TXMC395 User Manual Issue 1.0.1 Page 7 of 12
2 Technical Specification
XMC Interface
Mechanical Interface
Conduction Cooled Switched Mezzanine Card (CCXMC) Interface
conforming to ANSI/VITA 42.0 and ANSI/VITA 20
Standard single-width (143.75 mm x 74 mm)
Electrical Interface x4 PCI Express (Specification 2.1) compliant interface conforming
to ANSI/VITA 42.3
On Board Devices
PCIe Switch PI7C9X2G608GP (Diodes Incorporated)
Gigabit Ethernet Controllers For each interface: I210-IT (Intel)
16 Mbit Serial Flashes for Boot
ROM For each interface: W25Q16JV (Winbond)
I/O Interface
Number of Channels 4
I/O Standards
1000Base-T
100Base-TX
10Base-T
I/O Connector
Back I/O P16 (Samtec ASP-103614-04 or compatible)
Two ports mapped in X12d range and two ports mapped in X8d
range (VITA46.9)
Physical Data
Power Requirements
600mA typical @ VPWR = +5V (four channel, no link)
app. additional 10mA to 100mA per link
270mA typical @ VPWR = +12V (four channel, no link)
app. additional 4.5mA to 45mA per link
Temperature Range Operating
Storage
-40°C to +85°C
-40°C to +85°C
MTBF
922000 h
MTBF values shown are based on calculation according to MIL-HDBK-217F and
MIL-HDBK-217F Notice 2; Environment: GB 20°C.
The MTBF calculation is based on component FIT rates provided by the
component suppliers. If FIT rates are not available, MIL-HDBK-217F and
MIL-HDBK-217F Notice 2 formulas are used for FIT rate calculation.
Humidity 5 – 95 % non-condensing
Weight 68 g
Table 2-1 : Technical Specification