iv Maintenance & Service Guide
Contents
4 Removal & Replacement Procedures
4.1 DisassemblySequenceChart.........................................4–1
4.2 PreparationforDisassembly..........................................4–2
4.3 CableLock.......................................................4–3
4.4 WorkstationFeet...................................................4–4
4.5 AccessPanel......................................................4–5
4.6 Battery...........................................................4–6
4.7 HoodSensor......................................................4–7
4.8 ShippingBracket...................................................4–8
4.9 MemoryComponents...............................................4–9
4.9.1 Overview...................................................4–9
4.9.2 RemovingtheMemoryExpansionBoard.........................4–10
4.9.3 RIMMInstallationGuidelines..................................4–11
4.9.4 RIMMSlotLocations........................................4–12
4.9.5 RIMMSocketConfigurations..................................4–12
4.9.6 InstallingaMemoryDevice...................................4–13
4.10 FrontBezel.....................................................4–14
4.11 BlankDriveBezel................................................4–15
4.12 FrontI/OBoardandPowerSwitchAssembly..........................4–16
4.13 EMI/CoolingShield..............................................4–17
4.14 MassStorageDevices.............................................4–18
4.14.1 DrivePositions ............................................4–18
4.14.2 SpareScrews..............................................4–19
4.14.3 RemovingaHardDrivefromBays5or6 .......................4–20
4.14.4 CD-ROMDrive............................................4–21
4.14.5 DisketteDrive.............................................4–22
4.15 ExpansionBoards................................................4–23
4.15.1 RemovinganExpansionBoard................................4–24
4.15.2 Installing an Expansion Board.................................4–25
4.16 AirBaffles......................................................4–26
4.16.1 MainBaffle...............................................4–26
4.16.2 Power Supply Air Baffle. . ...................................4–27
4.17 PowerSupply...................................................4–28
4.18 RemovableHardDriveCage.......................................4–29
4.18.1 RemovingtheRemovableHardDriveCage......................4–29
4.18.2 Removing a Hard Drive from the Removable
HardDriveCage(Bays1-3)..................................4–30
4.18.3 Installing a Hard Drive in the Removable
HardDriveCage(Bays1-3)..................................4–31
4.19 Heatsink and Processor 4–33
4.19.1 SeparatingtheHeatsink-ProcessorAssembly.....................4–33
HeatsinkCool-DownTime....................................4–33
HeatsinkWarm-UpTime.....................................4–33
4.19.2 RemovingtheHeatsinkandProcessor..........................4–34
4.19.3 Installing an Additional Processor..............................4–36
HardwareAbstractionLayer...................................4–36
AdditionalProcessorInstallation...............................4–36
4.20 SystemBoard...................................................4–39
4.21 RearFan.......................................................4–40
4.22 ProcessorFan...................................................4–41
4.23 Speaker........................................................4–42
4.24 CardGuide.....................................................4–43
4.25 AirPlenumFan..................................................4–44