Freescale DualCore MPC8572 CPU Board
Manual
Adbc7515
Preface
Thank for choosing the Adbc7515. Please read this manual before using the Adbc7515 so that you may obtain the
greatest benefit from using the device.
This manual presents the specifications, functions, and method of use of the Freescale DualCore MPC8572 CPU
Board Adbc7515.
Advanet Inc. has made every effort to carefully inspect each product and has taken great care to package and to ship
the product. In the unlikely event of the product’s failure to operate normally due to problems in shipping or other-
wise, the company will repair or replace the product at its own responsibility.
Contact Advanet at the following address if you have any questions.
Inquiries
Sales Division
Headquarters
616-4 Tanaka, Kita-ku, Okayama 700-0951 Japan
TEL : 086-245-2861 FAX : 086-245-2860
Tokyo Office KDX Kaji-cho 4F , 3-5-2 Kanda Kaji-cho,
Chiyoda-ku, Tokyo 101-0045 Japan
TEL : 03-5294-1731 FAX : 03-5294-1734
INTERNETURL http://www.advanet.co.jp/
1. In order to improve the product, the contents of this document as well as product specifications are subject to change without notice.
2. This document does not give permission to the implementation of patents or other rights held by Advanet or third parties.
3. Reproduction of all or part of this document without Advanet’s permission is prohibited.
2009 Advanet Inc.
Precautions in Use
Please read this manual before using the product in order to insure its safe use.
Do not place the product in a
location where it can fall or be
subject to vibration or impact
because this may cause device
failure.
Protect the device from vibration and impact.
Do not modify the device.
For safety reasons, under no
circumstances should you
modify the device. Advanet will
not repair products that have
been modified.
Protect the product from water
and chemicals.
Contact between the product
and water or chemicals can
result in product failure,
electrocution, or fire.
Protect the product from
foreign material.
Make sure that foreign
material does not get into the
product during use, storage, or
transport because this can
result in product failure.
Take precautions in handling to insure
that you are not injured.
The sharp projections on this
product may cause injury. Take
care in handling this product in
order to avoid injury.
Do not disassemble the product.
In order to maintain
guaranteed product
performance, do not under any
circumstances disassemble
this product.
Keep the product away from radios and TVs.
Do not use the product near
radios, television sets, or other
devices generating strong
magnetic or electrical fields.
This could result in failure or
malfunction.
Keep the product away from
flame, humidity, and direct sunlight.
Do not use or store the product
in any of the following locations
as this could result in product
failure.
Places where there is fire.
Locations high in humidity
or exposed to rain
Locations exposed to direct
sunlight
Dusty or dirty locations
Locations containing
excessive water or
chemical vapors
Precautions in use
Please read this manual before using the product in order to insure its safe use.
Install the product in well-ventilated locations.
Install the product in well-
ventilated locations to
efficiently disperse heat
generated by the product.
Remove the power plug from the receptacle
when not using the product.
Turn off the main switch and
remove the power plug from
the receptacle when not using
the product, or there is the risk
of lightning strike.
Be sure to use the device within rated parameters.
Be sure to use the product
within the ratings specified in
this manual. Failure to do so
may result in malfunction.
Cleaning the product
If the product becomes dirty,
wipe it with a dry soft cloth. A
thinned neutral cleaner may be
used if the product is
particularly dirty. Do not use
benzene, thinners, or other
solvents under any
circumstances.
Be sure to ground the product in order
to prevent electrocution.
Be sure to ground the product
by connecting it to a 3-pole AC
receptacle or by using an AC
receptacle having a grounding
terminal.
Be sure to dispose of the product properly.
Use appropriate methods for
handling industrial wastes
when disposing of this product.
Please contact Advanet for repair of the product.
Please contact your retail
dealer or Advanet when repairs
are necessary.
Make sure that the product is not miswired.
Failure to wire the product
correctly can result in
malfunction or fire. Read this
manual and wire the product
correctly.
Static electricity may cause malfunction.
This product comprises
electronic parts that are highly
susceptible to static electricity.
Static electricity can cause the
product to malfunction. Take
care not to touch any of the
terminals, connectors, ICs, or
other parts with the hands.
When you believe the product to be malfunctioning
Stop using the product if you
believe it is malfunctioning.
Continuing to use a
malfunctioning product can
cause the malfunction to
spread to other products and
can cause short circuits or fire.
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Content
1. Prior to Use .............................................................................................................................................................................. 6
1.1 Period and Scope of Warranty .......................................................................................................................................... 6
1.2 Scope of Service ............................................................................................................................................................... 6
2. Outline ...................................................................................................................................................................................... 7
3. Specifications ........................................................................................................................................................................... 8
4. Block Diagram ........................................................................................................................................................................ 10
5. External Dimensions ...............................................................................................................................................................11
6. Interface / On Board Component ............................................................................................................................................ 12
6.1. Name of Each Part ...........................................................................................................................................................12
6.2. Function of Each Part ...................................................................................................................................................... 14
6.2.1. COM Express Conncector ........................................................................................................................................ 14
6.2.2. Memory Socket 1 to 2 for DDR2 SO-RDIMM ........................................................................................................14
6.2.3. microSD Card Socket ............................................................................................................................................... 14
6.2.4. Status LED ................................................................................................................................................................ 14
6.2.5. DIP switch 1 to 7 ...................................................................................................................................................... 15
6.3.Concerning the heat release .............................................................................................................................................. 16
7. Address map as seen from the CPU ........................................................................................................................................ 17
8. I2C Bus Device List ................................................................................................................................................................ 19
9. Hardware Details ..................................................................................................................................................................... 20
9.1. CPU .................................................................................................................................................................................. 20
9.2. Main memory ...................................................................................................................................................................20
9.3. Status LED ....................................................................................................................................................................... 20
9.4. Interrupt ........................................................................................................................................................................... 20
9.5. Ethernet ............................................................................................................................................................................ 21
9.6. microSD Card .................................................................................................................................................................. 21
9.7. GPCM (Local Bus) Device .............................................................................................................................................. 22
10. GPCM Local Bus Bank3 (CPLD) ......................................................................................................................................... 23
10.1. Board Status Register .................................................................................................................................................... 23
10.2. Board Control Register ..................................................................................................................................................24
10.3. Watchdog Timer, Control Register ................................................................................................................................ 25
10.4. Watchdog Timer, Status Register ................................................................................................................................... 26
10.5. Watchdog Timer Clear Register .....................................................................................................................................26
10.6. Scratch Pad Register ...................................................................................................................................................... 27
11. Connectors .............................................................................................................................................................................28
11.1. microSD Card Socket .................................................................................................................................................... 28
11.2. CPU_ICE Connector ...................................................................................................................................................... 28
11.3. COM Express Connector ............................................................................................................................................... 29
12. PCI Express / Serial RapidIO Link Setting .......................................................................................................................... 32
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1. Prior to Use
1.1 Period and Scope of Warranty
Delivered products are under warranty for a period of one year after delivery.
During the period of warranty, the vendor will have his own to responsibility replace or repair malfunctioning
parts if the product malfunction is the responsibility of the vendor.
However, this warranty does not apply under the following circumstances:
(1) If the user handles or uses the product in an inappropriate way
(2) If the malfunction is caused by something other than the delivered product
(3) If the delivered product has been modified or repaired by anyone other than the vendor
(4) Due to natural disaster, accident, or other reason not the responsibility of the vendor
In this context, the term “warranty” means solely a warranty of the individual delivered product, and does not
include any compensation for the damage caused by malfunction of the delivered product.
1.2 Scope of Service
The service costs such as the costs of sending technical personnel are not included in the price of the delivered
product. Customers will be charged for the following costs:
(1) Assistance with installation adjustments and test running
(2) Maintenance inspections, adjustments, and repairs
(3) Technical assistance and technical training
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2. Outline
The Adbc7515 is a Computer-On-Module (COM) that is equipped with Freescale Dual Core Processor MPC8572.
Utilized in concert with a customer needs-matched carrier board, this PICMG COM.0 R1.0-compatible board allows
you to freely expand a variety of embedded systems.
Dual Core Processor MPC8572 is endowed with the ECC-compatible memory controller, gigabit Ethernet controller,
PCI Express route function, end-point function, and Serial RapidIO interface. The Adbc7515 uses a dual channel that
allows for DDR2-667-capable SDRAM for main memory, and the main memory is expandable up to 4GB.
The Adbc7515 has the following features:
z Basic Module size COM Express-compliant CPU module
z Freescale Dual Core Processor MPC8572(1.5GHz) is supported
z Up to 4GB of DDR2-667-compliant SDRAM can be mounted with dual channel configuration
z Equipped with Serial RapidIO and PCI Express high-speed interconnection interface
z Equipped with 2 channels of DMA controller that enables high-speed transfer from memory to Serial RapidIO
or PCI Express
z Gigabit Ethernet (3ports)
z One microSD card slot
z RoHS compliant
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3. Specifications
[Table 3.1] Specifications List
CPU (SoC)
SoC Freescale MPC8572
Processor e500Core,Dual Core
Operating Clock 1.5GHz
Internal bus operating
frequency
600MHz
L1 cache 32kB for Data and 32kB for Instruction
L2 cache 1MB for Data/Instruction
Memory
Boot ROM 512kB FLASH memory
Main memory DDR2-667 SO-RDIMM Dual Channel 2GB×2 ECC support
(1-bit error automatic correction, 2-bit error detection)
EEPROM 2kbits I2C EEPROM
VxWorks boot parameter and MAC address are stored
microSD One socket for microSD
COM Express IO Ethernet 3ports, MPC8572 MAC and VSC8211 used
10/100/1000Base-T Specifications, Auto MDI/MDI-X
Without pulse transformer (prepared by carrier board side)
IEEE1588 Hardware Assistance use is possible
PCI Express Bus PCI Express Rev2.0 Specifications
8 lane
MPC8572 PCI Express I/F used
Can be used as PCIe of x4 when RapidIO is used
SerialRapidIO RapidIO Interconnect Specification,Revision1.2 Specifications
4 lane
RS232C
Serial Port
TIA/EIA-232 Asynchronous,115.2kbps max,2ports
Without RS232C transceiver (prepared by carrier board side)
MPC8572 UART used
I2C 2ports
COM Express
Standard PICMG COM.0 R1.0 COM Express Module Base Spec Rev 1.0
Module size Basic module (125mm × 95mm)
Pin out Type Type5
The Adbc7515 is not compatible with the following pins:
・ PCI Express Graphics, PCI Express Lane0~23
・ SATA0~3
・ USB0~7
・ LVDS
・ VGA
・ TV-OUT
・ AC'97
・ Suspend
・ Wake
RAS function Watchdog Timer The board is reset at the time-out
Setting within 15.6ms~1s is available at the time-out
Temperature
Monitoring
Internal temperature of CPU is monitored
Surface temperature of print board is monitored
Operational switch
display
On board 8bits width DIP switch
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[Table 3.1] Specifications List
Power supply
specification
Supply Voltage DC12.0V±5%
Battery power supply : DC3.0V (2.4V~3.3V)
supplied from the COM Express connector
Consumption Current max 5A (12V)
Supply Voltage Size 125mm × 95mm × 18mm
(Heat spreader included, but not Hiat sink)
Weight CPU board : 115g
Heat spreader : 75g
Environmental
specification
Operating Temperature
Range
0~55℃
However, the heat radiator or other item is necessary to
prevent the inner temperature of CPU from exceeding 100℃.
Operating Humidity
Range
35~85%RH (non- condensing)
Storage Temperature
Range
-10~70℃
Storage Humidity
Range
Under 90%RH (non- condensing)
Others RoHS Compliant
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4. Block Diagram
Figure 4.1 shows a block diagram of the Adbc7515.
[Figure 4.1] Block Diagram
Freescale
MPC8572
1.5GHz
GbE
PHY
COM
Express
DDR2-667(2GB)
with ECC
microSD
socket
Temp.Monitor
RTC
GbE
MEM
eLBC
PCIePCIe(x8)
PCIe/sRIOsRIO
UART
UART
UART1
UART2
10/100/1000
Ethernet
GMII
GbE
PHY
GbE
10/100/1000
Ethernet
GMII
GbE
PHY
GbE
10/100/1000
Ethernet
GMII
I2C I2C
SMBus I2C
I2C
multiplexer
x4
72
8
x4
Boot ROM
16
PLD
EEPROM
16
TE4301
Clock Generator
Power Regulators
Reset Generators
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5. External Dimensions
Figure 5.1 shows the external dimensions of the Adbc7515.
[Figure 5.1] External Dimensions
10 10
40 40
40
62
95
8 13
125
2-M2.5
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6. Interface / On Board Component
6.1. Name of Each Part
The part layout of this board is shown in Figures 6.1.1 and 6.1.2.
[Figure 6.1.1] Part side
[Figure 6.1.2] Solder side
LED1 LED2
CN6
CN1
DSW1
DSW3
DSW5
DSW7
DSW6
DSW4
DSW2
CN7
CN2
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CN1 .............................. COM Express connector
CN2 .............................. Memory socket 1 for DDR2 SO-RDIMM (SO-RDIMM1)
CN7 .............................. Memory socket 2 for DDR2 SO-RDIMM (SO-RDIMM2)
CN6 .............................. microSD card socket
LED1 ............................ Status LED (Green)
LED2 ............................ Status LED (Red)
DSW1........................... DIP switch 1
DSW2........................... DIP switch 2
DSW3........................... DIP switch 3
DSW4........................... DIP switch 4
DSW5........................... DIP switch 5
DSW6........................... DIP switch 6
DSW7........................... DIP switch 7
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6.2. Function of Each Part
6.2.1. COM Express Conncector
COM Express connector are stacking connectors to establish connection with the carrier board. The Adbc7515
incorporates TycoElectronics AMP 3-1827231-6 connectors. Tyco Electronics AMP 3-1827233-6 connectors
or equivalent are tobe used for stacking connectors that are mounted on the carrier board, if stacked connec-
tors stand 5 mm high. If they stand 8 mm high, Tyco Electronics AMP 3-5353652-6 connectors or equivalent
must be used.
See chapter 11.3 for connector pin assignment.
Mounting on the carrier board
Use the following procedure to mount the Adbc7515 on the carrier board.
[Figure 6.2.1] Mounting on the carrier board
(1) Replace the stacking spacer with the supplied 5mm spacer if stacked connectors stand 5mm high. There
is no necessity to replace the spacer if they stand 8mm high.
(2) Align the Adbc7515 with the 440-pin connector pair on the carrier board, and push the Adbc7515 into the
carrier board. Place a proper supporter behind the connectors mounted on the carrier board to keep the
carrier board from becoming warped, and insure a good fit between the connectors.
(3) Tighten the supplied M2.5 × 5mm SEMS screws from behind the carrier board.
6.2.2. Memory Socket 1 to 2 for DDR2 SO-RDIMM
This board is equipped with two memory sockets for SO-RDIMM of DDR2.
With the sockets, DDR2-667-compliant SO-RDIMM memory module can be mounted.
ECC is supported.Up to 4GB (mounted by 2GB) can be mounted.
The operation by mounting only one module is also available.
6.2.3. microSD Card Socket
To this board, there is a socket to implement a microSD card.
The hot plug is not available. Refer to Chapter 9.7 for the details.
6.2.4. Status LED
To this board, there is two status LED.
Lighting color is red and green.
Refer to Chapter 9.3 for the details.
440pin connector pair
Stacking spacer
(5points)
Adbc7515
Carrier board
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6.2.5. DIP switch 1 to 7
With DIP switch on the board, the following setting is possible.
Reference Bit Setting Item
Initial
Value
Remarks
DSW1
1
CCB/SYSCLK PLL Ratio 010b
CCB CLOCK : SYSCLK
6 : 1
※SYSCLK is 100MHz
2
3
4
e500 CORE0 PLL Ratio 101b
e500 CORE0 : CCB CLOCK
2.5 : 1
5
6
7
e500 CORE1 PLL Ratio 101b
e500 CORE1 : CCB CLOCK
2.5 : 1
8
DSW2
1
2
DDR PLL Ratio 111b Synchronous mode3
4
5
Boot ROM Location 1101b Local bus GPCM - 8bit ROM
6
7
8
DSW3
1
Host/Agent Configuration 111b
PCI Express1~3 : host
Serial RapidIO : host
2
3
4
I/O Port Selection 1011b
Serial RapidIO (x4)(2.5GHz)
PCI Express1 (x4)(2.5GHz)
5
6
7
8
CPU Boot Configuration 11b no external master
DSW4
1
2
Boot Sequencer Configuration 11b no I2C ROM
3
4 DDR SDRAM Type 0b DDR2,1.8V
5 FEC Configuration 1b parallel interface mode
6 eTSEC1 SGMII Mode 1b parallel interface mode
7 eTSEC2 SGMII Mode 1b parallel interface mode
8 eTSEC3 SGMII Mode 1b parallel interface mode
DSW5
1 eTSEC4 SGMII Mode 1b parallel interface mode
2 SGMII SerDes 1b 100MHz(not used)
3 eTSEC1 and eTSEC2 Width 1b parallel protocol
4eTSEC3 and eTSEC4 Width1b
5
eTSEC1 Protocol 10b GMII protocol
6
7
eTSEC2 Protocol 10b GMII protocol
8
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6.3.Concerning the heat release
This board is equipped with a heat spreader.
The heat spreader is equipped with two screw holes of M2.5.
These holes are prepared for mounting the heatsink.
Select the heatsink with 1.4°C/W or less of heat resistance under the use environment.
Reference Bit Setting Item
Initial
Value
Remarks
DSW6
1
eTSEC3 Protocol 10b GMII protocol
2
3
eTSEC4 Protocol 11b RTBI protocol(not used)
4
5
RapidIO Device ID 000b6
7
8 RapidIO System Size 1b 256 devices
DSW7
1
Memory Debug Configuration 11b debug information(not used)
2
3 DDR Debug Configuration 1b debug information(not used)
4 eLBC FCM ECC Configuration 1b DATA Error Check enable
5 SerDes1 Enable 0b disable
6 SGMII Serdes Enable 0b disable
7
SD1_REF_CLK_SEL 01b
00b : 25MHz, 01b : 100MHz,
10b : 125MHz, 11b : 200MHz
8
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7. Address map as seen from the CPU
Address map as seen from the CPU is shown.
Address Device Remarks
0_0000_0000h ~ 0_7FFF_FFFFh Main Memory (Max 2GB)
0_8000_0000h ~ 0_8003_FFFFh
CCSRBAR
(internal
MPC8572
registers)
1MB
General Utilities
Local Access
ECM
DDR Ctrl1
I2C
DUART
Local BUS
DDR Ctrl2
Reserved
PCI Express3
PCI Express2
PCI Express1
Reserved
DMA2
Reserved
GPIO
PME Gen Ctrl
PME Chan1
PME Chan2
PME Chan3
PME Chan4
TLU2
Reserved
L2 Cache
DMA1
Reserved
eTSEC1
eTSEC2
eTSEC3
eTSEC4
FEC
Reserved
TLU1
SEC
0_8004_0000h ~ 0_8007_FFFFh PIC
Reserved
Global Cfg
Timers
Reserved
Timers
Reserved
External IRQs
Internal IRQs
Processor
0_8008_0000h ~ 0_800B_FFFFh Reserved
0_800C_0000h ~ 0_800D_FFFFh RapidIO
RapidIO Arch
RapidIO Extended Features
RapidIO Impl
RapidIO Messaging
Reserved
0_800 E _0000h ~ 0_800F_FFFFh
Device-Specific
Utilities
Global Utilities
Perf. Monitor
Watchpoint/Debug
Reserved
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Address Device Remarks
0_8010 _0000h ~ 0_80FF_FFFFh Reserved
0_8100 _0000h~ 0_817F_FFFFh
Local Bus
Bank1
SRAM (512kB)
0_8180 _0000h~ 0_81FF_FFFFh Reserved
0_8200 _0000h~ 0_8200_00FFh
Local Bus
Bank2
SD Controller Register
0_8200 _0100h~ 0_82FF_FFFFh Reserved
0_8300 _0000h~ 0_8300_0001h
Local Bus
Bank3
(CPLD)
Board Status Register
0_8300 _0002h~ 0_8300_0003h Board Control Register
0_8300 _0004h~ 0_8300_0005h Watchdog Timer Control Register
0_8300 _0006h~ 0_8300_0007h Watchdog Timer Status Register
0_8300 _0008h~ 0_8300_0009h Watchdog Timer Clear Register
0_8300 _000Ah~ 0_8300_000Bh Scratch Pad Register
0_8300 _000Ah~ 0_83FF_FFFFh Reserved
0_8400 _0000h~ 0_FF7F_FFFFh Reserved
0_FF80_0000h~ 0_FF87_FFFFh BootROM (FLASH Memory-512kB)
0_FF88_0000h~ 0_FFFF_FFFFh Reserved
1_0000_0000h~ 1_7FFF_FFFFh Main Memory (Max 2GB)
1_8000_0000h~ 1_FFFF_FFFFh Reserved
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8. I2C Bus Device List
Lists the connected I2C devices and corresponding addresses.
This board is equipped with two I2C bus systems.
I2C bus is switched by I2C multiplexer.
I2C multiplexer can be switched to channel 0 and channel 1 and it is set to channel 0 at the startup.
For the setting method of I2C multiplexer, please refer to the data sheet of PCA9544APW (Philips Ltd.).
Channel Device Type Device maker: Model number Address Remarks
I2C Multiplexer PHILIPS:PCA9544APW 1110000b
0 Temperature monitor Analog Device : ADT7461 1001100b Remote temperature:
CPU temperature
Local temperature :
Main board temperature
0 EEPROM ST-Micro : M24C02 equivalency 1010100b
0 Real-time clock EPSON : RTC8564JE 1010001b
0
EEPROM to store SPD
information
IC on the memory module 1010000b SO-RDIMM1
0 Temperature monitor IC on the memory module 0011000b SO-RDIMM1
0
EEPROM to store SPD
information
IC on the memory module 1010011b SO-RDIMM2
0 Temperature monitor IC on the memory module 0011011b SO-RDIMM2
1 Carrier board SMBus ---
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9. Hardware Details
9.1. CPU
The model number of the CPU on this board is as below.
Freescale MPC8572EVTAVNB (1.5GHz)
9.2. Main memory
This board is equipped with two memory outlets.
For the memory module, up to 2GB of DDR2-677 SO-RDIMM can be mounted on one side.
9.3. Status LED
With this board, the status LED is mounted and the board status can be checked.
The status LED on the board can be controller by CPLD connected to the local bus.
Refer to 10.3 chapters board control registers for the details.
9.4. Interrupt
There are total of 3 types of MPC8572 interrupt, they are machine check interrupt (MCP), system management
interrupts (SMI) and the usual interrupt (INT).
INT is usable with this board.
List of interrupts from external device connected to MPC8572 is shown as follows.
Status LED Lighting color Usages
LED1 Green It lights at power supply ON.
LED2 Red When resetting it, it lights.
Tsi108 access point
pin name
Interrupt cause Remarks
IRQ0 Ethernet 1, PHY Device ActiveLo, Level sense
IRQ1 Ethernet 2, PHY Device ActiveLo, Level sense
IRQ2 Ethernet 3, PHY Device ActiveLo, Level sense
IRQ3 CPU module temperatures monitor ActiveLo, Level sense
IRQ4 Carrier board temperatures monitor ActiveLo, Level sense
IRQ5 SMB Alarm ActiveLo, Level sense
IRQ6 Interrupt of CPLD( watchdog timer) ActiveLo, Level sense
IRQ7 Interrupt of the microSD card ActiveLo, Level sense
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