AIC Pavo User manual

Category
Servers
Type
User manual
UM_Pavo_v1.9_112423
Pavo
Server Motherboard
User's Manual
Content
Table of Contents
Preface ����������������������������������������������������������������������������������������������� i
Safety Instructions ���������������������������������������������������������������������������� ii
About This Manual ��������������������������������������������������������������������������� iii
Chapter 1� Product Features �������������������������������������������������������������� 1
1.1 Components .............................................................................................. 1
1.2 Specifications ............................................................................................ 2
1.3 Feature ....................................................................................................... 3
Chapter 2� Hardware Setup ���������������������������������������������������������������� 4
2.1 Central Processing Unit Setup ................................................................. 4
2.1.1 Processor Installation ..........................................................................................4
2.2 System Memory ........................................................................................ 7
2.2.1 Placement ............................................................................................................. 7
2.2.2 DIMM Population .................................................................................................8
2.2.3 DCPMM DIMM Population ................................................................................10
2.2.4 Memory Installation ...........................................................................................11
Chapter 3� Motherboard Settings ����������������������������������������������������� 12
3.1 Block Diagram ......................................................................................... 12
3.2 Content List ............................................................................................. 13
3.3 Placement ................................................................................................ 14
3.4 Connector and Jumper ........................................................................... 15
3.4.1 Connector ...........................................................................................................15
3.4.2 Jumper ................................................................................................................19
3.5 System LED Indicator .............................................................................. 21
3.5.1 Front Panel .........................................................................................................21
3.5.2 Rear I350 LAN ...................................................................................................21
3.5.3 Rear PCH LAN ...................................................................................................22
3.5.4 Rear UID and Internal LED..................................................................................23
Chapter 4� BIOS Configuration Settings ������������������������������������������� 24
4.1 Navigation Keys ....................................................................................... 24
4.2 BIOS Setup ............................................................................................... 25
4.2.1 Menu ...................................................................................................................25
4.2.2 Startup ................................................................................................................25
4.2.3 Update .................................................................................................................28
4.2.4 DCPMM Setup ....................................................................................................30
4.3 Main ......................................................................................................... 35
4.3.1 Main ....................................................................................................................35
4.4 Advanced ................................................................................................. 36
4.4.1 Peripheral Configuration .................................................................................... 36
4.4.2 Video Configuration ...........................................................................................36
4.4.3 OEMBoard Function ...........................................................................................36
4.4.4 SIO AST2500 ......................................................................................................37
4.4.5 Socket Configuration .........................................................................................37
4.4.6 ME Configuration ...............................................................................................43
4.4.7 PCH Configuration .............................................................................................44
4.4.8 H2O IPMI Configuration .....................................................................................45
4.4.9 APEI Configuration .............................................................................................45
4.4.10 Console Redirection .........................................................................................45
4.4.11 H2O Event Log Config Manager ......................................................................46
4.4.12 H2oUve Configuration .....................................................................................46
4.5 Security .................................................................................................... 47
4.5.1 Security ...............................................................................................................47
4.6 Power ....................................................................................................... 48
4.6.1 Power ..................................................................................................................48
4.7 Boot .......................................................................................................... 49
4.7.1 Boot .....................................................................................................................49
4.8 Exit ............................................................................................................ 50
4.8.1 Exit.......................................................................................................................50
4.9 BIOS Post Code ....................................................................................... 51
Chapter 5� BMC Configuration Settings ������������������������������������������� 56
5.1 Method 1 (Use the BIOS Setup) .............................................................. 56
5.2 Method 2 (Use a Dos Tool - Syscheck) .................................................. 59
5.3 Login ......................................................................................................... 61
5.4 Web GUI .................................................................................................. 62
5.4.1 Menu Bar .............................................................................................................62
5.4.2 User Information and Quick Button ..................................................................63
5.4.3 Dashboard ..........................................................................................................64
5.4.4 Sensor ................................................................................................................64
5.4.5 FRU Information .................................................................................................64
5.4.6 Logs and Report .................................................................................................65
5.4.7 Settings .............................................................................................................. 65
5.4.8 Remote Control ..................................................................................................66
5.5 Firmware Update ..................................................................................... 68
5.5.1 Requirement .......................................................................................................68
5.5.2 Update Guide ...................................................................................................... 68
5.5.3 SOC Flash Update ..............................................................................................74
Chapter 6� Technical Support ����������������������������������������������������������� 76
Content
Copyright © 2017 AIC®, Inc� All Rights Reserved�
This document contains proprietary information about
AIC® products and is not to be disclosed or used except in
accordance with applicable agreements.
Document Release History
Release Date Version Update Content
2017 1 User's Manual release to public.
July
2017 1.1 1. BIOS update.
December
2018 1.2 1. New Cover.
2. Specification update.
May
2019 1.3 DIMM update.
September
2019 1.4
1. DCPMM Population.
2. BIOS update.
3. HW update.
October
2019 1.5 Hardware Spec update.
November
2019 1.6 1. Datasheet update.
2. SW update.
December
2019 1.7 BIOS update.
January
2021 1.8 Manual cover update.
BMC update.
November
2023 1.9 Add new section: 4.9 BIOS Post Code.
Copyright
No part of this publication may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means, electronic, mechanical, photo-static, recording
or otherwise, without the prior written consent of the manufacturer.
Trademarks
All products and trade names used in this document are trademarks or registered
trademarks of their respective holders.
Changes
The material in this document is for information purposes only and is subject to change
without notice.
Warning
1. A shielded-type power cord is required in order to meet FCC emission limits and also
to prevent interference to the nearby radio and television reception. It is essential
that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. You are cautioned that changes or modifications not expressly approved by the
party responsible for compliance could void your authority to operate the equipment.
Disclaimer
AIC® shall not be liable for technical or editorial errors or omissions contained herein.
The information provided is provided "as is" without warranty of any kind. To the extent


damages relating to the procurement of substitute products or services; or damages
for loss of data, or software restoration. The information in this document is subject to
change without notice.
Instruction Symbols
Special attention should be given to the instruction symbols below.
NOTE This symbol indicates that there is an explanatory or
supplementary instruction.
CAUTION
This symbol denotes possible hardware impairment. Upmost
precaution must be taken to prevent serious hardware damage.
WARNING
This symbol serves as a warning alert for potential body
injury. The user may suffer possible injury from disregard or
lack of attention.
Preface
i
When installing, operating, or performing maintenance on this equipment, the following
safety precautions should always be taken into account in order to reduce the risk of fire,
electric shock, and personal injury.
Carefully read the safety instructions below before using this product.
Observe all of the warning and instruction signs distinctively marked on the product.
Before performing system installations, please consult the User’s Manual provided
with this product.
Do not place this product on an uneven or weak surface (unstable cart, stand, table,
ect.) that might induce the product to fall and sustain serious damage.
Install only the equipment or device identified in the User’s Manual. Deploying other
equipment or device with this motherboard could invoke improper connection of
circuitry that leads to fire or personal injury.
This product should only be operated with the type of power source indicated on the
marked label. If you are questionable about which type of power supply is used in your
area, consult your dealer or local Power Company.
Disconnect the power supply module before removing power from the system.
Unplug this product from the wall outlet before cleaning. Use a damp cloth for
cleaning. Do not use liquid cleaners or aerosol cleaners.
Do not use this product near a water source, including faucet and lavatory.
Never spill liquids of any kind on this product.
Never shove objects of any kind into this product’s open slots, as they may touch
dangerous voltage points or short out parts and could result in fire or electric shock.
Do not block or cover slots and openings in this unit, as they were made for ventilation
and prevent this unit from overheating. Do not place this product in a built-in
installation unless proper ventilation is available.
Do not disassemble this product. This product should only be taken apart by trained
personnel. Opening or removing covers and circuit boards may expose you to electric
shock or other risks. Incorrect reassembly can also cause electric shock when the
unit is subsequently used.
Risk of explosion is possible if battery is replaced with an incompatible type. Dispose
of used batteries accordingly.
This product is equipped with a three-wire grounding type plug, a plug with a third
(grounding) pin. As a safety feature, this plug is intended to fit only into a grounding
type power outlet. If you are unable to insert the plug into the outlet, contact your
electrician to replace the outlet. Do not remove the grounding type plug or use a
3-Prong To 2-Prong Adapter to circumvent the safety feature; doing so may result in
electric shock and/or damage to this product.
Safety Instructions
Thank you for selecting and purchasing the Pavo Serverboard.
This user's manual is provided for professional technicians to perform easy hardware
setup, basic system configurations, and quick software startup. This document pellucidly
presents a brief overview of the product design, device installation, and firmware settings
for the Pavo motherboard. For the latest version of this user's manual, please refer to the
AIC® website: https://www.aicipc.com/en/productdetail/20854.
Chapter 1 Product Features
This chapter delivers the overall layout of the product, including the fundamental
components on the motherboard, design specifications, and noteworthy features. Pavo
is an ideal server grade motherboard that is specifically designed to accommodate
diverse enterprises for managing heavy workloads, databases, nearline applications, and
cloud deployments. This product supports thee Intel® Xeon® Scalable Processors with
Socket P0 (LGA-3647) and a memory support 16 DDR4 2400/2666 MHz across 6 memory
channels per CPU.
Chapter 2 Hardware Setup
This chapter displays an easy installation guide for assembling the CPU (Central
Processing Unit) and memory module. Utmost caution for proceeding to set up the
hardware is highly advised. The components on the motherboard are highly fragile and
vulnerable to exterior influence. Do not attempt to endanger the device by placing the
device in a potentially unstable or hazardous surroundings, including positioning the device
on an uneven grounds or humid environments.
Chapter 3 Motherboard Settings
This chapter elaborates the overall layout of the server motherboard, including
multifarious connectors, jumpers, and LED descriptions. These descriptions assist users
to configure different settings and functions of the motherboard, as well as to confirm the
location of each connector and jumper.
Chapter 4 BIOS Configuration Settings
This chapter introduces the key features of BIOS, including the descriptions and option
keys for diverse functions. These details provide users to effortlessly navigate and
configure the input/output devices.
Chapter 5 BMC Configuration Settings
This chapter illustrates the diverse functions of IPMI BMC, including the details on logging
into the web page and assorted definitions. These descriptions are helpful in configuring
various functions through Web GUI without entering the BIOS setup. For more information
of BMC configurations, please refer to IPMI BMC (Aspeed AST2500) User's Manual for a
more detailed description.
Chapter 6 Technical Support
For more information or suggestion, please contact the nearest AIC® corporation
representative in your district or visit the AIC® website: https://www.aicipc.com/en/index.
It is our greatest honor to provide the best service for our customers.
About This Manual
1
PAVO
Product features and specifications are subject to change without notice�
LGA3647 Socket P0 for Intel
Xeon Processor Skylake-SP (CPU0)
8 x DDR4 DIMM Slots
6 Channels (for CPU0)
2 x 10GbE SFP+
2 x GbE RJ45
VGA Port
2 x USB 3.0
COM Port by
Audio Jack
RJ45 for BMC
Management
Aspeed AST2500
Video + BMC
AIC MAX I/O™ 2.0 PCIe Gen3 x
Total Supports 64 Lanes + 5 x SATA + 1 x USB 2.0
OCP Mezzanine V2.0 Connector
8 x DDR4 DIMM Slots
6 Channels (for CPU1)
1 x Mini-SAS HD
Supports 4 x SATA3
(Lewisburg)
2 x SATA3 LGA3647 Socket P0 for Intel
Xeon Processor Skylake-SP (CPU1)
Chapter 1� Product Features
1�1 Components
2
Chapter 1. Product Features
1�2 Specifications
System
Processor
Support
Intel® Xeon® Scalable Processors
(Skylake/Cascade Lake/Cascade Lake Refresh)
CPU TDP 165W
UPI Speeds 10.4 GT/s, 9.6 GT/s
Socket Type Socket P0 (LGA-3647 Socket)
System
Memory
• 6 x memory channels per CPU,
2 channels with 2DPC + 4 channels with 1DPC
• 16 x DIMM slots support:
DDR4 2666/2400MHz RDIMM/LRDIMM
(feature supports up to DDR4 2933MHz
by next gen. process upgrade)
- up to 256GB RDIMM SRx4
- up to 512GB RDIMM DRx4
- up to 2048GB RDIMM 3DS 8Rx4
- up to 1024GB LRDIMM QRx4
- up to 2048GB LRDIMM 3DS 8Rx4
• Intel® Optane™ DC Persistent Memory
(Apache Pass) support
Expansion
Slots
• 1 x AIC Max I/O® supports: PCIe Gen3
total 64 lanes + 5 x SATA + 1 x USB2.0
• 1 x OCP Mezzanine V2.0 support PCIe
Gen3 x16
System BIOS
BIOS Type Insyde UEFI BIOS
BIOS
Features
ACPI
• PXE
• WOL
AC loss recovery
• IPMI KCS interface
• SMBIOS
• Serial console
redirection
• BIOS Boot
• BIOS Recovery
Mode
• SRIOV
• iSCSI
• TPM
• PCIe Hotplug
On-board
Devices
SATA
Intel® Lewisburg PCH on-chip solution
• 4 x SATA 6.0 Gb/s (by 1 x mini-SAS HD) +
2 x SATA 6.0 Gb/s (by 2 x SATA 7 pin)
• 5 x SATA 6.0 Gb/s (by Max I/O®)
BMC
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
• Baseboard Management Controller
• Intelligent Platform Interface 2.0 (IPMI 2.0)
• iKVM, Media Redirection, IPMI over LAN,
Serial over LAN
• SMASH Support
• HTML5
Network
Controller
• Intel® PCH (Lewisburg) Integrated 10GbE LAN
Controller with dual SFP+ rear connectors
• Intel® I350 dual ports RJ45 rear connectors
• Realtek RTL8211E GbE Ethernet for BMC
dedicated management port
Graphics
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
• PCIe VGA/2D Controller
• 1920x1200@60Hz 32bpp
Input/Output
SATA
11 x SATA 6.0 Gb/s ports
• 4 x SATA 6.0 Gb/s (by 1 x mini-SAS HD) +
2 x SATA 6.0 Gb/s (by 2 x SATA 7 pin) +
5 x SATA 6.0 Gb/s (by Max I/O®)
LAN
• 2 x 10GbE SFP+
• 2 x GbE RJ45
• 1 x GbE RJ45 dedicated to BMC management
USB
• 2 x USB 3.0 Type A connectors
• 1 x USB internal pin-header to support
2 x USB3.0/USB2.0
• 1 x USB internal pin-header to support
2 x USB 2.0
VGA
• 1 x external VGA port
• 1 x internal VGA pin-header
(share with external VGA port)
Serial Port • 1 x external COM port by 3.5mm phone jack
• 2 x internal COM pin-headers
Other • 1 x TPM 2.0 onboard
3
Chapter 1. Product Features
The Pavo server board integrates Intel® Xeon® Scalable processors and 16 DDR4 DIMM
2400/2666MHz (feature support up to DDR4 2933MHz by Cascade Lake upgrade) to offer
support for greater capacity, durability, and proficiency for our customers. Highlighting
Intel® Xeon® Scalable processors, which are emphasized for its optimized performance,
efficiency, and security, this product enhances these advantages by implementing the
microarchitecture, AIC® Max I/O™ 2.0 to maximize system expansion and operating speed.
In addition to integrating speed and system expansion to the server board, Pavo offers
immediate and efficient management with Onboard Baseboard Management Controller
and greater I/O extension. Featuring IPMI 2.0 and Aspeed AST2500 Advanced PCIe
Graphics, the server board offers support for iKVM, Media Redirection, IPMI over LAN,
Serial over LAN, HTML5, and Redfish.
Supports Intel® Xeon® Scalable Processors for highest server performance and
improved power efficiency
Supports 16 DDR4 DIMM slots for maximum memory performance
AIC® Max I/O™ supports 64 PCIe Gen3 lanes
Supports one OCP Mezzanine V2.0 up to PCIe Gen3x16 extension
Onboard dual 10GbE SFP+ ports by Intel® Lewisburg PCH and dual GbE ports by
Intel® Ethernet Controller I350
Onboard Baseboard Management Controller for system management and IPMI control
Embedded components for 5+ year long life
Rackmount Technology Extension (RTX) form factor utilizes full internal chassis
volume for optimum I/O configurations
1�3 Feature
4
This chapter provides the graphic detail and basic instruction for hardware installation.
Turn off the system and unplug all peripheral devices before proceeding.
2�1 Central Processing Unit Setup
The serverboard supports dual Xeon scalable processors and Socket P0 (LGA-3647).
2�1�1 Processor Installation
To ensure a safe and easy setup, you need to prepare before installation:
a T20 Torx screwdriver
ESD wrist strap/mat and conductive foam pad
Safe and stable environment
CAUTION

or any foreign objects are pressed against them. Please keep the socket protective cover on
when the processor is not installed.
CAUTION
When unpacking a processor, hold the processor only by its edges to avoid touching the
contacts.
Standard Processor Assembly:
A standard processor assembly is comprised of PHM(Processor Heatsink Module)
components and processor socket assembly.
Chapter 2� Hardware Setup
This information is provided for professional technicians only.
Heat sink
Standard
Processor Clip
Standard
Processor
Bolster Plate
Precsessor
Socket
PHM Components
Processor
Socket Assembly
o
5
Chapter 2. Hardware Setup
Processor Socket Assembly:
The server board includes two processor sockets (LGA-3647), supports one or two of
the Intel® Xeon® Processor Scalable Family and has a Thermal Design Power (TDP)
of up to 165W on selected models.
PHM (Processor Heatsink Module) Component:
This information is provided for professional technicians only.
Non Frabic
Processor
Non Frabic
Processor Clip
Heat sink
Fabric
Fabric
6
Chapter 2. Hardware Setup
The PHM sits level with the processor socket assembly. The PHM is NOT installed
properly if it does not sit level with the processor socket assembly. Once the PHM is
seated over the processor socket assembly, the four heat sink torque screws must be
tightened in order as shown below.
Processor Heat Sink – Top View with Screw Tightening Order
CAUTION
Failure to tighten the heatsink screws in the specified order may cause damage to the
processor socket assembly. Heat sink screws should be tighted to 12 in-lbs torque
according to the indicated order on the top of the heatsink label.
7
Chapter 2. Hardware Setup
This server board supports up to sixteen DDR4 2400 and 2666 Registered ECC DRAM/
Load-Reduced DIMM (LRDIMM).
2�2�1 Placement
CPU0CPU0CPU0CPU0 CPU1CPU1CPU1CPU1
DIMMCDIMMC
DIMMBDIMMB
DIMMA1DIMMA1
DIMMA2DIMMA2
2�2 System Memory
DIMMJDIMMJ
DIMMHDIMMH
DIMMG1DIMMG1
DIMMG2DIMMG2
DIMM_K2DIMM_K2
DIMM_K1DIMM_K1
DIMM_LDIMM_L
DIMM_MDIMM_M
DIMM_D2DIMM_D2
DIMM_D1DIMM_D1
DIMM_EDIMM_E
DIMM_FDIMM_F
8
Chapter 2. Hardware Setup
2�2�2 DIMM Population
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
DIMM Numbers DIMM ARRANGMENT
2 DIMMs
CPU0 CPU1
JDIMM_C JDIMM_J
CPU0
CPU0
CPU0
CPU0
CPU1
CPU1
CPU1
CPU1
4 DIMMs
CPU0 CPU1
JDIMM_C JDIMM_J
JDIMM_A1 JDIMM_G1
CPU0
CPU0
CPU0
CPU0
CPU1
CPU1
CPU1
CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
6 DIMMs
CPU0 CPU1
JDIMM_C JDIMM_J
JDIMM_A1 JDIMM_G1
JDIMM_F JDIMM_M
CPU0
CPU0
CPU0
CPU0
CPU1
CPU1
CPU1
CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
8 DIMMs
CPU0 CPU1
JDIMM_CJDIMM_J
JDIMM_A1 JDIMM_G1
JDIMM_D1 JDIMM_K1
JDIMM_FJDIMM_M
CPU0
CPU0
CPU0
CPU0
CPU1
CPU1
CPU1
CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
9
Chapter 2. Hardware Setup
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_D1
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_K1
JDIMM_M
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_A2
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_G2
JDIMM_K1
JDIMM_L
JDIMM_M
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_A2
JDIMM_D2
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_G2
JDIMM_K2
JDIMM_K1
JDIMM_L
JDIMM_M
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_K1
JDIMM_L
JDIMM_M
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_D1
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_K1
JDIMM_M
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_A2
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_G2
JDIMM_K1
JDIMM_L
JDIMM_M
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_A2
JDIMM_D2
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_G2
JDIMM_K2
JDIMM_K1
JDIMM_L
JDIMM_M
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
JDIMM_C
JDIMM_B
JDIMM_A1
JDIMM_D1
JDIMM_E
JDIMM_F
JDIMM_J
JDIMM_H
JDIMM_G1
JDIMM_K1
JDIMM_L
JDIMM_M
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
CPU0CPU0 CPU1CPU1
JDIMMD2 JDIMMK2
JDIMML
JDIMMM
JDIMMK1JDIMMD1
JDIMME
JDIMMF
JDIMMC
JDIMMB
JDIMMA1
JDIMMA2
JDIMMJ
JDIMMH
JDIMMG1
JDIMMG2
10
Chapter 2. Hardware Setup
2�2�3 DCPMM DIMM Population
Asymetric population
CPU0
DIMM JDIMMF JDIMME JDIMMD2 JDIMMD1 JDIMMC JDIMMB JDIMMA2 JDIMMA1
App Direct
Mode DRAM1 DRAM1 - DRAM1 DRAM1 DRAM1 DCPMM DRAM1
App Direct
Mode * DRAM1 DRAM1 - DRAM1 DRAM1 DRAM1 DCPMM DRAM1
NOTE
App Direct* : App Direct Mode with no DCPMM DIMM in second socket.
Symetrix population
CPU0 CPU1
DIMM JDIMMF JDIMME JDIMMD2 JDIMMD1 JDIMMC JDIMMB JDIMMA2 JDIMMA1 JDIMM JDIMML JDIMMK2 JDIMMK1 JDIMMJ JDIMMH JDIMMG2 JDIMMG1
App
Direct
Mode
DRAM1 DRAM1 DCPMM DRAM1 DRAM1 DRAM1 DCPMM DRAM1 - - - - - - - -
Memory
Mode DRAM2 DRAM2 DCPMM DRAM2 DRAM2 DRAM2 DCPMM DRAM2 - - - - - - - -
Mixed
Memory
Mode
DRAM4 DRAM4 DCPMM DRAM4 DRAM4 DRAM4 DCPMM DRAM4 - - - - - - - -
App
Direct
Mode
DRAM1 DRAM1 DCPMM DRAM1 DRAM1 DRAM1 DCPMM DRAM1 DRAM1 DRAM1 DCPMM DRAM1 DRAM1 DRAM1 DCPMM DRAM1
Memory
Mode DRAM2 DRAM2 DCPMM DRAM2 DRAM2 DRAM2 DCPMM DRAM2 DRAM2 DRAM2 DCPMM DRAM2 DRAM2 DRAM2 DCPMM DRAM2
Mixed
Memory
Mode
DRAM4 DRAM4 DCPMM DRAM4 DRAM4 DRAM4 DCPMM DRAM4 DRAM4 DRAM4 DCPMM DRAM4 DRAM4 DRAM4 DCPMM DRAM4
NOTE
DIMM Type RDIMM 3DS RDIMM LRDIMM 3DS LRDIMM Capacity
DRAM1 Any Capacity
DRAM2 
DRAM3    Any Capacity
DCPMM Any Capacity (Uniformly for all channels for system configuration)
NOTE
Please abide to the DCPMM population rules listed below for your system to function accordingly.
There is only a maximum of 1 DCPMM in each channel.
Populate DCPMM DIMM on DIMM0 first.
11
Chapter 2. Hardware Setup
2�2�4 Memory Installation
Step 1 Unlock the dimm socket by pressing the retaining clips outward.
Step 2 Insert the memory module into the slot. Make sure that the DIMM notch is
accurately positioned.
Step 3 Close the retaining clips to complete installation.
DIMM n
otch
12
Chapter 3. Motherboard Settings
This section describes the jumpers, internal connectors, and internal LED settings on the
Pavo motherboard. The motherboard layout and jumper settings are listed below.
3�1 Block Diagram
Chapter 3� Motherboard Settings
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AIC Pavo User manual

Category
Servers
Type
User manual

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