VIA Technologies EPIA-E900 User manual

Type
User manual
1.00-10082015-144100
USER MANUAL
EPIA-E900
Pico-ITXe board
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE
Copyright
Copyright © 2015 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language,
in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written
permission of VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respective holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no
warranties, implied or otherwise, in regard to this document and to the products described in this document. The information
provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA
Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra
device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document.
The information and product specifications within this document are subject to change at any time, without notice and without
obligation to notify any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior
notice.
Regulatory Compliance
FCC
FCCFCC
FCC-
--
-A Radio Frequency I
A Radio Frequency IA Radio Frequency I
A Radio Frequency Interference Statement
nterference Statement nterference Statement
nterference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his
personal expense.
Notice 1
Notice 1Notice 1
Notice 1
The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
Notice 2
Notice 2Notice 2
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Notice 3
Notice 3Notice 3
Notice 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts
or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before
placing an order.
Battery Recycling and Disposal
Only use the appropriate battery specified for this product.
Do not re-use, recharge, or reheat an old battery.
Do not attempt to force open the battery.
Do not discard used batteries with regular trash.
Discard used batteries according to local regulations.
Safety Precautions
Always read the safety instructions carefully.
Keep this User's Manual for future reference.
All cautions and warnings on the equipment should be noted.
Keep this equipment away from humidity.
Lay this equipment on a reliable flat surface before setting it up.
Make sure the voltage of the power source and adjust properly 110/220V before connecting
the equipment to the power inlet.
Place the power cord in such a way that people cannot step on it.
Always unplug the power cord before inserting any add-on card or module.
If any of the following situations arises, get the equipment checked by authorized service
personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment has not worked well or you cannot get it work according to User's Manual.
The equipment has dropped and damaged.
The equipment has obvious sign of breakage.
Do not leave this equipment in an environment unconditioned or in a storage temperature
above 60°C (140°F). The equipment may be damaged.
Do not leave this equipment in direct sunlight.
Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
Do not place anything over the power cord.
Do not cover the ventilation holes. The openings on the enclosure protect the equipment
from overheating
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Box Contents
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E900E900
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-1
11
12QE
2QE2QE
2QE
1 x EPIA-E900 embedded board
1 x SATA data cable
1 x SATA power cable
1 x DC-In power cable
Ordering Information
Model Nam
Model NamModel Nam
Model Name
ee
e
Description
DescriptionDescription
Description
EPIA
EPIAEPIA
EPIA-
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-E900
E900E900
E900-
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-12QE
12QE12QE
12QE Pico-ITXe board with 1.2 GHz VIA Eden
®
X4 processor, Mini
HDMI, 2 x USB 3.0, 2 x USB 2.0, 2 x COM, 2 x Gigabit Ethernet,
SATA and 12V DC-In
Optional Accessories
Wireless Accessories
Wireless AccessoriesWireless Accessories
Wireless Accessories
Model Number
Model NumberModel Number
Model Number
Description
DescriptionDescription
Description
EMIO-1533-00A2 VNT9271 IEEE 802.11b/g/n USB WiFi module with assembly kit
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Table of Contents
1.
1.1.
1.
Product Overview
Product OverviewProduct Overview
Product Overview................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................ 1
11
1
1.1.
Key Features and Benefits........................................................................... 1
1.1.1.
VIA Eden
®
X4 Processor ....................................................................... 1
1.1.2.
VIA VX11H MSP Chipset....................................................................... 2
1.1.3.
Expansion Option ................................................................................... 2
1.2.
Product Specifications................................................................................. 3
1.3.
Layout Diagram ............................................................................................. 6
1.4.
Dimensions .................................................................................................... 8
1.5.
Height Distribution....................................................................................... 9
2.
2.2.
2.
I/O Interface
I/O InterfaceI/O Interface
I/O Interface................................
................................................................
................................................................
................................................................
................................................................
................................................................
........................................
................
........ 10
1010
10
2.1.
External I/O Ports ....................................................................................... 10
2.1.1.
LED Indicators........................................................................................ 11
2.1.2.
Power Button ......................................................................................... 11
2.1.3.
COM Connector.................................................................................... 12
2.1.4.
USB 3.0 Port ........................................................................................... 13
2.1.5.
Gigabit Ethernet Port............................................................................ 14
2.1.6.
Mini HDMI
®
Port.................................................................................... 15
2.1.7.
USB 2.0 Port ........................................................................................... 16
2.2.
Onboard Connectors ................................................................................ 17
2.2.1.
DC-In Power Connector ...................................................................... 17
2.2.2.
SATA Connector ................................................................................... 18
2.2.3.
SATA Power Connector ...................................................................... 19
2.2.4.
SPI Pin Header ....................................................................................... 20
2.2.5.
CPU Fan Connector .............................................................................. 21
2.2.6.
CMOS Battery Connector.................................................................... 22
2.2.7.
WLAN Connector ................................................................................. 23
2.2.8.
LPC Connector....................................................................................... 24
3.
3.3.
3.
Jumpers
JumpersJumpers
Jumpers ................................
................................................................
................................................................
................................................................
................................................................
................................................................
...............................................
..............................
............... 25
2525
25
3.1.
Clear CMOS Jumper.................................................................................. 26
3.2.
AT/ATX Power Mode Select Jumper .................................................... 27
4.
4.4.
4.
Expansion Connectors
Expansion ConnectorsExpansion Connectors
Expansion Connectors................................
................................................................
................................................................
................................................................
.......................................................
..............................................
....................... 28
2828
28
4.1.
MXM Connector ......................................................................................... 28
4.2.
DDR3 SODIMM Memory Socket............................................................. 32
4.2.1.
Installing a Memory Module .............................................................. 33
4.2.2.
Removing a Memory Module............................................................. 34
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5.
5.5.
5.
Hardware Installation
Hardware InstallationHardware Installation
Hardware Installation ................................
................................................................
................................................................
................................................................
........................................................
................................................
........................ 35
3535
35
5.1.
Installing into a Chassis............................................................................. 35
5.1.1.
Suggested minimum chassis dimensions ......................................... 35
5.1.2.
Suggested minimum chassis height................................................... 36
5.1.3.
Suggested keepout areas .................................................................... 37
6
66
6.
..
.
BIOS Setup Utility
BIOS Setup UtilityBIOS Setup Utility
BIOS Setup Utility ................................
................................................................
................................................................
................................................................
..............................................................
............................................................
.............................. 38
3838
38
6.1.
Entering the BIOS Setup Utility............................................................... 38
6.2.
Control Keys................................................................................................ 38
6.3.
Getting Help................................................................................................ 38
6.4.
System Overview........................................................................................ 39
6.4.1.
BIOS Information................................................................................... 39
6.4.2.
Memory Information............................................................................. 39
6.4.3.
System Language................................................................................... 39
6.4.4.
System Date............................................................................................ 40
6.4.5.
System Time ........................................................................................... 40
6.5.
Advanced Settings ..................................................................................... 41
6.5.1.
ACPI Settings.......................................................................................... 42
6.5.2.
S5 RTC Wake Settings.......................................................................... 43
6.5.3.
CPU Configuration ................................................................................ 44
6.5.4.
SATA Configuration.............................................................................. 45
6.5.5.
USB Configuration................................................................................. 46
6.5.6.
F81801 Super IO Configuration ......................................................... 48
6.5.7.
F81801 H/W Monitor ........................................................................... 49
6.5.8.
Clock Generator Configuration.......................................................... 50
6.6.
OnBoard Device Configuration............................................................... 51
6.6.1.
S5 Wakeup by PME# ............................................................................ 51
6.7.
Chipset Settings .......................................................................................... 52
6.7.1.
DRAM Configuration ............................................................................ 53
6.7.2.
Video Configuration ............................................................................. 55
6.7.3.
PMU_ACPI Configuration .................................................................... 56
6.7.4.
Others Configuration............................................................................ 58
6.8.
Boot Settings ............................................................................................... 59
6.8.1.
Boot Configuration................................................................................ 59
6.8.2.
Boot Option Priorities .......................................................................... 60
6.9.
Security ......................................................................................................... 61
6.9.1.
Security Settings .................................................................................... 61
6.10.
Save & Exit ................................................................................................... 62
6.10.1.
Save Changes and Exit ......................................................................... 62
6.10.2.
Discard Changes and Exit.................................................................... 62
6.10.3.
Save Changes and Reset...................................................................... 62
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6.10.4.
Discard Changes and Reset................................................................. 62
6.10.5.
Save Changes ......................................................................................... 63
6.10.6.
Discard Changes.................................................................................... 63
6.10.7.
Save as User Defaults........................................................................... 63
6.10.8.
Restore User Defaults .......................................................................... 63
7.
7.7.
7.
Software and Technical Supports
Software and Technical SupportsSoftware and Technical Supports
Software and Technical Supports ................................
................................................................
................................................................
................................................................
....................................
........
.... 64
6464
64
7.1.
Microsoft and Linux Support ................................................................... 64
7.1.1.
Driver Installation.................................................................................. 64
7.2.
Technical Supports and Assistance........................................................ 64
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Lists of Figures
Figure 1: Top side layout diagram................................................................................. 6
Figure 2: Bottom side layout diagram........................................................................... 7
Figure 3: Top side dimensions (without heatsink) ..................................................... 8
Figure 4: Front panel side dimensions.......................................................................... 8
Figure 5: Rear panel side dimensions ........................................................................... 8
Figure 6: Top side height distribution........................................................................... 9
Figure 7: Bottom side height distribution .................................................................... 9
Figure 8: Front Panel I/O................................................................................................ 10
Figure 9: Rear Panel I/O ................................................................................................. 10
Figure 10: LED indicators diagram ............................................................................... 11
Figure 11: Power button diagram ................................................................................ 11
Figure 12: COM connector diagram ........................................................................... 12
Figure 13: USB 3.0 port diagram .................................................................................. 13
Figure 14: Gigabit Ethernet LAN port diagram......................................................... 14
Figure 15: Mini HDMI
®
port diagram .......................................................................... 15
Figure 16: USB 2.0 port diagram .................................................................................. 16
Figure 17: DC-In power connector diagram ............................................................. 17
Figure 18: SATA connector diagram........................................................................... 18
Figure 19: SATA power connector diagram ............................................................. 19
Figure 20: SPI pin header diagram............................................................................... 20
Figure 21: CPU fan connector diagram....................................................................... 21
Figure 22: CMOS battery connector diagram ........................................................... 22
Figure 23: WLAN connector diagram ......................................................................... 23
Figure 24: LPC connector diagram............................................................................... 24
Figure 25: Jumper settings example............................................................................ 25
Figure 26: Clear CMOS jumper diagram .................................................................... 26
Figure 27: AT/ATX power mode select jumper diagram....................................... 27
Figure 28: MXM connecter diagram............................................................................ 28
Figure 29: DDR3 SODIMM memory socket diagram ............................................... 32
Figure 30: Inserting the memory module................................................................... 33
Figure 31: Locking the memory module .................................................................... 33
Figure 32: Disengaging the SODIMM locking clips................................................. 34
Figure 33: Removing the memory module ................................................................ 34
Figure 34: Suggested minimum chassis dimensions ................................................ 35
Figure 35: Suggested minimum internal chassis ceiling height............................. 36
Figure 36: Suggested keepout areas (top side)........................................................ 37
Figure 37: Suggested keepout areas (bottom side) ................................................ 37
Figure 38: Illustration of the Main menu screen....................................................... 39
Figure 39: Illustration of the Advanced Settings screen......................................... 41
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Figure 40: Illustration of the ACPI Settings screen .................................................. 42
Figure 41: Illustration of the S5 RTC Wake Settings screen................................... 43
Figure 42: Illustration of CPU Configuration screen ................................................ 44
Figure 43: Illustration of SATA Configuration screen ............................................. 45
Figure 44: Illustration of PC Health Status screen ................................................... 46
Figure 45: Illustration of F81801 Super IO Configuration screen......................... 48
Figure 46: Illustration of F81801 H/W Monitor ........................................................ 49
Figure 47: Illustration of Clock Generator Configuration screen ......................... 50
Figure 48: Illustration of OnBoard Device Configuration screen ......................... 51
Figure 49: Illustration of Chipset Settings screen..................................................... 52
Figure 50: Illustration of DRAM Configuration screen ............................................ 53
Figure 51: Illustration of Video Configuration screen............................................. 55
Figure 52: Illustration of PMU_ACPI Configuration screen .................................... 56
Figure 53: Illustration of Other Control screen........................................................ 56
Figure 54: Illustration of Others Configuration screen ........................................... 58
Figure 55: Illustration of Boot Settings screen.......................................................... 59
Figure 56: Illustration of Security Settings screen.................................................... 61
Figure 57: Illustration of Save & Exit screen.............................................................. 62
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Lists of Tables
Table 1: Top side layout description table................................................................. 6
Table 2: Bottom side layout description table .......................................................... 7
Table 3: Layout description table of external I/O ports ........................................ 10
Table 4: COM connector pinouts ............................................................................... 12
Table 5: USB 3.0 port pinouts ...................................................................................... 13
Table 6: Gigabit Ethernet LAN port pinout............................................................... 14
Table 7: Gigabit Ethernet LED color definition ........................................................ 14
Table 8: Mini HDMI
®
port pinout ................................................................................ 15
Table 9: USB 2.0 port pinouts ...................................................................................... 16
Table 10: DC-In power connector pinout................................................................. 17
Table 11: SATA connector pinout .............................................................................. 18
Table 12: SATA power connector pinout................................................................. 19
Table 13: SPI pin header pinout .................................................................................. 20
Table 14: CPU fan connector pinout .......................................................................... 21
Table 15: CMOS battery connector pinout .............................................................. 22
Table 16: WLAN connector pinout ............................................................................ 23
Table 17: LPC connector pinout.................................................................................. 24
Table 18: Clear CMOS jumper settings ..................................................................... 26
Table 19: AT/ATX power mode select jumper settings ........................................ 27
Table 20: MXM connector pinout ............................................................................... 31
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1.
1.1.
1. Product Overview
Product OverviewProduct Overview
Product Overview
The EPIA-E900 is a highly integrated Pico-ITXe board powered by a 1.2GHz
VIA Eden
®
X4 processor and VIA VX11H MSP chipset that delivers a high
performance and rich multimedia features in an ultra-compact package for a
wide range of embedded system applications such as industrial automation,
transportation, medical, and infotainment.
The EPIA-E900 board is fully compatible with Microsoft
®
and Linux operating
systems, and provides an impressive I/O such as COM connectors, mini HDMI
®
port, Gigabit Ethernet (RJ-45) ports, USB 2.0 ports, USB 3.0 ports, SATA
connector for storage devices, and onboard MXM connector for an optional
E900-A expansion card. In addition, EPIA-E900 also includes one 1333 MHz
DDR3 SODIMM slot that support up to 8 GB memory size.
1.1. Key Features and Benefits
1.1.1. VIA Eden
®
X4 Processor
The VIA Eden
®
X4 is a 64-bit superscalar x86 multi-core processor combine
on two dies. It is based on advanced 28 nanometer process technology
packed into an ultra compact NanoBGA2 package measuring 21mm x 21mm.
The VIA Eden
®
X4 processor delivers a superb performance on multi-tasking,
multimedia playback, productivity and internet browsing in a low power
budget. In addition, it is ideal for most of multi-display environment, and
embedded system applications.
Note:
Note:Note:
Note:
For Windows 7 and Windows Server 2008 R2 users only:
If encounter the issue such as the operating system recognize the VIA Dual-Core CPU as two processors
instead of one processor with two cores. Download and install the hotfix released by Microsoft to
address this issue. The downloadable hotfix is available at http://support.microsoft.com/kb/25026
http://support.microsoft.com/kb/25026http://support.microsoft.com/kb/25026
http://support.microsoft.com/kb/2502664
6464
64
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1.1.2. VIA VX11H MSP Chipset
The VIA VX11H is the fourth generation, highly integrated Media System
Processor which provides high quality digital video streaming and high
definition video playback. It features the VIA Chrome
640 DX11 2D/3D
graphics and video processor, High Definition video decoder supports DDR3
1333 controller and USB 3.0 interface.
The VIA VX11H offers superb-graphics performance, immersive visual
experience, and supports DirectX 11.0 that allows realistic 3D rendering and
increased visual acuity. The VIA VX11H is based on a highly sophisticated
power efficient architecture that enables such rich integration into a compact
package.
1.1.3. Expansion Option
The EPIA-E900 further proves its versatility by providing an expansion MXM
connector for optional E900-A expansion card. The E900-A expansion card is
carrying multiple expansion I/O such as audio jack, USB 2.0 ports, SATA
connector, PCIe slot, LVDS panel connector, DisplayPort/HDMI port, DVP port
and etc.
The companies using the EPIA-E900 with E900-A expansion card obtain the
maximum benefits and enable to slowly roll out upgrades as necessary
instead of having to replace everything all at once.
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1.2. Product Specifications
Processor
ProcessorProcessor
Processor
VIA Eden X4 1.2 GHz processor
21 mm x 21 mm FCBGA
Chipset
ChipsetChipset
Chipset
VIA VX11H MSP chipset
33 mm x 33 mm FCBGA
Graphics
GraphicsGraphics
Graphics
Integrated VIA Chrome
640 DX11 2D/3D graphics and video processor
MPEG2, WMV9, VC1, H.264 Full HD video decoder
System Memory
System MemorySystem Memory
System Memory
1 x DDR3 1333 MHz SODIMM socket
Supports up to 8 GB memory size
BIOS
BIOSBIOS
BIOS
AMI Aptio UEFI BIOS, 32 Mbit flash memory
Onboard Peripherals
Onboard PeripheralsOnboard Peripherals
Onboard Peripherals
Serial ATA
Serial ATASerial ATA
Serial ATA
Supports up to 3.0 Gb/s
LAN
LANLAN
LAN
2 x Realtek RTL8111G PCIe Gigabit Ethernet controllers
Audio
AudioAudio
Audio
Through MXM support
Super I/O
Super I/OSuper I/O
Super I/O
Fintek F81801U-I Super I/O controller
Onboard I/O Connectors
Onboard I/O ConnectorsOnboard I/O Connectors
Onboard I/O Connectors
1 x DC-In power connector (12V DC)
1 x SATA connector
1 x SATA power connector
1 x MXM connector
1 x SPI pin header
1 x CPU fan connector
1 x Clear CMOS jumper
1 x AT/ATX jumper pin header
1 x LPC connector
1 x WLAN USB connector (supports VNT9271 WiFi module)
1 x CMOS external battery connector
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Front Panel I/O
Front Panel I/OFront Panel I/O
Front Panel I/O
1 x HDD LED
1 x Power LED
1 x Power button
2 x USB 3.0 ports
2 x COM connectors
Rear
RearRear
Rear Panel I/O
Panel I/O Panel I/O
Panel I/O
2 x Gigabit Ethernet (LAN) ports
1 x Mini HDMI
®
port (Type C)
2 x USB 2.0 ports
MXM
MXM MXM
MXM C
CC
Connector
onnector onnector
onnector i
ii
interface
nterfacenterface
nterface
Support one SATA connector
Support four USB 2.0 ports
Support one DisplayPort/HDMI interface
Support DVP port interface for two channel LVDS
Support LPC interface
Support SMBus interface
Support SPI interface
Support one Digital I/O (3GPI + 3GPO) interface
Support HD Audio interface
Support one fan controller for System fan
Support one PCIe x4 interface
Supported Operating System
Supported Operating SystemSupported Operating System
Supported Operating System
Microsoft Windows 10
Microsoft Windows 8.1
Microsoft Windows 8
Microsoft Windows 7
Microsoft Windows Embedded Standard 7
Linux
System Mo
System MoSystem Mo
System Monitoring & Management
nitoring & Managementnitoring & Management
nitoring & Management
Wake-on-LAN
Keyboard-Power-on
Timer-Power-on
System Power Management
AC power failure recovery
Watchdog Timer
Operating Conditions
Operating ConditionsOperating Conditions
Operating Conditions
Operating Temperature
Operating TemperatureOperating Temperature
Operating Temperature
0°C ~55°C
Operating Humidity
Operating HumidityOperating Humidity
Operating Humidity
0% ~ 95% (relative humidity; non-condensing)
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For
ForFor
Form Factor
m Factorm Factor
m Factor
Pico-ITXe (13.8 cm x 7.2 cm)
Compliance
ComplianceCompliance
Compliance
CE
FCC
Note:
Note:Note:
Note:
As the operating temperature provided in the specifications is a result of the test performed in VIA’s
chamber, a number of variables can influence this result. Please note that the working temperature may
vary depending on the actual situation and environment. It is highly suggested to execute a solid
testing and take all the variables into consideration when building the system. Please ensure that the
system runs well under the operating temperature in terms of application.
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1.3. Layout Diagram
Figure
Figure Figure
Figure 1
11
1: Top side layout diagram
: Top side layout diagram: Top side layout diagram
: Top side layout diagram
Item
ItemItem
Item
Description
DescriptionDescription
Description
1 PWR: DC-In power connector
2 SATA: SATA connector
3 SATA_PW: SATA power connector
4 MXM: MXM connector
5 SPI: SPI pin header
6 CLEAR_CMOS: Clear CMOS jumper
7 CPUFAN: CPU fan connector
8 AT/ATX: AT/ATX mode jumper pin header
9 Chipset: VIA VX11H MSP
10 CPU: 1.2 GHz VIA Eden x4 processor
Table
Table Table
Table 1
11
1: Top side layout description table
: Top side layout description table: Top side layout description table
: Top side layout description table
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Figure
Figure Figure
Figure 2
22
2: Bottom side layout diagram
: Bottom side layout diagram: Bottom side layout diagram
: Bottom side layout diagram
Item
ItemItem
Item
Description
DescriptionDescription
Description
11 SODIMM: DDR3 SODIMM socket
12 LPC: LPC connector
13 JWLAN: WiFi (WLAN) connector
14 CMOS battery connector
Table
Table Table
Table 2
22
2: Bott
: Bott: Bott
: Bottom side layout description table
om side layout description tableom side layout description table
om side layout description table
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1.4. Dimensions
Figure
Figure Figure
Figure 3
33
3: Top side dimensions
: Top side dimensions: Top side dimensions
: Top side dimensions (without heatsink)
(without heatsink) (without heatsink)
(without heatsink)
Figure
Figure Figure
Figure 4
44
4: Front panel side dimensions
: Front panel side dimensions: Front panel side dimensions
: Front panel side dimensions
Figure
Figure Figure
Figure 5
55
5: Rear panel
: Rear panel : Rear panel
: Rear panel side dimensions
side dimensionsside dimensions
side dimensions
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1.5. Height Distribution
Figure
Figure Figure
Figure 6
66
6: Top side height distribution
: Top side height distribution: Top side height distribution
: Top side height distribution
Figure
Figure Figure
Figure 7
77
7:
: :
: Bottom side h
Bottom side hBottom side h
Bottom side height distribution
eight distributioneight distribution
eight distribution
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2.
2.2.
2. I/O Interface
I/O InterfaceI/O Interface
I/O Interface
The VIA EPIA-E900 has a wide selection of interfaces. It includes a selection of
frequently used ports as part of the external I/O coastline.
2.1. External I/O Ports
Figure
Figure Figure
Figure 8
88
8:
: :
: Front P
Front PFront P
Front Panel I/O
anel I/Oanel I/O
anel I/O
Figure
Figure Figure
Figure 9
99
9: Rear Panel I/O
: Rear Panel I/O: Rear Panel I/O
: Rear Panel I/O
Item
ItemItem
Item
Description
DescriptionDescription
Description
1 Power status LED
2 HDD LED
3 Power button
4 COM 1 connector
5 COM 2 connector
6 USB 3.0 port 1
7 USB 3.0 port 2
8 Gigabit Ethernet port 1
9 Gigabit Ethernet port 2
10 Mini HDMI
®
port
11 USB 2.0 port 1
12 USB 2.0 port 2
Table
Table Table
Table 3
33
3: Layout desc
: Layout desc: Layout desc
: Layout description table of external I/O ports
ription table of external I/O portsription table of external I/O ports
ription table of external I/O ports
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VIA Technologies EPIA-E900 User manual

Type
User manual

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