SICK Sensor Integration Gateway - SIG200 Profinet Operating instructions

Type
Operating instructions
O P E R A T I N G I N S T R U C T I O N
Sensor Integration Gateway - SIG200
PROFINET
Integration Products
Described product
SIG - Sensor integration gateway
SIG200 PROFINET
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Production location
SICK PCA
55438 Minneapolis, MN
USA
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is only
permissible within the limits of the legal determination of Copyright Law. Any modifica‐
tion, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
E497722
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Contents
1 Safety information............................................................................ 4
1.1 General safety notes................................................................................ 4
1.2 Notes on UL approval............................................................................... 4
2 Correct use......................................................................................... 5
3 Product description........................................................................... 6
3.1 Product description.................................................................................. 6
3.2 Operating and status indicators.............................................................. 6
4 Transport and storage....................................................................... 8
4.1 Transport................................................................................................... 8
4.2 Transport inspection................................................................................. 8
4.3 Storage...................................................................................................... 8
5 Mounting............................................................................................. 9
6 Electrical installation........................................................................ 10
6.1 Pin alignment............................................................................................ 10
7 SIG200 configuration....................................................................... 13
7.1 SIG200 PROFINET interface.................................................................... 13
7.2 Operation via Webserver.......................................................................... 40
7.3 Operation via SOPAS ET (USB/Ethernet)................................................. 41
7.4 Configuration via REST API....................................................................... 56
8 Device Functions............................................................................... 74
8.1 Device Functions Overview...................................................................... 74
8.2 Data Storage............................................................................................. 76
8.3 Logic Editor................................................................................................ 77
8.4 Firmware.................................................................................................... 95
9 Troubleshooting................................................................................. 97
10 Disassembly and disposal............................................................... 98
11 Maintenance...................................................................................... 99
12 Technical data.................................................................................... 100
12.1 General technical data............................................................................. 100
CONTENTS
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1 Safety information
1.1 General safety notes
1.1.1 Safety notes
Read the operating instructions before commissioning.
Connection, mounting, and setting may only be performed by trained specialists.
Not a safety component in accordance with the EU Machinery Directive.
When commissioning, protect the device from moisture and contamination.
These operating instructions contain information required during the life cycle of
the gateway.
CAUTION
This equipment is not intended for use in residential environments and may not provide
adequate protection to radio reception in such environments.
1.2 Notes on UL approval
UL Environmental Rating: Enclosure type 1
1 SAFETY INFORMATION
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2 Correct use
The SIG200 (referred to as "module" in the following) is an IO-Link Master for connect‐
ing IO-Link devices, standard input signals or standard output signals.
Correct use requires that the device is used industrially indoors without any specific cli‐
matic and atmospheric requirements. Operation of the device in accordance with its
designated use and the degree of protection IP67 are only guaranteed if open male and
female connectors are closed using screw plugs.
If the product is used for any other purpose or modified in any way, any warranty claim
against SICK AG shall become void.
CORRECT USE 2
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3 Product description
3.1 Product description
The IO-Link-Master SIG200 is an intelligent gateway to connect IO-Link devices, input
and/or output signals for signal integration via Profinet to a PLC or via REST API to a
network. It was designed for use in industrial environments that require up to an IP67
enclosure rating. There are four IO-Link channels, each on a dedicated Port Type A M12
socket.
In addition, the SIG200 has a powerful user interface that can be accessed either via
USB using SICK's SOPAS ET software or via Ethernet and a web browser of choice. An
embedded IODD interpreter allows the user to easily configure both the SIG200 and
connected IO-Link devices by simply using the IODD file(s). The user interface also has
a logic editor to create sensor/actuator systems based on the information they provide.
3.2
Operating and status indicators
POWER
SF
BF
C/DI/DO1
DI
C/DI/DO1
DI
C/DI/DO1
DI
C/DI/DO
DI
LINK
ACT2
LINK
ACT1
SF
POWER
BF
/DO
DI
/DO
DI
/DO
DI
/DO
DI
LINK
ACT2
LINK
ACT1
SIG200
POWER CONFIG
S1
S2
S3
S4
P2
P1
1
2
â
á
8
9
ß
à
3
4
5
6
7
Figure 1: Dimensional drawing
1
POWER IN
2
IO-Link Port S1
3
IO-Link Port S2
4
IO-Link Port S3
5
IO-Link Port S4
6
Ethernet Port P2
7
Ethernet Port P1
8
DI: LED for pin 2
9
C/DI/DO LED for pin 4
3 PRODUCT DESCRIPTION
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ß
Mounting hole for front mounting
à
Mounting hole for side mounting
á
Removable user defined port labels
â
USB Port (M8) for configuration with SOPAS ET
LEDs on the fieldbus module
SF
BF
SIG200
POWER CONFIG
1
2
3
LINK
ACT2
LINK
ACT1
P2
P1
Table 1: LED status indicators
LED Indication Meaning
Supply voltage green Power on
Power off
BF (Bus fault) dark PROFINET connection ok
red Device offline from PROFINET
red blinking PROFINET communication start up or
invalid configuration
SF (System fault) dark Device ok
green blinking Find Me
red blinking System fault of the device
LINK ACT 1 (Link / Activity 1) dark No network connection on port 1
green Network connection on port 1
LINK ACT 2 (Link / Activity 2) dark No network connection on port 2
green Network connection on port 2
IO-Link Port LEDs (Port S1-S4)
/DO
DI
SIG200
S1
8
9
Legend LED Indication Meaning
8
DI: LED for pin 2 amber Additional DI on pin 2
off No additional DI on
pin 2
9
C/DI/DO LED for pin 4 green Pin 4 - IO-Link commu‐
nication active
green blinking Pin 4 - no IO-Link com‐
munication active
PRODUCT DESCRIPTION 3
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4 Transport and storage
4.1 Transport
For your own safety, please read and observe the following notes:
NOTE
Damage to the device due to improper transport.
The device must be packaged for transport with protection against shock and
moisture.
Recommendation: Use the original packaging as it provides the best protection.
Transport should be performed by specialist staff only.
The utmost care and attention is required at all times during unloading and trans‐
portation on company premises.
Note the symbols on the packaging.
Do not remove packaging until immediately before you start mounting.
4.2
Transport inspection
Immediately upon receipt at the receiving work station, check the delivery for complete‐
ness and for any damage that may have occurred in transit. In the case of transit dam‐
age that is visible externally, proceed as follows:
Do not accept the delivery or only do so conditionally.
Note the scope of damage on the transport documents or on the transport com‐
pany’s delivery note.
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
4.3 Storage
Store the device under the following conditions:
Recommendation: Use the original packaging.
Do not store outdoors.
Store in a dry area that is protected from dust.
So that any residual damp can evaporate, do not package in airtight containers.
Do not expose to any aggressive substances.
Protect from sunlight.
Avoid mechanical shocks.
Storage temperature: see "Technical data", page 100.
Relative humidity: see "Technical data", page 100.
For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
4 TRANSPORT AND STORAGE
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5 Mounting
The SIG200 is mounted with two screws, maximum M6, and two flat washers.
Note the maximum permissible tightening torque of 0.8 Nm.
2 x M6
< 0.8 Nm
Figure 2: Mounting
Scope of delivery:
SIG200
5 blind plugs (on Port CONFIG, S2, S3, S4, P1)
Quickstart instruction
20 labels for the label pocket
To ensure an adequate ground connection to the housing make sure the coating on the
housing is removed around the mounting screws.
NOTE
There can be several SIG200 mounted side by side without observing a minimum dis‐
tance between each IO-Link Master.
NOTE
On port P1, S1 and Power there is no protection cap.
NOTE
There are no screws inlcuded in the scope of delivery.
MOUNTING 5
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6 Electrical installation
The SIG200 power and IO-Link cables must be connected in a voltage-free state (U
V
=
0 V). The following information must be observed, depending on the connection type:
Even if the wiring is looped through, the total current of the module must not exceed
4A.
NOTICE DAMAGE OF EQUIPMENT
Equipment damage due to incorrect supply voltage! Please note the instructions for
electrical installation.
An incorrect supply voltage may result in damage to the equipment. Operation in short-
circuit protected network max. 8 A is allowed.
Only apply voltage/switch on the voltage supply (U
V
> 0 V) once all electrical connec‐
tions have been established.
Male and female connectors that are not used must be sealed with blind caps so that
the enclosure rating of IP 67 is assured.
Explanation of the connection diagrams:
DI = Digital input
DO = Digital output
FE = functional ground
IO-Link = IO-Link communication (C)
n. c. = not connected
Rx+ = Receiver +
Rx- = Receiver -
Tx+ = Transmitter +
Tx- = Transmitter +
6.1
Pin alignment
U
B
: 10 ... 30 V DC
Table 2: Power Port, M12 A-coded
Pin Signal Description
1 + (L+) + 24 V DC nominal
2 n.c. not connected
3 M 0 V
4 n.c. not connected
1
2
4 3
I
N
= 4 A
6 ELECTRICAL INSTALLATION
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Table 3: USB Port (for configuration), M8
Pin Signal Description
1 + (L+) + 5 V DC nominal
2 - Data
3 M 0 V (logic ground)
4 + Data
4
3
2
1
Table 4: Profinet Port (P1/P2), M12 D-coded
Pin Signal Description
1 Tx+ Sender +
2 Rx+ Receiver +
3 Tx- Sender -
4 Rx- Receiver -
Table 5: Port 1-4
Pin Signal Description
1 + (L+) + 24 V DC nominal
2 DI Standard data in (SDI)
3 M 0 V (logic ground)
4 DI / DO / IO-Link Master Configurable as Standard Data
In (SDI), Standard Data Out
(SDO) or IO-Link (IOL)
5 n. c.
2
1
3 4
Table 6: IO-Link Ports (S1-S4) M12, A-coded, (Port Class A)
Pin Signal Description
1 + (L+) + 24 V DC nominal
2 DI Configurable as Digital Input
3 M 0 V (logic ground)
4 DI / DO or IO-Link Configurable as Digital Input or
Digital Output or IO-Link
5 n. c.
ELECTRICAL INSTALLATION 6
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6 ELECTRICAL INSTALLATION
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7 SIG200 configuration
The SIG200 PROFINET can be configured via following different methods:
1 PROFINET (Fieldbus/PLC Engineering Tool)
2 Ethernet (Webserver)
3 USB (with SOPAS ET)
4 Ethernet (with SOPAS ET)
5 Ethernet (via REST API)
The configuration via PROFINET (1) is done by using the Engineering Tool of the PLC
manufacturer to get direct access to the SIG200. Depending on what kind of PLC/Engi‐
neering Tool is used, the configuration for SIG200 and the connected devices is done
differently.
The integrated webserver (2) of SIG200 allows a direct access for configuration pur‐
poses through suitable web browser software from any device connected to the same
Ethernet network as SIG200.
Furthermore, the SIG200 can be configured via USB (3) using the SOPAS Engineering
Tool from SICK. The necessary cable (M8 - USB) must be ordered separately. It is also
possible to connect the SIG200 via Ethernet (4) to SOPAS ET to do the configuration.
The SOPAS Engineering Tool can be downloaded on www.sick.com.
SIG200 additionally offers a REST API to accommodate in-depth access for high-level
automation processes. A REST API is a programming interface that defines a set of
functions where you can perform requests and receive responses via HTTP protocol
such as GET and POST (REST = Representational State Transfer, API = Application Pro‐
gramming Interface).
7.1
SIG200 PROFINET interface
The SIG200 can be configured with an appropriate PLC and PROFINET software tools.
This includes addressing and configuration. The following system integration and con‐
figuration are an example how to use the SIG200 together with the SIEMENS TIA Portal
V13 project planning software. When using other controllers and project planning soft‐
ware, refer to the relevant documentation.
GSDML file
Call up the PLC/PROFINET engineering tool.
Download the current GSDML file for the device from www.sick.com.
Install the GSDML file in the engineering tool.
7.1.1 Configuration via PROFINET
7.1.1.1 Integration of SIG200
Devices can be searched by using the hardware catalog. Choose the right product and
put it via Drag & Drop into the topology or network view.
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Figure 3: Hardware catalog
7.1.1.2 Device Model
PROFINET devices are designed as a modular system. The system is composed of a top
module and several data modules. To configure the IO-Link Master, the relevant data
modules are assigned to a slot or subslot. The project planning software represents the
data modules broken down according to the slots. Within SIG200 the slots are struc‐
tured in the following way:
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NOTE
Fixed modules/submodules cannot be changed by the user. Plugged modules/submod‐
ules are configured per default but can be removed by the user.
There is no default assignment of subslots 2-5 in the IO-Link Master module or in sub‐
slot 2 of the global functions module; they need to be configured during installation
process.
7.1.1.3 Device Name and PROFINET address
The communication parameters of the IO-Link Master are displayed by double-clicking
on SIG200 in the “Device overview” window.
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Figure 4: Device overview
Here, device name and PROFINET address (IP) can be configured.
Figure 5: PROFINET address
Click with the right mouse button on the selected module and click afterwards on
“assign device name”.
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SIG200 CONFIGURATION
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Figure 6: Assign device name
7.1.1.4 Allocating device names
Select the desired device name. Assign the device name to the marked and found
device using the command “Assign name”. The device name must be identical to the
names previously configured under “Properties”. The identification is done via the MAC
address or via the flash test. To get the MAC address, please have a look at the side
label of SIG200.
Figure 7: Device names
SIG200 CONFIGURATION
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As a next step, the different subslots (2-5; corresponding to IO-Link ports 1-4) (where
IO-Link or Standard I/O devices are connected) must be configured. Select correspond‐
ing to the process data length of the IO-Link device a matching IO-Link submodule in
the catalog on the right side and move it to the corresponding subslot (2-5) via Drag &
Drop.
Subslot 2.2. is linked to SIG200 Port S1.
Subslot 2.3 is linked to SIG200 Port S2.
Subslot 2.4 is linked to SIG200 Port S3.
Subslot 2.5 is linked to SIG200 Port S4.
Refer to the documentation for the IO-Link device for the required process data lengths
of the IO-Link device.
NOTE
In case you would like to use your IO-Link device in SIO mode, just use a digital input or
digital output module on the corresponding subslot.
NOTE
There is no configuration for Pin 2. Pin 2 is always 0 in case there is no physical connec‐
tion. In case there is a physical connection, the signal will be automatically transferred
without any further configuration and can be accessed through SIG200 IO-Link Master
subslot 2.1.
NOTE
In order to get valid process data for the logic editor submodule 1.1, the Profinet input
and output process data in the logic editor must be connected (see "Device Model ",
page 14).
Figure 8: Device overview
7.1.1.5 Addressing modules
The I/O addresses can be selected and changed by selecting the IO-Link modules.
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During the selection of the IO-Link module, the IO-Link parameters of the respective
port can be changed using the “Module parameters” menu item. E.g: validation and
backup.
Figure 9: Module parameters
7.1.1.6 Ending configuration
Click on “Compile” and download the configuration.
Figure 10: Compile
7.1.2 Operation via PROFINET
The SIG200 can exchange process data and parameters via PROFINET. To do so, the IO-
Link Master has to be connected to a suitable programmable logic controller (PLC).
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The PROFINET interface of the SIG200 has the following properties:
Characteristic Values
Transmission speed 100 Mbit/s
Maximum distance between nodes 100 m
Process data Max. 257 bytes input, 257 bytes output
Min. cycle time 1 ms
Asynchronous data Supported, see "Acyclic data", page 28
Compliant standard IEEE802.3u (100Base-Tx)
Conformance class Class B
Netload class II
Ethernet ports 2
PROFINET features Media redundancy (MRP), Network diagnostic (MIB/
SNMP), Topology detection, Port diagnostic (Up/Down),
Connection diagnostic (connection length measure‐
ment), I&M0…3, Auto device replacement, Reduction
ratio, OpenVAS tested
GSDML file Available in V2.2, V2.32, V2.33, V2.34
Any integration of SIG200 in a PROFINET PLC requires the use of the corresponding
GSDML file (General Station Description Markup Language).
Please download the GSDML file from www.sick.com. There are different versions for
different engineering tools available.
7.1.2.1 Device model
SIG200 PROFINET represents process data and acyclic data in the following slots:
The PROFINET slots have the following functions:
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SICK Sensor Integration Gateway - SIG200 Profinet Operating instructions

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