Intel WX58BP Datasheet

Brand: Intel

Model: WX58BP

Category: Server/workstation motherboards

Type: Datasheet

This manual is also suitable for

WX58BPR

April 2009

Order Number: E65585-002

The Intel

Workstation Board WX58BP may contain design defects or errors known as errata that may cause the product to deviate from

published specifications. Current characterized errata are documented in the Intel

Workstation Board WX58BP Specification Update.

Intel

Workstation Board

WX58BP

Technical Product Specification

Revision History

Date Revision

Number

Modifications

Feb 2009 001 Initial release of the Intel

Workstation Board WX58BP Technical Product

Specification.

April 2009 002 Minor edits and grammatical corrections.

This product specification applies to only the standard Intel

Workstation Board WX58BP with BIOS identifier

BPX5810J.86A.

Changes to this specification will be published in the Intel

Desktop Board WX58BP Specification Update before being

incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.

EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO

LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE

OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

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OR DEATH MAY OCCUR.

All Intel

desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC)

for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC

or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.

may not be supported without further evaluation by Intel.

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not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other

intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”

Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising

from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be

obtained from:

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* Other names and brands may be claimed as the property of others.

iii

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for the

Intel

Workstation Board WX58BP.

Intended Audience

This TPS is intended to provide detailed, technical information about the Intel

Workstation Board WX58BP and its components to the vendors, system integrators,

and other engineers and technicians who need this level of information. It is

specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the Intel

Workstation Board WX58BP

2 A map of the resources of the Intel

Workstation Board

3 Features supported by the BIOS Setup program

4 Description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings



NOTE

Notes call attention to important information.



INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to

system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board WX58BP Technical Product Specification

Other Common Notation

Notation Description

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/sec Gigabytes per second

Gbits/sec Gigabits per second

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

Kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbits/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Unless otherwise specified, voltages are DC.

* This symbol indicates third-party brands and names that are the property of their respective

owners.

Contents

1 Product Description .............................................................. 9

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 10

1.1.3 Block Diagram ..................................................................... 12

1.2 Legacy Considerations...................................................................... 13

1.3 Online Support................................................................................ 13

1.4 Processor ....................................................................................... 13

1.5 System Memory .............................................................................. 13

1.5.1 Memory Configurations ......................................................... 15

1.6 Intel

X58 Chipset........................................................................... 17

1.6.1 USB ................................................................................... 17

1.6.2 Serial ATA Interfaces ............................................................ 18

1.7 Real-Time Clock (RTC) Subsystem ..................................................... 19

1.8 Legacy I/O Controller....................................................................... 19

1.9 Audio Subsystem............................................................................. 20

1.9.1 Audio Subsystem Software .................................................... 20

1.9.2 Audio Connectors and Headers ............................................... 20

1.9.3 8-Channel (7.1) Audio Subsystem........................................... 21

1.10 LAN Subsystem............................................................................... 22

1.10.1 Intel

82567LM Gigabit Ethernet Controller.............................. 22

1.10.2 LAN Subsystem Software....................................................... 23

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 23

1.11 Hardware Management Subsystem .................................................... 24

1.11.1 Hardware Monitoring and Fan Control...................................... 24

1.11.2 Fan Monitoring..................................................................... 24

1.11.3 Chassis Intrusion and Detection.............................................. 24

1.11.4 Thermal Monitoring .............................................................. 25

1.12 Power Management ......................................................................... 26

1.12.1 ACPI 26

1.12.2 Hardware Support ................................................................ 30

1.12.3 ENERGY STAR* .................................................................... 34

2 Technical Reference............................................................ 35

2.1 Memory Resources .......................................................................... 35

2.1.1 Addressable Memory............................................................. 35

2.1.2 Memory Map........................................................................ 37

2.2 Connectors and Headers................................................................... 37

2.2.1 Back Panel Connectors .......................................................... 38

2.2.2 Component-side Connectors and Headers ................................ 39

2.3 Jumper Block .................................................................................. 48

2.4 Mechanical Considerations ................................................................ 50

2.4.1 Form Factor......................................................................... 50

Intel Desktop Board WX58BP Technical Product Specification

2.5 Electrical Considerations................................................................... 51

2.5.1 Power Supply Considerations ................................................. 51

2.5.2 Fan Header Current Capability................................................ 52

2.5.3 Add-in Board Considerations .................................................. 52

2.6 Thermal Considerations .................................................................... 52

2.7 Reliability ....................................................................................... 55

2.8 Environmental ................................................................................ 55

3 Overview of BIOS Features ................................................. 57

3.1 Introduction ................................................................................... 57

3.2 BIOS Flash Memory Organization ....................................................... 58

3.3 Resource Configuration .................................................................... 58

3.3.1 PCI Auto-configuration .......................................................... 58

3.4 System Management BIOS (SMBIOS)................................................. 59

3.5 Legacy USB Support ........................................................................ 59

3.6 BIOS Updates ................................................................................. 60

3.6.1 Language Support ................................................................ 60

3.6.2 Custom Splash Screen .......................................................... 61

3.7 BIOS Recovery................................................................................ 61

3.8 Boot Options................................................................................... 62

3.8.1 CD-ROM Boot ...................................................................... 62

3.8.2 Network Boot....................................................................... 62

3.8.3 Booting Without Attached Devices........................................... 62

3.8.4 Changing the Default Boot Device During POST ........................ 62

3.9 Adjusting Boot Speed....................................................................... 63

3.9.1 Peripheral Selection and Configuration..................................... 63

3.9.2 BIOS Boot Optimizations ....................................................... 63

3.10 BIOS Security Features .................................................................... 64

4 Error Messages and Beep Codes ......................................... 65

4.1 Speaker ......................................................................................... 65

4.2 BIOS Beep Codes ............................................................................ 65

4.3 BIOS Error Messages ....................................................................... 65

4.4 Port 80h POST Codes ....................................................................... 66

5 Regulatory Compliance and Battery Disposal Information .. 71

5.1 Regulatory Compliance..................................................................... 71

5.1.1 Safety Standards.................................................................. 71

5.1.2 European Union Declaration of Conformity Statement................ 72

5.1.3 Product Ecology Statements................................................... 73

5.1.4 EMC Regulations .................................................................. 77

5.1.5 Product Certification Markings (Board Level)............................. 78

5.2 Battery Disposal Information............................................................. 79

Contents

vii

Figures

Figure 1. Major Board Components............................................................... 10

Figure 2. Block Diagram.............................................................................. 12

Figure 3. Memory Channel and DIMM Configuration ........................................ 16

Figure 4. Back Panel Audio Connector Options................................................ 21

Figure 5. LAN Connector LED Locations ......................................................... 23

Figure 6. Thermal Sensors and Fan Headers .................................................. 25

Figure 7. Locations of Indicator LEDs ............................................................ 33

Figure 8. Detailed System Memory Address Map............................................. 36

Figure 9. Back Panel Connectors .................................................................. 38

Figure 10. Component-side Connectors and Headers....................................... 39

Figure 11. Connection Diagram for Front Panel Header.................................... 45

Figure 12. Connection Diagram for Front Panel USB Headers............................ 47

Figure 13. Connection Diagram for IEEE 1394a Header.................................... 47

Figure 14. Location of the Jumper Block ........................................................ 48

Figure 15. Board Dimensions....................................................................... 50

Figure 16. Localized High Temperature Zones ................................................ 53

Tables

Table 1. Feature Summary............................................................................ 9

Table 2. Components Shown in Figure 1........................................................ 11

Table 3. Supported Memory Configurations.................................................... 15

Table 4. LAN Connector LED States .............................................................. 23

Table 5. Effects of Pressing the Power Switch................................................. 27

Table 6. Power States and Targeted System Power......................................... 28

Table 7. Wake-up Devices and Events........................................................... 29

Table 8. System Memory Map...................................................................... 37

Table 9. Component-side Connectors and Headers Shown in Figure 10 .............. 40

Table 10. HD Audio Link Header................................................................... 41

Table 11. Front Panel Audio Header.............................................................. 41

Table 12. Serial ATA Connectors .................................................................. 41

Table 13. Chassis Intrusion Header .............................................................. 42

Table 14. Front and Rear Chassis (3-Pin) Fan Headers..................................... 42

Table 15. Processor and Rear Chassis 2 (4-Pin) Fan Headers............................ 42

Table 16. Processor Core Power Connector .................................................... 43

Table 17. Main Power Connector .................................................................. 44

Table 18. Front Panel Header....................................................................... 45

Table 19. States for a One-Color Power LED .................................................. 46

Table 20. States for a Two-Color Power LED .................................................. 46

Table 21. BIOS Setup Configuration Jumper Settings ...................................... 49

Table 22. Recommended Power Supply Current Values.................................... 51

Table 23. Fan Header Current Capability ....................................................... 52

Table 24. Thermal Considerations for Components.......................................... 54

Table 25. Environmental Specifications ......................................................... 55

Table 26. BIOS Setup Program Menu Bar ...................................................... 58

Table 27. BIOS Setup Program Function Keys ................................................ 58

Intel Desktop Board WX58BP Technical Product Specification

viii

Table 28. Acceptable Drives/Media Types for BIOS Recovery............................ 61

Table 29. Boot Device Menu Options............................................................. 62

Table 30. Supervisor and User Password Functions ......................................... 64

Table 31. Beep Codes................................................................................. 65

Table 32. BIOS Error Messages.................................................................... 65

Table 33. Port 80h POST Code Ranges .......................................................... 66

Table 34. Port 80h POST Codes.................................................................... 67

Table 35. Typical Port 80h POST Sequence .................................................... 69

Table 36. Safety Standards ......................................................................... 71

Table 37. Lead-Free Board Markings............................................................. 76

Table 38. EMC Regulations .......................................................................... 77

Table 39. Product Certification Markings........................................................ 78

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])

Processor

 Intel

Xeon

W3500 series Processor in an LGA1366 socket

Memory

 Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

 Support for DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz DIMMs

 Support for up to 16 GB of system memory

 Support for non-ECC memory and ECC memory

Chipset

Intel

X58 Chipset, consisting of:

 Intel

X58 I/O Hub (IOH)

 Intel

82801IJR I/O Controller Hub (ICH10R)

Audio Intel

High Definition Audio subsystem using the Realtek* ALC889 audio codec

Legacy I/O Control Winbond legacy I/O controller

Peripheral

Interfaces

 12 USB 2.0 ports

 Six internal Serial ATA interfaces with RAID support

 Two IEEE 1394a ports (one on back panel, one front-panel header)

BIOS

 Intel

BIOS resident in the SPI Flash device

 Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

Instantly Available

PC Technology

 Support for PCI Local Bus Specification Revision 2.2

 Support for PCI Express* Revision 2.0

 Suspend to RAM support

 Wake on PCI, front panel, and USB ports

LAN Support

Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel

82567LM

Gigabit Ethernet Controller

Expansion

Capabilities

 One PCI Conventional bus add-in card connector (SMBus routed to PCI

Conventional bus add-in card connector)

 Two PCI Express* 2.0 x16 bus add-in card connectors

 One PCI Express* 2.0 x4 bus add-in card connector

 Two PCI Express* 1.1 x1 bus add-in card connectors

Hardware Monitor

Subsystem

 Hardware monitoring and fan control ASIC

 Voltage sense to detect out of range power supply voltages

 Thermal sense to detect out of range thermal values

 Three fan headers using PWM control

 Three fan sense inputs used to monitor fan activity

 Fan speed control using voltage control (3-pin fan headers front and rear)

 Support for Product Environmental Control Interface (PECI)

Intel Desktop Board WX58BP Technical Product Specification

1.1.2 Board Layout

Figure 1 shows the location of the major components on the Intel

Workstation Board

WX58BP.

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Technical Reference

Table 2. Components Shown in Figure 1

Item/callout

from Figure 1

Description

A Auxiliary fan

B PCI Express* x1 connector

C PCI Express* x16 bus add-in card connector (Secondary)

D Front panel audio header

E PCI Conventional bus add-in card connector

F PCI Express* x1 bus add-in card connector

G PCI Express* x16 bus add-in card connector (Primary)

H PCI Express* x4 bus add-in card connector

I Back panel connectors

J Processor fan header

K Rear fan header

L LGA1366 processor socket

M DIMM Channel A sockets [2]

N DIMM Channel B socket

O DIMM Channel C socket

P Main power connector

Q Intel

82X58 IO Hub (IOH)

R Processor core power connector (2 X 4)

S Chassis intrusion header

T Front chassis fan header

U Serial ATA connectors [6]

V Front panel USB headers [2]

W Battery

X Intel

82801IJR I/O Controller Hub (ICH10R)

Y IEEE 1394a front panel header

Z BIOS Setup configuration jumper block

AA Auxiliary front panel power LED header

BB Front panel header

CC High Definition Audio Link header

DD S/PDIF connector

Intel Desktop Board WX58BP Technical Product Specification

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

Technical Reference

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products with specific changes

including (but not limited to) the following:

 No parallel port

 No floppy drive connector

 No serial port

 No PS/2 connectors

1.3 Online Support

To find information about… Website

Intel

Workstation Board WX58BP http://www.intel.com/products/motherboard/WX58BP/index.htm

Server Board Support http://support.intel.com/support/motherboards/server/WX58BP

BIOS and driver updates http://downloadcenter.intel.com/

1.4 Processor

The board is designed to support the following processor:

 Intel

Xeon

W3500 series Processor in an LGA1366 socket

In the future, this board may support other processors. This board is designed to

support processors with a maximum wattage of 130 W. The processor listed previously

is only supported when falling within the wattage requirements of the Intel

Workstation Board WX58BP. For the most up-to-date list of supported processors,

refer to the following Intel web site: http://processormatch.intel.com

CAUTION

Use only the processors listed on the website mentioned previously. Use of

unsupported processors can damage the board, processor, and power supply.



INTEGRATOR’S NOTE

This board has specific requirements for providing power to the processor. For

information on power supply requirements for this board, refer to Section 2.5.1.

1.5 System Memory

The board has four DIMM sockets and supports the following memory features:

 1.5-V DDR3 SDRAM DIMMs

 Three independent memory channels with interleaved mode support

 Unbuffered, single-sided or double-sided DIMMs with the following restriction: This

board does not support double-sided DIMMs with x16 organization.

Intel Desktop Board WX58BP Technical Product Specification

 16 GB maximum total system memory. For information on the total amount of

addressable memory, refer to Section 2.1.1.

 Minimum total system memory: 1 GB

 Non-ECC DIMMs and ECC DIMMs

 Serial Presence Detect

 DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz SDRAM DIMMs

 NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, you

should populate the board with DIMMs that support the Serial Presence Detect (SPD)

data structure. This allows the BIOS to read the SPD data and program the chipset to

accurately configure memory settings for optimum performance. If non-SPD memory

is installed, the BIOS will attempt to correctly configure the memory settings, but this

may impact the performance and reliability or the DIMMs may not function under the

determined frequency.

Technical Reference

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

DIMM

Capacity

Configuration

(Note 1)

SDRAM

Density

SDRAM Organization

Front-side/Back-side

Number of SDRAM

Devices

(Note 2)

1024 MB SS 1 Gb 128 M x 8/empty 8 [9]

2048 MB DS 1 Gb 128 M x 8/128 M x 8 16 [18]

Notes:

1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)

and “SS” refers to single-sided memory modules (containing one row of SDRAM).

2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.

1.5.1 Memory Configurations

The Intel

Xeon

W3500 series Processor supports the following types of memory

organization:

 Tri/Dual channel (Interleaved) mode. This mode offers the highest throughput

for “real world” applications. Interleaving reduces overall memory latency by

accessing the DIMM memory sequentially. Data is spread amongst the memory

modules in an alternating pattern.

 Three independent memory channels give two possible modes of interleaving:

 Tri-Channel Mode: Enabled when identical matched memory modules are

installed in each of the three memory channels (blue connectors).

 Dual-Channel Mode: Enabled when two of the blue memory connectors

are populated with matched DIMMs.

 Single-Channel (Asymmetric) Mode: Equivalent to single-channel bandwidth

operation for real world applications. This mode is used when only a single DIMM is

installed or the installed memory modules are not matched. Technology and device

width can vary from one channel to the other.

Figure 3 illustrates the memory channel and DIMM configuration.

Intel Desktop Board WX58BP Technical Product Specification

Figure 3. Memory Channel and DIMM Configuration

Technical Reference

1.6 Intel

X58 Chipset

The Intel

X58 chipset consists of the following devices:

 Intel

82X58 IOH with Direct Media Interface (DMI) interconnect

 Intel

82801IJR I/O Controller Hub (ICH10R)

The IOH component provides interfaces to the processor and the PCI Express*

graphics connectors. The ICH10R is a centralized controller for the board’s I/O paths.

For information about… Refer to

Intel

X58 chipset http://www.intel.com/products/desktop/chipsets/index.htm

Resources used by the chipset Chapter 2

1.6.1 USB

The board supports up to 12 USB 2.0 ports; supports UHCI and EHCI; and uses UHCI-

and EHCI-compatible drivers.

The ICH10R provides the USB controller for all ports. The port arrangement is as

follows:

 Eight ports are implemented with dual, stacked back panel connectors adjacent to

the audio connectors

 Four ports are routed to two separate front panel USB headers

For information about Refer to

The location of the USB connectors on the back panel Figure 9

The location of the front panel USB headers Figure 10

Intel Desktop Board WX58BP Technical Product Specification

1.6.2 Serial ATA Interfaces

The board provides six Serial ATA (SATA) connectors, which support one device per

connector.

1.6.2.1 Serial ATA Support

The board’s Serial ATA controller offers six independent Serial ATA ports with a

theoretical maximum transfer rate of 3 Gb/s per port. You can install one device on

each port for a maximum of six Serial ATA devices. Unlike a Parallel ATA IDE, which

supports a master/slave configuration and two devices per channel, a point-to-point

interface is used for host to device connections.

For compatibility, the underlying Serial ATA functionality is transparent to the

operating system. The Serial ATA controller can operate in both legacy and native

modes. In Legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14

and 15). In Native mode, standard PCI Conventional bus resource steering is used.

Native mode is the preferred mode for configurations using Microsoft Windows XP*

and Microsoft Windows Vista* operating systems.



NOTE

Many Serial ATA drives use new low-voltage power connectors and require adapters or

power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about the location of the Serial ATA connectors, refer to Figure 10.

1.6.2.2 Serial ATA RAID

The board supports the following RAID (Redundant Array of Independent Drives)

levels via the ICH10R:

 RAID 0 - Data striping

 RAID 1 - Data mirroring

 RAID 0+1 (or RAID 10) - Data striping and mirroring

 RAID 5 - Distributed parity



NOTE

In order to use supported RAID features, you must first enable RAID in the BIOS.

Also, during Microsoft Windows XP* installation, you must press F6 to install the RAID

drivers. For more information about installing drivers during installation, refer to your

Microsoft Windows XP* documentation.

Technical Reference

1.7 Real-Time Clock (RTC) Subsystem

A coin-cell battery (CR2032) powers the real-time clock (RTC) and CMOS memory.

When the computer is not plugged into a wall socket, the battery’s estimated life is

three years. When the computer is plugged in, the standby current from the power

supply extends the life of the battery. The clock is accurate to  13 minutes/year at

25º C with 3.3 VSB applied.

 NOTE

If the battery and AC power fail, the Date and Time values will reset and the user is

notified during POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored

in CMOS RAM (for example, the date and time) might not be accurate. Replace the

battery with an equivalent one. Figure 1 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

 Serial IRQ interface compatible with serialized IRQ support for PCI systems

 Intelligent power management, including a programmable wake-up event interface

 PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

Intel Desktop Board WX58BP Technical Product Specification

1.9 Audio Subsystem

This board supports the Intel

High Definition Audio subsystem based on the Realtek*

ALC889 audio codec. The audio subsystem supports the following features:

 Advanced jack sense for the back panel audio jacks that enables the audio codec to

recognize the device connected to an audio port. The back panel audio jacks are

capable of retasking according to the user’s definition, or can be automatically

switched depending on the recognized device type.

 Stereo input and output for all back panel jacks

 Line out and Mic in functions for front panel audio jacks

 A signal-to-noise (S/N) ratio of 90 dB

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s website. For information on

obtaining audio software and drivers, refer to Section 1.3.

1.9.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back panel and the

component side of the board. The component-side audio headers include the following:

 Front panel audio (a 2 x 5-pin header that provides a mic in and line out signals for

front panel audio connectors)

 High Definition (HD) Audio Link header (a 2 x 8-pin header for S/PDIF) used for

HDMI Video cards

 S/PDIF audio connector (1 x 3-pin connector) can be used for HDMI Video cards

that do not work with the HD Audio header

 S/PDIF output between the back panel Optical connector and the internal S/PDIF

header can be selected in BIOS setup

For information about… Refer to

Locations of the front panel audio header, HD Audio Link header, and S/PDIF

audio connector

Figure 10

Signal names of the front panel audio header Table 11

Back panel audio connectors Section 2.2.1

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Model: WX58BP

Category: Server/workstation motherboards

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