PDS-060926 Rev.0 December 2014
1. Introduction
The GX3146 is a low-power, high-speed 146×146 crosspoint switch, with robust signal conditioning
circuits for driving and receiving high-speed signals through backplanes. This document describes the
contents, features, and use of the GX3146 IBIS-AMI model. The model includes all equalization, de-
emphasis and swing settings of the GX3146 and facilitates simulation of the GX3146 in EDA platforms
compliant with IBIS 5.0.
2. GX3146 IBIS-AMI Model
The GX3146 IBIS-AMI model comprises of RX and TX models. The RX model applies the equalization
on signal received from a channel. The received signal is then transmitted into another channel using the
TX model. Note that the switching core is not included in the model. Therefore, the RX and TX models
have to be used in two separate testbenches to optimize the chip different settings and board design as
shown in Figure 2-1.
Figure 2-1: The receiver and transmitter testbenches in order to use GX3146 IBIS-AMI model.
Please be advised that the receiver output signal represents the signal at the output of the on-chip equalizer
and the transmitter input is the signal after the switching core. In order to meet the receiver sensitivity
specifications, the signals at the equalizer output should have more than 100mVppd vertical eye opening.
The user should optimize the equalizer output to have the maximum vertical and horizontal eye opening.
Please note that this eye diagram will be sliced before going into the switching core and its shape is not
very important as long as it has low jitter and high vertical eye opening. The slicers have not been included
in the receiver model in order to build a linear model.
2.1 GX3146 Receiver IBIS-AMI Model
The GX3146 Receiver IBIS-AMI model consists of three parts: (1) the Analog Termination IBIS model,
(2) the Receiver AMI model and (3) the QFN package model. The block diagram in Figure 2-2 shows the
sequence of signal flow and the individual parts of the model. The external S-parameter file for the QFN
Package model extends the accuracy of the package effects beyond which can be described by R, L and C
components in the current IBIS 5.0 standard. The external S-parameter data is processed as part of the
channel by the EDA platforms.