Eurotech Adbc7515 Owner's manual

Brand: Eurotech

Model: Adbc7515

Type: Owner's manual

Freescale DualCore MPC8572 CPU Board

Manual

Adbc7515

Preface

Thank for choosing the Adbc7515. Please read this manual before using the Adbc7515 so that you may obtain the

greatest benefit from using the device.

This manual presents the specifications, functions, and method of use of the Freescale DualCore MPC8572 CPU

Board Adbc7515.

Advanet Inc. has made every effort to carefully inspect each product and has taken great care to package and to ship

the product. In the unlikely event of the product’s failure to operate normally due to problems in shipping or other-

wise, the company will repair or replace the product at its own responsibility.

Contact Advanet at the following address if you have any questions.

Inquiries

Sales Division

Headquarters

616-4 Tanaka, Kita-ku, Okayama 700-0951 Japan

TEL : 086-245-2861 FAX : 086-245-2860

Tokyo Office KDX Kaji-cho 4F , 3-5-2 Kanda Kaji-cho,

Chiyoda-ku, Tokyo 101-0045 Japan

TEL : 03-5294-1731 FAX : 03-5294-1734

INTERNETURL http://www.advanet.co.jp/

1. In order to improve the product, the contents of this document as well as product specifications are subject to change without notice.

2. This document does not give permission to the implementation of patents or other rights held by Advanet or third parties.

3. Reproduction of all or part of this document without Advanet’s permission is prohibited.

2009 Advanet Inc.

Precautions in Use

Please read this manual before using the product in order to insure its safe use.

Do not place the product in a

location where it can fall or be

subject to vibration or impact

because this may cause device

failure.

Protect the device from vibration and impact.

Do not modify the device.

For safety reasons, under no

circumstances should you

modify the device. Advanet will

not repair products that have

been modified.

Protect the product from water

and chemicals.

Contact between the product

and water or chemicals can

result in product failure,

electrocution, or fire.

Protect the product from

foreign material.

Make sure that foreign

material does not get into the

product during use, storage, or

transport because this can

result in product failure.

Take precautions in handling to insure

that you are not injured.

The sharp projections on this

product may cause injury. Take

care in handling this product in

order to avoid injury.

Do not disassemble the product.

In order to maintain

guaranteed product

performance, do not under any

circumstances disassemble

this product.

Keep the product away from radios and TVs.

Do not use the product near

radios, television sets, or other

devices generating strong

magnetic or electrical fields.

This could result in failure or

malfunction.

Keep the product away from

flame, humidity, and direct sunlight.

Do not use or store the product

in any of the following locations

as this could result in product

failure.

Places where there is fire.

Locations high in humidity

or exposed to rain

Locations exposed to direct

sunlight

Dusty or dirty locations

Locations containing

excessive water or

chemical vapors

Precautions in use

Please read this manual before using the product in order to insure its safe use.

Install the product in well-ventilated locations.

Install the product in well-

ventilated locations to

efficiently disperse heat

generated by the product.

Remove the power plug from the receptacle

when not using the product.

Turn off the main switch and

remove the power plug from

the receptacle when not using

the product, or there is the risk

of lightning strike.

Be sure to use the device within rated parameters.

Be sure to use the product

within the ratings specified in

this manual. Failure to do so

may result in malfunction.

Cleaning the product

If the product becomes dirty,

wipe it with a dry soft cloth. A

thinned neutral cleaner may be

used if the product is

particularly dirty. Do not use

benzene, thinners, or other

solvents under any

circumstances.

Be sure to ground the product in order

to prevent electrocution.

Be sure to ground the product

by connecting it to a 3-pole AC

receptacle or by using an AC

receptacle having a grounding

terminal.

Be sure to dispose of the product properly.

Use appropriate methods for

handling industrial wastes

when disposing of this product.

Please contact Advanet for repair of the product.

Please contact your retail

dealer or Advanet when repairs

are necessary.

Make sure that the product is not miswired.

Failure to wire the product

correctly can result in

malfunction or fire. Read this

manual and wire the product

correctly.

Static electricity may cause malfunction.

This product comprises

electronic parts that are highly

susceptible to static electricity.

Static electricity can cause the

product to malfunction. Take

care not to touch any of the

terminals, connectors, ICs, or

other parts with the hands.

When you believe the product to be malfunctioning

Stop using the product if you

believe it is malfunctioning.

Continuing to use a

malfunctioning product can

cause the malfunction to

spread to other products and

can cause short circuits or fire.

Content

1. Prior to Use .............................................................................................................................................................................. 6

1.1 Period and Scope of Warranty .......................................................................................................................................... 6

1.2 Scope of Service ............................................................................................................................................................... 6

2. Outline ...................................................................................................................................................................................... 7

3. Specifications ........................................................................................................................................................................... 8

4. Block Diagram ........................................................................................................................................................................ 10

5. External Dimensions ...............................................................................................................................................................11

6. Interface / On Board Component ............................................................................................................................................ 12

6.1. Name of Each Part ...........................................................................................................................................................12

6.2. Function of Each Part ...................................................................................................................................................... 14

6.2.1. COM Express Conncector ........................................................................................................................................ 14

6.2.2. Memory Socket 1 to 2 for DDR2 SO-RDIMM ........................................................................................................14

6.2.3. microSD Card Socket ............................................................................................................................................... 14

6.2.4. Status LED ................................................................................................................................................................ 14

6.2.5. DIP switch 1 to 7 ...................................................................................................................................................... 15

6.3.Concerning the heat release .............................................................................................................................................. 16

7. Address map as seen from the CPU ........................................................................................................................................ 17

8. I2C Bus Device List ................................................................................................................................................................ 19

9. Hardware Details ..................................................................................................................................................................... 20

9.1. CPU .................................................................................................................................................................................. 20

9.2. Main memory ...................................................................................................................................................................20

9.3. Status LED ....................................................................................................................................................................... 20

9.4. Interrupt ........................................................................................................................................................................... 20

9.5. Ethernet ............................................................................................................................................................................ 21

9.6. microSD Card .................................................................................................................................................................. 21

9.7. GPCM (Local Bus) Device .............................................................................................................................................. 22

10. GPCM Local Bus Bank3 (CPLD) ......................................................................................................................................... 23

10.1. Board Status Register .................................................................................................................................................... 23

10.2. Board Control Register ..................................................................................................................................................24

10.3. Watchdog Timer, Control Register ................................................................................................................................ 25

10.4. Watchdog Timer, Status Register ................................................................................................................................... 26

10.5. Watchdog Timer Clear Register .....................................................................................................................................26

10.6. Scratch Pad Register ...................................................................................................................................................... 27

11. Connectors .............................................................................................................................................................................28

11.1. microSD Card Socket .................................................................................................................................................... 28

11.2. CPU_ICE Connector ...................................................................................................................................................... 28

11.3. COM Express Connector ............................................................................................................................................... 29

12. PCI Express / Serial RapidIO Link Setting .......................................................................................................................... 32

1. Prior to Use

1.1 Period and Scope of Warranty

Delivered products are under warranty for a period of one year after delivery.

During the period of warranty, the vendor will have his own to responsibility replace or repair malfunctioning

parts if the product malfunction is the responsibility of the vendor.

However, this warranty does not apply under the following circumstances:

(1) If the user handles or uses the product in an inappropriate way

(2) If the malfunction is caused by something other than the delivered product

(3) If the delivered product has been modified or repaired by anyone other than the vendor

(4) Due to natural disaster, accident, or other reason not the responsibility of the vendor

In this context, the term “warranty” means solely a warranty of the individual delivered product, and does not

include any compensation for the damage caused by malfunction of the delivered product.

1.2 Scope of Service

The service costs such as the costs of sending technical personnel are not included in the price of the delivered

product. Customers will be charged for the following costs:

(1) Assistance with installation adjustments and test running

(2) Maintenance inspections, adjustments, and repairs

(3) Technical assistance and technical training

2. Outline

The Adbc7515 is a Computer-On-Module (COM) that is equipped with Freescale Dual Core Processor MPC8572.

Utilized in concert with a customer needs-matched carrier board, this PICMG COM.0 R1.0-compatible board allows

you to freely expand a variety of embedded systems.

Dual Core Processor MPC8572 is endowed with the ECC-compatible memory controller, gigabit Ethernet controller,

PCI Express route function, end-point function, and Serial RapidIO interface. The Adbc7515 uses a dual channel that

allows for DDR2-667-capable SDRAM for main memory, and the main memory is expandable up to 4GB.

The Adbc7515 has the following features:

z Basic Module size COM Express-compliant CPU module

z Freescale Dual Core Processor MPC8572(1.5GHz) is supported

z Up to 4GB of DDR2-667-compliant SDRAM can be mounted with dual channel configuration

z Equipped with Serial RapidIO and PCI Express high-speed interconnection interface

z Equipped with 2 channels of DMA controller that enables high-speed transfer from memory to Serial RapidIO

or PCI Express

z Gigabit Ethernet (3ports)

z One microSD card slot

z RoHS compliant

3. Specifications

[Table 3.1] Specifications List

CPU (SoC)

SoC Freescale MPC8572

Processor e500Core,Dual Core

Operating Clock 1.5GHz

Internal bus operating

frequency

600MHz

L1 cache 32kB for Data and 32kB for Instruction

L2 cache 1MB for Data/Instruction

Memory

Boot ROM 512kB FLASH memory

Main memory DDR2-667 SO-RDIMM Dual Channel 2GB×2 ECC support

(1-bit error automatic correction, 2-bit error detection)

EEPROM 2kbits I2C EEPROM

VxWorks boot parameter and MAC address are stored

microSD One socket for microSD

COM Express IO Ethernet 3ports, MPC8572 MAC and VSC8211 used

10/100/1000Base-T Specifications, Auto MDI/MDI-X

Without pulse transformer (prepared by carrier board side)

IEEE1588 Hardware Assistance use is possible

PCI Express Bus PCI Express Rev2.0 Specifications

8 lane

MPC8572 PCI Express I/F used

Can be used as PCIe of x4 when RapidIO is used

SerialRapidIO RapidIO Interconnect Specification,Revision1.2 Specifications

4 lane

RS232C

Serial Port

TIA/EIA-232 Asynchronous,115.2kbps max,2ports

Without RS232C transceiver (prepared by carrier board side)

MPC8572 UART used

I2C 2ports

COM Express

Standard PICMG COM.0 R1.0 COM Express Module Base Spec Rev 1.0

Module size Basic module (125mm × 95mm)

Pin out Type Type5

The Adbc7515 is not compatible with the following pins:

・ PCI Express Graphics, PCI Express Lane0~23

・ SATA0~3 　

・ USB0~7 　

・ LVDS

・ VGA

・ TV-OUT 　

・ AC'97 　

・ Suspend

・ Wake

RAS function Watchdog Timer The board is reset at the time-out

Setting within 15.6ms~1s is available at the time-out

Temperature

Monitoring

Internal temperature of CPU is monitored

Surface temperature of print board is monitored

Operational switch

display

On board 8bits width DIP switch

[Table 3.1] Specifications List

Power supply

specification

Supply Voltage DC12.0V±5%

Battery power supply : DC3.0V (2.4V~3.3V)

supplied from the COM Express connector

Consumption Current max 5A (12V)

Supply Voltage Size 125mm × 95mm × 18mm

(Heat spreader included, but not Hiat sink)

Weight CPU board : 115g

Heat spreader : 75g

Environmental

specification

Operating Temperature

Range

0~55℃

However, the heat radiator or other item is necessary to

prevent the inner temperature of CPU from exceeding 100℃.

Operating Humidity

Range

35~85%RH (non- condensing)

Storage Temperature

Range

-10~70℃

Storage Humidity

Range

Under 90%RH (non- condensing)

Others RoHS Compliant

4. Block Diagram

Figure 4.1 shows a block diagram of the Adbc7515.

[Figure 4.1] Block Diagram

Freescale

MPC8572

1.5GHz

GbE

PHY

COM

Express

DDR2-667(2GB)

with ECC

microSD

socket

Temp.Monitor

RTC

GbE

MEM

eLBC

PCIePCIe(x8)

PCIe/sRIOsRIO

UART

UART1

UART2

10/100/1000

Ethernet

GMII

GbE

PHY

GbE

10/100/1000

Ethernet

GMII

GbE

PHY

GbE

10/100/1000

Ethernet

GMII

I2C I2C

SMBus I2C

I2C

multiplexer

Boot ROM

PLD

EEPROM

TE4301

Clock Generator

Power Regulators

Reset Generators

5. External Dimensions

Figure 5.1 shows the external dimensions of the Adbc7515.

[Figure 5.1] External Dimensions

10 10

40 40

8 13

125

2-M2.5

6. Interface / On Board Component

6.1. Name of Each Part

The part layout of this board is shown in Figures 6.1.1 and 6.1.2.

[Figure 6.1.1] Part side

[Figure 6.1.2] Solder side

LED1 LED2

CN6

CN1

DSW1

DSW3

DSW5

DSW7

DSW6

DSW4

DSW2

CN7

CN2

 CN1 .............................. COM Express connector

 CN2 .............................. Memory socket 1 for DDR2 SO-RDIMM (SO-RDIMM1)

 CN7 .............................. Memory socket 2 for DDR2 SO-RDIMM (SO-RDIMM2)

 CN6 .............................. microSD card socket

 LED1 ............................ Status LED (Green)

 LED2 ............................ Status LED (Red)

 DSW1........................... DIP switch 1

 DSW2........................... DIP switch 2

 DSW3........................... DIP switch 3

 DSW4........................... DIP switch 4

 DSW5........................... DIP switch 5

 DSW6........................... DIP switch 6

 DSW7........................... DIP switch 7

6.2. Function of Each Part

6.2.1. COM Express Conncector

COM Express connector are stacking connectors to establish connection with the carrier board. The Adbc7515

incorporates TycoElectronics AMP 3-1827231-6 connectors. Tyco Electronics AMP 3-1827233-6 connectors

or equivalent are tobe used for stacking connectors that are mounted on the carrier board, if stacked connec-

tors stand 5 mm high. If they stand 8 mm high, Tyco Electronics AMP 3-5353652-6 connectors or equivalent

must be used.

See chapter 11.3 for connector pin assignment.

 Mounting on the carrier board

Use the following procedure to mount the Adbc7515 on the carrier board.

[Figure 6.2.1] Mounting on the carrier board

(1) Replace the stacking spacer with the supplied 5mm spacer if stacked connectors stand 5mm high. There

is no necessity to replace the spacer if they stand 8mm high.

(2) Align the Adbc7515 with the 440-pin connector pair on the carrier board, and push the Adbc7515 into the

carrier board. Place a proper supporter behind the connectors mounted on the carrier board to keep the

carrier board from becoming warped, and insure a good fit between the connectors.

(3) Tighten the supplied M2.5 × 5mm SEMS screws from behind the carrier board.

6.2.2. Memory Socket 1 to 2 for DDR2 SO-RDIMM

This board is equipped with two memory sockets for SO-RDIMM of DDR2.

With the sockets, DDR2-667-compliant SO-RDIMM memory module can be mounted.

ECC is supported.Up to 4GB (mounted by 2GB) can be mounted.

The operation by mounting only one module is also available.

6.2.3. microSD Card Socket

To this board, there is a socket to implement a microSD card.

The hot plug is not available. Refer to Chapter 9.7 for the details.

6.2.4. Status LED

To this board, there is two status LED.

Lighting color is red and green.

Refer to Chapter 9.3 for the details.

440pin connector pair

Stacking spacer

(5points)

Adbc7515

Carrier board

6.2.5. DIP switch 1 to 7

With DIP switch on the board, the following setting is possible.

Reference Bit Setting Item

Initial

Value

Remarks

DSW1

CCB/SYSCLK PLL Ratio 010b

CCB CLOCK : SYSCLK

6 : 1

※SYSCLK is 100MHz

e500 CORE0 PLL Ratio 101b

e500 CORE0 : CCB CLOCK

2.5 : 1

e500 CORE1 PLL Ratio 101b

e500 CORE1 : CCB CLOCK

2.5 : 1

DSW2

DDR PLL Ratio 111b Synchronous mode3

Boot ROM Location 1101b Local bus GPCM - 8bit ROM

DSW3

Host/Agent Configuration 111b

PCI Express1~3 : host

Serial RapidIO : host

I/O Port Selection 1011b

Serial RapidIO (x4)(2.5GHz)

PCI Express1 (x4)(2.5GHz)

CPU Boot Configuration 11b no external master

DSW4

Boot Sequencer Configuration 11b no I2C ROM

4 DDR SDRAM Type 0b DDR2,1.8V

5 FEC Configuration 1b parallel interface mode

6 eTSEC1 SGMII Mode 1b parallel interface mode

7 eTSEC2 SGMII Mode 1b parallel interface mode

8 eTSEC3 SGMII Mode 1b parallel interface mode

DSW5

1 eTSEC4 SGMII Mode 1b parallel interface mode

2 SGMII SerDes 1b 100MHz(not used)

3 eTSEC1 and eTSEC2 Width 1b parallel protocol

4eTSEC3 and eTSEC4 Width1b

eTSEC1 Protocol 10b GMII protocol

eTSEC2 Protocol 10b GMII protocol

6.3.Concerning the heat release

This board is equipped with a heat spreader.

The heat spreader is equipped with two screw holes of M2.5.

These holes are prepared for mounting the heatsink.

Select the heatsink with 1.4°C/W or less of heat resistance under the use environment.

Reference Bit Setting Item

Initial

Value

Remarks

DSW6

eTSEC3 Protocol 10b GMII protocol

eTSEC4 Protocol 11b RTBI protocol(not used)

RapidIO Device ID 000b6

8 RapidIO System Size 1b 256 devices

DSW7

Memory Debug Configuration 11b debug information(not used)

3 DDR Debug Configuration 1b debug information(not used)

4 eLBC FCM ECC Configuration 1b DATA Error Check enable

5 SerDes1 Enable 0b disable

6 SGMII Serdes Enable 0b disable

SD1_REF_CLK_SEL 01b

00b : 25MHz, 01b : 100MHz,

10b : 125MHz, 11b : 200MHz

7. Address map as seen from the CPU

Address map as seen from the CPU is shown.

Address Device Remarks

0_0000_0000h ~ 0_7FFF_FFFFh Main Memory (Max 2GB)

0_8000_0000h ~ 0_8003_FFFFh

CCSRBAR

(internal

MPC8572

registers)

1MB

General Utilities

Local Access

ECM

DDR Ctrl1

I2C

DUART

Local BUS

DDR Ctrl2

Reserved

PCI Express3

PCI Express2

PCI Express1

Reserved

DMA2

Reserved

GPIO

PME Gen Ctrl

PME Chan1

PME Chan2

PME Chan3

PME Chan4

TLU2

Reserved

L2 Cache

DMA1

Reserved

eTSEC1

eTSEC2

eTSEC3

eTSEC4

FEC

Reserved

TLU1

SEC

0_8004_0000h ~ 0_8007_FFFFh PIC

Reserved

Global Cfg

Timers

Reserved

Timers

Reserved

External IRQs

Internal IRQs

Processor

0_8008_0000h ~ 0_800B_FFFFh Reserved

0_800C_0000h ~ 0_800D_FFFFh RapidIO

RapidIO Arch

RapidIO Extended Features

RapidIO Impl

RapidIO Messaging

Reserved

0_800 E _0000h ~ 0_800F_FFFFh

Device-Specific

Utilities

Global Utilities

Perf. Monitor

Watchpoint/Debug

Reserved

Address Device Remarks

0_8010 _0000h ~ 0_80FF_FFFFh Reserved

0_8100 _0000h~ 0_817F_FFFFh

Local Bus

Bank1

SRAM (512kB)

0_8180 _0000h~ 0_81FF_FFFFh Reserved

0_8200 _0000h~ 0_8200_00FFh

Local Bus

Bank2

SD Controller Register

0_8200 _0100h~ 0_82FF_FFFFh Reserved

0_8300 _0000h~ 0_8300_0001h

Local Bus

Bank3

(CPLD)

Board Status Register

0_8300 _0002h~ 0_8300_0003h Board Control Register

0_8300 _0004h~ 0_8300_0005h Watchdog Timer Control Register

0_8300 _0006h~ 0_8300_0007h Watchdog Timer Status Register

0_8300 _0008h~ 0_8300_0009h Watchdog Timer Clear Register

0_8300 _000Ah~ 0_8300_000Bh Scratch Pad Register

0_8300 _000Ah~ 0_83FF_FFFFh Reserved

0_8400 _0000h~ 0_FF7F_FFFFh Reserved

0_FF80_0000h~ 0_FF87_FFFFh BootROM (FLASH Memory-512kB)

0_FF88_0000h~ 0_FFFF_FFFFh Reserved

1_0000_0000h~ 1_7FFF_FFFFh Main Memory (Max 2GB)

1_8000_0000h~ 1_FFFF_FFFFh Reserved

8. I2C Bus Device List

Lists the connected I2C devices and corresponding addresses.

This board is equipped with two I2C bus systems.

I2C bus is switched by I2C multiplexer.

I2C multiplexer can be switched to channel 0 and channel 1 and it is set to channel 0 at the startup.

For the setting method of I2C multiplexer, please refer to the data sheet of PCA9544APW (Philips Ltd.).

Channel Device Type Device maker: Model number Address Remarks

I2C Multiplexer PHILIPS:PCA9544APW 1110000b

0 Temperature monitor Analog Device : ADT7461 1001100b Remote temperature:

CPU temperature

Local temperature :

Main board temperature

0 EEPROM ST-Micro : M24C02 equivalency 1010100b

0 Real-time clock EPSON : RTC8564JE 1010001b

EEPROM to store SPD

information

IC on the memory module 1010000b SO-RDIMM1

0 Temperature monitor IC on the memory module 0011000b SO-RDIMM1

EEPROM to store SPD

information

IC on the memory module 1010011b SO-RDIMM2

0 Temperature monitor IC on the memory module 0011011b SO-RDIMM2

1 Carrier board SMBus ---

9. Hardware Details

9.1. CPU

The model number of the CPU on this board is as below.

Freescale MPC8572EVTAVNB (1.5GHz)

9.2. Main memory

This board is equipped with two memory outlets.

For the memory module, up to 2GB of DDR2-677 SO-RDIMM can be mounted on one side.

9.3. Status LED

With this board, the status LED is mounted and the board status can be checked.

The status LED on the board can be controller by CPLD connected to the local bus.

Refer to 10.3 chapters board control registers for the details.

9.4. Interrupt

There are total of 3 types of MPC8572 interrupt, they are machine check interrupt (MCP), system management

interrupts (SMI) and the usual interrupt (INT).

INT is usable with this board.

List of interrupts from external device connected to MPC8572 is shown as follows.

Status LED Lighting color Usages

LED1 Green It lights at power supply ON.

LED2 Red When resetting it, it lights.

Tsi108 access point

pin name

Interrupt cause Remarks

IRQ0 Ethernet 1, PHY Device ActiveLo, Level sense

IRQ1 Ethernet 2, PHY Device ActiveLo, Level sense

IRQ2 Ethernet 3, PHY Device ActiveLo, Level sense

IRQ3 CPU module temperatures monitor ActiveLo, Level sense

IRQ4 Carrier board temperatures monitor ActiveLo, Level sense

IRQ5 SMB Alarm ActiveLo, Level sense

IRQ6 Interrupt of CPLD( watchdog timer) ActiveLo, Level sense

IRQ7 Interrupt of the microSD card ActiveLo, Level sense

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Eurotech Adbc7515 Owner's manual

Eurotech Adbc7515 Owner's manual

Eurotech Adbc7515 Owner's manual

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