Texas Instruments TMS320C6416 Seamless CVE Model (Rev. B) User guide

Category
Supplementary music equipment
Type
User guide
TMS320C6416
Seamless CVE Model
Users Guide
Literature Number: SPRU548B
May 2002
Printed on Recycled Paper
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Copyright 2002, Texas Instruments Incorporated
vRead This First
Preface
Read This First
About This Manual
This document contains the following chapters:
Chapter one describes some of the features of the TMS320C6416 Seamless
CVE model, including features supported, device pins, accuracy and known
limitations.
The second chapter takes you through the tutorials provided with the Seam-
less CVE model.
Notational Conventions
This document uses the following conventions.
- Program listings, program examples, and interactive displays are shown
in a special typeface similar to a typewriter’s. Examples use a bold
version of the special typeface for emphasis; interactive displays use a
bold version of the special typeface to distinguish commands that you
enter from items that the system displays (such as prompts, command
output, error messages, etc.).
Here is a sample program listing:
0011 0005 0001 .field 1, 2
0012 0005 0003 .field 3, 4
0013 0005 0006 .field 6, 3
0014 0006 .even
Here is an example of a system prompt and a command that you might
enter:
C: csr –a /user/ti/simuboard/utilities
- In syntax descriptions, the instruction, command, or directive is in a bold
typeface font and parameters are in an italic typeface. Portions of a syntax
that are in bold should be entered as shown; portions of a syntax that are
in italics describe the type of information that should be entered. Here is
an example of a directive syntax:
.asect section name”, address
Notational Conventions
vi
.asect is the directive. This directive has two parameters, indicated by sec-
tion name and address. When you use .asect, the first parameter must be
an actual section name, enclosed in double quotes; the second parameter
must be an address.
- Square brackets ( [ and ] ) identify an optional parameter. If you use an
optional parameter, you specify the information within the brackets; you
don’t enter the brackets themselves. Heres an example of an instruction
that has an optional parameter:
LALK 16–bit constant [, shift]
The LALK instruction has two parameters. The first parameter, 16-bit con-
stant, is required. The second parameter, shift, is optional. As this syntax
shows, if you use the optional second parameter, you must precede it with
a comma.
Square brackets are also used as part of the pathname specification for
VMS pathnames; in this case, the brackets are actually part of the path-
name (they are not optional).
- Braces ( { and } ) indicate a list. The symbol | (read as or) separates items
within the list. Heres an example of a list:
{ * | *+ | *– }
This provides three choices: *, *+, or *–.
Unless the list is enclosed in square brackets, you must choose one item
from the list.
- Some directives can have a varying number of parameters. For example,
the .byte directive can have up to 100 parameters. The syntax for this di-
rective is:
.byte value
1
[, ... , value
n
]
This syntax shows that .byte must have at least one value parameter, but
you have the option of supplying additional value parameters, separated
by commas.
Information About Cautions and Warnings
viiRead This First
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you
.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Trademarks
TI is a trademark of Texas Instruments Incorporated.
Microsoft is a registered trademark of Microsoft Corporation.
Windows and Windows NT are registered trademarks of Microsoft Corporation.
Seamless CVE is a trademark of Mentor Graphics Corporation.
Contents
ix
Contents
1 Features of the TMS320C6416 Seamless CVE 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Describes the processor support package, methods for invoking, supported devices, simula-
tion features, and known limitations of the TMS320C6416 Seamless CVE model.
1.1 Processor Support Package 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.1 Contents 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.2 Licensing Information 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.3 Supported Platforms 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1.4 Versions 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 How to Invoke 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.1 Setting Up the Seamless CVE 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.2 Setting Up the ISS 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.3 Setting up the BIM 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Supported TMS320C6416 Device Pins 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Simulation Features 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.1 BootLoad 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.2 Reset Sequence 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.3 Clock Behavior 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Seamless Features Supported 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5.1 Seamless Optimization 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5.2 HW Break 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5.3 Loading COFF into External Memory 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Simulation Accuracy 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Known Limitations 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 TMS320C6416 Seamless CVE Model Tutorial 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contains tutorials that allow you to explore some of the capabilities of the TMS320C6416
Seamless CVE model.
2.1 Hooking up the Denali SRAM 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1.1 Connecting the TMS320C6416 Device and a Denali SRAM Model 2-2. . . . . . . . .
2.1.2 Performing Seamless Optimizations 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1.3 Performing COFF Load into External Memory 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Using the Serial Port 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.1 Using the Serial Port for Transmission and Reception 2-4. . . . . . . . . . . . . . . . . . . .
2.2.2 Generating Serial Port Events 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Simulating External Interrupts 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
x
2.3.1 Using External Interrupts 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Using the HPI 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.1 Performing HPI Bootload 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.2 Performing HOST Reads and Writes 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Using the Utopia 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.1 Performing Read and Write of an ATM Cell 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.6 Using the Hardware/Software Synchronization Feature 2-10. . . . . . . . . . . . . . . . . . . . . . . . .
2.6.1 How to Use the Synchronization Feature 2-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.6.2 Performing SYNCHRONIZATION_ON/_OFF During EMIF Transactions 2-10. . .
2.6.3 Synchronization Feature on External Interrupt 2-11. . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 Using Host Port Interface and Utopia On/Off Switch 2-12. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7.1 How to Use the Switching Feature 2-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8 Using the GPIO 2-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8.1 Generating EDMA Events and CPU Interrupts Using GPIO 2-13. . . . . . . . . . . . . .
2.9 Using the PCI 2-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.1 Performing the PCI Bootload 2-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.2 lPerforming PCI Slave Reads/Writes 2-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.3 Performing PCI Master Reads/Writes 2-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
FeaturesĂofĂtheĂTMS320C6416ĂSeamlessĂCVEĂ
This chapter describes the processor support package, methods for invoking,
supported devices, simulation features, simulation accuracy, and known limi-
tations of the TMS320C6416 Seamless CVE model.
Topic Page
1.1 Processor Support Package 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 How to Invoke 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Supported TMS320C6416 Device Pins 1-6. . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Simulation Features 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Seamless Features Supported 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Simulation Accuracy 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Known Limitations 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1
Processor Support Package
1-2
1.1 Processor Support Package
The TMS320C6416 Seamless model simulates most of the pins of the
TMS320C6416 device accurately. The TMS320C6416 Processor Support
Package contains the Seamless model and all associated files required to run
in a Mentor Seamless CVE environment.
Code Composer Studio IDE, the debugger interface for the TMS320C6416
ISS, is not shipped as part of this package. Please contact Texas Instruments
to obtain a copy.
1.1.1 Contents
The package contains the following
- TMS320C6416 Seamless Model
- TMS320C6416 Seamless CVE Model User’s Guide
- Code Composer Studio GEL files that implement some of the standard
ISS commands to Seamless
- Binaries and Library files needed by the TMS320C6416 Seamless model
for execution
- Examples that help in using the various features of the TMS320C6416
Seamless model
1.1.2 Licensing Information
The TMS320C6416 Seamless model is a licensed product. Licenses need to
be obtained for two different entities of the product
- TMS320C6416 Seamless CVE model
- Code Composer Studio IDE on Solaris
Licenses for the model can be obtained by contacting Mentor Graphics Sup-
port. Please contact Texas Instruments to obtain licenses for Code Composer
Studio IDE.
1.1.3 Supported Platforms
The model is supported only on the UNIX–Solaris platform.
1.1.4 Versions
The following Solaris versions are supported:
Processor Support Package
1-3Features of the TMS320C6416 Seamless CVE
J
SUNOS 5.5.1 (SOLARIS 2.5.1)
J SUNOS 5.6 (SOLARIS 2.6)
The model supports Seamless CVE version 4.1.
The model supports ModelSim version 5.4c.
The model works with Code Composer Studio IDE V1.1 and V2.0 on the UNIX
platform.
How to Invoke
1-4
1.2 How to Invoke
This section details the steps to be performed to invoke the TMS320C6416
Seamless model. Please invoke the Seamless CVE executable only after the
ISS and BIM have been successfully set up, as seen in sections 1.2.2 and
NO TAG of this document.
1.2.1 Setting Up the Seamless CVE
Please refer the Mentor Graphics Seamless CVE User Guide for details as to
how to setup the Seamless CVE application.
The TMS320C6416 Seamless model is released as part of the Mentor Graph-
ics Seamless release tree.
1.2.2 Setting Up the ISS
1) Set the environment variable TI_PSP_DIR to the installation directory
2) Ensure that the location of cc_app (Code Composer Studio IDE) is in your
path.
3) Invoke cc_setup, select the tisimC64xx board and add to the system. For
more help, refer to the Code Composer Studio help.
4) Edit the board properties to select the simulator config file
simc6416seamless.cfg from the directory:
TI_PSP_DIR/isms/TMS320C6416/.
1.2.3 Setting up the BIM
1) Set the environment variable TI_PSP_DIR to the installation directory.
2) Set the environment variables CVE_HOME and MODELSIM.
3) Go to TI_PSP_DIR/isms/TMS320C6416/ and source the script
setup_tms320c6416
Sourcing this script will override the TI_PSP_DIR settings and point it to
CVE_HOME. If you do not source the script, you need to do the following set-
tings yourself:
- LD_LIBRARY_PATH settings
You need to set the LD_LIBRARY_PATH environment variable to include
H TI_PSP_DIR/isms/TMS320C6416,
How to Invoke
1-5Features of the TMS320C6416 Seamless CVE
H TI_PSP_DIR/lib/TMS320C6416, and
H TI_PSP_DIR/lib/TMS320C6416/VIP_MODEL/
VIP_END_USER_40/SunOS5/lib.
- VIPENV_VHD settings
You need to set the VIPENV_VHD environment variable to
H TI_PSP_DIR/lib/TMS320C6416/VIP_MODEL
- PATH settings.
You need to set the path to include the directories
H $(CVE_HOME}/bin, ${VIPENV_VHD}/SunOS5/bin
H ${VIPENV_VHD}/jre/SunOS5/bin
- VHDL GENERIC settings.
You need to set the VHDL generic ENDIAN_MODE. By default it is set to 1.
H 1 – little endian
H 0 – big endian
Supported TMS320C6416 Device Pins
1-6
1.3 Supported TMS320C6416 Device Pins
The following table summarizes the pins simulated by the TMS320C6416
Seamless Model.
Table 1–1. Pins Simulated by the TMS320C6416 Seamless Model
Pin Name Direction Width Supported Peripherals
CLKIN IN 1 X CLOCKING/PLL
CLKMODE IN 2–0 CLOCKING/PLL
PLLV OUT 1 CLOCKING/PLL
RESET IN 1 X SYSTEM CONTROL
PCI_EN IN 1 X SYSTEM CONTROL
MCBSP2_EN IN 1 X SYSTEM CONTROL
TINP IN 2–0 TIMER
BARDY IN 1 X EMIFB (16 BIT EXTERNAL MEMORY INT)
BHOLD IN 1 EMIFB (16 BIT EXTERNAL MEMORY INT)
BECLKIN IN 1 X EMIFB (16 BIT EXTERNAL MEMORY INT)
AARDY IN 1 X EMIFA (64 BIT EXTERNAL MEMORY INT)
AHOLD IN 1 EMIFA (64 BIT EXTERNAL MEMORY INT)
AECLKIN IN 1 EMIFA (64 BIT EXTERNAL MEMORY INT)
TCLK IN 1 EMULATION CONTROL
TDI IN 1 EMULATION CONTROL
TMS IN 1 EMULATION CONTROL
TRST IN 1 EMULATION CONTROL
UXCLK IN 1 X UTOPIA
URSOC IN 1 X UTOPIA
URENB IN 1 X UTOPIA
URDATA IN 7–0 X UTOPIA
CLKS0 IN 1 MCBSP0
CLKS2_GP8 INOUT 1 X MCBSP2
DR0 IN 1 X MCBSP2
GP0 INOUT 1 X GPIO
GP1_CLKOUT4 INOUT 1 X SYSTEM CONTROL
GP2_CLKOUT6 INOUT 1 X SYSTEM CONTROL
NMI IN 1 X SYSTEM CONTROL
GP3 INOUT 1 X SYSTEM CONTROL
GP4_EINT4 INOUT 1 X SYSTEM CONTROL
GP5_EINT5 INOUT 1 X SYSTEM CONTROL
GP6_EINT6 INOUT 1 X SYSTEM CONTROL
GP7_EINT7 INOUT 1 X SYSTEM CONTROL
XSP_CS OUT 1 PCI SERIAL EEPROM INTERFACE
TOUT OUT 2–0 TIMER
BED INOUT 15–0 X EMIFB 16 BIT MEMORY INTERFACE
BEA INOUT 8–1 X EMIFB 16 BIT MEMORY INTERFACE
BEA09 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA10 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
Supported TMS320C6416 Device Pins
1-7Features of the TMS320C6416 Seamless CVE
Table 11. Pins Simulated by the TMS320C6416 Seamless Model (Continued)
Pin Name Direction Width Supported Peripherals
BEA11_UTOPIAEN INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA20_LENDIAN INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA13_PCIEEAI INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA14_BECLKINSEL0 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA15_BECLKINSEL1 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA12 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA17_AECLKINSEL1 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA18_BOOTMODE0 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA19_BOOTMODE1 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BEA16_AECLKINSEL0 INOUT 1 X EMIFB 16 BIT MEMORY INTERFACE
AEDH INOUT 31–0 X EMIFA 64 BIT MEMORY INTERFACE
AEDL INOUT 31–0 X EMIFA 64 BIT MEMORY INTERFACE
EMU INOUT 9–0 EMULATION CONTROL
EMUCLK INOUT 1–0 EMULATION CONTROL
UXCLAV OUT 1 X UTOPIA
UXENB IN 1 X UTOPIA
UXADDR0 IN 1 X UTOPIA
URCLAV OUT 1 X UTOPIA
URCLK IN 1 X UTOPIA
DX1_UXADDR4 INOUT 1 X MCBSP1/UTOPIA
FSX1_UXADDR3 INOUT 1 X MCBSP1/UTOPIA
FSR1_UXADDR2 INOUT 1 X MCBSP1/UTOPIA
DR1_UXADDR1 IN 1 X MCBSP1/UTOPIA
CLKX1_UXADDR4 INOUT 1 X MCBSP1/UTOPIA
CLKS1_UXADDR3 IN 1 X MCBSP1/UTOPIA
CLKR1_UXADDR2 INOUT 1 X MCBSP1/UTOPIA
URADDR IN 1–0 X UTOPIA
CLKX0 INOUT 1 X MCBSP0
CLKX2_XSPCLK INOUT 1 X MCBSP2/PCI
CLKR0 INOUT 1 X MCBSP0
CLKR2 INOUT 1 X MCBSP2
FSX0 INOUT 1 X MCBSP0
FSX2 INOUT 1 X MCBSP2
FSR0 INOUT 1 X MCBSP0
DR2_XSPDI IN 1 X MCBSP2/PCI
FSR2 INOUT 1 X MCBSP2
PCBE0 INOUT 1 PCI
HDS2_PCBE1 INOUT 1 X HPI/PCI
HRW_PCBE2 INOUT 1 X HPI/PCI
GP9_PIDSEL INOUT 1 X GPIO/PCI
GP10_PCBE3 INOUT 1 X GPIO/PCI
GP11_PREQ INOUT 1 X GPIO/PCI
GP12_PGNT INOUT 1 X GPIO/PCI
GP13_PINTA INOUT 1 X GPIO/PCI
Supported TMS320C6416 Device Pins
1-8
Table 11. Pins Simulated by the TMS320C6416 Seamless Model (Continued)
Pin Name Direction Width Supported Peripherals
GP14_PCLK INOUT 1 X GPIO/PCI
GP15_PRST INOUT 1 X GPIO/PCI
HINT_PFRAME INOUT 1 X HPI/PCI
HCNTRL0_PSTOP INOUT 1 X HPI/PCI
HCNTRL1_PDEVSEL INOUT 1 X HPI/PCI
HHWIL_PTRDY INOUT 1 X HPI/PCI
HAS_PPAR INOUT 1 X HPI/PCI
HCS_PPERR INOUT 1 X HPI/PCI
HDS1_PSERR INOUT 1 X HPI/PCI
HRDY_PIRDY INOUT 1 X HPI/PCI
HD_AD INOUT 31–0 X HPI/PCI
BCE OUT 3–0 X EMIFB 16 BIT MEMORY INTERFACE
BBE OUT 1–0 X EMIFB 16 BIT MEMORY INTERFACE
BSDCAS OUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BSDRAS OUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BSOE3 OUT 1 EMIFB 16 BIT MEMORY INTERFACE
BSDWE OUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BHOLDA OUT 1 EMIFB 16 BIT MEMORY INTERFACE
BBUSREQ OUT 1 EMIFB 16 BIT MEMORY INTERFACE
BPDT OUT 1 EMIFB 16 BIT MEMORY INTERFACE
BECLKOUT1 OUT 1 X EMIFB 16 BIT MEMORY INTERFACE
BECLKOUT2 OUT 1 EMIFB 16 BIT MEMORY INTERFACE
AEA OUT 19–0 X EMIFA 64 BIT MEMORY INTERFACE
ACE OUT 3–0 X EMIFA 64 BIT MEMORY INTERFACE
ABE OUT 7–0 X EMIFA 64 BIT MEMORY INTERFACE
ASDCAS OUT 1 X EMIFA 64 BIT MEMORY INTERFACE
ASDRAS OUT 1 X EMIFA 64 BIT MEMORY INTERFACE
ASOE3 OUT 1 EMIFA 64 BIT MEMORY INTERFACE
ASDWE OUT 1 X EMIFA 64 BIT MEMORY INTERFACE
ASCKE OUT 1 EMIFA 64 BIT MEMORY INTERFACE
AHOLDA OUT 1 EMIFA 64 BIT MEMORY INTERFACE
ABUSREQ OUT 1 EMIFA 64 BIT MEMORY INTERFACE
APDT OUT 1 EMIFA 64 BIT MEMORY INTERFACE
AECLKOUT1 OUT 1 X EMIFA 64 BIT MEMORY INTERFACE
AECLKOUT2 OUT 1 EMIFA 64 BIT MEMORY INTERFACE
TDO OUT 1 EMULATION CONTROL
UXSOC OUT 1 X UTOPIA
UXDATA OUT 7–0 X UTOPIA
DX0 OUT 1 X MCBSP0
DX2_XSPDO OUT 1 X MCBSP2/PCI
Simulation Features
1-9Features of the TMS320C6416 Seamless CVE
1.4 Simulation Features
1.4.1 BootLoad
The TMS320C6416 Seamless model supports device BOOTLOAD through
the EMIF pins.
At reset the model samples the pins BEA(19:18). The bootload operation hap-
pens depending on these pin values:
0 No Boot load. The model begins execution from the memory located at
address 0.
1 Boot load through HPI/PCI. The boot load is done through the Host Port
Interface (HPI) or the Peripheral Component Interconnect (PCI) port. The CPU
will wait till an external host initializes the CPUs memory space as necessary
through the parallel port. Once this is done, the CPU begins execution from
address 0. Boot load happens through PCI if PCI is enabled, otherwise Boot-
load happens through HPI.
2 Boot load from EMIF B CE1 space start address (0x64000000). (ROM
boot process) The EDMA copies 1K bytes from the beginning of CE1 to ad-
dress 0, using default ROM timings. After the transfer the CPU begins execut-
ing from address 0.
3 Quick Boot Load. This feature is supported by the model and not the actual
device. In this mode, the bootload will be performed through debug reads of
1K bytes from memory address 0x90000000. Once this is complete, the CPU
begins execution from address 0.
1.4.2 Reset Sequence
The TMS320C6416 Seamless model performs reset by sampling the RESET
pin. The reset pulse width should be a minimum of 10 CPU clock cycles. The
RESET pin is not sampled after the first reset.
The device reset uses active low signal RESET. While the RESET is low the
model is held in its reset state. The control will be with the Hardware simulator.
Most output pins go to their default state. The rising edge on the RESET starts
the model run with the prescribed boot configuration. The following pins are
sampled at reset:
- BEA20_LENDIAN : The model will sample this pin to ensure that the In-
struction Set Simulator (ISS) and the Bus Interface Model (BIM) are oper-
ating in the same endian. A ’1 on this pin will mean that the model should
Simulation Features
1-10
be operating in the little endian mode, whereas a ’0’ on this will mean that
the model should be operating in the big endian. The model will check to
see if the ISS and BIM are operating in the same endian, and if they are
not it will give an error message and exit.
- Boot load config pins BE18_BOOTMODE0, BE19_BOOTMODE1. The
values on these pins determine the boot load mode as explained in section
1.4.1, on page 1-9.
1.4.3 Clock Behavior
The model operates from the clock supplied by the CLKIN pin. The EMIF oper-
ates at 1/4th this clock frequency, whereas the HPI/PCI and Utopia operate at
1/2 this clock frequency. For the model to work properly, the rising edge of all
the clocks should be in sync when the reset is applied.
The EMIF doesnt support other clock frequencies or external clock inputs.
Seamless Features Supported
1-11Features of the TMS320C6416 Seamless CVE
1.5 Seamless Features Supported
1.5.1 Seamless Optimization
1.5.1.1 Memory Optimization
To learn more about Memory Optimization, please read the Mentor Graphics
Seamless CVE Users Guide.
TMS320C6416 PSP supports Memory Optimization. This feature has been
tested with Denali SRAM models. While using the Memory optimization fea-
ture, please register the memory ranges that are to be optimized, with the
Seamless CVE.
1.5.1.2 Time Optimization
To learn more about Time Optimization refer to the Mentor Graphics Seamless
CVE manuals.
The TMS320C6416 Seamless model supports the Time Optimization feature.
This optimization can be enabled at any time of execution of the model. The
model takes care of any unfinished pipelined memory requests that may be
pending at the time of turning on the Time Optimization feature, before switch-
ing into optimized mode of execution.
1.5.1.3 Ratio Time Optimization
To learn more about Ratio Time Optimization please refer to the Mentor Graph-
ics Seamless CVE Users Guide.
On the same lines of support for Time Optimization, the TMS320C6416 Seam-
less model supports Ratio Time Optimization also.
1.5.2 HW Break
This command is implemented as a Code Composer Studio GEL function. In-
voking this function from Code Composer Studio IDE causes the hardware
simulator to go into an interactive mode. It is possible to simultaneously use
both the hardware simulator and Code Composer Studio IDE interactively.
1.5.3 Loading COFF into External Memory
The TMS320C6416 Seamless model allows loading of a COFF file into exter-
nal memories. The hardware simulator is not advanced while the load is in
progress.
Seamless Features Supported
1-12
This feature is supported only when the external memories are Seamless me-
mories such as Denali memory models.
The COFF load is performed by loading the file through Code Composer Stu-
dio.
Simulation Accuracy
1-13Features of the TMS320C6416 Seamless CVE
1.6 Simulation Accuracy
The TMS320C6416 Seamless Model simulates the following blocks of the de-
vice:
J CPU
J L1, L2 Cache System
J Enhanced DMA subsystem
J Interrupt Selector
J Timers
J Serial Ports (McBSP)
J TCP, VCP coprocessors
J EMIF interface
J Utopia–II
J HPI/PCI
J GPIO
CPU The CPU core of the device has been modeled accurately both in terms
of functionality and cycles.
L1, L2 Cache System All of the functionality in the L1, L2 Cache system has
been modeled in the TMS320C6416 Seamless Model. The simulation of the
Cache System is still not 100% cycle accurate though. L1P is not accurate on
the Instruction Read Misses. L1D is very accurate on Data Read misses and
Victim requests to L2, but is about 95% accurate on L1D write miss cycles.
EDMA The EDMA subsystem is modeled functionally to support complete
programmability of the EDMA configuration registers. The number of cycles
spent in the subsystem is however inaccurate.
Peripherals such as the EMIF, Timer, Serial Ports, Utopia, GPIO, HPI, and PCI
are modeled accurately for functionality and cycles. Coprocessors TCP/VCP
are modeled accurately for functionality and cycles.
Please refer to Section 1.7 on page 1-14 for known limitations in the
TMS320C6416 Seamless model.
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Texas Instruments TMS320C6416 Seamless CVE Model (Rev. B) User guide

Category
Supplementary music equipment
Type
User guide

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