4
3.3.20 IPDS Version ......................................................................................................................... 23
3.4 COLOR MENU – Options Descriptions ................................................................................... 24
3.4.1 Color Management ................................................................................................................ 24
3.4.2 User CMYK Profile ................................................................................................................ 24
3.4.3 User RGB Profile ................................................................................................................... 24
3.4.4 User Dest. Profile .................................................................................................................. 25
3.4.5 RGB Grey to K ....................................................................................................................... 25
3.4.6 Preserve Black ....................................................................................................................... 25
3.4.7 Black Point Comp .................................................................................................................. 25
3.4.8 Embedded ICC Prof ............................................................................................................... 25
3.4.9 HL Mapping Table ................................................................................................................. 26
3.4.10 OCA Mapping Table .............................................................................................................. 26
3.4.11 DEF REND INTENT .............................................................................................................. 27
3.4.12 CMOCA Options .................................................................................................................... 27
3.4.13 Remove User Files ................................................................................................................. 28
3.5 PAPER HANDLING Menu – Option Descriptions .................................................................. 29
3.5.1 Offset Stacking ....................................................................................................................... 29
3.5.2 UNIVERSAL SIZE .................................................................................................................. 29
3.5.3 OTHER ENV SIZE ................................................................................................................. 31
3.6
MAP INPUT TRAYS Menu Options ....................................................................................... 34
3.7 MAP OUTPUT BINS Menu Options ....................................................................................... 37
3.7.1 Descriptions of Output Bin Values ......................................................................................... 37
3.7.2 Descriptions of IPDS Bin Selection Numbers ........................................................................ 38
3.7.3 Default Bin Mapping .............................................................................................................. 38
3.8 MARGINS Menu Options ........................................................................................................ 39
3.8.1 ALL INPUT TRAYS ................................................................................................................ 41
3.8.2 TRAY 1 ADJUST .................................................................................................................... 41
3.8.3 TRAY 2 ADJUST .................................................................................................................... 41
3.8.4 TRAY 3 ADJUST .................................................................................................................... 42
3.8.5 TRAY 4 ADJUST .................................................................................................................... 42
3.8.6 TRAY 5 ADJUST .................................................................................................................... 43
3.8.7 MP FEEDER ADJUST ........................................................................................................... 43
3.8.8 MANUAL PAPER ADJ .......................................................................................................... 44
3.8.9 MANUAL ENV ADJ ............................................................................................................... 44
3.9 RESOURCE CAPTURE Menu Options ................................................................................... 45
3.9.1 Capture Media ....................................................................................................................... 45
3.9.2 Capture Fonts ........................................................................................................................ 46
3.9.3 Capture Data Objects ............................................................................................................ 46
3.9.4 Capture CMR Objects ............................................................................................................ 46
3.9.5 Remove Resources .................................................................................................................. 46
4 Duplex Printing Using Preprinted Media ............................................................................. 48
5
Finishing Support .................................................................................................................... 49
5.1 Offset Stacking .......................................................................................................................... 51
5.1.1 AS/400 and iSeries Offset Stacking ........................................................................................ 51
5.1.2 Mainframe Offset Stacking ..................................................................................................... 52
5.2 Stapling ..................................................................................................................................... 54
5.2.1 AS/400 and iSeries Stapling ................................................................................................... 54
5.3 Mainframe Stapling ................................................................................................................... 61
5.4 Hole Punch ................................................................................................................................ 64
5.4.1 Hole Punch From an Input Source ........................................................................................ 64