M/S. VIDEOCON INDUSTRIES LIMITED,
14Km Stone, Paithan Road, Aurngabad,
Village Chitegaon, Taluka Paithan,
AURANGABAD –431105, MAHARASHTRA, INDIA
This Service manual is property of
Videocon Industries Ltd.
***VIDEOCON CONFIDENTIAL***
V59
Service Manual
Models :-
LEDTVVKC22FH-ZMA
LEDTVVKC24HH-ZMA
LEDTVVKC28HH-ZMA
LEDTVVKC32HH-ZMA
LEDTVVKC40FH-ZMA
LEDTVVKC50FH-ZMA
LEDTVVKC55FH-ZMA
V59 SERVICE MANUAL
SPECS REV
DATE DESCRIPTION
Ver1.0,Rev 0.0
28-AUG-13
PREPARED BY
***VIDEOCON CONFIDENTIAL***
R&D
V59 manual
***VIDEOCON CONFIDENTIAL***
The lighting flash with arrowhead symbol, with an equilateral triangle is intended to
the person.
The exclamation point within an equilateral triangle is intended to alert the user to the
presence of important operating and maintenance (servicing) instructions in the
literature accompanying the appliance.
CAUTION
RISK RISK OF OF ELECTRIELECTRIC
SHOCK SHOCK DO DO NOT NOT OPEN.OPEN.
dangerous
CAUTION :
enclosure that ma
y be of sufficient magnitude to constitute a risk of electr
ic shoc
k to
aler
t the user to the presence of
uninsulated
voltage
within the product s
hazardous radiation exposure.
Use of
controls,
other
may result
adjustments
or procedures
than
those specified
herein
in
1 SAFETY PRECAUTIONS.
WARNING: TO REDUCE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT
EXPOSE THIS APPLIANCE TO RAIN OR MOISTURE.
CAUTION:
Read all of these instructions. Save these instructions for later use. Follow all Warnings and
Instructions marked on the audio equipment.
1. Read Instructions- All the safety and operating instructions should be read before the product is operated.
2. Retain Instructions- The safety and operating instructions should be retained for future reference.
3. Heed Warnings- All warnings on the product and in the operating instructions should be adhered to.
4. Follow Instructions- All operating and use instructions should be followed.
IMPORTANT SAFETY INSTRUCTIONS
1
***VIDEOCON CONFIDENTIAL***
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
a.
2
***VIDEOCON CONFIDENTIAL***
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
3
***VIDEOCON CONFIDENTIAL***
3 V59 System Block diagram:-
OR 311XD
L/R
L/R
1.8V
DC/DC
3.3V
TSUMV59MS-QFP128
DSP
PWM IC
AC100V-240V
TRANSFORMER
F35WT/ST17WM(TCL)
T102
U807
RF IN
FP I/F
SY8008B
+12V
SPI FLASH
SY8008B
EFD25
1.2V
DC/DC
PI5V330
VGA
RGB
USB PORT
HDMI*2
IR,KEY0,KEY1
IF
TUNER
BLOCK DIAGRAM
DVD I/F
DDR2
CN301
AV1
32Mbit
(0B2273)
RT8296A
DC/DC
U2
DC/DC
U101
U105
U103
U13
5VSTB
5VA
12VA
PWR-ON/OFF
5VA
AUDIO AMP.
TPA1517
U702/U703
CVBS1
L/R (AIN1)
U501
RGB SW.
J501
J401,J402
YPbPr
J307
J301
L/R(AIN3)
YPbPr1/RGB1
CVBS2
J302
HeadPhone
PT2308
U701
5VA
TO SPK
CN701
HP_JACK
J304
SY8008B
Built-in
L/R(AIN5)
CN202
SCART
J306
RGB
RGB0
L/R (AIN4)
CVBS0
AV OUT
J308
CVBS_OUT
L/R (AOUT1)
L/R (AOUT0)
5VA
J502
3.3V
HDMI-1
HDMI-2/MHL
/TDA18273(On Board)
***VIDEOCON CONFIDENTIAL*** 7
4.4 SYSTEM WIRING DIAGRAM 22/24/28
Connection wire(Blacklight )
NO. Name
1
2
3
4
5
Connection Wire(For Keyboard and Remote)
Connection Wire(For Speaker)
LVDS Wire
Connection Wire(Power Wire)
1
5
2
3
4
***VIDEOCON CONFIDENTIAL*** 8
4.4 SYSTEM WIRING DIAGRAM 32
Connection wire(Blacklight )
NO. Name
1
2
3
4
5
Connection Wire(For Keyboard and Remote)
Connection Wire(For Speaker)
LVDS Wire
Connection Wire(Power Wire)
5
2
3
4
1
***VIDEOCON CONFIDENTIAL*** 8
4.4 SYSTEM WIRING DIAGRAM 40/46/50/55
Connection wire(Blacklight )
NO. Name
1
2
3
4
5
Connection Wire(For Keyboard and Remote)
Connection Wire(For Speaker)
LVDS Wire
Connection Wire(Power Wire)
5
2
3
4
1
6
Power Conn PSU to Main borad
6
***VIDEOCON CONFIDENTIAL*** 19
7.SERVICE
HOW TO ENTER IN SERVCE MODE AND DATA ADJUSTMENT
1) How to Enter in Factory menu:
Follow the below steps pop-up the factory menu.
- Press remote control key “Menu or TV/AV” to display menu
- Press remote control key “2”, “5”, “8” and “0”.
- Press Remote Control “OK” key or “RIGHT” key to enter the submenu.
- Press Remote Control “Menu” key to go back to the root menu.
- Press Remote Control “RIGHT” or “LEFT” key to change the values.
- Press Remote Control “MENU” key exit the factory menu.
- Do Mains OFF/ON after every change of Design Data to store data.
- Do the shipping after adjsutment of TV.
STEP 1
STEP 2
STEP 3
STEP 4
b) SW installation through USB (Display/Picture is ok).
Intoduction of SW Installation through USB
7.1.Software Loading Procedure
Download the Software file into USB device and Extract file in USB.
Ensure name file as MERGE.bin, if not then rename.
Plug in USB device in TV set and turn ON TV set.
Press "MENU" key and select the "SETTING" Menu.
STEP 4
Select "Software Update(USB)" to S/W Upgrade.
STEP 5
Press "OK" Key from Remote and followed instructions.
STEP 7
Please wait still upgradtion will start and complete.
Note:
Don’t Power OFF TV set Once you start SW loading process.
You can't use "SW installation through USB" if your TV set is on Permanent standby ( LED is RED) in this case
you must use JIG installation process.
STEP 9
After completion of software upgrade TV will be re-boot automatically and restart.
STEP 10
TV will go in burning mode automatically and Red,Blue & Green Patterns will be displayed.
STEP 11
Press "Mute" Key to turn OFF burning mode.
Please again enter in service mode and select do the NVM reset.
Now Software Upgrade procedure completed sucessfully,
TV become default factory conditions.
STEP 12
Enter in Service menu and do the shipping.
STEP 12
STEP 1
STEP 2
STEP 3
STEP 4
a) SW installation through USB in No Picture/No display condition of TV.
Download the Software file into USB device and Extract file in USB.
Ensure name file as MERGE.bin, if not then rename.
Plug in USB device in TV set and turn ON TV set.
Press "TV/AV" key and then press "9" & "9" key.
STEP 4
TV will be automatically upgrade S/W.
STEP 1
Check if remote working or not with TV set by pressing stand by Key , if work then follow below,
STEP 9
After completion of software upgrade TV will be re-boot automatically and restart.
STEP 10
Follow remaining steps from "b) SW installation through USB" STEP no 10 to 12.
25***VIDEOCON CONFIDENTIAL***
8. TROUBLESHOOTING.
Change Panel
Still having
problems
No picture but h
ave sound
Check if there is +5V at
Pin35 in CN201
No
Replace the
Q101
Yes
Check if there is normal
voltage at C1026
Yes
No
Check if U3 Pin20
（3.3V）、Pin11（5V）、
Pin19
（
5V
）;U5 ：
Pin2(0.72V)
、
Pin3
（
5V
）、
Pin4(12V)
、
Pin6(5.7V) is normal
Change LVDS wire
No
Replace U3 or
U5
Check if Q103 、
、 、 D9 、
R700 is working
Yes
Replace
Q103、
、 、
D9
No
M
a
in bo
a
rd fa
ilure
c
hec
k.
26***VIDEOCON CONFIDENTIAL***
26***VIDEOCON CONFIDENTIAL***
26***VIDEOCON CONFIDENTIAL***
Poor sound
Verify if sound system is
correct .
Poor sound
Change sound
system
No
Update the software and
make the reboot;
or change the
Mainboard
Still having
problems
For ease of use, recommend that customer format the picture and sound
settings in the automatic option.
26***VIDEOCON CONFIDENTIAL***
No color for some
channel program (blac
k and white)
Verify if the same
problem exists in
other channels
check out of picture
and sound system
Refer to relative
instructions in the
Manual for color adjust
No
No
Yes
Yes
Check out of picture and sound
system of this channel
Change the channel to the right
sound system (PAL-M/N PAL-D/K)
No color for some channel program (black and
white)
Still having
problems
Updata the software and
make the reboot;
or change the maiboard
27***VIDEOCON CONFIDENTIAL***
28***VIDEOCON CONFIDENTIAL***
• Mainboard not work
• 1. check if the power supply have
12V and 5V output
• 2.Verify if the DC/DC convertors
have the right output
(5V,3.3V,2.5V,1.8V,1.32V)
• 3.Verify if the Mainchip(V59),
DDR, AudioAMP…solder well;
• 4.Verify if the FLASH(U202) has the
right software and work well;
• 5.Verify if the Y1(Crystal) has the
right frequency
Panel not work
1. check if the voltage input and
output of boost IC is working
normally.
2.Verify if the Mainboard output the
right On/Off signal to power board;
3.Verify if the Mainboard output the
LVDS singal to panel T-con board
4.Verify if the software is the right
version of this model.
5.Change the LVDS wire to check
if it’s broken.
Power board not work
1.Verify if the power cord connect well?
2.check if the power supply if working
normally ; check if the power supply of
+5Vstandby is working normally;
3. check if the POWER ON/OFF
voltage is high pressure;
4.check if the power supply have
+12V/+5V output;
Check if Main board / LVDS wire /
Panel are in good condition ?
28***VIDEOCON CONFIDENTIAL***
8.2 .Pannel failure
Failure Mode
Part Name Description Phenomena Failure cause
TCP
V B/D Vertical bar
Block Defect :TCP cracking or cracking
Dim or L/D :TCP Sunken
:TCP lead cracking
:ACF bonding short
:Awful environment and
something electric enter
into LCD
:Mis-align between TCP and
Panel
:Panel failure
:TCP failure
V Dim Vertal gray line
V L/D
Vertical color
line(light or dark
forever)
H B/D Horizontal bar
H Dim
Horizontal gary
line
H L/D
Horizontal
line(light or dark
forever)
Part Name Description Phenomena Failure cause
Panel or
Polarlzer
Dot Defect
Bright dot dark dot in
pannel
Incoming Inspection
Standard
Polarizer Bubble Bladder in Polarizer
Bladder between Polarizer
and top glass
Polarizer Scratch Polarizer Scratch
Tine or rigidity arose
F/M inside
Polarizer
Eyewinker inside
Polarizer
Eyewinker inside Polarizer
Circuit
Abnormal Display Abnormal Display
1.Chip lose action
2.IC ahort or jointiog bad
3.Pannel and vsc connect
bad
Flashing
Bright and dark
display alternately
28
***VIDEOCON CONFIDENTIAL***
Part Name Description Phenomena Failure cause
Circuit
White Screen B/L normal,
only white screen
display
Maybe caused
by surge current
and EDS
Black Screen B/L normal,
only Black screen
display
FIIcker Crosstalk
LCD
Vcom imbalance
Abnormal Color Only
color abormal
Capacitance
improper bring
crosstalk inside
LCD pannel
Abnormal Color
Only
color abnormal
1.Chip
lose action
2.IC short or
jointion bad
3.Pannel and vsc
connect bad
Part Name Description Phenomena Failure cause
Mechanlcal
Nolse
When
turn panel,appear
cacophony
Caused
by Mechanica
noise of backlight
unit
Ripple Connectric circle
Causeed by
between
mechanism and
pannel
B/L off B/L lose action
*Connect
badness
between wire and
electrode
B/L dark B/L brightness
darker than
normal
*Connect
badnessShort
between wire and
electrode
B/L
wire damaged
B/L
wire damaged
Operation
abnormal
or systemic noise
B/L wire open Without backlight Operation
abnormal
or systemic noise
B/L shut down B/L shutdown in
sometime
Short bitween
lamp housing and
wire, Because
consume power
too much
F/M F/M
inB/L ,white,balck
Rotundity
or wirelike
F/M in B/L unit
Part Name Description Phenomena Failure cause
Mechanlcal or B/
L
Light leakage
Brightness
at bottom of LCM
brighter
than normal
B/L unit badness
Uniformity
B/L brightness
asymmetric
Sheet in B/L unit
is uneven
Mount hole
Lack screw
or screw damage
*Lack screw
Screw damage
29***VIDEOCON CONFIDENTIAL***
14. REMOTE CONTROL
14.1 REMOTE CONTROL PHOTO
-
1
-
2
-
3
-
4
-
5
-
6
-
7
-
8
-
9
-
10
-
11
-
12
-
13
-
14
-
15
-
16
-
17
-
18
-
19
-
20
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