6Introduction
1.6 Functional Description
Processor Support
The MI-110 embedded motherboard is equpped with the Intel®
Atomâ„¢ N270 processor in Micro-FCBGA8 package. Implemented
in 45nm process technology, the Intel® Atom™ N270 is power-
optimized to deliver robust performance per watt for cost-effective
embedded applications. Features include:
X 1.6 GHz core speed with 533 MHz FSB and 2.5 watts TDP
X Hyper-Threading Technology
X Enhanced Intel SpeedStep® Technology
X Enhanced low-power sleep states (C1E, C2E, C4E)
X Dynamic L2 cache sizing
Mobile Intel® 945GSE Express Chipset
The MI-110 is based on the Mobile Intel® 945GSE Express
Chipset, consisting of the Intel® 82945GSE Graphics Memory
Controller Hub and Intel® I/O Controller Hub 7-M. The chipset fea-
tures power-efficient graphics with an integrated 32-bit 3D graph-
ics engine based on Intel® Graphics Media Accelerator 950
architecture with SDVO, LVDS, and CRT display ports. It provides
rich I/O capabilities and flexibility via high-bandwidth interfaces
such as PCI Express, PCI, Serial ATA, and Hi-Speed USB 2.0
connectivity. It also includes a single channel for 400/533 MHz
DDR2 system memory, and Intel® High Definition Audio interface.
DDR2 memory
To meet the requirements of memory-intensive applications, the
MI-110 has a single-channel memory architecture supporting a
DDR2 400/533 MHz SO-DIMM. The high-bandwidth memory
specification, meets the requirements of the latest 3D graphics,
multimedia, and network application, and boosts system perfor-
mance by eliminating bottlenecks.