AIC SB101-LE User manual

UM_SB101-LE_v1_041819

SB101-LE

Storage Barebone

User's Manual

Table of Contents

Preface �� i

Safety Instructions �� ii

About This Manual �� iv

Chapter 1� Product Features ��1

1.1 Box Contents ...........................................................................................1

1.2 Specications ..........................................................................................2

1.3 Feature .....................................................................................................3

Chapter 2� Hardware Setup ��6

2.1 Central Processing Unit (CPU) ................................................................ 6

2.1.1 Processor Support ..............................................................................................6

2.1.2 Installing the CPU ...............................................................................................6

2.1.3 CPU Heatsink Installation ..................................................................................9

2.2 System Memory Setup ..........................................................................10

2.2.1 DIMM Installation ............................................................................................ 10

2.2.2 DIMM Location ................................................................................................ 11

2.2.3 Dimm Slot Installation Order ........................................................................... 11

2.3 Removing and Installing the Top Cover ................................................12

2.4 Removing and Installing Power Supply Unit Module...........................13

2.4.1 Removing the Power Supply Unit Module ...................................................... 13

2.4.2 Installing the Top Cover................................................................................... 13

2.5 Removing and Installing Fan Module ...................................................14

2.5.1 Removing the Fan Module .............................................................................. 14

2.5.2 Installing the Fan Module ................................................................................ 14

2.6 Removing and Installing Hard Disk Drive .............................................15

2.6.1 Removing the 3.5" External Hard Disk Drive Tray .......................................... 15

2.6.2 Installing the 3.5" Hard Disk Drive .................................................................. 15

2.6.3 Installing the 2.5" Internal Hard Disk Drive ................................................... 16

2.7 Removing and Installing HDD Backplane .............................................17

2.7.1 Removing the HDD Backplane ........................................................................ 17

2.7.2 Installing the HDD Backplane ......................................................................... 17

2.8 Removing and Installing Riser Card .....................................................18

2.8.1 Removing the Riser Card ................................................................................. 18

2.8.2 Installing the Riser Card .................................................................................. 18

Content

2.9 Removing and Front Door (Optional) ....................................................19

2.10 Slide Rail Installation ...........................................................................20

Chapter 3�Hardware Settings �� 23

3.1 Motherboard .........................................................................................23

3.1.1 Block Diagram.................................................................................................. 23

3.1.2 Motherboard Content List ............................................................................... 24

3.1.3 Motherboard Layout ........................................................................................ 26

3.1.4 Motherboard Connector and Jumper ............................................................. 27

3.1.5 System LED Indicator ...................................................................................... 29

3.2 HDD Backplane ......................................................................................31

3.2.1 Backplane Layout ............................................................................................ 31

3.2.2 Connector and Jumper .................................................................................... 31

3.2.3 LED Indicator ................................................................................................... 32

Chapter 4. BIOS Conguration Settings �� 33

4.1 Navigation Keys .....................................................................................33

4.2 BIOS Menu .............................................................................................34

4.3 Main ........................................................................................................ 35

4.3.1 Main .................................................................................................................. 35

4.4 Advanced ................................................................................................36

4.4.1 Trusted Computing .......................................................................................... 36

4.4.2 ACPI Settings ................................................................................................... 36

4.4.3 Onboard Device Conguration ........................................................................ 37

4.4.4 Hardware Health Conguration ...................................................................... 37

4.4.5 Super IO Conguration .................................................................................... 37

4.4.6 S5 RTC Wake Settings ..................................................................................... 38

4.4.7 Serial Port Console Redirection ...................................................................... 38

4.4.8 CPU Conguration ........................................................................................... 39

4.4.9 SATA Congurations ........................................................................................ 39

4.4.10 PCI Subsystem Settings ................................................................................ 40

4.4.11 CSM Conguration ....................................................................................... 40

4.4.12 USB Conguration ........................................................................................ 40

4.5 Chipset ...................................................................................................41

4.5.1 Intel Server Platform Services Conguration ................................................. 41

4.5.2 North Bridge Conguration ............................................................................. 41

Content

4.5.3 South Bridge Conguration ............................................................................. 42

4.6 Security ..................................................................................................43

4.6.1 Security ............................................................................................................ 43

4.7 Server Management ..............................................................................44

4.7.1 FRB-2 Timer ..................................................................................................... 44

4.7.2 OS Watchdog Timer ......................................................................................... 44

4.7.3 System Event Log ............................................................................................ 45

4.7.4 BMC Network Conguration ........................................................................... 45

4.8 Boot ........................................................................................................46

4.8.1 Boot .................................................................................................................. 46

4.9 Save and Exit ..........................................................................................47

4.9.1 Save and Exit .................................................................................................... 47

Chapter 5. BMC Conguration Settings �� 48

5.1 Login .......................................................................................................48

5.2 Web GUI ................................................................................................49

5.2.1 Menu Bar .......................................................................................................... 49

5.2.2 User Information and Quick Button ............................................................... 50

5.2.3 Dashboard ........................................................................................................ 51

5.2.4 Sensor .............................................................................................................. 51

5.2.5 System Inventory ............................................................................................. 52

5.2.6 FRU Information ............................................................................................... 52

5.2.7 Logs and Reports ............................................................................................ 53

5.2.8 Settings ............................................................................................................ 54

5.2.9 Remote Control ................................................................................................ 56

5.2.10 Power Control ................................................................................................ 61

5.2.11 Chassis Identify Control ................................................................................ 62

5.2.12 Set Front Panel Enables ................................................................................ 62

5.2.13 Maintenance .................................................................................................. 63

5.2.14 Sign out .......................................................................................................... 65

Chapter 6� Technical Support �� 66

Content

Document Release History

Release Date Version Update Content

April

2019

1 User's Manual release to public.

This document contains proprietary information about

AIC products and is not to be disclosed or used except in

accordance with applicable agreements.

Copyright

No part of this publication may be reproduced, stored in a retrieval system, or

transmitted in any form or by any means, electronic, mechanical, photo-static, recording

or otherwise, without the prior written consent of the manufacturer.

Trademarks

All products and trade names used in this document are trademarks or registered

trademarks of their respective holders.

Changes

The material in this document is for information purposes only and is subject to change

without notice.

Warning

1. A shielded-type power cord is required in order to meet FCC emission limits and also

to prevent interference to the nearby radio and television reception. It is essential

that only the supplied power cord be used.

2. Use only shielded cables to connect I/O devices to this equipment.

3. You are cautioned that changes or modifications not expressly approved by the

party responsible for compliance could void your authority to operate the equipment.

Disclaimer

AIC shall not be liable for technical or editorial errors or omissions contained herein.

The information provided is provided "as is" without warranty of any kind. To the

extent permitted by law, neither AIC or its afliates, subcontractors or suppliers will be

liable for incidental, special or consequential damages including downtime cost; lost

profits; damages relating to the procurement of substitute products or services; or

damages for loss of data, or software restoration. The information in this document

is subject to change without notice.

Instruction Symbols

Special attention should be given to the instruction symbols below.

NOTE

This symbol indicates that there is an explanatory or

supplementary instruction.

CAUTION

This symbol denotes possible hardware impairment. Upmost

precaution must be taken to prevent serious harware damage.

WARNING

This symbol serves as a warning alert for potential body

injury. The user may suffer possible injury from disregard or

lack of attention.

Preface

i

Before getting started, please read the following important cautions:

• All cautions and warnings on the equipment or in the manuals should be noted.

• Most electronic components are sensitive to electrical static discharge. Therefore, be

sure to ground yourself at all times when installing the internal components.

• Use a grounding wrist strap and place all electronic components in static-shielded

devices. Grounding wrist straps can be purchased in any electronic supply store.

• Be sure to turn off the power and then disconnect the power cords from your system

before performing any installation or servicing. A sudden surge of power could

damage sensitive electronic components.

• Do not open the system’s top cover. If opening the cover for maintenance is a must,

only a trained technician should do so. Integrated circuits on computer boards are

sensitive to static electricity. Before handling a board or integrated circuit, touch

an unpainted portion of the system unit chassis for a few seconds. This will help to

discharge any static electricity on your body.

• Place this equipment on a stable surface when install. A drop or fall could cause injury.

• Please keep this equipment away from humidity.

• Carefully mount the equipment into the rack, in such manner, that it won’t be

hazardous due to uneven mechanical loading.

• This equipment is to be installed for operation in an environment with maximum

ambient temperature below 35°C.

• The openings on the enclosure are for air convection to protect the equipment from

overheating. DO NOT COVER THE OPENINGS.

• Never pour any liquid into ventilation openings. This could cause fire or electrical

shock.

• Make sure the voltage of the power source is within the specication on the label when

connecting the equipment to the power outlet. The current load and output power of

loads shall be within the specication.

• This equipment must be connected to reliable grounding before using. Pay special

attention to power supplied other than direct connections, e.g. using of power strips.

• Place the power cord out of the way of foot traffic. Do not place anything over the

power cord. The power cord must be rated for the product, voltage and current marked

on the product’s electrical ratings label. The voltage and current rating of the cord

should be greater than the voltage and current rating marked on the product.

• If the equipment is not used for a long time, disconnect the equipment from mains to

avoid being damaged by transient over-voltage.

• Never open the equipment. For safety reasons, only qualied service personnel should

open the equipment.

Safety Instructions

ii

• If one of the following situations arise, the equipment should be checked by service

personnel:

1. The power cord or plug is damaged.

2. Liquid has penetrated the equipment.

3. The equipment has been exposed to moisture.

4. The equipment does not work well or will not work according to its user manual.

5. The equipment has been dropped and/or damaged.

6. The equipment has obvious signs of breakage.

7. Please disconnect this equipment from the AC outlet before cleaning. Do not

use liquid or detergent for cleaning. The use of a moisture sheet or cloth is

recommended for cleaning.

• Module and drive bays must not be empty! They must have a dummy cover.

iii

Thank you for selecting and purchasing the SB101-LE.

This user's manual is provided for professional technicians to perform easy hardware

setup, basic system congurations, and quick software startup. This document pellucidly

presents a brief overview of the product design, device installation, and rmware settings

for SB101-LE. For the latest version of this user's manual, please refer to the AIC website:

https://www.aicipc.com/en/productdetail/50958.

Chapter 1 Product Features

SB101-LE is a flexible storage server barebone that is specifically designed to

accommodate diverse corporations and enterprises for managing heavy workloads and

multiple applications.

Chapter 2 Hardware Setup

This chapter displays an easy installation guide for assembling the hardware in this

product. Utmost caution for proceeding to set up the hardware is highly advised. Most of

the components are highly fragile and vulnerable to exterior influence. Do not endanger

the device by placing the device in an unstable environment.

Chapter 3 Hardware Settings

This chapter elaborates the overall layout of the hardware settings, including multifarious

connectors, jumpers, and LED descriptions. These descriptions assist users to congure

different settings and functions of the motherboard, as well as to conrm the location of

each connector and jumper.

Chapter 4 BIOS Conguration Settings

This chapter introduces the key features of BIOS, including the descriptions and option

keys for diverse functions. These details provide users to effortlessly navigate and

congure the input/output devices.

Chapter 5 BMC Conguration Settings

This chapter illustrates the diverse functions of IPMI BMC, including the details on logging

into the web page and assorted denitions. These descriptions are helpful in conguring

various functions through Web GUI without entering the BIOS setup. For more information

of BMC congurations, please refer to IPMI BMC (Aspeed2400) User's Manual for a more

detailed description.

Chapter 6 Technical Support

For more information or suggestion, please contact the nearest AIC corporation

representative in your district or visit the AIC website: http://www.aicipc.com/en. It is our

greatest honor to provide the best service for our customers.

About This Manual

iv

Chapter 1. Product FeaturesSB101-LE User Manual

1

Spica User Manual Chapter 1. Product Features

Chapter 1� Product Features

SB101-LE is a high density storage server that includes motherboard, chassis, power

supply, and fan. For more information about our product, please visit our website at

http://www.aicipc.com/en.

Before removing the subsystem from the shipping carton, visually inspect the physical

condition of the shipping carton. Exterior damage to the shipping carton may indicate

that the contents of the carton are damaged. If any damage is found, do not remove

the components; contact the dealer where the subsystem was purchased for further

instructions. Before continuing, rst unpack the subsystem and verify that the number

of components in the shipping carton is accurate and in good condition

1�1 Box Contents

This product contains the components listed below.

Please conrm the number and the condition of the components before

installation.

• System barebone

(includes power supply, fan

& hard disk drive tray)

• Power cord (vary per region)

• 28" Slide rail x 1 set (optional)

Product features are subject to change without notice�

2

Chapter 1. Product FeaturesSB101-LE User Manual

1.2 Specications

Dimensions

(W x D x H)

mm : 438 x 560 x 43.5

inches : 17.2 x 22 x 1.7

Motherboard

AIC Server Board Lepus

Processor

Support

• Intel® Xeon® Processors E3-1200 v5/v6

product family / 7th/6th Gen. Intel® Core i3

Processors / Intel® Celeron and Intel® Pentium

• Supports CPU TDP up to 79W

Socket Type LGA1151

Chipset Support

Intel® C232 PCH

System Memory

• DDR4 2400/2133 ECC UDIMM

• 4 DIMM slots ; 2 Channels ; Up to 64G

Front Panel

• System power on/off

• System reset

• System ID

• 2 x USB 3.0 Type A

LEDs

• Power status

• System alert

• LAN activity

• Drive activity

• System ID

Drive Bays

External 3.5" 4 (tool-less)

Internal 2.5" 4 (tool-less)

Backplane

1 x 4-port 12G SAS backplane with 1 x SFF-8643 connector

Expansion Slots PCIe 3.0

• 1 x16 slot (x8 mode) (FH)

• 1 x8 slot (optional for non-IOC SKU) (FH)

Riser Card

(included)

RC1-EX8

1 x8 PCIe slot

System BIOS

BIOS Type

AMI BIOS code @ 16MB Flash EEPROM

BIOS

Features

• ACPI

• PXE

• WOL

• AC loss recovery

• IPMI KCS interface

• SMBIOS

• Serial console redirection

• BIOS Recovery Mode

On-board Devices

SATA/SAS

SATA: Built-in SATA controller with RAID

support on Intel® C232 PCH

SAS: Optional Broadcom/LSI SAS 3008 IOC

IPMI

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Processor

• Baseboard Management Controller

• Intelligent Platform Interface 2.0 (IPMI 2.0)

• iKVM, Media Redirection, IPMI over LAN,

Serial over LAN

• SMASH Support

Network

Controllers

• 2 x Intel® Ethernet Controller I210 GbE

[Optional: 2 x Intel® Ethernet Controller I210

for quad port GbE (BTO)]

• BCM5221 PHY for BMC dedicated

management port

Graphics

Aspeed AST2400 Advanced PCIe Graphics &

Remote Management Process

• PCIe VGA/2D Controller

• 1920x1200@60Hz 32bpp

Rear I/O

LAN

• 2 x external RJ45 ports support 1 GbE

[Optional 2 x external RJ45 ports support

1 GbE (BTO)]

• 1 x GbE RJ45 dedicated for BMC

management

USB

4 x USB 3.0 Type A

VGA

1 x external DB-15 VGA port

Serial Port

1 x external DB-9 COM port

Power Supply

400W single power supply 80+ Gold

• AC INPUT : 100~240V,47-63Hz,10-5A

300W 1+1 redundant power supply 80+ Gold (BTO)

• AC INPUT : 100~240V,50-60Hz,4A

System Cooling

4 x 40x28mm easy swap fans

System

Management

• IPMI 2.0 compliant baseboard management controller

(BMC) / Supports storage over IP and remote platform-

• 24-bit high quality video compression / 10/100 Mb/s

MAC interface

Environmental

• Storage temperature : -10ºC(14ºF) ~ 60ºC(140ºF)

• Operating temperature : 0ºC(32ºF) ~ 35ºC(95ºF)

• Storage operating umidity : 5%~95% non-condensing

Gross Weight

(w/ PSU & Rail)

kgs : 15

lbs : 33

Packaging

Dimensions

(W x D x H)

mm : 615 x 895 x 273

inches : 24.2 x 35.2 x 10.8

Mounting

Standard 28" tool-less slide rail

Front Bezel

Optional to add

3

Chapter 1. Product FeaturesSB101-LE User Manual

SB101-LE is a reliable 1U storage server barebone with 4 hotswap drives bays. This prod-

uct is designed to accommodate the serverboard, Lepus, which supports Intel® C232

PCH chipset and 4 DDR4 2133/2400Mhz EEC UDIMM to offer greater perfomance, ef-

ciency, and utility for our customers. Featuring Intel® C232 PCH system chipset, which is

emphasized for its accelerated speed and expansion, this product enhances these advan-

tages by integrating flexible IO usage and system expansion into to provide greater band-

width and utilization.

In addition to the noteworthy features of the barebone, SB101-LE provides immediate and

efcient management with Onboard Baseboard Management Controller and greater I/O

extension. Featuring IPMI 2.0 and Aspeed AST2400 Advanced PCIe Graphics, the server

board offers support for iKVM, Media Redirection, Smash Support, IPMI over LAN, and

Serial over LAN.

• 1U 4-Bay general purpose storage server (maximin 8 bay supported)

• Supports Intel® Xeon® Processors E3-1200 v5/v6 product family

• With Intel® C232 Series Chipset

• Onboard Baseboard Management Controller for system management and IPMI control

• Front-to-back airflow and easy swap redundant fans to provide optimal thermal

conditions

• Two GbE RJ45 ports plus dedicated BMC management port

1�3 Feature

4

Chapter 1. Product FeaturesSB101-LE User Manual

Front Panel

Rear Panel

Item Description

1

400W single power supply 80+ Gold

300W 1+1 redundant power supply 80+ Gold

(BTO)

2

1 x GbE RJ45 dedicated for BMC management

3

4 x USB 3.0 Type A

4 1 x external DB-15 VGA port

5 1 x external DB-9 COM port

6 2 x RJ45 ports support 1 GbE

7 1 x8 PCIe slot

4 x 3.5" drive bays

Power Button

Drive Activity LED

Power Status LED

LAN Activity LED

System ID LED

System Alert LED

System ID Button

System Reset Button

 

 

  



5

Chapter 1. Product FeaturesSB101-LE User Manual

Top View

400W single

power supply

80+ Gold

300W 1+1

redundant

power supply

80+ Gold

(BTO)

4 x 40x28mm easy swap fans

internal 2�5" drive bays

6

Chapter 2. Hardware Setup

SB101-LE User Manual

2�1 Central Processing Unit (CPU)

2�1�1 Processor Support

The server board includes two processor sockets (LGA3647) that provides one or two

processors of the Intel® Xeon® Processor Scalable Family and supports a Thermal

Design Power (TDP) of up to 165W on selected models.

CAUTION

When unpacking a processor, hold the processor only by the edge to avoid touching the con-

tacts.

2�1�2 Installing the CPU

Step 1 Push the lever handle down and toward the CPU socket.

Rotate the lever handle up.

Chapter 2� Hardware Setup

Load lever

7

Chapter 2. Hardware SetupSB101-LE User Manual

Step 2 While holding down the lever handle, with your other hand, lift open the

Load Plate.

Step 3 Remove the protective cover from the CPU socket. Do not throw away the

protective cover. It may be further used for RMA purposes.

Step 4 Orient the processor with the socket so that the processor cutouts match

the four orientation posts on the socket. Note the location of a gold key

at the corner of the processor. Carefully place (Do NOT drop) the CPU

into the socket.

Load plate

Processor protective cover

Cutouts

8

Chapter 2. Hardware Setup

SB101-LE User Manual

Step 5 Close the loading plate by pushing down the locking lever on the side.

Slide the tip of the lever under the notch on the loading plate. Make sure

the loading plate tab engages under the socket lever when fully closed.

Press to close

9

Chapter 2. Hardware SetupSB101-LE User Manual

2�1�3 CPU Heatsink Installation

Step 1 Apply thermal grease onto the heatsink and position the heatsink onto

the CPU socket. Make certain that the heatsink is accurately positioned.

Step 2 Tighten the four screws in a diagonal sequence. Secure the screws a

couple of turns until the screws are tightly secured and the heatsink is

fastened onto the server board.

10

Chapter 2. Hardware Setup

SB101-LE User Manual

This server board supports 4 DIMM memory slots with 2 channels and a memory capacity of

up to 64G.

2�2�1 DIMM Installation

Step 1 Unlock the dimm socket by pressing the retaining clips outward.

Step 2 Insert the memory module into the slot. Make sure that the dimm notch is

accurately positioned.

Step 3 Close the retaining clips to complete installation.

DIMM n

otch

2�2 System Memory Setup

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