Molex 0430451214, a Micro-Fit 3.0 Vertical Header, boasts a dual-row design with 12 circuits, enabling efficient power distribution in wire-to-board applications. Its 3.00mm pitch and offset through-hole mounting provide secure and reliable connections. Made from high-temperature thermoplastic, this header can withstand temperatures ranging from -40°C to +125°C, making it suitable for demanding environments. Achieve optimal performance by mating with Micro-Fit 3.0 Receptacle Housing 43025 or Micro-Fit 3.0 TPA Receptacle Housing 172952.
Molex 0430451214, a Micro-Fit 3.0 Vertical Header, boasts a dual-row design with 12 circuits, enabling efficient power distribution in wire-to-board applications. Its 3.00mm pitch and offset through-hole mounting provide secure and reliable connections. Made from high-temperature thermoplastic, this header can withstand temperatures ranging from -40°C to +125°C, making it suitable for demanding environments. Achieve optimal performance by mating with Micro-Fit 3.0 Receptacle Housing 43025 or Micro-Fit 3.0 TPA Receptacle Housing 172952.
Molex 0430451214, a Micro-Fit 3.0 Vertical Header, boasts a dual-row design with 12 circuits, enabling efficient power distribution in wire-to-board applications. Its 3.00mm pitch and offset through-hole mounting provide secure and reliable connections. Made from high-temperature thermoplastic, this header can withstand temperatures ranging from -40°C to +125°C, making it suitable for demanding environments. Achieve optimal performance by mating with Micro-Fit 3.0 Receptacle Housing 43025 or Micro-Fit 3.0 TPA Receptacle Housing 172952.
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