Transistors
Publication date : October 2008 SJC00416AED 1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SB0621A
Silicon PNP epitaxial planar type
For low-frequency driver amplification
Complementary to 2SD0592A
Features
Low collector-emitter saturation voltage V
CE(sat)
High transition frequency f
T
Absolute Maximum Ratings T
a
= 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) V
CBO
–60 V
Collector-emitter voltage (Base open) V
CEO
–50 V
Emitter-base voltage (Collector open) V
EBO
–5 V
Collector current I
C
–1 A
Peak collector current I
CP
–1.5 A
Collector power dissipation P
C
750 mW
Junction temperature T
j
150
°C
Storage temperature T
stg
–55 to +150
°C
Electrical Characteristics T
a
= 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) V
CBO
I
C
= –10 mA, I
E
= 0 –60 V
Collector-emitter voltage (Base open) V
CEO
I
C
= –2 mA, I
B
= 0 –50 V
Emitter-base voltage (Collector open) V
EBO
I
E
= –10 mA, I
C
= 0 –5 V
Collector-base cutoff current (Emitter open)
I
CBO
V
CB
= –20 V, I
E
= 0 – 0.1
mA
Forward current transfer ratio
h
FE1
*
V
CE
= –10 V, I
C
= –500 mA 85 340
h
FE2
V
CE
= –5 V, I
C
= –1 A 50
Collector-emitter saturation voltage V
CE(sat)
I
C
= –500 mA, I
B
= –50 mA – 0.2 – 0.4 V
Base-emitter saturation voltage V
BE(sat)
I
C
= –500 mA, I
B
= –50 mA – 0.85 –1.2 V
Transition frequency f
T
V
CB
= –10 V, I
E
= 50 mA, f = 200 MHz 200 MHz
Collector output capacitance
(Common base, input open circuited)
C
ob
V
CB
= –10 V, I
E
= 0, f = 1 MHz 20 30 pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2.
*
: Rank classification
Rank Q R S
h
FE1
85 to 170 120 to 240 170 to 340
Package
Code
TO-92B-B1
Pin Name
1. Emitter
2. Collector
3. Base
2SB0621A
2 SJC00416AED
This product complies with the RoHS Directive (EU 2002/95/EC).
P
C
T
a
I
C
V
CE
I
C
I
B
V
CE(sat)
I
C
V
BE(sat)
I
C
h
FE
I
C
0 16040 12080
0
1.0
0.8
0.6
0.4
0.2
Collector power dissipation P
C
(
W
)
Ambient temperature T
a
(
°C
)
0 −10−8−2 −6−4
0
−1.50
−1.25
−1.00
− 0.75
− 0.50
− 0.25
I
B
= −10 mA
−9 mA
−8 mA
−7 mA
−6 mA
−5 mA
−4 mA
−3 mA
−2 mA
−1 mA
T
a
= 25°C
Collector current I
C
(
A
)
Collector-emitter voltage V
CE
(
V
)
− 0.01
− 0.1 −1 −10
− 0.01
− 0.1
−1
−10
−100
I
C
/ I
B
= 10
−25°C
T
a
= 75°C
25°C
Collector-emitter saturation voltage V
CE(sat)
(
V
)
Collector current I
C
(
A
)
− 0.01
− 0.1 −1 −10
− 0.01
− 0.1
−1
−10
−100
I
C
/ I
B
= 10
T
a
= −25°C
75°C
25°C
Base-emitter saturation voltage V
BE(sat)
(
V
)
Collector current I
C
(
A
)
− 0.01
− 0.1 −1 −10
0
500
400
300
200
100
V
CE
= −10 V
T
a
= 75°C
25°C
−25°C
Forward current transfer ratio h
FE
Collector current I
C
(
A
)
1 10 100
0
200
160
120
80
40
V
CB
= −10 V
T
a
= 25°C
Transition frequency f
T
(
MHz
)
Emitter current I
E
(
mA
)
−1 −10 −100
0
50
40
30
20
10
I
E
= 0
f = 1 MHz
T
a
= 25°C
Collector-base voltage V
CB
(
V
)
Collector output capacitance
(Common base, input open circuited)
C
ob
(pF)
0.1 1 10 100
Collector-emitter voltage
(Resistor between B and E)
V
CER
(V)
0
−120
−100
−80
−60
−40
−20
I
C
= −10 mA
T
a
= 25°C
Base-emitter resistance R
BE
(
kΩ
)
0 −12−10−8−2 −6−4
0
−1.2
−1.0
− 0.8
− 0.6
− 0.4
− 0.2
V
CE
= −10 V
T
a
= 25°C
Base current I
B
(
mA
)
Collector current I
C
(
A
)
f
T
I
E
C
ob
V
CB
V
CER
R
BE
2SB0621A
SJC00416AED 3
This product complies with the RoHS Directive (EU 2002/95/EC).
I
CEO
T
a
安全動作領域
0 16040 12080
1
10
10
2
10
3
10
4
V
CE
= −10 V
Ambient temperature T
a
(
°C
)
I
CEO
(
T
a
)
I
CEO
(
T
a
= 25°C
)
− 0.1 −1 −10 −100
− 0.001
− 0.01
− 0.1
−1
−10
Single pulse
T
a
= 25°C
t = 10 ms
t = 1 s
I
CP
I
C
Collector current I
C
(
A
)
Collector-emitter voltage V
CE
(
V
)
2SB0621A
4 SJC00416AED
This product complies with the RoHS Directive (EU 2002/95/EC).
TO-92-B1 Unit: mm
5.0 ±0.2
5.1 ±0.212.9 ±0.5
0.7 ±0.2
0.7 ±0.1
0.45
4.0 ±0.2
0.45
2.3 ±0.2
1
2
3
2.5
2.5
+0.15
−0.1
+0.6
−0.2
+0.15
−0.1
+0.6
−0.2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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