Dynatron 88885166 Datasheet

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NEW PRODUCT SPEC SHEET
Dynatron K618 Thermal Performance
0.19
0.21
0.23
0.25
0.27
0.29
0.31
0.33
0.35
0 1821242730
Wind Tunnel Airflow Rate (CFM)
Thermal Resistance (°c/w)
R-th
Model Number: K618
Recommend for Intel® Xeon® Processor E3 Family, Socket LGA1155
Xeon® Processor 3000 Sequence, Socket LGA1156
Passive Heat Sink for 2U Server
Overall Specification:
Dimension: 90.0 x 90.0 x 66.0mm
Weight: 490g
Copper Base with Aluminum Stacked Fin plus 3 Heat Pipes
Back Strip is Included
Thermal Grease Pre-Printed with GE-Toshiba TIG830SP
Support CPU Power up to 95 Watts
Heatsink K618 Thermal Performance VS. Wind Tunnel Airflow :
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