APPLICATION NOTE
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Download newest version at: www.trinamic.com
AN005p: IC Package / PCB Footprint Guidelines - SSOP16
Document Revision V2.11 •2021-Dec-09
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and
its PCB footprint. The document covers package dimensions, example footprint and general infor-
mation on PCB footprints.
Contents
1 Figures Index 1
2 Tables Index 1
3 Overview 2
4 SSOP16 Package Details 2
4.1 SSOP16 ................................................... 2
4.2 Dimensions ................................................ 2
4.3 Land Pattern ................................................ 3
5 General PCB Footprint and Packaging Information Resources 4
5.1 Tape & reel ................................................. 4
5.2 Reel Box .................................................. 5
6 Disclaimer 6
7 Revision History 6
1 Figures Index
1 SSOP16 3D example .......... 2
2 SSOP16 package outline drawings . . 2
3 SSOP16 example land patterns .... 3
4 Quadrant assignment within the tape 4
5 Tape diagram .............. 4
6 Reel diagram ............... 4
7 Box for reel with dimensions ..... 5
2 Tables Index
1 SSOP16 dimensions .......... 3
2 Dimensions and properties of Tape
and Reel ................. 5
3 Document Revision ........... 6