Dinghua DH-5830 is a professional BGA rework station designed for precise and efficient rework of electronic components. With its advanced features and capabilities, it offers a wide range of applications, including:
BGA Desoldering: Safely remove BGA chips from printed circuit boards (PCBs) using controlled hot air and vacuum suction.
BGA Re-balling: Replace damaged or missing solder balls on BGA chips, ensuring proper electrical connections.
PCB Preheating: Prepare PCBs for rework by evenly distributing heat, reducing thermal stress and preventing component damage.
Temperature Control: Precisely manage temperature profiles with multiple heating zones and closed-loop control, ensuring optimal conditions for soldering and desoldering.
Dinghua DH-5830 is a professional BGA rework station designed for precise and efficient rework of electronic components. With its advanced features and capabilities, it offers a wide range of applications, including:
BGA Desoldering: Safely remove BGA chips from printed circuit boards (PCBs) using controlled hot air and vacuum suction.
BGA Re-balling: Replace damaged or missing solder balls on BGA chips, ensuring proper electrical connections.
PCB Preheating: Prepare PCBs for rework by evenly distributing heat, reducing thermal stress and preventing component damage.
Temperature Control: Precisely manage temperature profiles with multiple heating zones and closed-loop control, ensuring optimal conditions for soldering and desoldering.
Dinghua DH-5830 is a professional BGA rework station designed for precise and efficient rework of electronic components. With its advanced features and capabilities, it offers a wide range of applications, including:
BGA Desoldering: Safely remove BGA chips from printed circuit boards (PCBs) using controlled hot air and vacuum suction.
BGA Re-balling: Replace damaged or missing solder balls on BGA chips, ensuring proper electrical connections.
PCB Preheating: Prepare PCBs for rework by evenly distributing heat, reducing thermal stress and preventing component damage.
Temperature Control: Precisely manage temperature profiles with multiple heating zones and closed-loop control, ensuring optimal conditions for soldering and desoldering.
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