APPLICATION NOTE
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Download newest version at: www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100
Document Revision V2.11 •2021-Dec-09
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and
its PCB footprint. The document covers package dimensions, example footprint and general infor-
mation on PCB footprints.
Contents
1 Figures Index 1
2 Tables Index 1
3 Overview 2
4 TQFP100 Package Details 2
4.1 TQFP100 .................................................. 2
4.2 Dimensions ................................................ 2
4.3 Land Pattern ................................................ 3
5 General PCB Footprint and Packaging Information Resources 4
5.1 QFP Packages ............................................... 4
5.2 Tray Box .................................................. 5
6 Disclaimer 6
7 Revision History 6
1 Figures Index
1 TQFP100 3D example .......... 2
2 TQFP100 package outline drawings . 2
3 TQFP100 example land patterns . . . 3
4 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 4
5 Box for trays with dimensions .... 5
2 Tables Index
1 TQFP100 dimensions .......... 3
2 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 4
3 Document Revision ........... 6