Dynatron 88885149 Datasheet

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NEW PRODUCT SPEC SHEET
Thermal Performance Chart
0.448
0.393
0.352
0.32
0.295
0.28
0.31
0.34
0.37
0.4
0.43
0.46
01013161922
Wind Tunnel Simulation (CFM)
Thermal Resistance (°c/w)
K1
Model Number: K1
Recommend for Intel® Core™ i5 I5-750; Xeon® Processor 3400 Series; Core™ i7 Processors
I7-870 & I7-860; Socket LGA1156
Passive Heat Sink for 1U Server
Overall Specification:
Dimension: 95.0 x 95.0 x 26.5 mm
Weight: 300g ±5g
Material: Aluminum with Skiving Fins
Captive mounting design
Back Strip is Included
TIG830SP Thermal Grease Pre-Printed
Support CPU Power up to 85Watts
Passive Cooler K1 Cooling Performance VS. Airflow (Wind Tunnel Simulation):
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