Gigabyte H270-H70 User manual

Brand: Gigabyte

Model: H270-H70

Category: Servers

Type: User manual

This manual is also suitable for

H270-F4G

H270-F4G

H270-H70

Dual LGA2011 sockets R3 motherboard for Intel® E5-2600 V3/V4 series processors

Service Guide

Rev. 1.1

The trademarks mentioned in this manual are legally registered to their respective owners.

Disclaimer

Information in this manual is protected by copyright laws and is the property of GIGABYTE.

Changes to the specifications and features in this manual may be made by GIGABYTE

without prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or

published in any form or by any means without GIGABYTE's prior written permission.

Documentation Classications

In order to assist in the use of this product, GIGABYTE provides the following types of documentations:

 For detailed product information, carefully read the User's Manual.

For more information, visit our website at:

http://b2b.gigabyte.com

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Get an access to our complete source of sales, marketing & technical materials at:

http://reseller.b2b.gigabyte.com

https://www.facebook.com/gigabyteserver

Preface

Before using this information and the product it supports, please read the following general infor-

mation.

1. This Service Guide provides you with all technical information relating to the BASIC CON-

FIGURATION decided for GIGABYTE’s “global” product offering. To better t local market-

requirements and enhance product competitiveness, your regional ofce MAY have decided

toextend the functionality of a machine (e.g. add-on card, modem, or extra memory capabil-

ity).These LOCALIZED FEATURES will NOT be covered in this generic service guide. In

suchcases, please contact your regional ofces or the responsible personnel/channel to

provide youwith further technical details.

2. Please note WHEN ORDERING SPARE PARTS, you should check the most up-to-date

informationavailable on your regional web or channel. For whatever reason, if a part num-

ber change is made,it will not be noted in the printed Service Guide. For GIGABYTE-AU-

THORIZED SERVICEPROVIDERS, your GIGABYTE ofce may have a DIFFERENT part

number code to thosegiven in the FRU list of this printed Service Guide. You MUST use the

list provided by yourregional GIGABYTE ofce to order FRU parts for repair and service of

customer machines.

- 4 -

Table of Contents

Box Contents ...................................................................................................................7

Safety, Care and Regulatory Information ........................................................................8

Chapter 1 Hardware Installation ...................................................................................11

1-1 Installation Precautions .................................................................................. 11

1-2 Product Specications (Per Node) ................................................................. 12

1-3 System Block Diagram ................................................................................... 14

1-3-1 H270-F4G ...............................................................................................................14

1-3-2 H270-H70 ...............................................................................................................15

Chapter 2 System Hardware Installation ......................................................................16

2-1 System Components ...................................................................................... 17

2-2 Replacing Power Supply Board Cage Cover ................................................. 18

2-3 Replacing the Motherboard Tray .................................................................... 19

2-4 Removing and Installing the Fan Duct ........................................................... 20

2-5 Installing the CPU ......................................................................................... 21

2-6 Installing the Heat Sink ................................................................................. 22

2-7 Installing the Memory ..................................................................................... 24

2-7-1 Four Channel Memory Conguration .....................................................................24

2-7-2 Installing a Memory ...............................................................................................25

2-8 Installing the PCI Express Expansion Card ................................................... 26

2-8-1 Installing Add-on Card (Optional) ...........................................................................27

2-9 Installing the Hard Disk Drive ......................................................................... 28

2-10 Replacing the Power Supply .......................................................................... 29

2-11 Installing Rail Into A Rack ............................................................................... 30

Chapter 3 System Appearance .....................................................................................31

3-1 Front View ...................................................................................................... 31

3-2 Rear View ....................................................................................................... 32

3-3 HDD and Nodes Connection .......................................................................... 34

3-4 Front Panel LED and Buttons ........................................................................ 35

3-4 Rear System Button and LEDs ...................................................................... 36

3-5 Hard Disk Drive LEDs ................................................................................... 38

3-6 Cable Routing ................................................................................................ 39

Chapter 4 Motherboard Components ...........................................................................40

4-1 Motherboard Components ............................................................................. 40

4-1-1 MH70-HD0 (H270-F4G) .........................................................................................40

- 5 -

4-1-2 MH70-HD1 (H270-H70) ..........................................................................................42

4-2 Jumper Setting ............................................................................................... 44

MH70-HD0 (H270-F4G) .....................................................................44

MH70-HD1 (H270-H70) .....................................................................45

Chapter 5 BIOS Setup ..................................................................................................46

5-1 The Main Menu .............................................................................................. 48

5-2 Advanced Menu ............................................................................................. 51

5-2-1 Serial Port Console Redirection .............................................................................52

5-2-2 PCI Subsystem Settings .........................................................................................56

5-2-2-1 PCI Express Settings ..............................................................................................58

5-2-3 Network Stack ........................................................................................................60

5-2-4 CSM Conguration .................................................................................................61

5-2-5 Post Report Conguration ......................................................................................63

5-2-6 Trusted Computing .................................................................................................64

5-2-7 USB Conguration ..................................................................................................65

5-2-8 Chipset Conguration .............................................................................................66

5-9 SIO Conguration ...................................................................................................67

5-2-10 iSCSI Conguration ................................................................................................70

5-3 Intel RC Setup Menu ...................................................................................... 71

5-3-1 Processor Conguration .........................................................................................72

5-3-1-1 Pre-Socket Conguration .......................................................................................75

5-3-2 Advanced Power Management Conguration ........................................................77

5-3-2-1 CPU P State Control ...............................................................................................78

5-3-2-2 CPU C State Control ..............................................................................................79

5-3-2-3 CPU T State Control ...............................................................................................80

5-3-3 Common RefCode Conguration ...........................................................................81

5-3-4 QPI Conguration ...................................................................................................82

5-3-5 Memory Conguration ............................................................................................84

5-3-5-1 Memory Topology ...................................................................................................86

5-3-5-2 Memory Thermal ....................................................................................................87

5-3-5-3 Memory Map ...........................................................................................................88

5-3-5-4 Memory RAS Conguration ....................................................................................89

5-3-6 IIO Conguration ....................................................................................................90

5-3-6-1 IOAT Conguration .................................................................................................91

5-3-6-2 Intel VT for Directed I/O (VT-d) ..............................................................................92

5-3-7 PCH Conguration .................................................................................................93

5-3-7-1 PCH Devices ..........................................................................................................94

5-3-7-2 PCH SATA Conguration ........................................................................................95

5-3-7-2-1 SATA Mode Options .............................................................................................. 98

5-3-7-3 USB Conguration ................................................................................................100

5-3-8 Miscellaneous Conguration ................................................................................101

- 6 -

5-3-9 Server ME Conguration ......................................................................................102

5-3-10 Runtime Error Logging .........................................................................................103

5-3-10-1 Whea Setting ........................................................................................................104

5-3-10-2 Memory Error Enabling .........................................................................................105

5-3-10-3 PCI/PCI Error Enabling .........................................................................................106

5-4 Server Management Menu ........................................................................... 107

5-4-1 System Event Log ................................................................................................109

5-4-2 View FRU Information ..........................................................................................110

5-4-3 BMC network conguration .................................................................................. 111

5-5 Security Menu .............................................................................................. 112

5-5-1 Secure Boot menu ............................................................................................... 113

5-5-1-1 Key Management ...............................................................................................114

5-6 Boot Menu .................................................................................................... 116

5-7 Save & Exit Menu ......................................................................................... 118

5-8 BIOS POST Codes ...................................................................................... 120

5-9 BIOS POST Beep code ................................................................................ 124

5-9-1 PEI Beep Codes ...................................................................................................124

5-9-2 DEX Beep Codes .................................................................................................124

5-10 BIOS Recovery Instruction ........................................................................... 125

- 7 -

Box Contents

H270-F4G System/H270-H70 System

Driver CD

Service Guide

Heat Sink x 8

Rail Kit

• The box contents above are for reference only and the actual items shall depend on the product package you obtain.

The box contents are subject to change without notice.

• The motherboard image is for reference only.

- 8 -

Safety, Care and Regulatory Information

Important safety information

Read and follow all instructions marked on the product and in the documentation before you operateyour sys-

tem. Retain all safety and operating instructions for future use.

• The product should be operated only from the type of power source indicated on the rating label.* If your

computer has a voltage selector switch, make sure that the switch is in the proper position foryour area.

The voltage selector switch is set at the factory to the correct voltage.

• The plug-socket combination must be accessible at all times because it serves as the main disconnect-

ing device.

• All product shipped with a three-wire electrical grounding-type plug only fits into a grounding-type

poweroutlet. This is a safety feature. The equipment grounding should be in accordance with local and

nationalelectrical codes. The equipment operates safely when it is used in accordance with its marked

electricalratings and product usage instructions

• Do not use this product near water or a heat source.* Set up the product on a stable work surface or so

as to ensure stability of the system.

• Openings in the case are provided for ventilation. Do not block or cover these openings. Make sure

youprovide adequate space around the system for ventilation when you set up your work area. Never

insertobjects of any kind into the ventilation openings.

• To avoid electrical shock, always unplug all power cables and modem cables from the wall outletsbefore

removing covers.

• Allow the product to cool before removing covers or touching internal components.

Precaution for Product with Laser Devices

Observe the following precautions for laser devices:

• Do not open the CD-ROM drive, make adjustments, or perform procedures on a laser device other than

those specied in the product's documentation.

• Only authorized service technicians should repair laser devices.

Precaution for Product with Modems, Telecommunications, or Local AreaNetwork Options

Observe the following precautions for laser devices:

• Do not connect or use a modem or telephone during a lightning storm. There may be a risk of electri-

calshock from lightning.

• To reduce the risk of re, use only No. 26 AWG or larger telecommunications line cord.

• Do not plug a modem or telephone cable into the network interface controller (NIC) receptacle.

• Disconnect the modem cable before opening a product enclosure, touching or installing internalcompo-

nents, or touching an uninsulated modem cable or jack.

• Do not use a telephone line to report a gas leak while you are in the vicinity of the leak.

- 9 -

Federal Communications Commission (FCC) Statement

Warning

This is a class A product. In a domestic environment this product may cause radiointerfer-

enceIn which case the user may be required to take adequate measures.

This equipment has been tested and found to comply with the limits for a Class A digital device,pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection againstharmful interfer-

ence when the equipment is operated in a commercial environment. This equipmentgenerates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance withthe instruction manual, may

cause harmful interference to radio communications. Operation of thisequipment in a residential area is likely

to cause harmful interference in which case the user will berequired to correct the interference at his own ex-

pense.Properly shielded and grounded cables and connectors must be used in order to meet FCC emission-

limits. Neither the provider nor the manufacturer are responsible for any radio or television interferencecaused

by using other than recommended cables and connectors or by unauthorized changes ormodications to this

equipment. Unauthorized changes or modications could void the user's authority tooperate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired opera-

tion.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class A limits for radio noise emissions from digitalapparatus as

set out in the radio interference regulations of Industry Canada.Le present appareil numerique n'emet pas

de bruits radioelectriques depassant les limites applicables auxappareils numeriques de Classe A prescrites

dans le reglement sur le brouillage radioelectrique edicte parIndustrie Canada.

Class A equipment

This device has been tested and found to comply with the limits for a class A digital device pursuantPart 15 of

the FCC Rules. These limits are designed to provide reasonable protection againstharmful interference when

the equipment is operated in a commercial environment. This equipmentgenerate, uses, and can radiate

radio frequency energy, and if not installed and used in accordancewith the instructions, may cause harmful

interference to radio communication. Operation of thisequipment in a residential area is likely to cause harm-

ful interference, in which case the user will berequired to correct the interference at personal expence.

However, there is no guarantee that interference will not occur in a particular installation. If thisdevice does

cause harmful interference to radio or television reception, which can be determined bytuning the device off

and on, the user is encouraged to try to correct the interference by on or more ofthe following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the device and receiver

• Connect the device into an outlet on a circuit different from that to which the receiver isconnected'Consult

the dealer or an experienced radio/television technician for help.

- 10 -

Battery Warning: Incorrectly installing a battery or using incompatible battery may increase

the risk of ifre explosion. Replace the battery only with the same or equivalent type.

• Do not disassemble, crush, punchture batteries.

• Do not store or place your battery pack next to or in a heat source such as a re, heatgenerating

appliance, can or exhaust vent. Heating battery cells to temperatures above 65oC (149oF) can

cause explosion or re.

• Do not attempt to open or service batteries. Do not dispose of batteries in a re or with house-

hold waste.

WEEE Symbol Statement

The symbol shown below is on the product or on its packaging, which indicates that this product

must not be disposed of with other waste. Instead, the device should be taken to the waste

collection centers for activation of the treatment, collection, recycling and disposal procedure.

The separate collection and recycling of your waste equipment at the time of disposal will help to

conserve natural resources and ensure that it is recycled in a manner that protects human health

and the environment. For more information about where you can drop off your waste equipment for recycling,

please contact your local government ofce, your household waste disposal service or where you purchased

the product for details of environmentally safe recycling.

w When your electrical or electronic equipment is no longer useful to you, "take it back" to your local or

regional waste collection administration for recycling.

w If you need further assistance in recycling, reusing in your "end of life" product, you may contact us at the

Customer Care number listed in your product's user's manual and we will be glad to help you with your

effort.

California Proposition 65

Warning:

This product contains a chemical, including lead , known to the State of California to cause cancer

http://www.p65warnings.ca.gov/

Warning:

This product contains a chemical, including lead , known to the State of California to cause birth defects or

other reproductive harm.

http://www.p65warnings.ca.gov/

- 11 - Hardware Installation

1-1 Installation Precautions

The motherboard/system contain numerous delicate electronic circuits and components which

can become damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully

read the service guide and follow these procedures:

• Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or

warranty sticker provided by your dealer. These stickers are required for warranty validation.

• Always remove the AC power by unplugging the power cord from the power outlet before

installing or removing the motherboard or other hardware components.

• When connecting hardware components to the internal connectors on the motherboard,

make sure they are connected tightly and securely.

• When handling the motherboard, avoid touching any metal leads or connectors.

• It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic

components such as a motherboard, CPU or memory. If you do not have an ESD wrist

strap, keep your hands dry and rst touch a metal object to eliminate static electricity.

•

Prior to installing the motherboard, please have it on top of an antistatic pad or within an

electrostatic shielding container.

• Before unplugging the power supply cable from the motherboard, make sure the power

supply has been turned off.

• Before turning on the power, make sure the power supply voltage has been set according to

the local voltage standard.

• Before using the product, please verify that all cables and power connectors of your

hardware components are connected.

• To prevent damage to the motherboard, do not allow screws to come in contact with the

motherboard circuit or its components.

• Make sure there are no leftover screws or metal components placed on the motherboard or

within the computer casing.

• Do not place the computer system on an uneven surface

• Do not place the computer system in a high-temperature environment.

• Turning on the computer power during the installation process can lead to damage to

system components as well as physical harm to the user.

• If you are uncertain about any installation steps or have a problem related to the use of the

product, please consult a certied computer technician.

Chapter 1 Hardware Installation

Hardware Installation - 12 -

1-2 Product Specications (Per Node)

Motherboard wH270-F4G: MH70-HD0

wH270-H70: MH70-HD1

CPU wSupport for Intel® Xeon® E5-2600 V3/V4 series processors in the LGA2011

package

wL3 cache varies with CPU

wSupports Dual QuickPath Interconnect up to 9.6GT/s

wEnhanced Intel SpeedStep Technology (EIST)

wSupport Intel Virtualization Technology (VT)

Chipset wIntel® C612 Express (Wellsburg) Chipset

Memory w16 x DIMM slots

wDDR4 memory supported only

wQuad channel memory architecture

wECC RDIMM / LRDIMM modules supported

wSingle and dual rank RDIMM modules up to 32GB supported

w3DS LRDIMM modules up to 128GB supported

w1.2V modules: 1600/1866/2133/2400 MHz

LAN

(H270-F4G)

wIntel® 82599ES 10GbE LAN controller with QSFP+

wRealtek RTL8211E supports server management LAN port

LAN

(H270-H70)

wIntel® I350 GbE LAN controller

wRealtek RTL8211E supports server management LAN port

Expansion Slot w1 x PCI Express x16 slot, running at x16 (Gen3)

w1 x Mezzanine Card, running at x8 (Gen3)

Onboard

Graphics wASPEED® AST2400 supports 16MB DDR3 VRAM

Mass Storage w4 x 2.5” Hot-Swap SATA/SAS HDDs

wSupport for Intel IRSTe SATA RAID 0, RAID 1, RAID 5, RAID 10

System Fans w4 x 40x40x56mm 23000rpm

USB wUp to 4 USB 3.0 ports ( 2 on the rear panel I/O, 2 additional ports via the USB

brackets connected to the internal USB headers)

Internal

Connectors

w2 x 18-pin power connectors

w1 x Front panel header

w6 x SATA3 6Gb/s connectors

w1 x USB 3.0 header

w1 x TPM module connector

w1 x SATA SPGIO header

w1 x BMC SPGIO header

w1 x PMBUS header

w1 x IPMB connector

w1 x Software RAID key connector

w1 x SATA Power connector (H270-H70 Only)

w1 x Mananement LAN port cable header (H270-H70 Only)

w1 x Serial port header

w1 x VGA port header

- 13 - Hardware Installation

Rear Panel I/O w2 x USB 2.0/3.0 ports

w1 x 10/100/1000 Management LAN port

w2 x RJ-45 ports (H270-H70 Only)

w1 x QSFP+ LAN port (H270-F4G Only)

w1 x Serial port

w1 x VGA port

w1 x Power switch button/status LED

w1 x ID switch button/LED

w1 x Reset button

w1 x NMI button

w1 x System status LED

w2 x LAN Link/Active LED (LAN1/LAN2)

Front Panel

LED/Buttons

w1 x Power button/System status LED

w1 x ID button/LED

w2 x USB3.0/2.0 ports

w1 x VGA port

I/O Controller wASPEED® AST2400 BMC chip

Hardware

Monitor

wSystem voltage detection

wCPU/System temperature detection

BIOS w1 x 128 Mbit ash

wAMI BIOS

Environment

Ambient

Temperature

Relative

Humidity

wOperating Temperature: 10oC to 35oC

wNon-operating Temperature: -40oC to 60oC

wOperating humidity: 8-80% (non-condensing)

wNon-operating humidity: 20%-95% (non-condensing)

System

Dimension

w447Wx87.2Hx780D (mm)

Electrical

Power Supply

w2 x Hot-plug 1U PSU 1600W at 80 plus Platinum level

wAC input 100-127V: DC Output 1000W Max

wAC input 200-240V: DC Output 1600W Max

* GIGABYTE reserves the right to make any changes to the product specifications and product-related information

without prior notice.

Hardware Installation - 14 -

1-3 System Block Diagram

1-3-1 H270-F4G

Hardware Installation - 15 -

1-3-2 H270-H70

- 16 - Hardware Installation

Chapter 2 System Hardware Installation

Pre-installation Instructions

Perform the steps below before you open the server or before you remove or replaceany

component.

• Back up all important system and data les before performing any hardwareconguration.

• Turn off the system and all the peripherals connected to it.

• Locate the pin one of the CPU. The CPU cannot be inserted if oriented incorrectly. (Or you may

locate the notches on both sides of the CPU and alignment keys on the CPU socket.)

• Apply an even and thin layer of thermal grease on the surface of the CPU.

• Do not turn on the computer if the CPU cooler is not installed, otherwise overheating and

damage of the CPU may occur.

• Set the CPU host frequency in accordance with the CPU specications. It is not recommended

that the system bus frequency be set beyond hardware specications since it does not meet the

standard requirements for the peripherals. If you wish to set the frequency beyond the standard

specifications, please do so according to your hardware specifications including the CPU,

graphics card, memory, hard drive, etc.

Hardware Installation - 17 -

Item Decription

1. Power module

2. Power supply board cage

3. PCI Express card

4. Fan duct

5. Memory module

6. System cooling fan

7. Hard drive

2-1 System Components

- 18 - Hardware Installation

2-2 Replacing Power Supply Board Cage Cover

Before you remove or install the power supply board cage cover

• Make sure the system is not turned on or connected to AC power.

Follow these instructions to remove the power supply board cage cover:

1. Loosen and remove the screw securing the cover.

2. Holding the cage and vertically lift it from the system.

Hardware Installation - 19 -

2-3 Replacing the Motherboard Tray

Follow these instructions to replace the motherboard tray:

1. Disconnect the power, SATA, front panel, and mainboard cable connectors.

2. Press the retaining clip on the left side of the tray along the direction of the arrow.

3. At the same time, pull out the tray by using its handle.Pull up the tray handle and slide of the

motherboard tray along the direction of the arrow.

- 20 - Hardware Installation

2-4 Removing and Installing the Fan Duct

Follow these instructions to remove/install the fan duct:

1. Lift up to remove the fan duct

2. To install the fan duct, align the fan duct with the guiding groove. Push down the fan duct into

chassis until its rmly seats

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Gigabyte H270-H70 User manual

Brand: Gigabyte

Model: H270-H70

Category: Servers

Type: User manual

This manual is also suitable for

H270-F4G

Download PDF

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Gigabyte H270-H70 User manual

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Gigabyte H270-H70 User manual

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