Trinamic TMC424 User guide

Type
User guide
APPLICATION NOTE
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Download newest version at: www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100
Document Revision V2.11 2021-Dec-09
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and
its PCB footprint. The document covers package dimensions, example footprint and general infor-
mation on PCB footprints.
Contents
1 Figures Index 1
2 Tables Index 1
3 Overview 2
4 TQFP100 Package Details 2
4.1 TQFP100 .................................................. 2
4.2 Dimensions ................................................ 2
4.3 Land Pattern ................................................ 3
5 General PCB Footprint and Packaging Information Resources 4
5.1 QFP Packages ............................................... 4
5.2 Tray Box .................................................. 5
6 Disclaimer 6
7 Revision History 6
1 Figures Index
1 TQFP100 3D example .......... 2
2 TQFP100 package outline drawings . 2
3 TQFP100 example land patterns . . . 3
4 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 4
5 Box for trays with dimensions .... 5
2 Tables Index
1 TQFP100 dimensions .......... 3
2 EIA Standard Board Layout of Sol-
dered Pad for QFP Devices ...... 4
3 Document Revision ........... 6
AN005q: IC Package / PCB Footprint Guidelines - TQFP100 Application Note Document Revision V2.11 2021-Dec-09 2/6
3 Overview
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and its PCB
footprint. The document covers package dimensions, example footprint and general information on PCB
footprints with their packaging as well.
4 TQFP100 Package Details
4.1 TQFP100
Figure 1: TQFP100 3D example
4.2 Dimensions
Figure 2: TQFP100 package outline drawings
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Terms of delivery and rights to technical change reserved.
Download newest version at www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100 Application Note Document Revision V2.11 2021-Dec-09 3/6
Table 1: TQFP100 dimensions
Symbol Dimensions in MILLIMETERS Dimensions in INCHES
Min Typ Max Min Typ Max
A– – 1.6 – 0.0629
A1 0.05 – 0.15 0.0019 – 0.0059
A2 1.35 1.4 1.45 0.0531 0.0551 0.0570
b0.17 0.22 0.27 0.0066 0.0086 0.0106
c0.09 – 0.2 0.0035 – 0.0078
D/E 16 BSC 0.6299 BSC
D1/E1 14 BSC 0.5511 BSC
e0.5 BSC 0.0196 BSC
L0.45 0.6 0.75 0.0177 – 0.0295
Θ03.5703.57
4.3 Land Pattern
Figure 3: TQFP100 example land patterns (unit: mm)
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Terms of delivery and rights to technical change reserved.
Download newest version at www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100 Application Note Document Revision V2.11 2021-Dec-09 4/6
5 General PCB Footprint and Packaging Information Resources
These guidelines and information are proposals and suggestions as they are proven and work well with
TRINAMIC modules. Some ICs are available in Tape & Reel and in IC trays.
5.1 QFP Packages
These guidelines are for Quad Flat Packages in general (PQFP, LQFP, TQFP) and are derived from the
EIA/JEDEC standard.
Figure 4: EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm)
Table 2: EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm)
Dim. PQ100 PQ144 PQ160
3.2mm
PQ160
3.9mm
PQ/
RQ208
PQ/
RQ240
VQ80 VQ/
TQ100
VQ128 VQ176 TQ64 TQ144 TQ176
Md 20.4 28.4 28.4 29.2 28.2 32.2 13.8 13.8 13.8 19.8 10.1 19.8 23.8
Me 14.4 28.4 28.4 29.2 28.2 32.2 13.8 13.8 13.8 19.8 10.1 19.8 23.8
e 0.65 0.65 0.65 0.65 0.5 0.5 0.65 0.5 0.4 0.4 0.5 0.5 0.5
b2 0.3-0.5 0.3-0.5 0.3-0.5 0.3-0.5 0.3-0.4 0.3-0.4 0.3-0.5 0.3-0.4 0.25-
0.30
0.25-
0.30
0.3-0.4 0.3-0.4 0.3-0.4
l2 1.8 1.8 1.8 1.8 1.6 1.6 1.8 1.6 1.6 1.6 1.6 1.6 1.6
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Terms of delivery and rights to technical change reserved.
Download newest version at www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100 Application Note Document Revision V2.11 2021-Dec-09 5/6
5.2 Tray Box
Trays are packed in boxes like shown in the following figure 5.
Figure 5: Box for tray with dimensions (unit: mm).
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Terms of delivery and rights to technical change reserved.
Download newest version at www.trinamic.com
AN005q: IC Package / PCB Footprint Guidelines - TQFP100 Application Note Document Revision V2.11 2021-Dec-09 6/6
6 Disclaimer
TRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in life
support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co. KG. Life
support systems are equipment intended to support or sustain life, and whose failure to perform, when
properly used in accordance with instructions provided, can be reasonably expected to result in personal
injury or death.
Information given in this application note is believed to be accurate and reliable. However, no responsi-
bility is assumed for the consequences of its use nor for any infringement of patents or other rights of
third parties that may result from its use.
Specifications are subject to change without notice.
All trademarks used are property of their respective owners.
7 Revision History
Table 3: Document Revision
Version Date Author Description
V1.00 20.05.2017 SK V1.00 release version
V2.00 02.07.2021 FV Added Tray and Reel information. Removed outdated notes.
V2.10 30.07.2021 FV Added boxes for Tray and Reel.
V2.11 09.12.2021 FV Changed logo to ADI Trinamic.
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Terms of delivery and rights to technical change reserved.
Download newest version at www.trinamic.com
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Trinamic TMC424 User guide

Type
User guide

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