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NXP MPC106 Reference guide

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MPC106UM/AD
7/2003
Rev. 2
MPC106
PCI Bridge/Memory Controll
er
User’s Manu
al
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HOW TO REACH US:
USA/EUROPE/LOCATIONS NOT LISTED:
Motorola Literature Distribution
P.O. Box 5405, Denver, Colorado 80217
1-480-768-2130
(800) 521-6274
JAPAN:
Motorola Japan Ltd.
SPS, Technical Information Center
3-20-1, Minami-Azabu Minato-ku
Tokyo 106-8573 Japan
81-3-3440-3569
ASIA/PACIFIC:
Motorola Semiconductors H.K. Ltd.
Silicon Harbour Centre, 2 Dai King Street
Tai Po Industrial Estate, Tai Po, N.T., Hong Kong
852-26668334
TECHNICAL INFORMATION CENTER:
(800) 521-6274
HOME PAGE:
www.motorola.com/semiconductors
Motorola and the Stylized M Logo are registered in the U.S. Patent and Trademark Office.
digital dna is a trademark of Motorola, Inc. The described product is a PowerPC
microprocessor. The PowerPC name is a trademark of IBM Corp. and is used under license.
All other product or service names are the property of their respective owners. Motorola, Inc. is
an Equal Opportunity/Affirmative Action Employer.
© Motorola, Inc. 2003
Information in this document is provided solely to enable system and software implementers to use
Motorola products. There are no express or implied copyright licenses granted hereunder to design
or fabricate any integrated circuits or integrated circuits based on the information in this document.
Motorola reserves the right to make changes without further notice to any products herein.
Motorola makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, nor does Motorola assume any liability arising out of the application or
use of any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters which may be provided in
Motorola data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated
for each customer application by customer’s technical experts. Motorola does not convey any
license under its patent rights nor the rights of others. Motorola products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the
body, or other applications intended to support or sustain life, or for any other application in which
the failure of the Motorola product could create a situation where personal injury or death may
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
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Signal Descriptions
Device Programming
Processor Bus Interface
Secondary Cache Interface
Memory Interface
Internal Control
Performance Monitor
PCI Bus Interface
Bit and Byte Ordering
Index
Power Management
GLO
IND
A
Glossary of Terms and Abbreviations
1
2
3
5
6
7
8
9
4
10
Error Handling
B
Overview
Initialization Example
JTAG/Testing Support C
D
Revision History E
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Signal Descriptions
Device Programming
Processor Bus Interface
Secondary Cache Interface
Memory Interface
Internal Control
Performance Monitor
PCI Bus Interface
Bit and Byte Ordering
Index
Power Management
GLO
IND
A
Glossary of Terms and Abbreviations
1
2
3
5
6
7
8
9
4
10
Error Handling
B
Overview
Initialization Example
JTAG/Testing SupportC
D
Revision History E
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Contents
Section
Number Title
Page
Number
MOTOROLA Contents iii
Contents
Paragraph
Number Title
Page
Number
Contents
About This Book
Audience........................................................................................................... xxvii
Organization..................................................................................................... xxviii
Suggested Reading............................................................................................. xxix
General Information....................................................................................... xxix
Documentation on PowerPC Architecture..................................................... xxix
Conventions....................................................................................................... xxxi
Acronyms and Abbreviations ............................................................................ xxxi
Chapter 1
Overview
1.1 MPC106 PCIB/MC Features............................................................................... 1-1
1.2 MPC106 Major Functional Units ........................................................................1-4
1.2.1 60x Processor Interface....................................................................................1-4
1.2.2 Secondary (L2) Cache/Multiple Processor Interface....................................... 1-4
1.2.3 Memory Interface ............................................................................................ 1-5
1.2.4 PCI Interface....................................................................................................1-6
1.3 Performance Monitor........................................................................................... 1-6
1.4 Power Management ............................................................................................. 1-7
1.4.1 Full-On Mode .................................................................................................. 1-7
1.4.2 Doze Mode....................................................................................................... 1-7
1.4.3 Nap Mode ........................................................................................................ 1-7
1.4.4 Sleep Mode......................................................................................................1-7
1.4.5 Suspend Mode..................................................................................................1-8
Chapter 2
Signal Descriptions
2.1 Signal Configuration............................................................................................2-1
2.2 Signal Descriptions.............................................................................................. 2-2
2.2.1 Signal States at Reset....................................................................................... 2-8
2.2.2 60x Processor Interface Signals.......................................................................2-9
2.2.2.1 Address Bus (A[0–31]).............................................................................. 2-10
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iv MPC106 PCI/Bridge/Memory Controller User’s Manual MOTOROLA
2.2.2.1.1 Address Bus (A[0–31])—Output........................................................... 2-10
2.2.2.1.2 Address Bus (A[0–31])—Input ............................................................. 2-10
2.2.2.2 Address Acknowledge (AACK
)................................................................2-10
2.2.2.2.1 Address Acknowledge (AACK
)—Output............................................. 2-10
2.2.2.2.2 Address Acknowledge (AACK)—Input ............................................... 2-11
2.2.2.3 Address Retry (ARTRY
)............................................................................ 2-11
2.2.2.3.1 Address Retry (ARTRY
)—Output ........................................................ 2-11
2.2.2.3.2 Address Retry (ARTRY)—Input........................................................... 2-12
2.2.2.4 Bus Grant 0 (BG0
)—Output...................................................................... 2-12
2.2.2.5 Bus Request 0 (BR0
)—Input..................................................................... 2-13
2.2.2.6 Caching-Inhibited (CI)—Input/Output...................................................... 2-13
2.2.2.7 Data Bus Grant 0 (DBG0)—Output.......................................................... 2-13
2.2.2.8 Data Bus Grant Local Bus Slave (DBGLB)—Output............................... 2-14
2.2.2.9 Data Bus (DH[0–31], DL[0–31]) ..............................................................2-14
2.2.2.9.1 Data Bus (DH[0–31], DL[0–31])—Output ........................................... 2-15
2.2.2.9.2 Data Bus (DH[0–31], DL[0–31])—Input..............................................2-15
2.2.2.10 Global (GBL)—Input/Output.................................................................... 2-16
2.2.2.11 Local Bus Slave Claim (LBCLAIM)—Input............................................ 2-16
2.2.2.12 Machine Check (MCP)—Output............................................................... 2-16
2.2.2.13 Transfer Acknowledge (TA)...................................................................... 2-17
2.2.2.13.1 Transfer Acknowledge (TA)—Output................................................... 2-17
2.2.2.13.2 Transfer Acknowledge (TA)—Input .....................................................2-17
2.2.2.14 Transfer Burst (TBST)............................................................................... 2-18
2.2.2.14.1 Transfer Burst (TBST)—Output............................................................ 2-18
2.2.2.14.2 Transfer Burst (TBST)—Input.............................................................. 2-18
2.2.2.15 Transfer Error Acknowledge (TEA)—Output........................................... 2-18
2.2.2.16 Transfer Start (TS)..................................................................................... 2-19
2.2.2.16.1 Transfer Start (TS)—Output.................................................................. 2-19
2.2.2.16.2 Transfer Start (TS)—Input..................................................................... 2-19
2.2.2.17 Transfer Size (TSIZ[0–2]) ......................................................................... 2-19
2.2.2.17.1 Transfer Size (TSIZ[0–2])—Output...................................................... 2-19
2.2.2.17.2 Transfer Size (TSIZ[0–2])—Input......................................................... 2-20
2.2.2.18 Transfer Type (TT[0–4])............................................................................ 2-20
2.2.2.18.1 Transfer Type (TT[0–4])—Output......................................................... 2-20
2.2.2.18.2 Transfer Type (TT[0–4])—Input........................................................... 2-20
2.2.2.19 Write-Through (WT)—Input/Output......................................................... 2-20
2.2.2.20 Extended Address Transfer Start (XATS)—Input..................................... 2-21
2.2.3 L2 Cache/Multiple Processor Interface Signals............................................. 2-21
2.2.3.1 Internal L2 Controller Signals ................................................................... 2-22
2.2.3.1.1 Address Strobe (ADS)—Output............................................................2-22
2.2.3.1.2 Burst Address 0 (BA0)—Output...........................................................2-22
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MOTOROLA Contents v
2.2.3.1.3 Burst Address 1 (BA1)—Output...........................................................2-22
2.2.3.1.4 Bus Address Advance (BAA)—Output ................................................ 2-23
2.2.3.1.5 Data Address Latch Enable (DALE
)—Output...................................... 2-23
2.2.3.1.6 Data RAM Chip Select (DCS
)—Output ...............................................2-23
2.2.3.1.7 Dirty In (DIRTY_IN)—Input................................................................2-24
2.2.3.1.8 Dirty Out (DIRTY_OUT
)—Output....................................................... 2-24
2.2.3.1.9 Data RAM Output Enable (DOE
)—Output .......................................... 2-24
2.2.3.1.10 Data RAM Write Enable (DWE[0–2])—Output................................... 2-25
2.2.3.1.11 Hit (HIT
)—Input ................................................................................... 2-25
2.2.3.1.12 Tag Output Enable (TOE
)—Output....................................................... 2-25
2.2.3.1.13 Tag Valid (TV)—Output........................................................................ 2-26
2.2.3.1.14 Tag Write Enable (TWE)—Output........................................................ 2-26
2.2.3.2 External L2 Controller Signals..................................................................2-26
2.2.3.2.1 External L2 Bus Grant (BGL2)—Output..............................................2-26
2.2.3.2.2 External L2 Bus Request (BRL2)—Input............................................. 2-27
2.2.3.2.3 External L2 Data Bus Grant (DBGL2)—Output................................... 2-27
2.2.3.2.4 Hit (HIT)—Input ................................................................................... 2-27
2.2.3.3 Multiple Processor Interface Signals......................................................... 2-28
2.2.3.3.1 Bus Grant 1–3 (BG[1–3])—Output....................................................... 2-28
2.2.3.3.2 Bus Request 1–3 (BR[1–3])—Input...................................................... 2-28
2.2.3.3.3 Data Bus Grant 1–3 (DBG[1–3])—Output ...........................................2-29
2.2.4 Memory Interface Signals.............................................................................. 2-29
2.2.4.1 ROM Address 0 (AR0)—Output............................................................... 2-29
2.2.4.2 ROM Address 1–8 (AR[1–8])—Output....................................................2-30
2.2.4.3 ROM Address 9–20 (AR[9–20])—Output................................................2-30
2.2.4.4 Buffer Control (BCTL[0–1])—Output...................................................... 2-30
2.2.4.5 Column Address Strobe (CAS[0–7])—Output.......................................... 2-31
2.2.4.6 SDRAM Clock Enable (CKE)—Output.................................................... 2-31
2.2.4.7 SDRAM Chip Select (CS[0–7])—Output................................................. 2-31
2.2.4.8 SDRAM Data Input/Output Mask (DQM[0–7])—Output........................ 2-32
2.2.4.9 Flash Output Enable (FOE)—Output........................................................ 2-32
2.2.4.10 Memory Address (MA[0–12])—Output.................................................... 2-32
2.2.4.11 Memory Data Latch Enable (MDLE)—Output......................................... 2-33
2.2.4.12 Data Parity/ECC (PAR[0–7])..................................................................... 2-33
2.2.4.12.1 Data Parity (PAR[0–7])—Output .......................................................... 2-33
2.2.4.12.2 Data Parity (PAR[0–7])—Input............................................................. 2-33
2.2.4.13 Parity Path Read Enable (PPEN)—Output................................................ 2-33
2.2.4.14 Row Address Strobe (RAS[0–7])—Output............................................... 2-34
2.2.4.15 ROM Bank 0 Select (RCS0)—Output....................................................... 2-34
2.2.4.16 ROM Bank 1 Select (RCS1)—Output....................................................... 2-34
2.2.4.17 Real Time Clock (RTC)—Input ................................................................ 2-35
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vi MPC106 PCI/Bridge/Memory Controller User’s Manual MOTOROLA
2.2.4.18 SDRAM Internal Bank Select 0–1 (SDBA[0–1])—Output ...................... 2-35
2.2.4.19 SDRAM Column Address Strobe (SDCAS)—Output.............................. 2-35
2.2.4.20 SDRAM Address (SDMA[0–12])—Output.............................................. 2-35
2.2.4.21 SDRAM Row Address Strobe (SDRAS)—Output ................................... 2-36
2.2.4.22 Write Enable (WE)—Output ..................................................................... 2-36
2.2.5 PCI Interface Signals..................................................................................... 2-36
2.2.5.1 PCI Address/Data Bus (AD[31–0])........................................................... 2-37
2.2.5.1.1 Address/Data (AD[31–0])—Output ...................................................... 2-37
2.2.5.1.2 Address/Data (AD[31–0])—Input......................................................... 2-37
2.2.5.2 Command/Byte Enable (C/BE[3–0])......................................................... 2-37
2.2.5.2.1 Command/Byte Enable (C/BE[3–0])—Output .....................................2-37
2.2.5.2.2 Command/Byte Enable (C/BE[3–0])—Input........................................2-38
2.2.5.3 Device Select (DEVSEL).......................................................................... 2-38
2.2.5.3.1 Device Select (DEVSEL)—Output....................................................... 2-38
2.2.5.3.2 Device Select (DEVSEL)—Input.......................................................... 2-38
2.2.5.4 Frame (FRAME)........................................................................................ 2-39
2.2.5.4.1 Frame (FRAME)—Output ....................................................................2-39
2.2.5.4.2 Frame (FRAME)—Input.......................................................................2-39
2.2.5.5 PCI Bus Grant (GNT)—Input ...................................................................2-39
2.2.5.6 Initiator Ready (IRDY).............................................................................. 2-39
2.2.5.6.1 Initiator Ready (IRDY)—Output........................................................... 2-40
2.2.5.6.2 Initiator Ready (IRDY)—Input ............................................................. 2-40
2.2.5.7 Lock (LOCK)—Input................................................................................2-40
2.2.5.8 Parity (PAR)............................................................................................... 2-40
2.2.5.8.1 Parity (PAR)—Output ...........................................................................2-40
2.2.5.8.2 Parity (PAR)—Input..............................................................................2-41
2.2.5.9 Parity Error (PERR)................................................................................... 2-41
2.2.5.9.1 Parity Error (PERR)—Output ...............................................................2-41
2.2.5.9.2 Parity Error (PERR)—Input.................................................................. 2-41
2.2.5.10 PCI Bus Request (REQ)—Output............................................................. 2-41
2.2.5.11 System Error (SERR) ................................................................................ 2-42
2.2.5.11.1 System Error (SERR)—Output............................................................. 2-42
2.2.5.11.2 System Error (SERR)—Input................................................................ 2-42
2.2.5.12 Stop (STOP)...............................................................................................2-42
2.2.5.12.1 Stop (STOP)—Output ........................................................................... 2-42
2.2.5.12.2 Stop (STOP)—Input.............................................................................. 2-42
2.2.5.13 Target Ready (TRDY) ............................................................................... 2-42
2.2.5.13.1 Target Ready (TRDY)—Output ............................................................ 2-42
2.2.5.13.2 Target Ready (TRDY)—Input............................................................... 2-43
2.2.5.14 PCI Sideband Signals ................................................................................ 2-43
2.2.5.14.1 Flush Request (FLSHREQ)—Input....................................................... 2-43
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MOTOROLA Contents vii
2.2.5.14.2 ISA Master (ISA_MASTER)—Input.................................................... 2-43
2.2.5.14.3 Memory Acknowledge (MEMACK)—Output ..................................... 2-44
2.2.5.14.4 Modified Memory Interrupt Request (PIRQ
)—Output......................... 2-44
2.2.6 Interrupt, Clock, and Power Management Signals........................................ 2-44
2.2.7 External ECM Error Detect (BERR)—Input................................................. 2-44
2.2.7.1 Test Clock (CKO)—Output.......................................................................2-45
2.2.7.2 Hard Reset (HRST
)—Input.......................................................................2-45
2.2.7.3 Nonmaskable Interrupt (NMI)—Input ...................................................... 2-45
2.2.7.4 Quiesce Acknowledge (QACK
)—Output.................................................2-46
2.2.7.5 Quiesce Request (QREQ
)—Input.............................................................. 2-46
2.2.7.6 Suspend (SUSPEND)—Input.................................................................... 2-46
2.2.7.7 System Clock (SYSCLK)—Input.............................................................. 2-47
2.2.8 IEEE 1149.1 Interface Signals.......................................................................2-47
2.2.8.1 JTAG Test Clock (TCK)—Input................................................................ 2-47
2.2.8.2 JTAG Test Data Output (TDO)—Output................................................... 2-47
2.2.8.3 JTAG Test Data Input (TDI)—Input ......................................................... 2-47
2.2.8.4 JTAG Test Mode Select (TMS)—Input..................................................... 2-48
2.2.8.5 JTAG Test Reset (TRST)—Input ..............................................................2-48
2.2.9 Configuration Signals....................................................................................2-48
2.2.9.1 501-Mode (BCTL0)—Input ...................................................................... 2-48
2.2.9.2 Address Map (DBG0)—Input ................................................................... 2-49
2.2.9.3 ROM Bank 0 Data Path Width (FOE)—Input........................................... 2-49
2.2.9.4 60x Clock Phase (LBCLAIM)—Input ...................................................... 2-49
2.2.9.5 Clock Mode (PLL[0–3])—Input................................................................ 2-49
2.2.9.6 ROM Location (RCS0)—Input ................................................................. 2-50
2.3 Clocking............................................................................................................. 2-50
Chapter 3
Device Programming
3.1 Address Maps ......................................................................................................3-1
3.1.1 Address Map A................................................................................................ 3-1
3.1.2 Address Map B ................................................................................................ 3-8
3.1.3 Emulation Mode Address Map...................................................................... 3-11
3.2 Configuration Registers.....................................................................................3-14
3.2.1 Configuration Register Access ...................................................................... 3-14
3.2.1.1 Configuration Register Access in Little-Endian Mode ............................. 3-14
3.2.1.2 Configuration Register Access in Big-Endian Mode ................................ 3-16
3.2.2 Configuration Register Summary.................................................................. 3-17
3.2.3 PCI Registers ................................................................................................. 3-21
3.2.3.1 PCI Command Register............................................................................. 3-22
3.2.3.2 PCI Status Register.................................................................................... 3-24
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viii MPC106 PCI/Bridge/Memory Controller User’s Manual MOTOROLA
3.2.4 Performance Monitor Registers..................................................................... 3-25
3.2.4.1 Performance Monitor Command Register (CMDR)—0x48 ..................... 3-25
3.2.4.2 Performance Monitor Mode Control Register (MMCR)—0x4C..............3-26
3.2.4.3 Performance Monitor Counters (PMC0, PMC1, PMC2, PMC3)—
0x50, 0x54, 0x58, 0x5C......................................................................... 3-27
3.2.5 Power Management Configuration Registers (PMCRs)................................ 3-28
3.2.6 Output Driver Control Register (ODCR)—0x73...........................................3-31
3.2.7 Error Handling Registers............................................................................... 3-33
3.2.7.1 ECC Single-Bit Error Registers................................................................. 3-33
3.2.7.2 Error Enabling Registers............................................................................ 3-34
3.2.7.3 Error Detection Registers ..........................................................................3-36
3.2.7.4 Error Status Registers ................................................................................ 3-38
3.2.8 Memory Interface Configuration Registers...................................................3-40
3.2.8.1 Memory Boundary Registers..................................................................... 3-40
3.2.8.2 Memory Bank Enable Register.................................................................. 3-44
3.2.8.3 Memory Page Mode Register....................................................................3-45
3.2.8.4 Memory Control Configuration Registers................................................. 3-46
3.2.9 Processor Interface Configuration Registers ................................................. 3-56
3.2.10 Alternate OS-Visible Parameters Registers................................................... 3-66
3.2.11 Emulation Support Configuration Registers.................................................. 3-68
3.2.11.1 Modified Memory Status Register............................................................. 3-70
3.2.12 External Configuration Registers................................................................... 3-71
Chapter 4
Processor Bus Interface
4.1 MPC106 Processor Bus Configuration................................................................ 4-1
4.1.1 Single-Processor System Configuration.......................................................... 4-1
4.1.2 Multiprocessor System Configuration............................................................. 4-1
4.1.3 Multiprocessor System Configuration with External L2 Cache...................... 4-3
4.1.4 Processor Bus Interface Configuration Registers............................................4-5
4.2 Processor Bus Protocol Overview ....................................................................... 4-5
4.2.1 MPC106 Arbitration........................................................................................4-6
4.2.2 Address Pipelining and Split-Bus Transactions............................................... 4-7
4.3 Address Tenure Operations..................................................................................4-8
4.3.1 Address Arbitration.......................................................................................... 4-8
4.3.2 Address Transfer Attribute Signals................................................................ 4-10
4.3.2.1 Transfer Type Signal Encodings................................................................ 4-10
4.3.2.2 TBST and TSIZ[0–2] Signals and Size of Transfer ..................................4-13
4.3.2.3 Burst Ordering During Data Transfers ...................................................... 4-13
4.3.2.4 Effect of Alignment on Data Transfers...................................................... 4-14
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MOTOROLA Contents ix
4.3.3 Address Transfer Termination ....................................................................... 4-16
4.3.3.1 MPC106 Snoop Response ......................................................................... 4-16
4.3.3.2 Address Tenure Timing Configuration......................................................4-17
4.4 Data Tenure Operations ..................................................................................... 4-18
4.4.1 Data Bus Arbitration......................................................................................4-18
4.4.2 Data Bus Transfers and Normal Termination................................................4-18
4.4.3 Data Tenure Timing Configurations..............................................................4-19
4.4.4 Data Bus Termination by TEA ...................................................................... 4-19
4.4.5 60x Local Bus Slave Support.........................................................................4-20
4.4.5.1 60x Local Bus Slave Timing .....................................................................4-21
Chapter 5
Secondary Cache Interface
5.1 L2 Cache Configurations..................................................................................... 5-2
5.1.1 Write-Back Cache Operation........................................................................... 5-2
5.1.2 Write-Through Cache Operation .....................................................................5-2
5.1.3 Synchronous Burst SRAMs.............................................................................5-2
5.1.4 Pipelined Burst SRAMs...................................................................................5-4
5.1.5 Asynchronous SRAMs .................................................................................... 5-6
5.1.6 Two-Bank Support........................................................................................... 5-7
5.2 Internal L2 Cache Controller Operation.............................................................. 5-8
5.2.1 L2 Cache Addressing....................................................................................... 5-8
5.2.2 L2 Cache Line Status....................................................................................... 5-9
5.2.3 L2 Cache Tag Lookup......................................................................................5-9
5.2.4 L2 Cache Castout Operations........................................................................ 5-10
5.2.5 L2 Cache Parity ............................................................................................. 5-10
5.2.6 L2 Cache Interface and Interrupt Vector Relocation..................................... 5-11
5.3 L2 Cache Response to Bus Operations.............................................................. 5-11
5.3.1 Write-Back L2 Cache Response.................................................................... 5-11
5.3.2 Write-Through L2 Cache Response............................................................... 5-18
5.4 L2 Cache Interface Parameters.......................................................................... 5-21
5.4.1 L2 Cache Interface Control Parameters ........................................................ 5-22
5.4.2 L2 Cache Interface Initialization Parameters................................................. 5-22
5.4.2.1 CF_L2_HIT_DELAY................................................................................5-24
5.4.2.2 CF_DOE.................................................................................................... 5-24
5.4.2.3 CF_WDATA .............................................................................................. 5-24
5.4.2.4 CF_WMODE............................................................................................. 5-25
5.4.2.4.1 Normal Write Timing without Partial Update (CF_WMODE = 0)....... 5-25
5.4.2.4.2 Normal Write Timing (CF_WMODE = 1)............................................5-26
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5.4.2.4.3 Delayed Write Timing (CF_WMODE = 2)........................................... 5-27
5.4.2.4.4 Early Write Timing (CF_WMODE = 3)................................................ 5-28
5.5 L2 Cache Interface Timing Examples ...............................................................5-29
5.5.1 Synchronous Burst SRAM L2 Cache Timing ...............................................5-29
5.5.1.1 L2 Cache Read Hit Timing........................................................................ 5-29
5.5.1.2 L2 Cache Write Hit Timing ....................................................................... 5-31
5.5.1.3 L2 Cache Line Update Timing .................................................................. 5-32
5.5.1.4 L2 Cache Line Castout Timing.................................................................. 5-33
5.5.1.5 L2 Cache Hit Timing Following PCI Read Snoop.................................... 5-35
5.5.1.6 L2 Cache Line Push Timing Following PCI Write Snoop ........................ 5-36
5.5.1.7 L2 Cache Line Invalidate Timing Following PCI
Write-with-Invalidate Snoop ................................................................. 5-37
5.5.2 Asynchronous SRAM L2 Cache Timing....................................................... 5-38
5.5.2.1 Burst Read Timing..................................................................................... 5-38
5.5.2.2 L2 Cache Burst Read Line Update Timing ............................................... 5-39
5.5.2.3 Burst Write Timing.................................................................................... 5-40
5.6 External L2 Cache Controller Operation........................................................... 5-41
5.6.1 External L2 Cache Operation ........................................................................5-42
5.6.2 External L2 Cache Controller Interface Parameters...................................... 5-42
Chapter 6
Memory Interface
6.1 Overview..............................................................................................................6-1
6.2 Memory Interface Signal Buffering..................................................................... 6-2
6.2.1 Flow-Through Buffers..................................................................................... 6-3
6.2.2 Transparent Latch Buffers ............................................................................... 6-4
6.2.3 Registered Buffers ........................................................................................... 6-5
6.2.4 Parity/ECC Path Read Control ........................................................................ 6-8
6.3 Memory Interface Signal Connections ................................................................ 6-8
6.4 DRAM/EDO Interface Operation...................................................................... 6-10
6.4.1 Supported DRAM/EDO Organizations......................................................... 6-12
6.4.2 DRAM/EDO Address Multiplexing.............................................................. 6-13
6.4.3 DRAM/EDO Power-On Initialization........................................................... 6-15
6.4.3.1 Supported Memory Interface Configurations............................................ 6-16
6.4.4 DRAM/EDO Interface Timing ...................................................................... 6-16
6.4.5 DRAM/EDO Burst Wrap............................................................................... 6-23
6.4.6 DRAM/EDO Latency.................................................................................... 6-23
6.4.7 DRAM/EDO Page Mode Retention .............................................................. 6-24
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MOTOROLA Contents xi
6.4.8 DRAM/EDO Parity and RMW Parity...........................................................6-25
6.4.8.1 RMW Parity Latency Considerations........................................................ 6-25
6.4.9 Error Checking and Correction—ECC.......................................................... 6-26
6.4.9.1 DRAM/EDO Interface Timing with ECC................................................. 6-26
6.4.10 DRAM/EDO Refresh..................................................................................... 6-30
6.4.10.1 DRAM/EDO Refresh Timing.................................................................... 6-30
6.4.10.2 DRAM/EDO Refresh and Power Saving Modes....................................... 6-31
6.4.10.2.1 Self-Refresh in Sleep and Suspend Modes............................................ 6-32
6.4.10.2.2 RTC Refresh in Suspend Mode............................................................. 6-33
6.4.11 Processor-to-DRAM Transaction Examples.................................................. 6-33
6.4.12 PCI-to-DRAM Transaction Examples........................................................... 6-37
6.5 SDRAM Interface Operation............................................................................. 6-44
6.5.1 Supported SDRAM Organizations ................................................................ 6-46
6.5.2 SDRAM Address Multiplexing.....................................................................6-47
6.5.3 SDRAM Burst and Single-Beat Transactions................................................ 6-49
6.5.4 SDRAM Page Mode Retention......................................................................6-49
6.5.5 SDRAM Power-On Initialization .................................................................. 6-51
6.5.6 JEDEC Standard SDRAM Interface Commands........................................... 6-53
6.5.7 SDRAM Interface Timing ............................................................................. 6-55
6.5.7.1 Processor-to-SDRAM Transaction Examples ........................................... 6-55
6.5.7.2 SDRAM Mode-Set Command Timing...................................................... 6-60
6.5.8 SDRAM Parity and RMW Parity .................................................................. 6-61
6.5.8.1 RMW Parity Latency Considerations........................................................ 6-62
6.5.9 External Error Checking Module (ECM) Support......................................... 6-62
6.5.9.1 External ECM Timing Examples............................................................... 6-64
6.5.10 SDRAM Refresh............................................................................................ 6-66
6.5.10.1 SDRAM Refresh Timing........................................................................... 6-68
6.5.10.2 SDRAM Refresh and Power Saving Modes.............................................. 6-68
6.6 ROM/Flash Interface Operation ........................................................................6-70
6.6.1 ROM/Flash Cacheability ...............................................................................6-73
6.6.2 64-Bit ROM/Flash Interface Timing .............................................................6-73
6.6.3 Processor Read from 64-Bit ROM Transaction Examples............................ 6-75
6.6.4 Eight-Bit ROM/Flash Interface Timing......................................................... 6-78
6.6.5 Processor Read from 8-Bit ROM Transaction Examples.............................. 6-79
6.6.6 ROM/Flash Interface Write Operations......................................................... 6-83
6.6.6.1 ROM/Flash Interface Write Timing........................................................... 6-83
6.6.6.2 Processor Write to 8-Bit ROM Transaction Example ............................... 6-84
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Chapter 7
PCI Bus Interface
7.1 PCI Interface Overview ....................................................................................... 7-1
7.1.1 MPC106 as a PCI Master.................................................................................7-2
7.1.2 MPC106 as a PCI Target.................................................................................. 7-2
7.2 PCI Bus Arbitration .............................................................................................7-3
7.3 PCI Bus Protocol ................................................................................................. 7-3
7.3.1 Basic Transfer Control..................................................................................... 7-3
7.3.2 PCI Bus Commands.........................................................................................7-4
7.3.3 Addressing.......................................................................................................7-6
7.3.3.1 Memory Space Addressing..........................................................................7-6
7.3.3.2 I/O Space Addressing .................................................................................. 7-7
7.3.3.3 Configuration Space Addressing.................................................................7-7
7.3.4 Device Selection.............................................................................................. 7-7
7.3.5 Byte Alignment................................................................................................7-8
7.3.6 Bus Driving and Turnaround ........................................................................... 7-8
7.4 PCI Bus Transactions...........................................................................................7-9
7.4.1 PCI Read Transactions..................................................................................... 7-9
7.4.2 PCI Write Transactions.................................................................................. 7-10
7.4.3 Transaction Termination................................................................................ 7-11
7.4.3.1 Master-Initiated Termination..................................................................... 7-11
7.4.3.2 Target-Initiated Termination...................................................................... 7-12
7.4.4 Fast Back-to-Back Transactions .................................................................... 7-14
7.4.5 Configuration Cycles..................................................................................... 7-15
7.4.5.1 The PCI Configuration Space Header ....................................................... 7-15
7.4.5.2 Accessing the PCI Configuration Space.................................................... 7-17
7.4.6 Other Bus Transactions.................................................................................. 7-21
7.4.6.1 Interrupt Acknowledge Transactions......................................................... 7-21
7.4.6.2 Special-Cycle Transactions........................................................................ 7-22
7.5 Exclusive Access ............................................................................................... 7-23
7.5.1 Starting an Exclusive Access......................................................................... 7-23
7.5.2 Continuing an Exclusive Access.................................................................... 7-24
7.5.3 Completing an Exclusive Access................................................................... 7-24
7.5.4 Attempting to Access a Locked Target.......................................................... 7-24
7.5.5 Exclusive Access and the MPC106............................................................... 7-24
7.6 PCI Error Functions........................................................................................... 7-25
7.6.1 PCI Parity.......................................................................................................7-25
7.6.2 Error Reporting.............................................................................................. 7-26
7.7 MPC106-Implemented PCI Sideband Signals................................................... 7-27
7.7.1 ISA_MASTER............................................................................................... 7-27
7.7.2 FLSHREQ and MEMACK............................................................................7-27
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7.8 Emulation Support............................................................................................. 7-28
7.8.1 PCI Address Decoding................................................................................... 7-28
7.8.2 Interrupt Vector Relocation............................................................................7-28
7.8.3 Modified Memory Status Register.................................................................7-28
7.8.4 Curious Code Protection................................................................................ 7-31
7.9 Processor-to-PCI Transaction Examples ...........................................................7-31
Chapter 8
Internal Control
8.1 Internal Buffers.................................................................................................... 8-1
8.1.1 60x Processor/System Memory Buffers .......................................................... 8-2
8.1.2 60x Processor/PCI Buffers...............................................................................8-3
8.1.2.1 Processor-to-PCI-Read Buffer (PRPRB)..................................................... 8-4
8.1.2.2 Processor-to-PCI-Write Buffers (PRPWBs)................................................ 8-5
8.1.3 PCI/System Memory Buffers........................................................................... 8-6
8.1.3.1 PCI-to-System-Memory-Read Buffer (PCMRB)........................................ 8-7
8.1.3.1.1 Speculative PCI Reads from System Memory........................................ 8-8
8.1.3.2 PCI-to-System-Memory-Write Buffers (PCMWBs)................................... 8-9
8.2 Internal Arbitration .............................................................................................. 8-9
Chapter 9
Error Handling
9.1 Priority of Externally-Generated Interrupts......................................................... 9-2
9.2 Interrupt and Error Signals .................................................................................. 9-3
9.2.1 System Reset.................................................................................................... 9-3
9.2.2 60x Processor Bus Error Signals .....................................................................9-3
9.2.2.1 Machine Check (MCP)................................................................................ 9-3
9.2.2.2 Transfer Error Acknowledge (TEA)............................................................ 9-4
9.2.3 PCI Bus Error Signals...................................................................................... 9-5
9.2.3.1 System Error (SERR) .................................................................................. 9-5
9.2.3.2 Parity Error (PERR)..................................................................................... 9-5
9.2.3.3 Nonmaskable Interrupt (NMI)..................................................................... 9-5
9.3 Error Reporting.................................................................................................... 9-6
9.3.1 60x Processor Interface....................................................................................9-7
9.3.1.1 Unsupported 60x Bus Transaction Error ..................................................... 9-7
9.3.1.2 Illegal L2 Copyback Error........................................................................... 9-7
9.3.1.3 Flash Write Error ......................................................................................... 9-7
9.3.2 Memory Interface ............................................................................................ 9-7
9.3.2.1 System Memory Read Data Parity Error..................................................... 9-8
9.3.2.2 L2 Cache Read Data Parity Error................................................................ 9-8
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9.3.2.3 System Memory ECC Error......................................................................... 9-8
9.3.2.3.1 External ECM Errors............................................................................... 9-9
9.3.2.4 System Memory Select Error....................................................................... 9-9
9.3.2.5 System Memory Refresh Overflow Error.................................................... 9-9
9.3.3 PCI Interface....................................................................................................9-9
9.3.3.1 Address Parity Error.................................................................................. 9-10
9.3.3.2 Data Parity Error........................................................................................ 9-10
9.3.3.3 Master-Abort Transaction Termination ..................................................... 9-10
9.3.3.4 Received Target-Abort Error ..................................................................... 9-11
9.3.3.5 NMI (Nonmaskable Interrupt)...................................................................9-12
9.4 Interrupt Latencies............................................................................................. 9-12
9.5 Example Signal Connections............................................................................. 9-12
Chapter 10
Performance Monitor
10.1 Performance Monitor Operation........................................................................ 10-1
10.2 Performance Monitor Events............................................................................. 10-2
10.2.1 Command Type 0 Events............................................................................... 10-3
10.2.2 Command Type 1 Events............................................................................... 10-4
10.2.3 Threshold Events ........................................................................................... 10-8
10.2.4 Burstiness.......................................................................................................10-8
10.2.5 Counter Overflow.......................................................................................... 10-9
Appendix A
Power Management
A.1 MPC106 Power Modes....................................................................................... A-1
A.1.1 MPC106 Power Mode Transition................................................................... A-1
A.1.2 Full-On Mode ................................................................................................. A-3
A.1.3 Doze Mode...................................................................................................... A-3
A.1.4 Nap Mode ....................................................................................................... A-3
A.1.5 Sleep Mode..................................................................................................... A-4
A.1.6 Suspend Mode................................................................................................. A-5
A.2 MPC106 Power Management Support ............................................................... A-6
A.2.1 Power Management Configuration Registers................................................. A-6
A.2.2 Clock Configuration ....................................................................................... A-6
A.2.3 PCI Address Bus Decoding ............................................................................ A-7
A.2.4 PCI Bus Special-Cycle Operations................................................................. A-7
A.2.5 Processor Bus Request Monitoring................................................................. A-7
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A.2.6 Memory Refresh Operations in Sleep/Suspend Mode.................................... A-8
A.2.7 PCI Bus Parking in Sleep and Suspend Modes .............................................. A-8
A.2.8 Device Drivers................................................................................................ A-8
Appendix B
Bit and Byte Ordering
B.1 Big-Endian Mode.................................................................................................B-1
B.2 Little-Endian Mode..............................................................................................B-5
Appendix C
JTAG/Testing Support
C.1 JTAG Interface Description.................................................................................C-1
C.1.1 JTAG Signals...................................................................................................C-2
C.1.2 JTAG Registers and Scan Chains....................................................................C-2
C.1.2.1 Bypass Register ...........................................................................................C-2
C.1.2.2 Boundary-Scan Registers.............................................................................C-2
C.1.2.3 Instruction Register......................................................................................C-3
C.1.3 TAP Controller ................................................................................................C-3
Appendix D
Initialization Example
Appendix E
Revision History
E.1 Revision Changes From Revision 1 to Revision 2............................................. D-1
Glossary of Terms and Abbreviations
Index
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Figures
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MOTOROLA Figures xvii
Figures
1-1 MPC106 Block Diagram............................................................................................. 1-2
2-1 MPC106 Signal Groupings......................................................................................... 2-3
2-2 SYSCLK Input with Internal Multiples.................................................................... 2-50
3-1 Address Map A (Contiguous Map)............................................................................. 3-4
3-2 Address Map A (Discontiguous Map) ........................................................................ 3-5
3-3 PCI Memory Map (Address Map A) .......................................................................... 3-6
3-4 PCI I/O Map (Address Map A)...................................................................................3-7
3-5 Address Map B.......................................................................................................... 3-10
3-6 Emulation Mode Address Map ................................................................................. 3-13
3-7 MPC106 Configuration Space.................................................................................. 3-21
3-8 PCI Command Register ............................................................................................ 3-22
3-9 PCI Status Register ................................................................................................... 3-24
3-10 Performance Monitor Command Register (CMDR)—0x48..................................... 3-25
3-11 Performance Monitor Mode Control Register (MMCR)—0x4C ............................. 3-26
3-12 Performance Monitor Counter (PMCn)....................................................................3-28
3-13 Power Management Configuration Register 1 (PMCR1)......................................... 3-28
3-14 Power Management Configuration Register 2 (PMCR2)......................................... 3-30
3-15 Output Driver Control Register (ODCR)—0x73...................................................... 3-31
3-16 ECC Single-Bit Error Counter Register—0xB8....................................................... 3-33
3-17 ECC Single-Bit Error Trigger Register—0xB9........................................................ 3-33
3-18 Error Enabling Register 1 (ErrEnR1)........................................................................ 3-34
3-19 Error Enabling Register 2 (ErrEnR2)........................................................................ 3-35
3-20 Error Detection Register 1 (ErrDR1)—0xC1 ........................................................... 3-36
3-21 Error Detection Register 2 (ErrDR2)—0xC5 ........................................................... 3-37
3-22 60x Bus Error Status Register—0xC3 ...................................................................... 3-38
3-23 PCI Bus Error Status Register—0xC7......................................................................3-39
3-24 60x/PCI Error Address Register—0xC8................................................................... 3-39
3-25 Memory Starting Address Register 1—0x80............................................................ 3-40
3-26 Memory Starting Address Register 2—0x84............................................................ 3-41
3-27 Extended Memory Starting Address Register 1—0x88............................................ 3-41
3-28 Extended Memory Starting Address Register 2—0x8C........................................... 3-41
3-29 Memory Ending Address Register 1—0x90............................................................. 3-42
3-30 Memory Ending Address Register 2—0x94............................................................. 3-42
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xviii MPC106 PCI/Bridge/Memory Controller User’s Manual MOTOROLA
3-31 Extended Memory Ending Address Register 1—0x98............................................. 3-43
3-32 Extended Memory Ending Address Register 2—0x9C............................................3-43
3-33 Memory Bank Enable Register—0xA0....................................................................3-44
3-34 Memory Page Mode Register—0xA3....................................................................... 3-45
3-35 Memory Control Configuration Register 1 (MCCR1)—0xF0 ................................. 3-46
3-36 Memory Control Configuration Register 2 (MCCR2)—0xF4 ................................. 3-49
3-37 Memory Control Configuration Register 3 (MCCR3)—0xF8 ................................. 3-51
3-38 Memory Control Configuration Register 4 (MCCR4)—0xFC................................. 3-54
3-39 Processor Interface Configuration Register 1 (PICR1)—0xA8................................ 3-57
3-40 Processor Interface Configuration Register 2 (PICR2)—0xAC............................... 3-61
3-41 Alternate OS-Visible Parameters Register 1—0xBA ............................................... 3-66
3-42 Alternate OS-Visible Parameters Register 2—0xBB................................................ 3-67
3-43 Emulation Support Configuration Register 1 (ESCR1)—0xE0 ............................... 3-68
3-44 Emulation Support Configuration Register 2 (ESCR2)—0xE8 ............................... 3-69
3-45 Modified Memory Status Register—0xE4/0xEC ..................................................... 3-70
3-46 External Configuration Register 1—Port 0x092....................................................... 3-71
3-47 External Configuration Register 2—Port 0x81C...................................................... 3-72
3-48 External Configuration Register 3—Port 0x850....................................................... 3-72
4-1 Single-Processor Configuration with Optional L2 Cache........................................... 4-2
4-2 Multiprocessor Configuration.....................................................................................4-3
4-3 Multiprocessor Configuration with External L2 Cache.............................................. 4-4
4-4 Overlapping Tenures on the 60x Bus for a Single-Beat Transfer ............................... 4-6
4-5 Address Bus Arbitration with Dual Processors........................................................... 4-9
4-6 Address Pipelining.................................................................................................... 4-10
4-7 Snooped Address Transaction with ARTRY and L1 Cache Copyback.................... 4-17
4-8 Single-Beat and Burst Data Transfers....................................................................... 4-19
4-9 Data Tenure Terminated by Assertion of TEA ......................................................... 4-20
4-10 Local Bus Slave Transaction.....................................................................................4-23
4-11 60x Bus State Diagram.............................................................................................. 4-24
5-1 Typical L2 Cache Using Burst SRAM (Write-Back).................................................. 5-3
5-2 Typical L2 Cache Using Pipelined Burst SRAM (Write-Back, ADSC Only)............ 5-4
5-3 Alternate L2 Cache Using Pipelined Burst SRAM (Write-Back
Using ADSP).......................................................................................................... 5-5
5-4 Typical L2 Cache Using Asynchronous SRAM (Write-Back)................................... 5-6
5-5 512-Kbyte, Two-Bank, L2 Cache Using Synchronous Burst SRAM (Write-Back)... 5-7
5-6 1-Mbyte, Two-Bank, L2 Cache Using Pipelined Burst SRAM
(Write-Back, ADSC Only)..................................................................................... 5-8
5-7 HIT and DIRTY_IN Delay Configuration................................................................ 5-24
5-8 External Byte Decode Logic Requiring CF_WMODE = 1 ...................................... 5-26
5-9 Normal Write Timing (CF_WMODE = 0 or 1)........................................................ 5-26
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