UM10237
LPC24XX User manual
Rev. 04 — 26 August 2009 User manual
Document information
Info Content
Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478,
ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0,
Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,
Microcontroller
Abstract LPC24XX User manual release
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 2 of 792
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP Semiconductors
UM10237
LPC24XX User manual
Revision history
Rev Date Description
04 20090826 LPC24XX user manual release.
Modifications:
Memory size for LPC2458 external SRAM memory corrected in Table 2–14.
Deep power-down mode functionality added (see Section 4–3.4 “Power control and
Section 26–6.6 “Alarm output).
Register containing device revision added (implemented starting with revision C, see
Section 30–9.11
).
XTAL1 input selection and PCB layout guidelines added (see Section 4–2.2).
Editorial updates throughout the user manual.
ISP1302 replaces ISP1301 in Section 15–6.
UART fractional baud rate generator disabled in auto baud mode (see Section 16–4.10
and Section 17–4.14).
03 20090115 LPC24XX user manual release.
Modifications:
Description of AHB1 and AHB2 configuration registers updated.
02 20081219 LPC24XX user manual release.
Modifications:
Added parts LPC2420.
Editorial updates.
AHB1 and AHB2 configuration registers added.
01 20080718 Initial LPC24XX user manual release. Replaces all draft versions UM10237_1.00 to
UM10237_1.05.
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 3 of 792
1. Introduction
NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bit
ARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG and
embedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speed
Flash memory. This Flash memory includes a special 128-bit wide memory interface and
accelerator architecture that enables the CPU to execute sequential instructions from
Flash memory at the maximum 72 MHz system clock rate. This feature is available only
on the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both
32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets means
Engineers can choose to optimize their application for either performance or code size at
the sub-routine level. When the core executes instructions in Thumb state it can reduce
code size by more than 30 % with only a small loss in performance while executing
instructions in ARM state maximizes core performance.
The LPC2400 microcontrollers are ideal for multi-purpose communication applications. It
incorporates a 10/100 Ethernet Media Access Controller (MAC), a USB full speed
device/host/OTG controller with 4 kB of endpoint RAM, four UARTs, two Controller Area
Network (CAN) channels, an SPI interface, two Synchronous Serial Ports (SSP), three I
2
C
interfaces, and an I
2
S interface. Supporting this collection of serial communications
interfaces are the following feature components; an on-chip 4 MHz internal precision
oscillator, 98 kB of total RAM consisting of 64 kB of local SRAM, 16 kB SRAM for
Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of battery powered SRAM, and an
External Memory Controller (EMC). These features make this device optimally suited for
communication gateways and protocol converters. Complementing the many serial
communication controllers, versatile clocking capabilities, and memory features are
various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, two PWM units, four external
interrupt pins, and up to 160 fast GPIO lines. The LPC2400 connect 64 of the GPIO pins
to the hardware based Vector Interrupt Controller (VIC) that means these external inputs
can generate edge-triggered, interrupts. All of these features make the LPC2400
particularly suitable for industrial control and medical systems.
2. How to read this manual
Important: The term “LPC24XX“ in this user manual will be used as a generic name for all
LPC2400 parts. It covers the following parts: LPC2458, LPC2420, LPC2460, LPC2468,
LPC2470, and LPC2478.
For information about individual parts refer to Table 1–1
and Table 1–2.
UM10237
Chapter 1: LPC24XX Introductory information
Rev. 04 — 26 August 2009 User manual
Table 1. LPC24XX overview
LPC2458 LPC2420/60 LPC2468 LPC2470 LPC2478
Features Section 1–3
Section 1–3 Section 1–3 Section 1–3 Section 1–3
Ordering options Section 1–5.1 Section 1–5.2 Section 1–5.3 Section 1–5.4 Section 1–5.5
Block diagrams Section 1–9 Section 1–10 Section 1–11 Section 1–12 Section 1–13
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 4 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
Most features and peripherals are identical for all LPC2400 parts. All differences are listed
in Table 1–2
.
3. LPC2400 features
ARM7TDMI-S processor, running at up to 72 MHz.
98 kB on-chip SRAM includes:
64 kB of SRAM on the ARM local bus for high performance CPU access.
16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
16 kB SRAM for general purpose DMA use also accessible by the USB.
2 kB SRAM data storage powered from the RTC power domain.
LPC2458/68/78 only: 512 kB on-chip Flash program memory with In-System
Programming (ISP) and In-Application Programming (IAP) capabilities. Flash program
memory is on the ARM local bus for high performance CPU access.
Dual Advanced High-performance Bus (AHB) system allows memory access by
multiple resources and simultaneous program execution with no contention.
EMC provides support for asynchronous static memory devices such as RAM, ROM
and Flash, as well as dynamic memories such as Single Data Rate SDRAM.
Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.
General Purpose AHB DMA controller (GPDMA) that can be used with the SSP, I
2
S,
and SD/MM interface as well as for memory-to-memory transfers.
LPC2470/78 only: LCD controller, supporting both Super-Twisted Nematic (STN) and
Thin-Film Transistors (TFT) displays.
Dedicated DMA controller.
Selectable display resolution (up to 1024 × 768 pixels).
Supports up to 24-bit true-color mode.
Serial Interfaces:
Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB bus.
USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and
associated DMA controller.
Four UARTs with fractional baud rate generation, one with modem control I/O, one
with IrDA support, all with FIFO.
CAN controller with two channels.
Table 2. Differences between LPC2400 parts
Pins/
High-speed
GPIO pins
Flash EMC LCD
LPC2458 180/136 512 kB 16-bit no
LPC2460/20 208/160 flashless 32-bit no
LPC2468 208/160 512 kB 32-bit no
LPC2470 208/160 flashless 32-bit yes
LPC2478 208/160 512 kB 32-bit yes
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 5 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
SPI controller.
Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate
for the SPI port, sharing its interrupt. SSPs can be used with the GPDMA
controller.
Three I
2
C-bus interfaces (one with open-drain and two with standard port pins).
I
2
S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
Other peripherals:
SD/MMC memory card interface.
160 general purpose I/O pins with configurable pull-up/down resistors.
10-bit ADC with input multiplexing among 8 pins.
10-bit DAC.
Four general purpose timers/counters with 8 capture inputs and 10 compare
outputs. Each timer block has an external count input.
Two PWM/timer blocks with support for three-phase motor control. Each PWM has
an external count inputs.
Real-Time Clock (RTC) with separate power domain, clock source can be the RTC
oscillator or the APB clock.
2 kB SRAM powered from the RTC power pin, allowing data to be stored when the
rest of the chip is powered off.
WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
Standard ARM test/debug interface for compatibility with existing tools.
Emulation trace module supports real-time trace.
Single 3.3 V power supply (3.0 V to 3.6 V).
Four reduced power modes: idle, sleep, power-down, and deep power-down.
Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0
and PORT2 can be used as edge sensitive interrupt sources.
Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt, CAN bus activity, PORT0/2 pin interrupt).
Two independent power domains allow fine tuning of power consumption based on
needed features.
Each peripheral has its own clock divider for further power saving. These dividers help
reducing active power by 20 - 30 %.
Brownout detect with separate thresholds for interrupt and forced reset.
On-chip power-on reset.
On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz.
4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
the system clock. When used as the CPU clock, does not allow CAN and USB to run.
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC
oscillator, or the RTC oscillator.
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User manual Rev. 04 — 26 August 2009 6 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
Boundary scan for simplified board testing.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
4. Applications
Industrial control
Medical systems
Protocol converter
Communications
5. Ordering options
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Table 3. LPC2458 ordering information
Type number Package
Name Description Version
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Table 4. LPC2458 ordering options
Type number Flash
(kB)
SRAM (kB) External
bus
Ethernet USB
OTG/
OHC/
DEV
+4kB
FIFO
CAN channels
SD/
MMC
GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2458FET180 512 64 16 16 2 98 16-bit MII/
RMII
yes 2 yes yes 8 1 40 °C to
+85 °C
Table 5. LPC2420/60 ordering information
Type number Package
Name Description Version
LPC2420FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2460FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 7 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Table 6. LPC2420/60 ordering options
Type number Flash
(kB)
SRAM (kB) External
bus
Ethernet USB
OTG/
OHCI/
DEV
+4kB
FIFO
CAN channels
SD/
MMC
GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2420FBD208 N/A 64 - 16 2 82 Full 32-bit - yes - yes yes 8 1 40 °C to
+85 °C
LPC2460FBD208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 °C to
+85 °C
LPC2460FET208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 °C to
+85 °C
Table 7. LPC2468 ordering information
Type number Package
Name Description Version
LPC2468FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Table 8. LPC2468 ordering options
Type number Flash
(kB)
SRAM (kB) External
bus
Ethernet USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
CAN channels
SD/
MMC
GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2468FBD208 512 64 16 16 2 98 Full 32-bit MII/
RMII
yes 2 yes yes 8 1 40 °C to
+85 °C
LPC2468FET208 512 64 16 16 2 98 Full 32-bit MII/
RMII
yes 2 yes yes 8 1 40 °C to
+85 °C
Table 9. LPC2470 ordering information
Type number Package
Name Description Version
LPC2470FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
0.7 mm
SOT950-1
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User manual Rev. 04 — 26 August 2009 8 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
5.5 LPC2478 ordering options
6. Architectural overview
The LPC2400 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2400 implements two AHB buses in order to allow the Ethernet block to operate
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
Table 10. LPC2470 ordering options
Type number Flash
(kB)
SRAM (kB) External
bus
Ethernet USB
OTG/
OHC/
Device
+ 4 kB
FIFO
CAN channels
SD/
MMC
GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2470FBD208 N/A 64 16 16 2 98 Full
32-bit
MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
LPC2470FET208 N/A 64 16 16 2 98 Full
32-bit
MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
Table 11. LPC2478 ordering information
Type number Package
Name Description Version
LPC2478FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC2478FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
0.7 mm
SOT950-1
Table 12. LPC2478 ordering options
Type number Flash
(kB)
SRAM (kB) External
bus
Ethernet USB
OTG/
OHC/
Device
+ 4 kB
FIFO
CAN channels
SD/
MMC
GP
DMA
ADC channels
DAC channels
Temp
range
Local bus
Ethernet buffer
GP/USB
RTC
Total
LPC2478FBD208 512 64 16 16 2 98 Full
32-bit
MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
LPC2478FET208 512 64 16 16 2 98 Full
32-bit
MII/RMII yes 2 yes yes 8 1 40 °C
to
+85 °C
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User manual Rev. 04 — 26 August 2009 9 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB
ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the
AHB address space. Lower speed peripheral functions are connected to the APB bus.
The AHB to APB bridge interfaces the APB bus to the AHB bus. APB peripherals are also
allocated a 2 MB range of addresses, beginning at the 3.5 GB address point. Each APB
peripheral is allocated a 16 kB address space within the APB address space.
The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers
high performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed complex
instruction set computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
the standard 32-bit ARM set
a 16-bit Thumb set
The Thumb set’s 16-bit instruction length allows it to approach higher density compared to
standard ARM code while retaining most of the ARM’s performance.
7. On-chip flash programming memory (LPC2458/68/78)
The LPC2400 incorporates 512 kB Flash memory system. This memory may be used for
both code and data storage. Programming of the Flash memory may be accomplished in
several ways. It may be programmed In System via the serial port (UART0). The
application program may also erase and/or program the Flash while the application is
running, allowing a great degree of flexibility for data storage field and firmware upgrades.
The Flash memory is 128 bits wide and includes pre-fetching and buffering techniques to
allow it to operate at speeds of 72 MHz.
The LPC2400 provides a minimum of 100000 write/erase cycles and 20 years of data
retention.
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User manual Rev. 04 — 26 August 2009 10 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
8. On-chip SRAM
The LPC2400 includes a SRAM memory of 64 kB reserved for the ARM processor
exclusive use. This RAM may be used for code and/or data storage and may be accessed
as 8 bits, 16 bits, and 32 bits.
A 16 kB SRAM block serving as a buffer for the Ethernet controller and a 16 kB SRAM
associated with the second AHB bus can be used both for data and code storage, too.
Remaining SRAM such as a 4 kB USB FIFO and a 2 kB RTC SRAM can be used for data
storage only. The RTC SRAM is battery powered and retains the content in the absence of
the main power supply.
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User manual Rev. 04 — 26 August 2009 11 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
9. LPC2458 block diagram
Fig 1. LPC2458 block diagram
power domain 2
LPC2458
A[19:0]
D[15:0]
EXTERNAL
MEMORY
CONTROLLER
ALARM
002aad093
PWM0, PWM1
ARM7TDMI-S
PLL
EINT3 to EINT0
FLASH
P3, P4
P0, P1, P2,
LEGACY GPI/O
64 PINS TOTAL
P0, P1
SCK, SCK0
MOSI, MOSI0
SSEL, SSEL0
SCK1
MOSI1
MISO1
SSEL1
SCL0, SCL1, SCL2
I2SRX_CLK
I2STX_CLK
I2SRX_WS
I2STX_WS
8 × AD0
RTCX1
RTCX2
MCICLK, MCIPWR
RXD0, RXD2, RXD3
TXD1
RXD1
RD1, RD2
TD1, TD2
CAN1, CAN2
port 1
XTAL1
TCK TDO
EXTIN0
XTAL2
RESET
TRST
TDITMS
HIGH-SPEED
GPI/O
136 PINS
TOTAL
port 2
64 kB
SRAM
512 kB
FLASH
INTERNAL
CONTROLLERS
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
trace signals
AHB
BRIDGE
AHB
BRIDGE
ETHERNET
MAC WITH
DMA
16 kB
SRAM
MASTER
PORT
AHB TO
AHB BRIDGE
SLAVE
PORT
system
clock
SYSTEM
FUNCTIONS
INTERNAL RC
OSCILLATOR
V
DDA
V
DD(3V3)
V
DD(DCDC)(3V3)
VREF
V
SSA
, V
SSIO,
V
SSCORE
VIC
16 kB
SRAM
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
GP DMA
CONTROLLER
I
2
S INTERFACE
SPI, SSP0 INTERFACE
I2SRX_SDA
I2STX_SDA
MISO, MISO0
SSP1 INTERFACE
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
TXD0, TXD2, TXD3
UART0, UART2, UART3
UART1
DTR1, RTS1
DSR1, CTS1, DCD1,
RI1
I
2
C0, I
2
C1, I
2
C2
SDA0, SDA1, SDA2
EXTERNAL INTERRUPTS
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
A/D CONVERTER
D/A CONVERTER
2 kB BATTERY RAM
RTC
OSCILLATOR
REAL-
TIME
CLOCK
WATCHDOG TIMER
SYSTEM CONTROL
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2,
2 × MAT3,
2 × MAT1/MAT0
6 × PWM0, PWM1
1 × PCAP0,
2 × PCAP1
AOUT
VBAT
AHB TO
APB BRIDGE
SRAM
MII/RMII
V
BUS
DBGEN
P0, P2
AHB2
AHB1
control lines
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User manual Rev. 04 — 26 August 2009 12 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
10. LPC2420/60 block diagram
(1) LPC2460 only.
Fig 2. LPC2460 block diagram
power domain 2
LPC2420/2460
A[23:0]
D[31:0]
EXTERNAL
MEMORY
CONTROLLER
ALARM
002aad313
PWM0, PWM1
ARM7TDMI-S
PLL
EINT3 to EINT0
P3, P4
P0, P1, P2,
LEGACY GPI/O
64 PINS TOTAL
P0, P1
SCK, SCK0
MOSI, MOSI0
SSEL, SSEL0
SCK1
MOSI1
MISO1
SSEL1
SCL0, SCL1, SCL2
I2SRX_CLK
I2STX_CLK
I2SRX_WS
I2STX_WS
8 × AD0
RTCX1
RTCX2
MCICLK, MCIPWR
RXD0, RXD2, RXD3
TXD1
RXD1
RD1, RD2
TD1, TD2
CAN1
(1)
, CAN2
(1)
port1
XTAL1
TCK TDO
EXTIN0
XTAL2
RESET
TRST
TDITMS
HIGH-SPEED
GPI/O
160 PINS
TOTAL
port2
64 kB
SRAM
INTERNAL
SRAM
CONTROLLER
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
trace signals
AHB
BRIDGE
AHB
BRIDGE
ETHERNET
MAC WITH
DMA
(1)
16 kB
SRAM
(1)
MASTER
PORT
AHB TO
AHB BRIDGE
SLAVE
PORT
system
clock
SYSTEM
FUNCTIONS
INTERNAL RC
OSCILLATOR
V
DDA
V
DD(3V3)
V
DD(DCDC)(3V3)
VREF
V
SSA
, V
SSCORE
, V
SSIO
VIC
16 kB
SRAM
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
GP DMA
CONTROLLER
I
2
S INTERFACE
SPI, SSP0 INTERFACE
I2SRX_SDA
I2STX_SDA
MISO, MISO0
SSP1 INTERFACE
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
TXD0, TXD2, TXD3
UART0, UART2, UART3
UART1
DTR1, RTS1
DSR1, CTS1, DCD1,
RI1
I
2
C0, I
2
C1, I
2
C2
SDA0, SDA1, SDA2
EXTERNAL INTERRUPTS
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
A/D CONVERTER
D/A CONVERTER
2 kB BATTERY RAM
RTC
OSCILLATOR
REAL-
TIME
CLOCK
WATCHDOG TIMER
SYSTEM CONTROL
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2/MAT3,
2 × MAT0,
3 × MAT1
6 × PWM0/PWM1
1 × PCAP0,
2 × PCAP1
AOUT
VBAT
AHB TO
APB BRIDGE
MII/RMII
V
BUS
DBGEN
P0, P2
AHB2
AHB1
control lines
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 13 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
11. LPC2468 block diagram
Fig 3. LPC2468 block diagram
power domain 2
LPC2468
A[23:0]
D[31:0]
EXTERNAL
MEMORY
CONTROLLER
ALARM
002aac721
PWM0, PWM1
ARM7TDMI-S
PLL
EINT3 to EINT0
FLASH
P3, P4
P0, P1, P2,
LEGACY GPI/O
64 PINS TOTAL
P0, P1
SCK, SCK0
MOSI, MOSI0
SSEL, SSEL0
SCK1
MOSI1
MISO1
SSEL1
SCL0, SCL1, SCL2
I2SRX_CLK
I2STX_CLK
I2SRX_WS
I2STX_WS
8 × AD0
RTCX1
RTCX2
MCICLK, MCIPWR
RXD0, RXD2, RXD3
TXD1
RXD1
RD1, RD2
TD1, TD2
CAN1, CAN2
port1
XTAL1
TCK TDO
EXTIN0
XTAL2
RESET
TRST
TDITMS
HIGH-SPEED
GPI/O
160 PINS
TOTAL
port2
64 kB
SRAM
512 kB
FLASH
INTERNAL
CONTROLLERS
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
trace signals
AHB
BRIDGE
AHB
BRIDGE
ETHERNET
MAC WITH
DMA
16 kB
SRAM
MASTER
PORT
AHB TO
AHB BRIDGE
SLAVE
PORT
system
clock
SYSTEM
FUNCTIONS
INTERNAL RC
OSCILLATOR
V
DDA
V
DD(3V3)
V
DD(DCDC)(3V3)
VREF
V
SSA
, V
SSIO,
V
SSCORE
VIC
16 kB
SRAM
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
GP DMA
CONTROLLER
I
2
S INTERFACE
SPI, SSP0 INTERFACE
I2SRX_SDA
I2STX_SDA
MISO, MISO0
SSP1 INTERFACE
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
TXD0, TXD2, TXD3
UART0, UART2, UART3
UART1
DTR1, RTS1
DSR1, CTS1, DCD1,
RI1
I
2
C0, I
2
C1, I
2
C2
SDA0, SDA1, SDA2
EXTERNAL INTERRUPTS
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
A/D CONVERTER
D/A CONVERTER
2 kB BATTERY RAM
RTC
OSCILLATOR
REAL-
TIME
CLOCK
WATCHDOG TIMER
SYSTEM CONTROL
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2/MAT3,
2 × MAT0,
3 × MAT1
6 × PWM0/PWM1
1 × PCAP0,
2 × PCAP1
AOUT
VBAT
AHB TO
APB BRIDGE
SRAM
MII/RMII
V
BUS
DBGEN
P0, P2
AHB2
AHB1
control lines
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 14 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
12. LPC2470 block diagram
Fig 4. LPC2470 block diagram
power domain 2
LPC2470
A[23:0]
D[31:0]
EXTERNAL
MEMORY
CONTROLLER
ALARM
002aad317
PWM0, PWM1
ARM7TDMI-S
PLL
EINT3 to EINT0
P3, P4
P0, P1, P2,
LEGACY GPI/O
64 PINS TOTAL
P0, P1
SCK, SCK0
3 × I2STX
3 × I2SRX
8 × LCD control
LCDVD[23:0]
LCDCLKIN
MOSI, MOSI0
SSEL, SSEL0
SCK1
MOSI1
MISO1
SSEL1
SCL0, SCL1, SCL2
8 × AD0
RTCX1
RTCX2
MCICLK, MCIPWR
RXD0, RXD2, RXD3
RD1, RD2
TD1, TD2
CAN1, CAN2
port1
XTAL1
TCK TDO
EXTIN0
XTAL2
RESET
TRST
TDITMS
HIGH-SPEED
GPI/O
160 PINS
TOTAL
port2
64 kB
SRAM
INTERNAL
SRAM
CONTROLLER
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
trace signals
AHB
BRIDGE
AHB
BRIDGE
ETHERNET
MAC WITH
DMA
16 kB
SRAM
MASTER
PORT
AHB TO
AHB BRIDGE
SLAVE
PORT
system
clock
SYSTEM
FUNCTIONS
INTERNAL RC
OSCILLATOR
V
DDA
V
DD(3V3)
V
DD(DCDC)(3V3)
VREF
VIC
16 kB
SRAM
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
GP DMA
CONTROLLER
LCD INTERFACE
WITH DMA
I
2
S INTERFACE
SPI, SSP0 INTERFACE
MISO, MISO0
SSP1 INTERFACE
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
TXD0, TXD2, TXD3
UART0, UART2, UART3
UART1
TXD1, DTR1, RTS1
RXD1, DSR1, CTS1,
DCD1, RI1
I
2
C0, I
2
C1, I
2
C2
SDA0, SDA1, SDA2
EXTERNAL INTERRUPTS
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
A/D CONVERTER
D/A CONVERTER
2 kB BATTERY RAM
RTC
OSCILLATOR
REAL-
TIME
CLOCK
WATCHDOG TIMER
SYSTEM CONTROL
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2/MAT3,
2 × MAT0,
3 × MAT1
6 × PWM0/PWM1
1 × PCAP0,
2 × PCAP1
AOUT
VBAT
AHB TO
APB BRIDGE
MII/RMII
V
BUS
DBGEN
P0, P2
AHB2
AHB1
control lines
V
SSA
, V
SSCORE
, V
SSIO
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 15 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
13. LPC2478 block diagram
Fig 5. LPC2478 block diagram
power domain 2
LPC2478
A[23:0]
D[31:0]
EXTERNAL
MEMORY
CONTROLLER
ALARM
002aac805
PWM0, PWM1
ARM7TDMI-S
PLL
EINT3 to EINT0
FLASH
P3, P4
P0, P1, P2,
LEGACY GPI/O
64 PINS TOTAL
P0, P1
SCK0, SCK
3 × I2STX
3 × I2SRX
8 × LCD control
LCDVD[23:0]
LCDCLKIN
MOSI0, MOSI
SSEL0, SSEL
SCK1
MOSI1
MISO1
SSEL1
SCL0, SCL1, SCL2
8 × AD0
RTCX1
RTCX2
MCICLK, MCIPWR
RXD0, RXD2, RXD3
RD1, RD2
TD1, TD2
CAN1, CAN2
port1
XTAL1
TCK TDO
EXTIN0
XTAL2
RESET
TRST
TDITMS
HIGH-SPEED
GPI/O
160 PINS
TOTAL
port2
64 kB
SRAM
512 kB
FLASH
INTERNAL
CONTROLLERS
TEST/DEBUG
INTERFACE
EMULATION
TRACE MODULE
trace signals
AHB
BRIDGE
AHB
BRIDGE
ETHERNET
MAC WITH
DMA
16 kB
SRAM
MASTER
PORT
AHB TO
AHB BRIDGE
SLAVE
PORT
system
clock
SYSTEM
FUNCTIONS
INTERNAL RC
OSCILLATOR
V
DDA
V
DD(3V3)
V
DD(DCDC)(3V3)
VREF
V
SSA
, V
SSIO,
V
SSCORE
VIC
16 kB
SRAM
USB DEVICE/
HOST/OTG WITH
4 kB RAM AND DMA
GP DMA
CONTROLLER
LCD INTERFACE
WITH DMA
I
2
S INTERFACE
SSP0/SPI INTERFACE
MISO0, MISO
SSP1 INTERFACE
SD/MMC CARD
INTERFACE
MCICMD,
MCIDAT[3:0]
TXD0, TXD2, TXD3
UART0, UART2, UART3
UART1
TXD1, DTR1, RTS1
RXD1, DSR1, CTS1,
DCD1, RI1
I
2
C0, I
2
C1, I
2
C2
SDA0, SDA1, SDA2
EXTERNAL INTERRUPTS
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
A/D CONVERTER
D/A CONVERTER
2 kB BATTERY RAM
RTC
OSCILLATOR
REAL-
TIME
CLOCK
WATCHDOG TIMER
SYSTEM CONTROL
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2/MAT3,
2 × MAT0,
3 × MAT1
6 × PWM0/PWM1
1 × PCAP0,
2 × PCAP1
AOUT
VBAT
AHB TO
APB BRIDGE
SRAM
MII/RMII
V
BUS
DBGEN
P0, P2
AHB2
AHB1
control lines
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 16 of 792
1. How to read this chapter
The memory addressing and mapping for different LPC2400 parts depends on flash size,
EMC size, and the LCD peripheral, see Table 2–13
.
2. Memory map and peripheral addressing
ARM processors have a single 4 GB address space. The following table shows how this
space is used on NXP embedded ARM devices.
UM10237
Chapter 2: LPC24XX Memory mapping
Rev. 04 — 26 August 2009 User manual
Table 13. LPC2400 memory options and addressing
Flash LCD EMC Memory map
Table 2–19;
Table 2–21
Figure 2–8
LPC2458 512 kB no 16-bit Table 2–14
LPC2420 flashless no 32-bit Table 2–15
LPC2460 flashless no 32-bit Table 2–15
LPC2468 512 kB no 32-bit Table 2–16
LPC2470 flashless yes 32-bit Table 2–15
LPC2478 512 kB yes 32-bit Table 2–16
Table 14. LPC2458 memory usage and details
Address range General use Address range details and description
0x0000 0000 to
0x3FFF FFFF
On-chip non-volatile
memory and Fast I/O
0x0000 0000 - 0x0007 FFFF Flash Memory (512 kB)
0x3FFF C000 - 0x3FFF FFFF Fast GPIO registers
0x4000 0000 to
0x7FFF FFFF
On-chip RAM 0x4000 0000 - 0x4000 FFFF RAM (64 kB)
0x7FE0 0000 - 0x7FE0 3FFF Ethernet RAM (16 kB)
0x7FD0 0000 - 0x7FD0 3FFF USB RAM (16 kB)
0x8000 0000 to
0xDFFF FFFF
Off-Chip Memory Two static memory banks, 1 MB each
0x8000 0000 - 0x800F FFFF Static memory bank 0
0x8100 0000 - 0x810F FFFF Static memory bank 1
Two dynamic memory banks, 256 MB each
0xA000 0000 - 0xAFFF FFFF Dynamic memory bank 0
0xB000 0000 - 0xBFFF FFFF Dynamic memory bank 1
0xE000 0000 to
0xEFFF FFFF
APB Peripherals 36 peripheral blocks, 16 kB each
0xF000 0000 to
0xFFFF FFFF
AHB peripherals
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 17 of 792
NXP Semiconductors
UM10237
Chapter 2: LPC24XX Memory mapping
Table 15. LPC2420/60/70 memory usage and details
Address range General use Address range details and description
0x0000 0000 to
0x3FFF FFFF
Fast I/O 0x0000 0000 - 0x0007 FFFF Reserved (flashless parts)
0x3FFF C000 - 0x3FFF FFFF Fast GPIO registers
0x4000 0000 to
0x7FFF FFFF
On-chip RAM 0x4000 0000 - 0x4000 FFFF RAM (64 kB)
0x7FE0 0000 - 0x7FE0 3FFF Ethernet RAM (16 kB) (LPC2460
only)
0x7FD0 0000 - 0x7FD0 3FFF USB RAM (16 kB)
0x8000 0000 to
0xDFFF FFFF
Off-Chip Memory Four static memory banks, 16 MB each
0x8000 0000 - 0x80FF FFFF Static memory bank 0
0x8100 0000 - 0x81FF FFFF Static memory bank 1
0x8200 0000 - 0x82FF FFFF Static memory bank 2
0x8300 0000 - 0x83FF FFFF Static memory bank 3
Four dynamic memory banks, 256 MB each
0xA000 0000 - 0xAFFF FFFF Dynamic memory bank 0
0xB000 0000 - 0xBFFF FFFF Dynamic memory bank 1
0xC000 0000 - 0xCFFF FFFF Dynamic memory bank 2
0xD000 0000 - 0xDFFF FFFF Dynamic memory bank 3
0xE000 0000 to
0xEFFF FFFF
APB Peripherals 36 peripheral blocks, 16 kB each
0xF000 0000 to
0xFFFF FFFF
AHB peripherals
Table 16. LPC2468/78 memory usage and details
Address range General use Address range details and description
0x0000 0000 to
0x3FFF FFFF
On-chip non-volatile
memory and Fast I/O
0x0000 0000 - 0x0007 FFFF Flash Memory (512 kB)
0x3FFF C000 - 0x3FFF FFFF Fast GPIO registers
0x4000 0000 to
0x7FFF FFFF
On-chip RAM 0x4000 0000 - 0x4000 FFFF RAM (64 kB)
0x7FE0 0000 - 0x7FE0 3FFF Ethernet RAM (16 kB)
0x7FD0 0000 - 0x7FD0 3FFF USB RAM (16 kB)
0x8000 0000 to
0xDFFF FFFF
Off-Chip Memory Four static memory banks, 16 MB each
0x8000 0000 - 0x80FF FFFF Static memory bank 0
0x8100 0000 - 0x81FF FFFF Static memory bank 1
0x8200 0000 - 0x82FF FFFF Static memory bank 2
0x8300 0000 - 0x83FF FFFF Static memory bank 3
Four dynamic memory banks, 256 MB each
0xA000 0000 - 0xAFFF FFFF Dynamic memory bank 0
0xB000 0000 - 0xBFFF FFFF Dynamic memory bank 1
0xC000 0000 - 0xCFFF FFFF Dynamic memory bank 2
0xD000 0000 - 0xDFFF FFFF Dynamic memory bank 3
0xE000 0000 to
0xEFFF FFFF
APB Peripherals 36 peripheral blocks, 16 kB each
0xF000 0000 to
0xFFFF FFFF
AHB peripherals
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 18 of 792
NXP Semiconductors
UM10237
Chapter 2: LPC24XX Memory mapping
3. Memory maps
The LPC2400 incorporates several distinct memory regions, shown in the following
figures. Figure 2–6
shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping,
which is described later in this section.
Fig 6. LPC2400 system memory map
0.0 GB
1.0 GB
ON-CHIP NON-VOLATILE MEMORY OR RESERVED
0x0000 0000
RESERVED ADDRESS SPACE
SPECIAL REGISTERS
ON-CHIP STATIC RAM
RESERVED ADDRESS SPACE
0x4000 0000
0x3FFF 8000
0x3FFF FFFF
2.0 GB 0x8000 0000
0x7FFF FFFF
BOOT ROM AND BOOT FLASH
EXTERNAL STATIC AND DYNAMIC MEMORY
3.75 GB
4.0 GB
3.5 GB
AHB PERIPHERALS
APB PERIPHERALS
0xE000 0000
0xF000 0000
0xFFFF FFFF
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 19 of 792
NXP Semiconductors
UM10237
Chapter 2: LPC24XX Memory mapping
Figure 8 and Table 2–17 show different views of the peripheral address space. Both the
AHB and APB peripheral areas are 2 megabyte spaces which are divided up into 128
peripherals. Each peripheral space is 16 kilobytes in size. This allows simplifying the
address decoding for each peripheral.
Fig 7. Peripheral memory map
RESERVED
RESERVED
0xF000 0000
0xEFFF FFFF
APB PERIPHERALS
0xE020 0000
0xE01F FFFF
0xE000 0000
AHB PERIPHERALS
0xFFFF FFFF
0xFFE0 0000
0xFFDF FFFF
3.75 GB
3.5 GB
3.5 GB + 2 MB
4.0 GB - 2 MB
4.0 GB
UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 20 of 792
NXP Semiconductors
UM10237
Chapter 2: LPC24XX Memory mapping
All peripheral register addresses are word aligned (to 32 bit boundaries) regardless of
their size. This eliminates the need for byte lane mapping hardware that would be required
to allow byte (8 bit) or half-word (16 bit) accesses to occur at smaller boundaries. An
implication of this is that word and half-word registers must be accessed all at once. For
example, it is not possible to read or write the upper byte of a word register separately.
(1) LPC247x only.
Fig 8. AHB peripheral map
VECTORED INTERRUPT CONTROLLER
(AHB PERIPHERAL #0)
0xFFFF F000 (4G - 4K)
0xFFFF C000
0xFFFF 8000
(AHB PERIPHERAL #4)
(AHB PERIPHERAL #3)
(AHB PERIPHERAL #2)
(AHB PERIPHERAL #1)
(AHB PERIPHERAL #126)
0xFFE1 8000
0xFFE1 4000
0xFFE1 0000
0xFFE0 C000
0xFFE0 8000
0xFFE0 4000
0xFFE0 0000
ETHERNET CONTROLLER
GENERAL PURPOSE DMA CONTROLLER
EXTERNAL MEMORY CONTROLLER
USB CONTROLLER
LCD
(1)
(AHB PERIPHERAL #5)
NOT USED
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