APPLICATION NOTE
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Download newest version at: www.trinamic.com
AN005d: IC Package / PCB Footprint Guidelines - LQFP44
Document Revision V2.11 •2021-Dec-09
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and
its PCB footprint. The document covers package dimensions, example footprint and general infor-
mation on PCB footprints.
Contents
1 Figures Index 1
2 Tables Index 1
3 Overview 2
4 LQFP44 Package Details 2
4.1 LQFP44 ................................................... 2
4.2 Dimensions ................................................ 3
4.3 Land Pattern ................................................ 5
5 General PCB Footprint and Packaging Information Resources 6
5.1 QFP Packages ............................................... 6
5.2 Tape & reel ................................................. 7
5.3 Reel Box .................................................. 8
5.4 Tray ..................................................... 9
5.5 Tray Box .................................................. 9
6 Disclaimer 10
7 Revision History 10
1 Figures Index
1 LQFP44 3D example .......... 2
2 LQFP44 package outline drawings . . 3
3 LQFP44 example land patterns (unit:
mm) .................... 5
4 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 6
5 Quadrant assignment within the tape 7
6 Tape diagram .............. 7
7 Reel diagram ............... 7
8 Box for reel with dimensions ..... 8
9 Tray with dimensions .......... 9
10 Box for trays with dimensions .... 9
2 Tables Index
1 LQFP44 dimensions ........... 4
2 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 6
3 Dimensions and properties of Tape
and Reel ................. 7
4 Document Revision ........... 10