Molex 0430450818, a Micro-Fit 3.0 Vertical Header, offers reliable power solutions for wire-to-board applications. With its 8 circuits and 3.00mm pitch dual-row design, it ensures efficient signal transmission. Made from high-temperature thermoplastic, it can withstand temperatures ranging from -40° to +105°C, making it suitable for demanding environments. The Micro-Fit connector system ensures secure mating with its shrouded design and polarization features. Trust Molex 0430450818 for durable and versatile power distribution in your electronic projects.
Molex 0430450818, a Micro-Fit 3.0 Vertical Header, offers reliable power solutions for wire-to-board applications. With its 8 circuits and 3.00mm pitch dual-row design, it ensures efficient signal transmission. Made from high-temperature thermoplastic, it can withstand temperatures ranging from -40° to +105°C, making it suitable for demanding environments. The Micro-Fit connector system ensures secure mating with its shrouded design and polarization features. Trust Molex 0430450818 for durable and versatile power distribution in your electronic projects.
Molex 0430450818, a Micro-Fit 3.0 Vertical Header, offers reliable power solutions for wire-to-board applications. With its 8 circuits and 3.00mm pitch dual-row design, it ensures efficient signal transmission. Made from high-temperature thermoplastic, it can withstand temperatures ranging from -40° to +105°C, making it suitable for demanding environments. The Micro-Fit connector system ensures secure mating with its shrouded design and polarization features. Trust Molex 0430450818 for durable and versatile power distribution in your electronic projects.
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