TechNexion TEP1560 Series User manual

TEP-1560-BSW MODULAR HMI PRODUCT MANUAL

(TEP-1560-BSW)

VER. 1.00

March 25, 2019

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

Page 2 of 39

REVISION HISTORY

Revision

Date

Originator

Notes

1.00

March 25, 2019

TechNexion

First public release

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019 
Page 3 of 39 
TABLE OF CONTENTS 
 
Introduction ............................................................................................................................................... 5 
1. General Care and Maintenance ......................................................................................................... 5 
TEP-1560-BSW Product Overview ........................................................................................................... 6 
1. Functional Block Diagram .................................................................................................................. 6 
2. Dimensions ......................................................................................................................................... 7 
3. Device Cut-out Dimensions For Mounting Though a Panel ............................................................... 8 
4. External Connectors ........................................................................................................................... 9 
5. Internal Board Connectors ............................................................................................................... 10 
5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx) ............................... 10 
5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx) ........................ 11 
External Connectors ................................................................................................................................ 12 
1. LED Light Indicator ........................................................................................................................... 12 
2. Micro-SIM Connector ........................................................................................................................ 12 
3. MicroSD Connector .......................................................................................................................... 12 
4. USB OTG (Type-C) Connector ........................................................................................................ 13 
5. Gigabit Ethernet Interface (LAN1/LAN2) .......................................................................................... 13 
6. USB 2.0 Host Connectors ................................................................................................................ 13 
7. USB 3.0 Host Connectors ................................................................................................................ 14 
8. miniDP (Mini DisplayPort) Connector ............................................................................................... 14 
9. HDMI (High Definition Multi-Media Interface) Connector ................................................................. 14 
10. Audio Connectors ........................................................................................................................... 14 
11. RST Button ..................................................................................................................................... 14 
12. PWR Button .................................................................................................................................... 14 
13. Power Input Connector ................................................................................................................... 15 
14. Antenna Holes ................................................................................................................................ 15 
15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx-xxxx) (optional) . 15 
15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ...................................... 16 
15.2. Galvanic Isolated Serial Port (RS-XXX) (optional) .................................................................. 17 
16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx-xxxx) 
(optional) .................................................................................................................................................. 18 
16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) .............................. 19 
16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)........................................................... 20 
Internal Connectors and Expansion Options .......................................................................................... 21 
1. M.2 KEY-B Slots ............................................................................................................................... 21 
2. SATA 3.0 and SATA Power Connectors .......................................................................................... 21 
3. RTC Battery Connector .................................................................................................................... 22 

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019 
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4. M.2 KEY-E Slot ................................................................................................................................. 22 
5. CMOS Jumper .................................................................................................................................. 22 
6. SO-DIMM DDR3L Slot...................................................................................................................... 22 
7. Internal Stereo Speaker Connectors ................................................................................................ 23 
BIOS Setup ............................................................................................................................................. 24 
1. Entering and Exiting BIOS ................................................................................................................ 24 
2. BIOS Setup Screens Overview ........................................................................................................ 24 
2.1. Main ........................................................................................................................................... 25 
2.2. Chipset ....................................................................................................................................... 26 
2.3. Advanced ................................................................................................................................... 27 
2.4. Boot ............................................................................................................................................ 30 
2.5. Security ...................................................................................................................................... 31 
2.6. Save & Exit ................................................................................................................................ 32 
Mounting.................................................................................................................................................. 33 
1. VESA Mounting ................................................................................................................................ 33 
2. Rear Mounting and Mounting Clips Installation ................................................................................ 34 
3. Surface Mounting ............................................................................................................................. 35 
Ordering Information ............................................................................................................................... 36 
1. Custom Part Number Rule ............................................................................................................... 36 
2. Standard Package Contents ............................................................................................................ 37 
Important Notice ...................................................................................................................................... 38 
Disclaimer ............................................................................................................................................... 39 
   

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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1. Introduction

1.1. General Care and Maintenance

Your device is a product of superior design and craftsmanship and should be treated with care.

The following suggestions will help you.

• Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain

minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.

• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be

damaged.

• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,

damage batteries, and warp or melt certain plastics.

• Do not store the device in cold areas. When the device returns to its normal temperature,

moisture can form inside the device and damage electronic circuit boards.

• Do not open the device while power is on. Otherwise electrical shock may result.

• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and

fine mechanics.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

• Do not paint the device. Paint can clog the parts and prevent proper operation.

• Unauthorized modifications or attachments could damage the device and may violate regulations

governing radio devices.

These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is

not working properly, take it to the nearest authorized service facility for service.

Regulatory information

Disposal of Waste Equipment by Users in Private Household in the European Union

This symbol on the product or on its packaging indicates that this product must not be

disposed of with your other household waste. Instead, it is your responsibility to dispose

of your waste equipment by handing it over to a designated collection point for the

recycling of waste electrical and electronic equipment. The separate collection and

recycling of your waste equipment at the time of disposal will help to conserve natural

resources and ensure that it is recycled in a manner that protects human health and the

environment. For more information about where you can drop off your waste equipment

for recycling, please contact your local city office, your household waste disposal service or the shop

where you purchased the product.

We hereby declare that the product is in compliance with the essential requirements and

other relevant provisions of European Directive 2014/53/EU (Directive on the

harmonisation of the laws of the Member States relating to the making available on the

market of radio equipment and repealing Directive 1999/5/EC).

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2. TEP-1560-BSW Product Overview

2.1. Functional Block Diagram

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2.2. Dimensions

The following figure shows the TEP-1560-BSW dimensions (unit: mm):

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2.3. Device Cut-out Dimensions For Mounting Though a Panel

The TEP-1560-BSW can be mounted on the front or the back of the panel. In order to mount it from the

front, a nominal rectangular cutout must be made in the panel. The following drawing shows the

dimensions of the cut-out area (unit: mm):

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2.4. External Connectors

The TEP-1560-BSW has a number of external connectors.

Bottom view:

1 2 4 5 6 8 10 11 12 14 15 16

3 7 9 13

17 18 19 20 21

External Connectors:

No.

Description

No.

Description

1

LED Light indicator

12

3.5mm jack Line out

2

Micro-SIM cardslot

13

3.5mm jack Line in

3

MicroSD cardslot

14

3.5mm jack Mic in

4

USB OTG (Type-C) connector

15

Reset button

5

LAN2 RJ45 connector

16

Power button

6

USB 2.0 Host connector

17

Power Input connector

7

USB 2.0 Host connector

18

LAN1 RJ45 connector (PoE)

8

USB 3.0 Host connector

19

GPIO1 connector (optional)

9

USB 3.0 Host connector

20

GPIO2 connector (optional)

10

miniDP connector

21

RS-XXX (Serial Port) connector (optional)

11

HDMI connector

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2.5. Internal Board Connectors

The TEP-1560-BSW has several connectors, switches and internal expansion options.

2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)

Rear view (opened device) with the galvanic isolated I/0 Expansion module:

I J

Power I/O Expansion

Module A H Module

B

C D

E F G

Internal Connectors and Switches:

No.

Description

No.

Description

A

M.2 KEY-B slot (SATA + USB 2.0)

F

RTC Battery connector

B

M.2 KEY-B slot (USB 2.0)

G

M.2 KEY-E slot (PCIe + USB 2.0)

C

SATA Power connector

H

SO-DIMM DDR3L slot

D

CMOS jumper

I

Internal R speaker connector

E

SATA 3.0 connector

J

Internal L speaker connector

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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2.5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx)

Rear view (opened device) with the non-galvanic isolated I/0 Expansion module:

I J

Power I/O Expansion

Module A H Module

B

C D

E F G

Internal Connectors and Switches:

No.

Description

No.

Description

A

M.2 KEY-B slot (SATA + USB 2.0)

F

RTC Battery connector

B

M.2 KEY-B slot (USB 2.0)

G

M.2 KEY-E slot (PCIe + USB 2.0)

C

SATA Power connector

H

SO-DIMM DDR3L slot

D

CMOS jumper

I

Internal R speaker connector

E

SATA 3.0 connector

J

Internal L speaker connector

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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3. External Connectors

3.1. LED Light Indicator

The TEP-1560-BSW has one Power LED Light indicator. The Power LED Light indicator is lit, when the

system is powered on.

LED #

Color

Power on

Power off

1

Green

ON

OFF

3.2. Micro-SIM Connector

The TEP-1560-BSW features an external Micro-SIM cardslot for use by 3G/4G/LTE wireless module.

NOTE: This cardslot can be only used by a M.2 KEY-B 3G/4G/LTE module installed into the 3G/LTE

connector. The 3G/LTE connector can be found at location “A” in chapter 4. Internal Connectors and

Expansion Options of this manual. No M.2 KEY-B 3G/LTE module is included in this device (must be

purchased separately, not sold by TechNexion).

3.3. MicroSD Connector

The TEP-1560-BSW features a standard microSD cardslot which is connected to the Intel processor’s

(Atom x5-E8000 / Pentium N3710) integrated “Ultra Secured Digital Host Controller” (uSDHC).

The following main features are supported by uSDHC:

• Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.

• Conforms to the SD Host Controller Standard Specification version 3.0.

• Compatible with the SD Memory Card Specification version 3.0 and supports the “Extended

Capacity SD Memory Card”.

• Compatible with the SDIO Card Specification version 3.0.

• Supports 1-bit / 4-bit SD and SDIO modes

The MMC/SD/SDIO host controller can support a single MMC / SD / SDIO card or device.

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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3.4. USB OTG (Type-C) Connector

The TEP-1560-BSW has one USB OTG Type-C connector (USB 2.0 and USB 3.0 signals) that can be

used to connect a host computer to the unit for programming and update purposes.

#

Signal

Description

#

Signal

Description

A1

GND

Ground

B1

GND

Ground

A2

TX1+

SS differential pair #1 signal

B2

TX2+

SS differential pair #3 signal

A3

TX1-

B3

TX2-

A4

VBUS

5V Universal Serial Bus Power

B4

VBUS

5V Universal Serial Bus Power

A5

CC1

OTG detection signal port 1

B5

CC2

OTG detection signal port 2

A6

USB_D+

USB differential pair signal

port 1

B6

USB_D+

USB differential pair signal

port 2

A7

USB_D-

B7

USB_D-

A8

SBU1

Sideband use port 1

B8

SBU1

Sideband use port 2

A9

VBUS

5V Universal Serial Bus Power

B9

VBUS

5V Universal Serial Bus Power

A10

RX2-

SS differential pair #4 signal

B10

RX1-

SS differential pair #2 signal

A11

RX2+

B11

RX1+

A12

GND

Ground

B12

GND

Ground

3.5. Gigabit Ethernet Interface (LAN1/LAN2)

The TEP-1560-BSW comes with two Gigabit Ethernet RJ45 connectors. LAN1 connector can support

802.3at Power over Ethernet functionality if configured with the PoE power option (TEP1010-xxxxx-Rxx-

LPOE-xxxx-xxxx-xxx-xxxx-xxxx) by connecting it to an 802.3at compliant PoE switch or power injector.

LAN1 / LAN2:

Pin #

1000 Mbps

100 Mbps

10 Mbps

1

MDI0+

Transmit Data+

2

MDI0-

Transmit Data-

3

MDI1+

Receive Data+

4

MDI2+

5

MDI2-

6

MDI1-

Receive Data-

7

MDI3+

8

MDI3-

3.6. USB 2.0 Host Connectors

The TEP-1560-BSW has two USB 2.0 Host connectors (USB 2.0 signals only) to connect to a USB

peripheral such as a keyboard, mouse, USB storage device or USB hub.

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3.7. USB 3.0 Host Connectors

The TEP-1560-BSW has two USB 3.0 Host connectors (USB 2.0 and USB 3.0 signals) to connect to a

USB peripheral such as a keyboard, mouse, USB storage device or USB hub.

3.8. miniDP (Mini DisplayPort) Connector

The miniDP interface available on the TEP-1560-BSW is based on Intel HD Graphics engine integrated

into the Intel Braswell processor and can be configured to support a secondary display.

The miniDP supports the following standards & features:

• DisplayPort 1.1a

• DisplayPort Content Protection

• High-bandwidth Digital Content Protection

• Refresh rate up to 240 FPS for 1080p at 24 bpp

• Support for up to 4k x 2k and 3D video formats

• Support for up to 48 bpp Color Depth

3.9. HDMI (High Definition Multi-Media Interface) Connector

The HDMI interface available on the TEP-1560-BSW is based on Intel HD Graphics engine integrated

into the Intel Braswell processor and can be configured to support a secondary display.

The HDMI supports the following standards & features:

• High-Definition Multimedia Interface Specification, Version 1.4b

• Digital Visual Interface, Revision 1.0

• HDMI Compliance Test Specification, Version 1.4b

• Support for up to 720p at 100Hz and 720i at 200Hz or 1080p at 60Hz and 1080i/720i at 120Hz

HDTV display resolutions and up to QXGA graphic display resolutions.

• Support for 4k x 2k and 3D video formats

• Support for up to 16-bit Deep Color modes

3.10. Audio Connectors

The TEP-1560-BSW has three external 3.5mm stereo audio jacks.

Color Code

Signal

Description

Green

L/R Line out

Audio output

Blue

L/R Line in

Audio input

Pink

Mic in

Microphone input

3.11. RST Button

The TEP-1560-BSW features a “RST” button for system reset.

3.12. PWR Button

The TEP-1560-BSW features a “PWR” button for system power on. System is turned on when button is

pressed, and the Power LED Light indicator lit. If the system hangs, depressing the button for 5 seconds

powers down the system.

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3.13. Power Input Connector

The TEP-1560-BSW can be powered either over the DC INPUT connector or PoE (optional) over the

RJ45 LAN1 port.

NOTE: Do not power the unit by DC input when you apply power over the Power over Ethernet (RJ45)!

Pin #

Signal

Description

1

GND

Ground

2

VCC

DC Voltage input (12V/24V/8~36VDC)

Header on TEP-1560-BSW: Molex 43045-0200 (2-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-0200 (2-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

3.14. Antenna Holes

There are six antenna holes available (two each on the left side, on the right side and on the top side).

They come fitted with breakaway metal tabs. In order to utilize them, the tabs must be removed by

carefully using pincers or pliers.

3.15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-

xxxx-xxxx) (optional)

This product is available with three optional connectors: GPIO1, GPIO2, and RS-XXX that can be ordered

in either galvanic isolated or non-galvanic isolated versions. The TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-

xxx-xxxx-xxxx has three optional galvanic isolated connectors: GPIO1, GPIO2, and RS-XXX.

Bottom view of the galvanic isolated I/0 Expansion module (TXR-I2-GS2-GG8):

B

A

No.

Description

No.

Description

A

SW1 DIP switch

B

SW3 Terminator Resistor DIP switch

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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3.15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)

The galvanic isolated GPIO Expansion headers have the following pinout:

GPIO1:

#

Signal

Description

Voltage

Curr

ent

Max.

Interfa

ce

Source

Control

ler

SIO

Pin #

Min.

Typ.

Max.

1

GPIO1A

DIG_IN1

4.75V

5V

5.25V

300

mA

LPC

Fintek

F81804

GPIO12

2

GPIO1B

DIG_IN2

4.75V

5V

5.25V

300

mA

LPC

Fintek

F81804

GPIO17

3

GND_DIO

Ground for digital

I/O

4

GND

Common Ground

5

GPIO1C

DIG_OUT5

11.21

V

11.8V

12.39

V

125

mA

LPC

Fintek

F81804

GPIO91

6

GPIO1D

DIG_OUT6

11.21

V

11.8V

12.39

V

125

mA

LPC

Fintek

F81804

GPIO94

7

VCC_DIO

Supply input for

digital I/O

5V

12.39

V

300

mA

8

VCC

Supply output

11.4V

12V

12.6V

300

mA

GPIO2:

#

Signal

Description

Voltage

Curr

ent

Max.

Interfa

ce

Source

Control

ler

SIO

Pin #

Min.

Typ.

Max.

1

GPIO2A

DIG_IN1

4.75V

5V

5.25V

300

mA

LPC

Fintek

F81804

GPIO93

2

GPIO2B

DIG_IN2

4.75V

5V

5.25V

300

mA

LPC

Fintek

F81804

GPIO16

3

GND_DIO

Ground for digital

I/O

4

GND

Common Ground

5

GPIO2C

DIG_OUT5

11.21

V

11.8V

12.39

V

125

mA

LPC

Fintek

F81804

GPIO92

6

GPIO2D

DIG_OUT6

11.21

V

11.8V

12.39

V

125

mA

LPC

Fintek

F81804

GPIO15

7

VCC_DIO

Supply input for

digital I/O

5V

12.39

V

300

mA

8

VCC

Supply output

11.4V

12V

12.6V

300

mA

Header on TEP-1560-BSW: Molex 43045-0800 (8-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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3.15.2. Galvanic Isolated Serial Port (RS-XXX) (optional)

The dual 4-wire galvanic isolated serial port can be configured as follows: the primary serial port can only

be used as a standard RS-232. The secondary port can be configured either as RS-232, or RS-422 or

RS-485. This serial port is set by default as RS-232. Setting the TEP-1560-BSW in other mode will

require to open the device and adjust the internal SW1 DIP and SW3 Terminator Resistor DIP switch

settings on the TEP I/O Expansion board. The SW1 DIP switch can be found at location “A” and SW3 DIP

switch at location “B” in chapter 3.15. Galvanic Isolated Connectors (TEP1010-xxxxx-Rxx-Lxxx-XG21-

xxxx-xxx-xxxx-xxxx) (optional) of this manual.

SW1:

Pin #

RS-232 (default)

RS-422

RS-485

1-8

ON

OFF

2-7

OFF

ON

OFF

3-6

OFF

ON

4-5

-

SW3:

Pin #

ON

OFF

1-8

Enable RS-485 Terminator Resistor

Disable RS-485 Terminator Resistor

2-7

Enable RS-422 Terminator Resistor

Disable RS-422 Terminator Resistor

3-6

-

4-5

-

RS-232 + RS-232 (default setup):

Pin #

Signal

Description

Device

1

GND

Ground

2

SERIAL1A_TXD

Port#1A Transmit data (output)

COM1

3

SERIAL1A_RXD

Port#1A Receive data (input)

COM1

4

SERIAL1A_RTS

Port#1A Request-to-send (output)

COM1

5

SERIAL1A_CTS

Port#1A Clear-to-send (input)

COM1

6

GND

Ground

7

SERIAL1B_TXD

Port#1B Transmit data (output)

COM2

8

SERIAL1B_RXD

Port#1B Receive data (input)

COM2

9

SERIAL1B_RTS

Port#1B Request-to-send (output)

COM2

10

SERIAL1B_CTS

Port#1B Clear-to-send (input)

COM2

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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RS-232 + RS-422:

Pin #

Signal

Description

Device

1~5

SERIAL1A

Identical as above

COM1

6

GND

Ground

7

SERIAL1B_TXD+

RS-422 Transmit positive data signal (output)

COM2

8

SERIAL1B_RXD-

RS-422 Receive negative data signal (input)

COM2

9

SERIAL1B_RXD+

RS-422 Receive positive data signal (input)

COM2

10

SERIAL1B_TXD-

RS-422 Transmit negative data signal (output)

COM2

RS-232 + RS-485:

Pin #

Signal

Description

Device

1~5

SERIAL1A

Identical as above

COM1

6

GND

Ground

7

SERIAL1B+

RS-485 positive data signal

COM2

8

NC

9

NC

10

SERIAL1B-

RS-485 negative data signal

COM2

Header on TEP-1560-BSW: Molex 43045-1000 (10-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

3.16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-

xxx-xxxx-xxxx) (optional)

This product is available with three optional connectors: GPIO1, GPIO2, and RS-XXX that can be ordered

in either galvanic isolated or non-galvanic isolated versions. The TEP1560-xxxxx-Rxx-Lxxx-XS21-xxxx-

xxx-xxxx-xxxx has three optional non-galvanic isolated connectors: GPIO1, GPIO2, and RS-XXX.

Bottom view of the non-galvanic isolated I/0 Expansion module (TXR-I2-S2-G8):

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

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3.16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)

The non-galvanic isolated GPIO Expansion headers have the following pinout:

GPIO1:

#

Signal

Description

Voltage

Curr

ent

Max.

Interfa

ce

Source

Control

ler

SIO

Pin #

Min.

Typ.

Max.

1

GPIO1A

DIG_IN1/OUT1

3.14V

3.3V

3.46V

12

mA

LPC

Fintek

F81804

GPIO12

2

GPIO1B

DIG_IN2/OUT2

3.14V

3.3V

3.46V

12

mA

LPC

Fintek

F81804

GPIO17

3

NC

4

GND

Common Ground

5

GPIO1C

DIG_IN5/OUT5

3.14V

3.3V

3.46V

12

mA

LPC

Fintek

F81804

GPIO91

6

GPIO1D

DIG_IN5/OUT6

3.14V

3.3V

3.46V

12

mA

LPC

Fintek

F81804

GPIO94

7

NC

8

VCC

Supply output

11.4V

12V

12.6V

300

mA

GPIO2:

#

Signal

Description

Voltage

Curr

ent

Max.

Interfa

ce

Source

Control

ler

SIO

Pin #

Min.

Typ.

Max.

1

GPIO2A

DIG_IN1/OUT1

3.14V

3.3V

3.6V

12

mA

LPC

Fintek

F81804

GPIO93

2

GPIO2B

DIG_IN2/OUT2

3.14V

3.3V

3.6V

12

mA

LPC

Fintek

F81804

GPIO16

3

NC

4

GND

Common Ground

5

GPIO2C

DIG_IN5/OUT5

3.14V

3.3V

3.6V

12

mA

LPC

Fintek

F81804

GPIO92

6

GPIO2D

DIG_IN5/OUT6

3.14V

3.3V

3.6V

12

mA

LPC

Fintek

F81804

GPIO15

7

NC

8

VCC

Supply output

11.4V

12V

12.6V

300

mA

Header on TEP-1560-BSW: Molex 43045-0800 (8-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

TEP-1560-BSW HARDWARE MANUAL – VER 1.00 MAR 25 2019

Page 20 of 39

3.16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)

The dual 4-wire non-galvanic isolated serial port are configured as follows: the primary and the secondary

serial port can only be used as a standard RS-232.

RS-232 + RS-232:

Pin #

Signal

Description

Device

1

GND

Ground

2

SERIAL1A_TXD

Port#1A Transmit data (output)

COM1

3

SERIAL1A_RXD

Port#1A Receive data (input)

COM1

4

SERIAL1A_RTS

Port#1A Request-to-send (output)

COM1

5

SERIAL1A_CTS

Port#1A Clear-to-send (input)

COM1

6

GND

Ground

7

SERIAL1B_TXD

Port#1B Transmit data (output)

COM2

8

SERIAL1B_RXD

Port#1B Receive data (input)

COM2

9

SERIAL1B_RTS

Port#1B Request-to-send (output)

COM2

10

SERIAL1B_CTS

Port#1B Clear-to-send (input)

COM2

Header on TEP-1560-BSW: Molex 43045-1000 (10-pin Micro-Fit 3.0).

Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

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