1024-bit EEPROM

• Lithium battery to back-up the SP

• Magnetic stripe reader

• Customer smart card reader

• 4 accessible SIM-sized readers (or 3 SIM-sized + the 2

nd

full size reader)

• Graphic display

• Keypad

• Buzzer

• Thermal printer

• Modem

• Ethernet (not present on X5)

• 2 x USB host (1 x USB host on X5)

• 1 x USB device (not present on X5)

• 1 x simple RS232 (with DTR signal)

• 1 x RS232 Pinpad (with power supply)

• Power supply input

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1. Printer 6. Modem 11. USB Device

2. Display 7. RS232 Pinpad 12. Power Supply

3. Keyboard 8. RS232 Serial Link 13. 2x USB Host

4. Smart Card Reader 9. Lithium battery 14. Ethernet

5. Magnetic Stripe Reader 10. 4x SIM-sized readers

2

3

5

8

14

1

4

7

6

9

10

13

11

12

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2.2 Physical Architecture

2.2.1 Block diagram

Main Processor

AT91RM9200

Ethernet

(phy)

Thermal

printer

Driver

Modem DSP / DAA

Power

managemnt

Vin USB-h/USB-h USB-d Ethernet

jack usb-a usb-a usb-b rj

45

Horizontal connectors

Pinpad RS232+dtr Modem

rj9 rj9 rj11

Vertical connectors

RS232 Driver

Secure Processor

AT91SO101

SIM1 to SIM3

smart card readers

Full internal smart card

readers / SIM4

Customer

smart card reader

Intrusion switch & mesh

sensors

Magnetic

stripe

d

Battery backup

Graphic display

Buzzer

Keyboard

EEPROM

FLASH

EPROM

SDRAM

Driver

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2.2.2 The AT91SO101, the Secure Processor

The AT91SO101 is a single package solution in BGA256 embedding two chips, the

AT91SO100 and the AT83C26

The AT91SO100 is a 32-bit microcontroller based on the ARM RISC architecture

(ARM7TDMI code compatible) with embedded EEPROM, RAM and peripheral functions. It

achieves throughputs close to 1 MIPS per Mhz.

The AT83C26 is a multiple Smart Card Reader interface. Combined to the AT91SO100, it

makes a fully compatible solution with ISO7816, EMV2000 level1 standards.

Below are the main features of the AT91SO101:

• 256 Kb EEPROM, 96 Kb RAM, 4 Kb crypto RAM, 32 Kb ROM

• RTC, System timers, Communication ports

• 1x ISO7816 controller

• 1x ISO7816 multiplexed to address up to 4 SAM in our application

• DES3, AES, SHA, crypto multiplier (RSA, DSA, key generation, ECC)

• True random number generator

Security features :

• 256 bits for key storage (battery backup)

• Dedicated hardware for protection against SPA/DPA attacks

• Active shield, intrusions sensors (mesh & switches)

• Environmental protection (voltage, frequency, temperature)

• Secure memory management

2.2.3 The AT91RM9200, as Main Processor

The AT91RM9200 is a complete system-on-chip built around the ARM920T core.

The AT91RM9200 operating frequency can go up to 190 MHz.

The ARM920T, an ARM9 32-bits RISC processor with :

• Mode Thumb

• 16 Kb Data cache, 16 Kb instruction cache

• MMU to provide access permission checks for instruction and data

• A set of system peripherals ; timers, RTC, interrupt controller, I/O, etc…

• Standard interfaces like dual master USB 2.0, simple device USB 2.0, Ethernet

10/100 Base-T, etc…

• Embedded memories (16 Kb SRAM, 128 Kb ROM)

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2.2.4 External Memory

2.2.4.1 FLASH

The Flash (8 Mb NOR-Flash) contains boot and compressed executable files as Linux, AM,

Applications, … The executable files are uncompressed and copied in SDRAM for

execution. Flash can be compared to the disk of your PC, a kind of Flash-disk.

2.2.4.2 SDRAM

The SDRAM (16 Mb) is used by MP as executable area (Linux, AM, Applications, …) and

working area (stacks, buffers, variables, …). The SDRAM content is lost when system

powered down.

2.2.4.3 EEPROM

This E

2

PROM (1024 bits) is used to keep Gemalto and manufacturer information such as

serial number for instance. This component is interfaced to the AT91SAM9200.

2.2.5 Magnetic stripe card reader interface

This interface allows reading magnetic stripe cards ISO1/2/3 according to ISO 7811

standard. The interface can be equipped with either head allowing 2 tracks reading ISO1/2

(2/3) or head allowing 3 tracks reading for ISO 1/2/3. Head (2 or 3 tracks) is connected to

the PCB via a 7-point connector.

Note:

 The cards can be read in both way, it can be introduced from up to down, or from down to up.

2.2.6 Smart card interfaces

The AT91SO101 includes a smart card solution fully compatible with ISO7816 & EMV2000

standards. The complete function is able to manage the customer card and up to 4 SIMs or

3 SIMs + the 2

nd

full reader.

Below are features that are common to all smart card interfaces.

• Support 3.3V and 5V cards.

• VPP is electrically isolated according to EMV specifications.

• Card clock runs to 4.80Mhz (means D=1 at 12.900 bps).

• D=2, D=4 are supported.

• Support asynchronous cards using protocols T=0 and T=1 according to ISO 7816-3

and EMV 2000 specifications.

2.2.6.1 Customer smart card reader

The smart card reader is located in the lower part of the Terminal, just under the keyboard.

The design allows use either friction or landing contact connector type. Both type includes

card detect switch which is dustproofed and washable, only ISO position (8 contacts) is

supported. Since auxiliary signals are interfaced (C4 & C8), synchronous cards can be

supported too.

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2.2.6.2 1 to 4 SIM card readers

The product supports up to 4 SIM-sized SAM readers. They are located in the bottom part

of the Terminal and accessible by openning the SIM lid. SIMs are mechanically guided and

held in place by the bottom plastic part.

SIM connectors do not include card detect switch.

Since auxiliary signals are not interfaced, synchronous cards are not supported.

2.2.6.3 The 2

nd

full-size reader (optional function)

The 2

nd

full-size reader (known as Sesam Vitale reader) is located on an extra pcb, this

board is located in the bottom part of the Terminal. The board is held in place by the bottom

plastic part, it can be put in place (or removed) by openning the SIM lid.

The smart card connector is a rubbing contact mechanism including card detect switch

which is dustproofed and washable, ISO position (8 contacts).

Since auxiliary signals are not interfaced, synchronous cards cannot be supported by this

interface.

The smart card is accessible by openning the SIM lid.

When introduced, the smart card covers entirely the SIMs readers.

Note:

• When this option is present, the SIM4 cannot be used. The 2

nd

full size reader and

SIM4 interfaces are mutually exclusive.

The signals of these 2 interfaces are electrically connected in parallel to the

AT91SO101. That means that, if for any reason a SIM is present in the SIM4 socket

while a smart card is present in the 2

nd

full-size reader, neither of them could be

handled properly by the system. Although this configuration does not work, it is not

destrutive, neither for electronic, nor for SIM or smart card.

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2.2.7 Graphic Display

One display type is supported, the 128x64 dots.

Main characteristics

Backlight Yes : Yellow-green LED backlight, control by software

Icon area Yes, on top of the display

Active area 57,57(L) x 28,77(w) mm

Dot size 0,42 x 0,42 mm (pitch 0,45 x 0,45)

Contrast Automatic temperature adjustment integrated to the display, with

possibility to control it by software

Lcd type Transflective FSTN - Film compensated black and white Super Twist

Nematic (grey background). FSTN is a type of lcd structure improving

viewing angle with extra film strengthening contrast.

Viewing direction 6 o’clock

Controller COG (Chip On Glass)

2.2.8 Keyboard

The keyboard consists of :

• A set of 3 cursor keys [U] [–] [V] without backlight

• A set of 15 keys with backlight, as follows :

- 11 numerical keypad : [0] – [9], [00]

- 4 function keys : [

*

] , [x]:cancel , [<]:clear , [O]:enter

- Keys [0] – [9] have alphabet marking

- Key [5] has the blind point

Mechanically it consists of a silicon rubber membrane where each key is covered by a

plastic cap (known as plastic caps technology).

The backlight is obtained by 4 LEDs implemented on the PCB. LEDs are neutral as

possible in order to spread light very close to the white. The backlight brightness is

hardware defined, no possibility to tune it by software.

2.2.9 Buzzer

The buzzer is used for sound generation according to the software needs (e.g. keystroke).

Frequencies are under software control.

2.2.10 Printer

The printers is Fujitsu FTP628MCL101. The main characteristics are :

• 384 dots per line

• Dot size 0.125 mm x 0.12 mm

• Printing speed = minimum 15 lines per secondes (15 lines of 24 characters, font

16x8)

• Operating temperature 0 to 50°C

• Life time (paper feed length) = 50 Km for printing rate 25% max

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2.2.11 Modem

The modem function is built around Silicon-Labs devices, the two-chip modem DSP Si2415

and the DAA Si3018. This solution includes a DSP data pump, modem ctrl, on-chip RAM

and ROM, codec, and DAA.

The main characteristics of the modem are :

• Compatibility with Bell 103, 212A, V21, V22, V22bis, V32, V32bis

• Connect rate from 300 bps to 14.4 kbps

• Fast connect (V22/V22bis fast handshake to connect to NAC hypercom for instance)

• Accept standard AT commands

• International PSTN

• Programmable (to meet worldwide PSTN regulations with a single design)

• Parallel phone detection

• Incoming call

2.2.12 Ethernet

The AT91RM9200 includes an Ethernet Macrocell that provides a full-function 10/100 Base-

T Ethernet MAC (Media Access Controller) compliant with IEEE 802.3 standards.

2.2.13 USB

• 2x USB 2.0 master, full speed and low speed (1.5 and 12 Mbps), 500 mA shared

between the 2 lines.

• 1x USB 2.0 device, full-speed compliance, 12 Mbps.

2.2.14 RS232

• Simple RS232 (Tx-Rx-Gnd + DTR). Communication can go up to 115.2 Kbps.

• Simple RS232 (Tx-Rx-Gnd + Vin power supply). Dedicated to the Pinpad.

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2.2.15 Battery backup

A lithium cell of 3V-235mA/h is used for the backup of the Secure Processor. It is located

on the main board, accessible by openning the SIM lid. Battery can therefore be replaced

during maintenance operation without openning the Terminal.

When a failure occurs on main power supply, the SP is backuped via the battery and the

following security items are still active : Supply monitor on Vbat, Temperature monitor,

Intrusion monitor (mesh and switches) and key integrity violation, Real Time Clock.

Battery life time : 3 years minimum

Notes:

 In case of battery remove while the Terminal is power off, the security sensors will trigg,

leading the loss of security keys.

 When the 2

nd

full size reader board is in place, the battery is not accessible. Removing

this board allows battery access.

 Only Secure processor is backuped, application contexts are not.

2.2.16 Tamper detection mechanisms

The Terminal is equipped with many different means of detection:

• Security features integrated in the Secure Processor, such as active shield, intrusion

sensors, environmental protection systems (Voltage, Frequency, UV and

Temperature).

• 3 switches are part of the keypad membrane.

• All pcbs, Keyboard, Main and side walls include a grid mesh in their internal layers,

making a cap on the smart card reader and on the sensitive components located in

the Secure area. It means that all sensitive components are surrounded by a grid

mesh. Grid mesh goes from Keyboard pcb to Main pcb through 2 elastomeric

connectors considered as 2 other actuator devices.

As soon as one of the means of detection triggers (grid mesh cutted or short-circuited,

elastomeric or keyboard switch disconnection, environmental detection, ….), the Secure

Processor goes immediately in security alert, leading to the erasure of its user key, by the

way the lost of all sensitive data contained by the Secure Processor.

Actuators are held in place through the mechanical structure, in sandwich between the front

and the bottom covers, the whole is maintained in position by screws. Mechanical

construction is designed in order to prevent access to sensitive components.

Note:

 When tampering, the Handset shall be put back into operation using the Unlocking tool.

2.2.17 Power supply

Vin = 7V +/- 5%, I = 3.5A max

2.2.18 Mechanical element characteristics

¾ Plastic is ABS, UL94 HB

¾ Other pieces are UL94 HB minimum

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2.2.19 Environment Use

¾ Operating

0°C to 40°C (32°F to 104°F), < 90% RH

¾ Storage

-20°C to 55°C (-4°F to 131°F)

3. Software Architecture

Following diagram describes software architecture on MagIC

3

Terminal

The main processor runs applications and application manager over the operating system

based on an embedded version of Linux.

The operating system ensures a strong fire walling between applications and allows multi-

tasking operations inside each application. It provides communication drivers for serial

ports, Ethernet, Modem and USB devices. The OS completely manages local software

downloading through USB keys, and on the Base through USB keys, USB cable and

remote TCP/IP downloading from the TMS through Ethernet or Modem.

The application manager is in charge of selecting the correct application for each

transaction. It also puts in common transactional services such as currencies, accounts,

total, merchants and messages management. It is up to the AM to handle idle screen and

all Terminal management menus to setup Terminal date, printer and display contrast, ticket

headers and footers, remote downloading parameters, etc.

The secure firmware is entirely contained in secure processor internal memory. It is in

charge of managing all sensitive devices related to the transaction process (display,

keyboard, smart cards and magnetic cards). The firmware also securely stores and

manages banking secret keys. Numeric and alphanumeric prompts are completely handled

by the secure processor to avoid fake PIN entries, and all messages used to prompt user

for data are authenticated by the secure firmware. This firmware will detect Terminal

tampering and attacks and will block security features when such event occurred.

Main processor

Secure processor

Banking applications

Application Manager

Operating system

(based on Linux)

Secure firmware

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END OF CHAPTER 1

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II) - TROUBLESHOOTING

1. Introduction

1.1 Methodology

The aim of this chapter is to provide assistance to operators in charge of corrective

maintenance, when the symptom of the failure is not obvious or corresponds to

different kinds of malfunction.

The instructions hereafter will inform on how to operate safely, locate the faulty unit

and identify the failure in a logical way.

1.1.1 Reference (MI)

The references (MI) linked to the troubleshooting procedures relate to procedures

listed in the MAINTENANCE part, chapter 3 of MAINTENANCE MANUAL.

1.1.2 Reference (T)

References (T) relate to the auto-test that can be run with Maintenance Software

MagIC

3

-Diag (refer to RI [02] for details).

1.2 Safety regulation

When the equipped boards are manipulated, these recommendations must be followed

to prevent electrostatic discharges:

• Use anti-static wrist and anti-static carpet

• Follow all the standard procedures for manipulation of SMD equipped PCBs.

1.3 Special tools and test equipment

• Tools

Cross shaped screwdriver Z (Pozidrive) :: PZ1 (diam. Max. 4.5mm).

Flat shaped screwdriver 3 x 75 mm.

Flat pliers.

• Test equipment Golden sample (reference Handset & reference Base).

Magnetic card ISO1/2/3.

SIM card (1 to 4 SIM).

Smart card.

Ethernet stub, RS232 stub, Master to Slave Usb cable.

Phone line.

• Diagnosis aid equipment Maintenance Software MagIC

3

-Diag (refer to RI [02])

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1.4 Procedure

The troubleshooting operation must always follow the general

procedure below :

¾ Make sure the software configuration is coherent and

operational.

¾ You are aware of information related to

ELASTOMERIC connectors by reading MI 14.

¾ Before opening the Terminal, make sure that all

cables are disconnected.

¾ When you operate the Terminal during repair

operation, Get into the habit of checking the

LITHIUM_BAT voltage. We recommend to change

the LITHIUM_BAT if Vbat < 2,9V (or if it is 3 years

old).

¾ Always start analyse by checking the POWER

SUPPLY first (§ 2.1).

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2. Troubleshooting Instructions

2.1 POWER SUPPLY failure

2.1.1 Symptoms

- Absence of any information on the display, no backlight (display & keyboard)

, no “beep” at boot time.

2.1.2 Procedure

Power supply failure

Ref.

1. Before opening the Terminal, make sure you reproduce the issue with a

reference power supply.

2. If the failure disappears, change the power supply (even though the power

supply seems the root cause, check the power jack of the CPU_BOARD, it

might be the problem).

3. If the failure is still present, change the CPU_BOARD by a new one. MI 10

2.1.3 PSU control

1. Disconnect the power supply from the Terminal.

2. Connect the power supply to the electrical wall plug.

3. Measure the DC output with a DC voltmeter, without charge and with a charge like

a reference Terminal.

4. The voltage must be comprised between 6.65V and 7.35V.

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2.2 DISPLAY failure

2.2.1 Symptoms

- The Terminal boots, bip occurs, but you note following behaviour(s) :

- No message displayed.

- No backlight.

- Bad contrast.

- Bad display positioning.

2.2.2 Procedure

Display failure

Ref.

1. Checklist :

¾ DISPLAY is correctly put in place in the BOARD_CRADLE.

MI 1

¾ DISPLAY flex is not damaged.

MI 6

¾ DISPLAY flex is correctly put in place in the BOARD_CRADLE locating pins.

MI 6

If need, reposition the piece and/or change the DISPLAY (if damaged)

¾ During this operation, check the elastomeric pads XJ2 of the CPU_BOARD

(dust, liquid, etc…), clean them if need and if possible. If damaged

(corrosion for instance), change the CPU_BOARD by a new one.

MI 10

2. Behaviour to apply in case no issue detected in step 1 :

¾ First, change the DISPLAY by a new one.

MI 6

¾ At the end, if the failure is still present, change the CPU_BOARD by a new

one.

MI 10

CPU_BOARD XJ2 elastomeric pads

XJ2

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Gemalto MagIC3 X-series Maintenance Manual

Gemalto MagIC3 X-series Maintenance Manual

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