AIC SB101-SP User manual

UM_SB101-SP_v1.3_012020

SB101-SP

Storage Server Barebone

User's Manual

Table of Contents

Preface �� i

Safety Instructions �� ii

About This Manual �� iv

Chapter 1� Product Features ��1

1�1 Box Contents ��1

1�2 Specications��2

1�3 Features ��3

Chapter 2� Hardware Setup ��6

2�1 Central Processing Unit Setup ��6

2.1.1 Processor Installation ........................................................................................6

2�2 System Memory Setup ��9

2.2.1 DIMM Installation ...............................................................................................9

2.2.2 DIMM Location ................................................................................................ 10

2.2.3 DIMM Slot Installation Order........................................................................... 11

2�3 Removing the Top Cover ��12

2�4 Removing and Installing the Power Supply Unit Module �� 13

2.4.1 Removing the Power Supply Unit ................................................................... 13

2.4.2 Installing the Power Supply Unit ..................................................................... 13

2�5 Removing and Installing the Fan Module ��14

2.5.1 Removing the Fan ............................................................................................ 14

2.5.2 Installing the Fan ............................................................................................. 14

2�6 Removing and Installing the Hard Disk Drive �� 15

2.6.1 Removing and Installing the Hard Disk Drive Tray ........................................ 15

2.6.2 Installing the Hard Disk Drive ......................................................................... 15

2�7 Removing and Installing the HDD Backplane Module ��16

2.7.1 Removing the HDD Backplane ....................................................................... 16

2.7.2 Installing the HDD Backplane ........................................................................ 16

2�8 Removing and Installing the Riser Card ��17

2.8.1 Removing the Riser Card ................................................................................. 17

2.8.2 Installing the Riser Card .................................................................................. 17

2�9 Slide Rail Installation �� 18

Chapter 3� Hardware Settings �� 21

3�1 Motherboard Block Diagram ��21

3�2 Motherboard Content List ��22

3�3 Motherboard Layout ��23

3�4 Connector and Jumper ��24

3�5 HDD Backplane ��26

3.5.1 Layout ............................................................................................................... 26

3.5.2 Connector and Jumper Location .................................................................... 27

3.5.3 Connector and Jumper .................................................................................... 27

3.5.4 LED Indicator ................................................................................................... 28

Chapter 4. BIOS Conguration Settings �� 29

4�1 Navigation Keys ��29

Content

4�2 BIOS Menu ��30

4�3 Main ��31

4.3.1 Main .................................................................................................................. 31

4�4 Advanced ��32

4.4.1 iSCSI Conguration ......................................................................................... 32

4.4.2 Intel® Virtual RAID on CPU ............................................................................. 33

4.4.3 Trusted Computing .......................................................................................... 33

4.4.4 APCI Settings ................................................................................................... 33

4.4.5 Hardware Health Conguration ...................................................................... 33

4.4.6 Onboard Device Conguration ........................................................................ 33

4.4.7 AST2500 Super IO Conguration .................................................................... 34

4.4.8 S5 RTC Wake Settings ..................................................................................... 34

4.4.9 Serial Port Console Redirection ...................................................................... 34

4.4.10 Option ROM Dispatch Policy ........................................................................ 35

4.4.11 PCI Subsystem Settings ................................................................................ 35

4.4.12 Network Stack Conguration ........................................................................ 36

4.4.13 CSM Conguration ........................................................................................ 36

4.4.14 USB Conguration ......................................................................................... 36

4.4.15 NVDIMM ADR Conguration ......................................................................... 37

4.5 Platform Conguration ��38

4.5.1 Platform Conguration .................................................................................... 38

4.5.2 PCH Conguration .......................................................................................... 39

4.5.3 Miscellaneous Conguration ......................................................................... 40

4.5.4 Server ME Conguration ................................................................................ 40

4.6 Socket Conguration ��41

4.6.1 Socket Conguration ....................................................................................... 41

4.6.2 Processor Conguration ................................................................................ 42

4.6.3 Common RefCode Conguration .................................................................... 42

4.6.4 UPI Conguration ............................................................................................ 42

4.6.5 Memory Conguration ..................................................................................... 43

4.6.6 IIO Conguration ............................................................................................. 43

4.6.7 Advanced Management Power Conguration ............................................... 45

4�7 Server Management ��46

4.7.1 Server Management ........................................................................................ 46

4.7.2 System Event Log ............................................................................................ 47

4.7.3 BMC Network Conguration ........................................................................... 47

4�8 Security �� 48

4.8.1 Security ............................................................................................................ 48

4�9 Boot ��50

4.9.1 Boot .................................................................................................................. 50

4.9.2 Delete Boot Option ......................................................................................... 50

4�10 Save and Exit ��51

4.10.1 Save and Exit.................................................................................................. 51

Chapter 5. BMC Conguration Settings �� 52

5�1 Login �� 52

5�2 Web GUI ��53

5.2.1 Menu Bar .......................................................................................................... 53

5.2.2 User Information and Quick Button ............................................................... 54

Content

5.2.3 Dashboard ........................................................................................................ 55

5.2.4 Sensor .............................................................................................................. 55

5.2.5 System Inventory ............................................................................................. 56

5.2.6 FRU Information ............................................................................................... 56

5.2.7 Logs and Reports ............................................................................................ 57

5.2.8 Settings ............................................................................................................ 58

5.2.9 Remote Control ................................................................................................ 60

5.2.10 Power Control ................................................................................................ 65

5.2.11 Chassis Identify Control ................................................................................ 66

5.2.12 Set Front Panel Enables ................................................................................ 66

5.2.13 Maintenance .................................................................................................. 67

5.2.14 Sign out .......................................................................................................... 69

Chapter 6� Technical Support �� 70

Content

This document contains proprietary information about

AIC products and is not to be disclosed or used except in

accordance with applicable agreements.

Document Release History

Release Date Version Update Content

January

2019

1 User's Manual release to public.

July

2019

1.1 Note sign update.

August

2019

1.2 Slide rail update.

January

2020

1.3 Specications update.

Copyright

No part of this publication may be reproduced, stored in a retrieval system, or

transmitted in any form or by any means, electronic, mechanical, photo-static, recording

or otherwise, without the prior written consent of the manufacturer.

Trademarks

All products and trade names used in this document are trademarks or registered

trademarks of their respective holders.

Changes

The material in this document is for information purposes only and is subject to change

without notice.

Warning

1. A shielded-type power cord is required in order to meet FCC emission limits and also

to prevent interference to the nearby radio and television reception. It is essential

that only the supplied power cord be used.

2. Use only shielded cables to connect I/O devices to this equipment.

3. You are cautioned that changes or modifications not expressly approved by the

party responsible for compliance could void your authority to operate the equipment.

Disclaimer

AIC shall not be liable for technical or editorial errors or omissions contained herein.

The information provided is provided "as is" without warranty of any kind. To the

extent permitted by law, neither AIC or its afliates, subcontractors or suppliers will be

liable for incidental, special or consequential damages including downtime cost; lost

profits; damages relating to the procurement of substitute products or services; or

damages for loss of data, or software restoration. The information in this document

is subject to change without notice.

Instruction Symbols

Special attention should be given to the instruction symbols below.

NOTE

This symbol indicates that there is an explanatory or

supplementary instruction.

CAUTION

This symbol denotes possible hardware impairment. Upmost

precaution must be taken to prevent serious harware damage.

WARNING

This symbol serves as a warning alert for potential body

injury. The user may suffer possible injury from disregard or

lack of attention.

Preface

i

ii

Before getting started, please read the following important cautions:

• All cautions and warnings on the equipment or in the manuals should be noted.

• Most electronic components are sensitive to electrical static discharge. Therefore, be

sure to ground yourself at all times when installing the internal components.

• Use a grounding wrist strap and place all electronic components in static-shielded

devices. Grounding wrist straps can be purchased in any electronic supply store.

• Be sure to turn off the power and then disconnect the power cords from your system

before performing any installation or servicing. A sudden surge of power could

damage sensitive electronic components.

• Do not open the system’s top cover. If opening the cover for maintenance is a must,

only a trained technician should do so. Integrated circuits on computer boards are

sensitive to static electricity. Before handling a board or integrated circuit, touch

an unpainted portion of the system unit chassis for a few seconds. This will help to

discharge any static electricity on your body.

• Place this equipment on a stable surface when install. A drop or fall could cause injury.

• Please keep this equipment away from humidity.

• Carefully mount the equipment into the rack, in such manner, that it won’t be

hazardous due to uneven mechanical loading.

• This equipment is to be installed for operation in an environment with maximum

ambient temperature below 35°C.

• The openings on the enclosure are for air convection to protect the equipment from

overheating. DO NOT COVER THE OPENINGS.

• Never pour any liquid into ventilation openings. This could cause fire or electrical

shock.

• Make sure the voltage of the power source is within the specification on the label

when connecting the equipment to the power outlet. The current load and output

power of loads shall be within the specification.

• This equipment must be connected to reliable grounding before using. Pay special

attention to power supplied other than direct connections, e.g. using of power strips.

• Place the power cord out of the way of foot traffic. Do not place anything over the

power cord. The power cord must be rated for the product, voltage and current marked

on the product’s electrical ratings label. The voltage and current rating of the cord

should be greater than the voltage and current rating marked on the product.

• If the equipment is not used for a long time, disconnect the equipment from mains to

avoid being damaged by transient over-voltage.

• Never open the equipment. For safety reasons, only qualified service personnel should

open the equipment.

Safety Instructions

iii

• If one of the following situations arise, the equipment should be checked by service

personnel:

1. The power cord or plug is damaged.

2. Liquid has penetrated the equipment.

3. The equipment has been exposed to moisture.

4. The equipment does not work well or will not work according to its user manual.

5. The equipment has been dropped and/or damaged.

6. The equipment has obvious signs of breakage.

7. Please disconnect this equipment from the AC outlet before cleaning. Do not

use liquid or detergent for cleaning. The use of a moisture sheet or cloth is

recommended for cleaning.

• Module and drive bays must not be empty! They must have a dummy cover.

CAUTION

The equipment intended for installation should be placed in Restricted Access

Location.

CAUTION

There will be a risk of explosion if battery is replaced by an incorrect type. Dispose

of used batteries according to the instructions. After performing any installation or

servicing, make sure the enclosure is correct in position before turning on the power.

CAUTION

This unit may have more than one power supply. Disconnect all power sources before

maintenance to avoid electric shock.

Thank you for selecting and purchasing the SB101-SP.

This user's manual is provided for professional technicians to perform easy hardware

setup, basic system configurations, and quick software startup. This document pellucidly

presents a brief overview of the product design, device installation, and firmware settings

for SB101-SP. For the latest version of this user's manual, please refer to the AIC website:

http://www.aicipc.com/tw/productdetail/51036.

Chapter 1 Product Features

SB101-SP is a flexible storage server barebone that is specifically designed to

accommodate diverse corporations and enterprises for managing heavy workloads and

multiple applications.

Chapter 2 Hardware Setup

This chapter displays an easy installation guide for assembling the hardware in this

product. Utmost caution for proceeding to set up the hardware is highly advised. Most of

the components are highly fragile and vulnerable to exterior influence. Do not endanger

the device by placing the device in an unstable environment.

Chapter 3 Hardware Settings

This chapter elaborates the overall layout of the server, including multifarious connectors,

jumpers, and LED descriptions. These descriptions assist users to configure different

settings and functions of the motherboard, as well as to confirm the location of each

connector and jumper.

Chapter 4 BIOS Configuration Settings

This chapter introduces the key features of BIOS, including the descriptions and option

keys for diverse functions. These details provide users to effortlessly navigate and

configure the input/output devices.

Chapter 5 BMC Configuration Settings

This chapter illustrates the diverse functions of IPMI BMC, including the details on logging

into the web page and assorted definitions. These descriptions are helpful in configuring

various functions through Web GUI without entering the BIOS setup. For more information

of BMC configurations, please refer to IPMI BMC (Aspeed AST2500) User's Manual for a

more detailed description.

Chapter 6 Technical Support

For more information or suggestion, please contact the nearest AIC corporation

representative in your district or visit the AIC website: http://www.aicipc.com/en. It is our

greatest honor to provide the best service for our customers.

About This Manual

iv

1

Chapter 1. Product FeaturesSB101-SP User Manual

SB101-SP is a high density storage server that includes mother board, chassis, power

supply, and HDD backplane. For more information about our product, please visit our

website at http://www.aicipc.com/en.

Before removing the subsystem from the shipping carton, visually inspect the physical

condition of the shipping carton. Exterior damage to the shipping carton may indicate

that the contents of the carton are damaged. If any damage is found, do not remove

the components; contact the dealer where the subsystem was purchased for further

instructions. Before continuing, first unpack the subsystem and verify that the number

of components in the shipping carton is accurate and in good condition

1�1 Box Contents

This product contains the components listed below.

Please confirm the number and the condition of the components before

installation.

• System barebone

(includes power supply, fan

& hard disk drive tray)

• Power cord (vary per region)

• 28" Slide rail x 1 set (optional)

Product features are subject to change without notice�

SB101-SP User Manual

Chapter 1� Product Features

2

Chapter 1. Product FeaturesSB101-SP User Manual

1.2 Specications

Dimensions

(W x D x H)

mm : 438 x 680 x 43.5

inches : 17.2 x 26.7 x 1.7

Motherboard

AIC Server Board Spica

Processor

Support

(Skylake/Cascade Lake/Cascade Lake Refresh

UPI Speeds

10.4 GT/s, 9.6 GT/s

Socket Type Socket P0 (LGA-3647 Socket)

Chipset Support

Intel® Lewisburg C620 series PCH

System Memory

6 channel per CPU (1DPC)

Front Panel

LEDs

Drive Bays

External 3.5" hot swap 4 x 6G SATA

Internal 2.5" 2 x 6G SATA

Backplane

1 x 4-port 12G SAS backplane with 1 x SFF-8643 connector

Expansion Slots PCIe 3.0 1 x16 slot (FH)

Riser Card

(included)

PC1-E16

1 x16 PCIe slot

System BIOS

BIOS Type

AMI UEFI BIOS

BIOS

Features

SRIOV

On-board

Devices

SATA

Lewisburg PCH on-chip solution

2 x SATA 6.0 Gb/s (by 2 x SATA 7 pin)

RAID 0, 1, 5, 10 support by Intel® RSTe

IPMI

Aspeed AST2500 Advanced PCIe Graphics &

Remote Management Processor

Serial over LAN

Network

Controllers

on rear I/O

LAN Controller supports 2 x 10GbE SFP+

on rear I/O (Optional, BTO)

management port

Graphics

Aspeed AST2500 Advanced PCIe Graphics &

Remote Management Process

Rear I/O

LAN

management

USB

2 x USB 3.0 Type A

VGA

1 x external DB-15 VGA port

Serial Port

1 x external DB-9 COM port

Power Supply

450W 1+1 redundant power supply 80+ Gold

500W single power supply 80+ Gold (BTO)

System Cooling

6 x 40x28mm hot swap fans

(Optional 6 x 40x56mm hot swap fans, BTO)

System

Management

Remote Management Processor

Gross Weight

(w/ PSU & Rail)

kgs : 20

lbs : 44

Packaging

Dimensions

(W x D x H)

mm : 615 x 1020 x 273

inches : 24.2 x 40.2 x 10.7

Mounting

Standard 28" tool-less slide rail

System UID

140

DDR4 2933/2666/2400 MHz

IPMI KCS interface

Environmental

Specifications

3

Chapter 1. Product FeaturesSB101-SP User Manual

SB101-SP is a reliable 1U storage server barebone with 4 hotswap drives bays. This prod-

uct is designed to accommodate the serverboard, Spica, which supports two Intel® Xeon®

Scalable Processors and 12 DDR4 DIMM to offer greater perfomance, efficiency, and util-

ity for our customers. Featuring Intel® C620 Series Chipset, which is emphasized for its

accelerated speed and expansion, this product enhances these advantages by integrating

flexible IO usage and system expansion into to provide greater bandwidth and utilization.

In addition to the noteworthy features of the barebone, SB101-SP provides immediate

and efficient management with Onboard Baseboard Management Controller and greater I/

O extension. Featuring IPMI 2.0 and Aspeed AST2500 Advanced PCIe Graphics, the server

board offers support for iKVM, Media Redirection, Smash Support, IPMI over LAN, and Se-

rial over LAN.

• 1U general purpose storage server that support 4 hot-swap 3.5" SATA drive bays

• Supports 2nd gen. Intel® Xeon® Scalable processors (Cascade Lake/Cascade Lake

Refresh/Skylake)

• Onboard Baseboard Management Controller for system management and IPMI control

• Front-to-back airflow and hot swap redundant fans to provide optimal thermal

conditions

• Two 10GbE SFP+ ports plus dedicated BMC management port (optional, BTO)

1�3 Features

4

Chapter 1. Product FeaturesSB101-SP User Manual

Front Panel

4x 3.5" HDD tray

System button and LED indicator

Rear Panel

2 x USB 3.0 double-stack Type

450W 1+1 Redundant PSU

(optional 500W single PSU,

BTO)

1 x GbE RJ45 for BMC

DB-15 VGA port

DB-9 COM port

Power On/Off Switch

System HDD Activity LED

System Power LED

LAN LED

System ID LED

System Fault LED

System ID Switch

System Reset Switch

5

Chapter 1. Product FeaturesSB101-SP User Manual

Major Components

450W 1+1 Redundant PSU

(optional 500W single PSU, BTO)

6x4028 system fans

(optional 6x4056 system fans, BTO)

6

Chapter 2. Hardware SetupSB101-SP User Manual

This section describes a simple instruction guide for installing the hardware components

on the serverboard system.

NOTE

Safety precautions before setup:

• Be aware of the placement of the system device.

• Make sure the components are cooled before touching.

• Dislodge the cables and connectors before removing the hareware component.

2�1 Central Processing Unit Setup

The serverboard supports dual Xeon scalable processors and Socket P0 (LGA-3647).

2�1�1 Processor Installation

To ensure a safe and easy setup, you need to prepare before installation:

 a T20 Torx screwdriver

 ESD wrist strap/mat and conductive foam pad

CAUTION

The pins of the processor socket are vulerable and easily susceptible to damage if fingers

or any foreign objects are pressed against them. Please keep the socket protective cover on

when the processor is not installed.

CAUTION

When unpacking a processor, hold the processor only by its edges to avoid touching the

contacts.

Standard Processor Assembly:

A standard processor assembly is comprised of PHM(Processor Heatsink Module)

components and processor socket assembly.

Chapter 2� Hardware Setup

Heat sink

Standard

Processor Clip

Standard

Processor

Bolster Plate

Precsessor

Socket

PHM Components

Processor

Socket Assembly

7

Chapter 2. Hardware SetupSB101-SP User Manual

Processor Socket Assembly:

The server board includes two processor sockets (LGA-3647), supports one or two of

the Intel® Xeon® Processor Scalable Family and has a Thermal Design Power (TDP)

of up to 165W on selected models.

PHM (Processor Heatsink Module) Component:

Non Frabic

Processor

Non Frabic

Processor Clip

Heat sink

8

Chapter 2. Hardware SetupSB101-SP User Manual

PHM Screw Installation Order:

The PHM sits level with the processor socket assembly. The PHM is NOT installed

properly if it does not sit level with the processor socket assembly. Once the PHM is

seated over the processor socket assembly, the four heat sink torque screws must be

secured in the following order as shown below.

Processor Heat Sink – Top View with Screw Tightening Order

CAUTIUON

Failure to tighten the heat sink screws in the specified order may cause damage to the

processor socket assembly. Heat sink screws should be tighted to 12 in-lbs torque

according to the ndicated order on the top of the heat sink label.

WARNING

Do not touch the heat sink when it is heated or when the system is operating to prevent

from being burnt or scalded.









This information is provided for professional technicians only.

9

Chapter 2. Hardware SetupSB101-SP User Manual

This server board supports 12 DIMM memory slots with 6 channel per CPU.

2�2�1 DIMM Installation

Step 1 Unlock the dimm socket by pressing the retaining clips outward.

Step 2 Insert the memory module into the slot. Make sure that the DIMM notch is

accurately positioned.

Step 3 Close the retaining clips to complete installation.

DIMM n

otch

2�2 System Memory Setup

This information is provided for professional technicians only.

10

Chapter 2. Hardware SetupSB101-SP User Manual

2�2�2 DIMM Location

The DIMMs are displayed on the Spica board as DIMM C0, DIMM B0, DIMM A0, DIMM

D0, DIMM E0, DIMM F0, DIMM C1, DIMM B1, DIMM A1, DIMM D1, DIMM E1, and DIMM

F1.

To ensure satisfactory performance, you need to:



Verify the DIMM type: DDR4 ECC RDIMM/LRDIMM 2666/2400/2133



Verify if all of the DIMMs installed are of the same DIMM type to avoid

memory failure or loss of performance speed.

CPU0

CPU1

DIMM_C0

DIMM_B0

DIMM_A0

DIMM_D0

DIMM_E0

DIMM_F0

DIMM_C1

DIMM_B1

DIMM_A1

DIMM_D1

DIMM_E1

DIMM_F1

Battery

BMC

BIOS

PCIe_7 (x8)

PCIe_6 (x16)

PCIe_5 (x8)

PCIe_4 (x16)

PCIe_3 (x8)

PCIe_2 (x8)

PCIe_1 (x8)

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AIC SB101-SP User manual

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