Intel WX58BP, WX58BPR Datasheet

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April 2009
Order Number: E65585-002
The Intel
®
Workstation Board WX58BP may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel
®
Workstation Board WX58BP Specification Update.
Intel
®
Workstation Board
WX58BP
Technical Product Specification
Revision History
Date Revision
Number
Modifications
Feb 2009 001 Initial release of the Intel
®
Workstation Board WX58BP Technical Product
Specification.
April 2009 002 Minor edits and grammatical corrections.
This product specification applies to only the standard Intel
®
Workstation Board WX58BP with BIOS identifier
BPX5810J.86A.
Changes to this specification will be published in the Intel
®
Desktop Board WX58BP Specification Update before being
incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE
OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
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OR DEATH MAY OCCUR.
All Intel
®
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC)
for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
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not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
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Copyright 2009, Intel Corporation. All rights reserved.
iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel
®
Workstation Board WX58BP.
Intended Audience
This TPS is intended to provide detailed, technical information about the Intel
®
Workstation Board WX58BP and its components to the vendors, system integrators,
and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel
®
Workstation Board WX58BP
2 A map of the resources of the Intel
®
Workstation Board
3 Features supported by the BIOS Setup program
4 Description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board WX58BP Technical Product Specification
iv
Other Common Notation
Notation Description
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
Kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Unless otherwise specified, voltages are DC.
* This symbol indicates third-party brands and names that are the property of their respective
owners.
v
Contents
1 Product Description .............................................................. 9
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 10
1.1.3 Block Diagram ..................................................................... 12
1.2 Legacy Considerations...................................................................... 13
1.3 Online Support................................................................................ 13
1.4 Processor ....................................................................................... 13
1.5 System Memory .............................................................................. 13
1.5.1 Memory Configurations ......................................................... 15
1.6 Intel
®
X58 Chipset........................................................................... 17
1.6.1 USB ................................................................................... 17
1.6.2 Serial ATA Interfaces ............................................................ 18
1.7 Real-Time Clock (RTC) Subsystem ..................................................... 19
1.8 Legacy I/O Controller....................................................................... 19
1.9 Audio Subsystem............................................................................. 20
1.9.1 Audio Subsystem Software .................................................... 20
1.9.2 Audio Connectors and Headers ............................................... 20
1.9.3 8-Channel (7.1) Audio Subsystem........................................... 21
1.10 LAN Subsystem............................................................................... 22
1.10.1 Intel
®
82567LM Gigabit Ethernet Controller.............................. 22
1.10.2 LAN Subsystem Software....................................................... 23
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 23
1.11 Hardware Management Subsystem .................................................... 24
1.11.1 Hardware Monitoring and Fan Control...................................... 24
1.11.2 Fan Monitoring..................................................................... 24
1.11.3 Chassis Intrusion and Detection.............................................. 24
1.11.4 Thermal Monitoring .............................................................. 25
1.12 Power Management ......................................................................... 26
1.12.1 ACPI 26
1.12.2 Hardware Support ................................................................ 30
1.12.3 ENERGY STAR* .................................................................... 34
2 Technical Reference............................................................ 35
2.1 Memory Resources .......................................................................... 35
2.1.1 Addressable Memory............................................................. 35
2.1.2 Memory Map........................................................................ 37
2.2 Connectors and Headers................................................................... 37
2.2.1 Back Panel Connectors .......................................................... 38
2.2.2 Component-side Connectors and Headers ................................ 39
2.3 Jumper Block .................................................................................. 48
2.4 Mechanical Considerations ................................................................ 50
2.4.1 Form Factor......................................................................... 50
Intel Desktop Board WX58BP Technical Product Specification
vi
2.5 Electrical Considerations................................................................... 51
2.5.1 Power Supply Considerations ................................................. 51
2.5.2 Fan Header Current Capability................................................ 52
2.5.3 Add-in Board Considerations .................................................. 52
2.6 Thermal Considerations .................................................................... 52
2.7 Reliability ....................................................................................... 55
2.8 Environmental ................................................................................ 55
3 Overview of BIOS Features ................................................. 57
3.1 Introduction ................................................................................... 57
3.2 BIOS Flash Memory Organization ....................................................... 58
3.3 Resource Configuration .................................................................... 58
3.3.1 PCI Auto-configuration .......................................................... 58
3.4 System Management BIOS (SMBIOS)................................................. 59
3.5 Legacy USB Support ........................................................................ 59
3.6 BIOS Updates ................................................................................. 60
3.6.1 Language Support ................................................................ 60
3.6.2 Custom Splash Screen .......................................................... 61
3.7 BIOS Recovery................................................................................ 61
3.8 Boot Options................................................................................... 62
3.8.1 CD-ROM Boot ...................................................................... 62
3.8.2 Network Boot....................................................................... 62
3.8.3 Booting Without Attached Devices........................................... 62
3.8.4 Changing the Default Boot Device During POST ........................ 62
3.9 Adjusting Boot Speed....................................................................... 63
3.9.1 Peripheral Selection and Configuration..................................... 63
3.9.2 BIOS Boot Optimizations ....................................................... 63
3.10 BIOS Security Features .................................................................... 64
4 Error Messages and Beep Codes ......................................... 65
4.1 Speaker ......................................................................................... 65
4.2 BIOS Beep Codes ............................................................................ 65
4.3 BIOS Error Messages ....................................................................... 65
4.4 Port 80h POST Codes ....................................................................... 66
5 Regulatory Compliance and Battery Disposal Information .. 71
5.1 Regulatory Compliance..................................................................... 71
5.1.1 Safety Standards.................................................................. 71
5.1.2 European Union Declaration of Conformity Statement................ 72
5.1.3 Product Ecology Statements................................................... 73
5.1.4 EMC Regulations .................................................................. 77
5.1.5 Product Certification Markings (Board Level)............................. 78
5.2 Battery Disposal Information............................................................. 79
Contents
vii
Figures
Figure 1. Major Board Components............................................................... 10
Figure 2. Block Diagram.............................................................................. 12
Figure 3. Memory Channel and DIMM Configuration ........................................ 16
Figure 4. Back Panel Audio Connector Options................................................ 21
Figure 5. LAN Connector LED Locations ......................................................... 23
Figure 6. Thermal Sensors and Fan Headers .................................................. 25
Figure 7. Locations of Indicator LEDs ............................................................ 33
Figure 8. Detailed System Memory Address Map............................................. 36
Figure 9. Back Panel Connectors .................................................................. 38
Figure 10. Component-side Connectors and Headers....................................... 39
Figure 11. Connection Diagram for Front Panel Header.................................... 45
Figure 12. Connection Diagram for Front Panel USB Headers............................ 47
Figure 13. Connection Diagram for IEEE 1394a Header.................................... 47
Figure 14. Location of the Jumper Block ........................................................ 48
Figure 15. Board Dimensions....................................................................... 50
Figure 16. Localized High Temperature Zones ................................................ 53
Tables
Table 1. Feature Summary............................................................................ 9
Table 2. Components Shown in Figure 1........................................................ 11
Table 3. Supported Memory Configurations.................................................... 15
Table 4. LAN Connector LED States .............................................................. 23
Table 5. Effects of Pressing the Power Switch................................................. 27
Table 6. Power States and Targeted System Power......................................... 28
Table 7. Wake-up Devices and Events........................................................... 29
Table 8. System Memory Map...................................................................... 37
Table 9. Component-side Connectors and Headers Shown in Figure 10 .............. 40
Table 10. HD Audio Link Header................................................................... 41
Table 11. Front Panel Audio Header.............................................................. 41
Table 12. Serial ATA Connectors .................................................................. 41
Table 13. Chassis Intrusion Header .............................................................. 42
Table 14. Front and Rear Chassis (3-Pin) Fan Headers..................................... 42
Table 15. Processor and Rear Chassis 2 (4-Pin) Fan Headers............................ 42
Table 16. Processor Core Power Connector .................................................... 43
Table 17. Main Power Connector .................................................................. 44
Table 18. Front Panel Header....................................................................... 45
Table 19. States for a One-Color Power LED .................................................. 46
Table 20. States for a Two-Color Power LED .................................................. 46
Table 21. BIOS Setup Configuration Jumper Settings ...................................... 49
Table 22. Recommended Power Supply Current Values.................................... 51
Table 23. Fan Header Current Capability ....................................................... 52
Table 24. Thermal Considerations for Components.......................................... 54
Table 25. Environmental Specifications ......................................................... 55
Table 26. BIOS Setup Program Menu Bar ...................................................... 58
Table 27. BIOS Setup Program Function Keys ................................................ 58
Intel Desktop Board WX58BP Technical Product Specification
viii
Table 28. Acceptable Drives/Media Types for BIOS Recovery............................ 61
Table 29. Boot Device Menu Options............................................................. 62
Table 30. Supervisor and User Password Functions ......................................... 64
Table 31. Beep Codes................................................................................. 65
Table 32. BIOS Error Messages.................................................................... 65
Table 33. Port 80h POST Code Ranges .......................................................... 66
Table 34. Port 80h POST Codes.................................................................... 67
Table 35. Typical Port 80h POST Sequence .................................................... 69
Table 36. Safety Standards ......................................................................... 71
Table 37. Lead-Free Board Markings............................................................. 76
Table 38. EMC Regulations .......................................................................... 77
Table 39. Product Certification Markings........................................................ 78
9
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor
Intel
®
Xeon
®
W3500 series Processor in an LGA1366 socket
Memory
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz DIMMs
Support for up to 16 GB of system memory
Support for non-ECC memory and ECC memory
Chipset
Intel
®
X58 Chipset, consisting of:
Intel
®
X58 I/O Hub (IOH)
Intel
®
82801IJR I/O Controller Hub (ICH10R)
Audio Intel
®
High Definition Audio subsystem using the Realtek* ALC889 audio codec
Legacy I/O Control Winbond legacy I/O controller
Peripheral
Interfaces
12 USB 2.0 ports
Six internal Serial ATA interfaces with RAID support
Two IEEE 1394a ports (one on back panel, one front-panel header)
BIOS
Intel
®
BIOS resident in the SPI Flash device
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
Support for PCI Local Bus Specification Revision 2.2
Support for PCI Express* Revision 2.0
Suspend to RAM support
Wake on PCI, front panel, and USB ports
LAN Support
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel
®
82567LM
Gigabit Ethernet Controller
Expansion
Capabilities
One PCI Conventional bus add-in card connector (SMBus routed to PCI
Conventional bus add-in card connector)
Two PCI Express* 2.0 x16 bus add-in card connectors
One PCI Express* 2.0 x4 bus add-in card connector
Two PCI Express* 1.1 x1 bus add-in card connectors
Hardware Monitor
Subsystem
Hardware monitoring and fan control ASIC
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan headers using PWM control
Three fan sense inputs used to monitor fan activity
Fan speed control using voltage control (3-pin fan headers front and rear)
Support for Product Environmental Control Interface (PECI)
Intel Desktop Board WX58BP Technical Product Specification
10
1.1.2 Board Layout
Figure 1 shows the location of the major components on the Intel
®
Workstation Board
WX58BP.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
Technical Reference
11
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1
Description
A Auxiliary fan
B PCI Express* x1 connector
C PCI Express* x16 bus add-in card connector (Secondary)
D Front panel audio header
E PCI Conventional bus add-in card connector
F PCI Express* x1 bus add-in card connector
G PCI Express* x16 bus add-in card connector (Primary)
H PCI Express* x4 bus add-in card connector
I Back panel connectors
J Processor fan header
K Rear fan header
L LGA1366 processor socket
M DIMM Channel A sockets [2]
N DIMM Channel B socket
O DIMM Channel C socket
P Main power connector
Q Intel
®
82X58 IO Hub (IOH)
R Processor core power connector (2 X 4)
S Chassis intrusion header
T Front chassis fan header
U Serial ATA connectors [6]
V Front panel USB headers [2]
W Battery
X Intel
®
82801IJR I/O Controller Hub (ICH10R)
Y IEEE 1394a front panel header
Z BIOS Setup configuration jumper block
AA Auxiliary front panel power LED header
BB Front panel header
CC High Definition Audio Link header
DD S/PDIF connector
Intel Desktop Board WX58BP Technical Product Specification
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
Technical Reference
13
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products with specific changes
including (but not limited to) the following:
No parallel port
No floppy drive connector
No serial port
No PS/2 connectors
1.3 Online Support
To find information about… Website
Intel
®
Workstation Board WX58BP http://www.intel.com/products/motherboard/WX58BP/index.htm
Server Board Support http://support.intel.com/support/motherboards/server/WX58BP
BIOS and driver updates http://downloadcenter.intel.com/
1.4 Processor
The board is designed to support the following processor:
Intel
®
Xeon
®
W3500 series Processor in an LGA1366 socket
In the future, this board may support other processors. This board is designed to
support processors with a maximum wattage of 130 W. The processor listed previously
is only supported when falling within the wattage requirements of the Intel
®
Workstation Board WX58BP. For the most up-to-date list of supported processors,
refer to the following Intel web site: http://processormatch.intel.com
CAUTION
Use only the processors listed on the website mentioned previously. Use of
unsupported processors can damage the board, processor, and power supply.
INTEGRATOR’S NOTE
This board has specific requirements for providing power to the processor. For
information on power supply requirements for this board, refer to Section 2.5.1.
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
1.5-V DDR3 SDRAM DIMMs
Three independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided DIMMs with the following restriction: This
board does not support double-sided DIMMs with x16 organization.
Intel Desktop Board WX58BP Technical Product Specification
14
16 GB maximum total system memory. For information on the total amount of
addressable memory, refer to Section 2.1.1.
Minimum total system memory: 1 GB
Non-ECC DIMMs and ECC DIMMs
Serial Presence Detect
DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, you
should populate the board with DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but this
may impact the performance and reliability or the DIMMs may not function under the
determined frequency.
Technical Reference
15
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
Configuration
(Note 1)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
(Note 2)
1024 MB SS 1 Gb 128 M x 8/empty 8 [9]
2048 MB DS 1 Gb 128 M x 8/128 M x 8 16 [18]
Notes:
1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).
2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.
1.5.1 Memory Configurations
The Intel
®
Xeon
®
W3500 series Processor supports the following types of memory
organization:
Tri/Dual channel (Interleaved) mode. This mode offers the highest throughput
for “real world” applications. Interleaving reduces overall memory latency by
accessing the DIMM memory sequentially. Data is spread amongst the memory
modules in an alternating pattern.
Three independent memory channels give two possible modes of interleaving:
Tri-Channel Mode: Enabled when identical matched memory modules are
installed in each of the three memory channels (blue connectors).
Dual-Channel Mode: Enabled when two of the blue memory connectors
are populated with matched DIMMs.
Single-Channel (Asymmetric) Mode: Equivalent to single-channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is
installed or the installed memory modules are not matched. Technology and device
width can vary from one channel to the other.
Figure 3 illustrates the memory channel and DIMM configuration.
Intel Desktop Board WX58BP Technical Product Specification
16
Figure 3. Memory Channel and DIMM Configuration
Technical Reference
17
1.6 Intel
®
X58 Chipset
The Intel
®
X58 chipset consists of the following devices:
Intel
®
82X58 IOH with Direct Media Interface (DMI) interconnect
Intel
®
82801IJR I/O Controller Hub (ICH10R)
The IOH component provides interfaces to the processor and the PCI Express*
graphics connectors. The ICH10R is a centralized controller for the board’s I/O paths.
For information about… Refer to
Intel
®
X58 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board supports up to 12 USB 2.0 ports; supports UHCI and EHCI; and uses UHCI-
and EHCI-compatible drivers.
The ICH10R provides the USB controller for all ports. The port arrangement is as
follows:
Eight ports are implemented with dual, stacked back panel connectors adjacent to
the audio connectors
Four ports are routed to two separate front panel USB headers
For information about Refer to
The location of the USB connectors on the back panel Figure 9
The location of the front panel USB headers Figure 10
Intel Desktop Board WX58BP Technical Product Specification
18
1.6.2 Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per
connector.
1.6.2.1 Serial ATA Support
The board’s Serial ATA controller offers six independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gb/s per port. You can install one device on
each port for a maximum of six Serial ATA devices. Unlike a Parallel ATA IDE, which
supports a master/slave configuration and two devices per channel, a point-to-point
interface is used for host to device connections.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In Legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using Microsoft Windows XP*
and Microsoft Windows Vista* operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about the location of the Serial ATA connectors, refer to Figure 10.
1.6.2.2 Serial ATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the ICH10R:
RAID 0 - Data striping
RAID 1 - Data mirroring
RAID 0+1 (or RAID 10) - Data striping and mirroring
RAID 5 - Distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP* installation, you must press F6 to install the RAID
drivers. For more information about installing drivers during installation, refer to your
Microsoft Windows XP* documentation.
Technical Reference
19
1.7 Real-Time Clock (RTC) Subsystem
A coin-cell battery (CR2032) powers the real-time clock (RTC) and CMOS memory.
When the computer is not plugged into a wall socket, the battery’s estimated life is
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to 13 minutes/year at
25º C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, the Date and Time values will reset and the user is
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
Serial IRQ interface compatible with serialized IRQ support for PCI systems
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
Intel Desktop Board WX58BP Technical Product Specification
20
1.9 Audio Subsystem
This board supports the Intel
®
High Definition Audio subsystem based on the Realtek*
ALC889 audio codec. The audio subsystem supports the following features:
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device connected to an audio port. The back panel audio jacks are
capable of retasking according to the user’s definition, or can be automatically
switched depending on the recognized device type.
Stereo input and output for all back panel jacks
Line out and Mic in functions for front panel audio jacks
A signal-to-noise (S/N) ratio of 90 dB
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s website. For information on
obtaining audio software and drivers, refer to Section 1.3.
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the following:
Front panel audio (a 2 x 5-pin header that provides a mic in and line out signals for
front panel audio connectors)
High Definition (HD) Audio Link header (a 2 x 8-pin header for S/PDIF) used for
HDMI Video cards
S/PDIF audio connector (1 x 3-pin connector) can be used for HDMI Video cards
that do not work with the HD Audio header
S/PDIF output between the back panel Optical connector and the internal S/PDIF
header can be selected in BIOS setup
For information about… Refer to
Locations of the front panel audio header, HD Audio Link header, and S/PDIF
audio connector
Figure 10
Signal names of the front panel audio header Table 11
Back panel audio connectors Section 2.2.1
/