T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
1
Description
The TS32MLS64V6D is a 32M bit x 64 Synchronous
Dynamic RAM high-density for PC-133. The
TS32MLS64V6D consists of 16pcs CMOS 16Mx8 bits
Synchronous DRAMs in TSOP-II 400mil packages and
a 2048 bits serial EEPROM on a 168-pin printed circuit
board. The TS32MLS64V6D is a Dual In-Line Memory
Module and is intended for mounting into 168-pin edge
connector sockets.
Synchronous design allows precise cycle control with
the use of system clock. I/O transactions are possible
on every clock cycle. Range of operation frequencies,
programmable latencies allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
Features
• RoHs Compliant Product
• Performance Range: PC-133.
• Conformed to JEDEC Standard Spec.
• Burst Mode Operation.
• Auto and Self Refresh.
• CKE Power Down Mode.
• DQM Byte Masking (Read/Write)
• Serial Presence Detect (SPD) with serial EEPROM
• LVTTL compatible inputs and outputs.
• Single 3.3V ± 0.3V power supply.
• MRS cycle with address key programs.
Latency (Access from column address)
Burst Length (1,2,4,8 & Full Page)
Data Sequence (Sequential & Interleave)
• All inputs are sampled at the positive going edge of
system clock.
Placement
E
H
G
F
E
D
C
B
A
I
PCB: 09-7149
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
2
Dimensions
Side Millimeters Inches
A 133.35±0.40 5.250±0.016
B 65.67000 2.585000
C 23.49000 0.925000
D 8.89000 0.350000
E 3.00000 0.118000
F 29.21±0.200 1.150±0.00800
G 19.8000 0.788000
H 15.80 0.622
I 1.27±0.10 0.050±0.004
(Refer Placement)
Pin Identification
Symbol Function
A0~A11, BA0, BA1
Address input
DQ0~DQ63
Data Input / Output.
CLK0~CLK3
Clock Input.
CKE0, CKE1
Clock Enable Input.
/CS0~/CS3
Chip Select Input.
/RAS
Row Address Strobe
/CAS
Column Address Strobe
/WE
Write Enable
DQM0~DQM7
Data (DQ) Mask
SA0~SA2
Address in EEPROM
SCL
Serial PD Clock
SDA
Serial PD Add/Data input/output
Vcc
+3.3 Voltage Power Supply
Vss
Ground
NC
No Connection
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
3
Pinouts:
Pin
No
Pin
Name
Pin
No
Pin
Name
Pin
No
Pin
Name
Pin
No
Pin
Name
01 Vss 43 Vss 85 Vss 127 Vss
02 DQ0 44 NC 86 DQ32 128 CKE0
03 DQ1 45 /CS2 87 DQ33 129 */CS3
04 DQ2 46 DQM2 88 DQ34 130 DQM6
05 DQ3 47 DQM3 89 DQ35 131 DQM7
06 Vcc 48 NC 90 Vcc 132 *A13
07 DQ4 49 Vcc 91 DQ36 133 Vcc
08 DQ5 50 NC 92 DQ37 134 NC
09 DQ6 51 NC 93 DQ38 135 NC
10 DQ7 52 *CB2 94 DQ39 136 *CB6
11 DQ8 53 *CB3 95 DQ40 137 *CB7
12 Vss 54 Vss 96 Vss 138 Vss
13 DQ9 55 DQ16 97 DQ41 139 DQ48
14 DQ10 56 DQ17 98 DQ42 140 DQ49
15 DQ11 57 DQ18 99 DQ43 141 DQ50
16 DQ12 58 DQ19 100 DQ44 142 DQ51
17 DQ13 59 Vcc 101 DQ45 143 Vcc
18 Vcc 60 DQ20 102 Vcc 144 DQ52
19 DQ14 61 NC 103 DQ46 145 NC
20 DQ15 62 *Vref 104 DQ47 146 *Vref
21 *CB0 63 *CKE1 105 *CB4 147 *REGE
22 *CB1 64 Vss 106 *CB5 148 Vss
23 Vss 65 DQ21 107 Vss 149 DQ53
24 NC 66 DQ22 108 NC 150 DQ54
25 NC 67 DQ23 109 NC 151 DQ55
26 Vcc 68 Vss 110 Vcc 152 Vss
27 /WE 69 DQ24 111 /CAS 153 DQ56
28 DQM0 70 DQ25 112 DQM4 154 DQ57
29 DQM1 71 DQ26 113 DQM5 155 DQ58
30 /CS0 72 DQ27 114 */CS1 156 DQ59
31 NC 73 Vcc 115 /RAS 157 Vcc
32 Vss 74 DQ28 116 Vss 158 DQ60
33 A0 75 DQ29 117 A1 159 DQ61
34 A2 76 DQ30 118 A3 160 DQ62
35 A4 77 DQ31 119 A5 161 DQ63
36 A6 78 Vss 120 A7 162 Vss
37 A8 79 *CLK2 121 A9 163 *CLK3
38 A10/AP 80 NC 122 BA0 164 NC
39 BA1 81 NC 123 A11 165 SA0
40 Vcc 82 SDA 124 Vcc 166 SA1
41 Vcc 83 SCL 125 *CLK1 167 SA2
42 CLK0 84 Vcc 126 *A12 168 Vcc
*Please refer Block Diagram
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
4
Block Diagram
DQM7
DQM6
DQM5
DQM4
DQM3
DQM2
DQM1
DQM0
CKE0
/CS0
DQ42
DQ41
DQ43
DQ40
DQ44
DQ46
DQ47
DQ45
DQM
/CS CKE
U14
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U6
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U2
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQ8
DQ9
DQ10
DQ11
DQ15
DQ14
DQ13
DQ12
DQM
/CS CKE
U10
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U3
DQM
/CS CKE
U7
DQ51
DQ50
DQ49
DQ48
DQ53
DQ54
DQ55
DQ52
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQ19
DQ18
DQ17
DQ16
DQ23
DQ22
DQ21
DQ20
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U11
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U15
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U8
DQ58
DQ59
DQ57
DQ56
DQ60
DQ61
DQ62
DQ63
DQ24
DQ25
DQ26
DQ27
DQ30
DQ31
DQ29
DQ28
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U4
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM /CS CKE
U12
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U16
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQ2
DQM
/CS CKE
U5
DQ35
DQ34
DQ33
DQ32
DQ39
DQ38
DQ37
DQ36
DQ3
DQ1
DQ0
DQ7
DQ5
DQ6
DQ4
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U1
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U9
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
DQM
/CS CKE
U13
I/O 0
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
I/O 2
I/O 1
/CS1
CKE1
Note:
2.DQ-to-I/O wiring may be changed per nibble.
3.Unless otherwise noted , resister values are 10 Ohms±5%
1.U1~U16 are 16Mx8 SDRAM.
BA0
BA1
-RAS
-CAS
-WE
CLK0
CLK1
CLK2
CLK3
U1~U16
U1~U16
U1~U16
U1~U16
U1~U16
U1,U2,U5,U6
U9,U10,U13,U14
U3,U4,U7,U8
U11,U12,U15,U16
VDD
VSS
U1~U16
SDA
SCL
SA0 SA1 SA2
EEPROM
WP
This technical information is based on industry standard data and tests believed to be reliable. However, Transcend makes no warranties, either expressed or
implied, as to its accuracy and assume no liability in connection with the use of this product. Transcend reserves the right to make changes in specifications at
any time without prior notice.
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
5
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Value Unit
Voltage on any pin relative to Vss VIN, VOUT -1.0~4.6 V
Voltage on VDD supply relative to Vss VDD, VDDQ -1.0~4.6 V
Storage temperature TSTG -55~+150 °C
Power dissipation PD 16 W
Short circuit current IOS 50 mA
Operating temperature TA 0~70 °C
Note:
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device
reliability.
DC OPERATING CONDITIONS AND CHARACTERISTICS
Recommended operating conditions (Voltage referenced to Vss = 0V, TA = 0 to 70°C)
Parameter Symbol Min Typ Max Unit Note
Supply voltage VDD 3.0 3.3 3.6 V
Input high voltage VIH 2.0 3.0 VDDQ+0.3 V 1
Input low voltage VIL -0.3 0 0.8 V 2
Output high voltage VOH 2.4 - - V IOH=-2mA
Output low voltage VOL - - 0.4 V IOL=2mA
Input leakage current ILI -10 - 10 uA 3
Note:
1. VIH (max) = 5.6V AC .The overshoot voltage duration is ≤ 3ns.
2. VIL (min) = -2.0V AC .The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VDDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE (VDD = 3.3V, TA = 23°C, f = 1MHz, VREF = 1.4V ± 200mV)
Parameter Symbol Min Max Unit
Address (A0 ~A11, BA0 ~BA1)
/RAS, /CAS, /WE
CKE (CKE0 ~ CKE1)
Clock (CLK0 ~ CLK3)
/CS (/CS0 ~ /CS3)
DQM (DQM0 ~ DQM7)
DQ (DQ0 ~ DQ63)
CADD
C
IN
C
CKE
C
CLK
C
C5
C
DQM
C
OUT
45
45
25
15
15
10
13
85
85
45
21
25
15
18
pF
pF
pF
pF
pF
pF
pF
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
6
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter Symbol Test Condition Value Unit Note
Operating Current
(One Bank Active)
ICC1
Burst Length =1
t
RC≥tRC(min)
IO=0mA
960 mA 1
ICC2P
CKE≤V
IL(max), tCC=10ns
32
Precharge Standby Current
in power-down mode
I
CC2PS
CKE & CLK≤V
IL(max), tCC=∞
32
mA
ICC2N
CKE≥V
IH(min), /CS≥VIH(min), tCC=10ns
Input signals are changed one time during 20ns
320 Precharge Standby Current
in non power-down mode
I
CC2NS
CKE≥V
IH(min), CLK≤VIL(max), tCC=∞
Input signals are stable
160
mA
ICC3P
CKE≤V
IL(max), tCC=10ns
80
Active Standby Current
in power-down mode
I
CC3PS
CKE & CLK≤V
IL(max), tCC=∞
80
mA
ICC3N
CKE≥V
IH(min), /CS≥VIH(min), tCC=10s
Input signals are changed one time during 20ns
480 Active Standby Current
in non power-down mode
(One Bank Active)
I
CC3NS
CKE≥V
IH(min), CLK≤VIL(max), tCC=∞
Input signals are stable
400
mA
Operating Current
(Bust Mode)
ICC4
I
OL= 0 mA
Page Burst
4 Banks activated
tcc
D = 2CLKs
1120 mA 1
Refresh Current ICC5
t
RC≥tRC(min)
1840 mA 2
C 32
Self Refresh Current ICC6
CKE≤0.2V
L 12.8
mA
Note:
1. Measured with outputs open.
2. Refresh period is 64ms
3. Unless otherwise noted, input swing level is CMOS (VIH/VIL=VDDQ/VSSQ)
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
7
AC OPERATING TEST CONDITIONS (VDD = 3.3V±0.3V, TA = 0 to 70°C)
Parameter Value Unit
AC Input levels (Vih/Vil) 2.4/0.4 V
Input timing measurement reference level 1.4 V
Input rise and fall time tr/tf=1/1 ns
Output timing measurement reference level 1.4 V
Output load condition See Fig. 2
Output
(Fig. 1) DC Output Load Circuit
3.3V
1200 Ohm
50pF
870 Ohm
V
OH
(DC)=2.4V, I
OH
=-2mA
V
OL
(DC)=0.4V, I
OL
=2mA
Output
(Fig. 2) AC Output Load Circuit
Vtt=1.4V
50 Ohm
50pF
Z0=50 Ohm
OPERATING AC PARAMETER (AC operating conditions unless otherwise noted)
Parameter Symbol Value Unit Note
Row active to row active delay tRRD(min) 15 ns 1
/RAS to /CAS delay tRCD(min) 20 ns 1
Row precharge time tRP(min) 20 ns 1
tRAS(min) 45 ns 1 Row active time
t
RAS(max) 100 us
Row cycle time
t
RC(min)
65 ns 1
Last data in to row precharge tRDL(min) 2 CLK 2
Last data in to Active precharge tDAL(min) 2 CLK + tRP -
Last data in to new col. address delay tCDL(min) 1 CLK 2
Last data in to burst stop tBDL(min) 1 CLK 2
Col. address to col. address delay tCCD(min) 1 CLK 3
Number of valid output data CAS latency=3 2 ea 4
Note:
1. The minimum number of clock cycles is determined by dividing the minimum time required with
clock cycle time, and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
8
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Refer to the individual component, not the whole module.
Parameter Symbol Min Max Unit Note
CLK cycle time tCC 7.5 1000 ns ns
CLK to valid output delay tSAC 5.4 ns 1, 2
Output data hold time tOH 3.0 ns 2
CLK high pulse width tCH 2.5 ns 3
CLK low pulse width tCL 2.5 ns 3
Input setup time tSS 1.5 ns 3
Input hold time tSH 0.8 ns 3
CLK to output in Low-Z tSLZ 1 ns 2
CLK to output in Hi-Z tSHZ 5.4 ns
Note:
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5) ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf)= 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
9
SIMPLIFIED TRUTH TABLE
COMMAND CKEn-1 CKEn /CS /RAS /CAS /WE DQM BA0,1 A10/AP A11, A0~A9 Note
Register Mode Register Set H X L L L L X OP CODE 1,2
Auto Refresh H 3
Entry
H
L
L L L H X X
3
L H H H 3
Refresh
Self
Refresh
Exit L H
H X X X
X X
3
Bank Active & Row Addr. H X L L H H X V Row Address
Auto Precharge Disable L 4Read &
Column Address
Auto Precharge Enable
H X L H L H X V
H
Column
Address
(A0~A9)
4, 5
Auto Precharge Disable L 4Write &
Column Address
Auto Precharge Enable
H X L H L L X V
H
Column
Address
(A0~A9)
4, 5
Burst Stop H X L H H L X X 6
Bank Selection V L Precharge
Both Banks
H X L L H L X
X H
X
H X X X
Entry
H L
L V V V
X
Clock Suspend or
Active Power
Down
Exit
L H X X X X X
X
H X X X
Entry
H L
L H H H
X
H X X X
Precharge Power
Down Mode
Exit
L H
L V V V
X
X
DQM H X V X 7
H X X X No Operation Command H X
L H H H
X X
(V=Valid, X=Don’t Care, H=Logic High, L=Logic Low)
Note: 1. OP Code: Operand Code
A0~A11, BA0~BA1: Program keys. (@MRS)
2. MRS can be issued only at both banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatically precharge without row precharge command is meant by “Auto”.
Auto/self refresh can be issued only at both banks precharge state.
4. BA0~BA1: Bank select address.
If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.
If both BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank B is selected.
If both BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected.
If A10/AP is “High” at row precharge, BA0 and BA1 are ignored and both banks are selected.
5. During burst read or write with auto precharge, new read/write command cannot be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edged of a CLK masks the data-in at the very CLK (Write DQM latency is 0),
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
10
Serial Presence Detect Specification
Serial Presence Detect
Byte No. Function Described Standard Specification Vendor Part
0 # of Bytes Written into Serial Memory 128bytes 80
1 Total # of Bytes of S.P.D Memory 256bytes 08
2 Fundamental Memory Type SDRAM 04
3 # of Row Addresses on this Assembly 12 0C
4 # of Column Addresses on this Assembly 10 0A
5 # of Module Rows on this Assembly 2 rows 02
6 Data Width of this Assembly 64bits 40
7 Data Width of this Assembly - 00
8 Voltage Interface Standard of this Assembly LVTTL3.3V 01
9 SDRAM Cycle Time @CAS latency of 3 7.5ns 75
10 SDRAM Access Time from Clock @CAS latency of 3 5.4ns 54
11 DIMM configuration type (non-parity, ECC) None 00
12 Refresh Rate Type 15.625us/Self Refresh 80
13 Primary SDRAM Width X8 08
14 Error Checking SDRAM Width None 00
15 Min Clock Delay for Back to Back Random Address tCCD=1CLK 01
16 SDRAM Device Attributes: Burst Lengths Supported 1,2,4,8 & Full page 8F
17 SDRAM Device Attributes: # of banks on SDRAM device 4 bank 04
18 SDRAM Device Attributes: CAS Latency 2,3 06
19 SDRAM Device Attributes: CS Latency 0 clock 01
20 SDRAM Device Attributes: Write Latency 0 clock 01
21 SDRAM Module Attributes
Non-buffered, non-registered
& redundant addressing
00
22 SDRAM Device Attributes: General
+/- 10% voltage tolerance,
Burst Read Signal bit Write
precharge all, auto
precharge
0E
23 SDRAM Cycle Time @CAS Latency of 2 10ns A0
24 SDRAM Access Time from Clock @CAS Latency of 2 6ns 60
25 SDRAM Cycle Time @CAS Latency of 1 - 00
26 SDRAM Access Time from Clock @CAS Latency of 1 - 00
27 Minimum Row Precharge Time (=t RP) 20ns 14
28 Minimum Row Active to Row Activate (=t RRD) 15ns 0F
29 Minimum RAS to CAS Delay (=t RCD) 20ns 14
30 Minimum Activate Precharge Time (=t RAS) 45ns 2D
31 Module Row Density 2 rows of 128MB 20
32 Command and Address Signal input Setup Time 1.5ns 15
33 Command and Address Signal input Hold Time 0.8ns 08
34 Data Signal Setup Time 1.5ns 15
35 Data Signal Hold Time 0.8ns 08
36-61 Superset Information - 00
62 SPD Data Revision Code JEDEC2 02
63 Checksum for Bytes 0-62 - A0
64-71 Manufacturers JEDEC ID Code per JEP-108E Transcend 7F, 4F
72 Manufacturing Location T 54
54 53 33 32 4D 4C
73-90 Manufacturers Part Number TS32MLS64V6D
53 36 34 56 36 44
T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
S
S
S
6
6
6
4
4
4
V
V
V
6
6
6
D
D
D
168PIN PC133 Unbuffered DIMM
256MB With 16Mx8 CL3
Transcend Information Inc.
11
20 20 20 20 20 20
91-92 Revision Code - 0
93-94 Manufacturing Date By Manufacturer Variable
95-98 Assembly Serial Number By Manufacturer Variable
99-125 Manufacturer Specific Data - 0
126 Intel Specification Frequency - 64
127 Intel Specification CAS# Latency/Clock Signal Support CL=2,3 Clock 0~3 F6
128~ Unused Storage Locations Open FF
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