Intel GME965 User manual

Document Number: 316704-001

Intel

®

Core

TM

2 Duo processor

and Mobile Intel

®

GME965

Express Chipset

Development Kit User Manual

June 2007

2 316704-001 / Development Kit User’s Manual

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT

AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY

WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL

PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,

OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended

for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights

that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide

any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual

property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from

future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor_number

for details.

The Intel

®

Core

TM

2 Duo processor and Mobile Intel

®

GME965 Express Chipset may contain design defects or errors known as

errata which may cause the product to deviate from published specifications. Current characterized errata are available on

request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained

by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com

.

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Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

316704-001 / Development Kit User’s Manual 3

Contents

1 About This Manual ............................................................................................6

1.1 Content Overview...................................................................................6

1.2 Text Conventions ...................................................................................6

1.3 Glossary of Terms and Acronyms..............................................................8

1.4 Support Options...................................................................................13

1.4.1 Electronic Support Systems ......................................................13

1.4.2 Additional Technical Support .....................................................13

1.5 Product Literature.................................................................................13

1.6 Related Documents...............................................................................14

2 Getting Started............................................................................................... 15

2.1 Overview ............................................................................................ 15

2.1.1 Development Board Features ....................................................15

2.2 Included Hardware and Documentation ...................................................17

2.3 Software Key Features ..........................................................................17

2.3.1 AMI BIOS............................................................................... 18

2.4 Before You Begin.................................................................................. 18

2.5 Setting Up the Development Board .........................................................20

2.6 Configuring the BIOS ............................................................................22

3 Theory of Operation ........................................................................................ 24

3.1 Block Diagram .....................................................................................24

3.2 Mechanical Form Factor.........................................................................24

3.3 Thermal Management ...........................................................................25

3.4 System Features and Operation..............................................................25

3.4.1 Mobile Intel

®

GME965 GMCH..................................................... 25

3.4.2 ICH8-M..................................................................................27

3.4.3 POST Code Debugger...............................................................31

3.5 Clock Generation..................................................................................31

3.6 Power Management States..................................................................... 31

3.7 Power Measurement Support..................................................................33

4 Hardware Reference ........................................................................................ 39

4.1 Primary Features..................................................................................39

4.2 Back Panel Connectors ..........................................................................41

4.2.1 TV-Out D-Connector ................................................................42

4.3 Configuration Settings...........................................................................43

4.4 Power On and Reset Buttons ..................................................................47

4.5 LEDs ..................................................................................................48

4.6 Other Headers, Slots and Sockets ...........................................................49

4.6.1 H8 Programming Headers.........................................................49

4.6.2 Expansion Slots and Sockets.....................................................50

Appendix A . Heatsink Installation Instructions ....................................................................64

4 316704-001 / Development Kit User’s Manual

Figures

Figure 1. Development Board Block Diagram.......................................................24

Figure 2. Development Board Component Locations ............................................. 39

Figure 3. Back Panel Connector Locations ...........................................................42

Figure 4. D-Connector to Component Video Cable................................................43

Figure 5. D-Connector to Composite Video Cable .................................................43

Figure 6. D-Connector to S-Video Cable ............................................................. 43

Figure 7. Configuration Jumper and Switch Locations ...........................................44

Figure 8. LED Locations ...................................................................................48

Figure 9. Heatsink and Backplate ......................................................................64

Figure 10. Backplate Pins .................................................................................65

Figure 11. Applying the Thermal Grease .............................................................66

Figure 12. Squeezing Activation Arm..................................................................66

Figure 13. Installing the Heatsink ...................................................................... 67

Figure 14. Plugging in the Fan ..........................................................................68

Figure 15. Completed Assembly ........................................................................68

Tables

Table 1. Text Conventions ..................................................................................7

Table 2. Terms and Acronyms.............................................................................8

Table 3. Acronyms .........................................................................................10

Table 4. Intel Literature Centers........................................................................ 13

Table 5. Related Documents .............................................................................14

Table 6. Development Board feature Set Summary ..............................................15

Table 7. BIOS Location Strapping Options........................................................... 30

Table 8. Primary System Clocks ........................................................................31

Table 9. Power Management States ...................................................................32

Table 10. Power Management M-States ..............................................................32

Table 11. Sleep Signals and M-State Definition.................................................... 33

Table 12. Development Board Voltage Rails ........................................................ 34

Table 13. Development Board Component Location Legend ...................................40

Table 14. Back Panel Connector Definitions.........................................................42

Table 15. Supported Configuration Jumper/Switch Settings...................................44

Table 16. LED Functions...................................................................................48

Table 17. Expansion Slots and Sockets...............................................................50

Table 18. PCI Express* (x16) Pinout (J6B2) ........................................................51

Table 19. ADD2 Slot (J6B2).............................................................................. 54

Table 20. MEC Slot (J6B2)................................................................................57

Table 21. PCI Express* (x1) Pinout (J6B1, J7B1, J8B4).........................................60

Table 22. IDE Connector ..................................................................................60

Table 23. SATA Port 0 ‘Direct Connect’ Connector Pinout (J8J1) .............................61

Table 24. SATA Ports 1 and 2 ‘Cable Connect’ Connector Pinout (J7J3, J7H1)...........61

Table 25. SATA Power Connection (J7H2) ...........................................................62

Table 26. Fan Connectors (J2B3, J2C1) ..............................................................62

Table 27. Fan Connector (J2F1) ........................................................................62

Table 28. Front Panel Connector........................................................................62

Table 29. USB Headers ....................................................................................63

316704-001 / Development Kit User’s Manual 5

Revision History

Document

Number

Revision

Number

Description Revision Date

316704 001 Initial public release. June 2007

§

About This Manual

6 316704-001 / Development Kit User’s Manual

1 About This Manual

This user’s manual describes the use of the Intel

®

Core

TM

2 Duo processor and Mobile

Intel

®

GME965 Express Chipset development kit. This manual has been written for

OEMs, system evaluators, and embedded system developers. This document defines

all jumpers, headers, LED functions, and their locations on the development board,

along with subsystem features and POST codes. This manual assumes basic familiarity

in the fundamental concepts involved with installing and configuring hardware for a

personal computer system.

For the latest information about the Intel

®

Core

TM

2 Duo processor and Mobile Intel

®

GME965 Express Chipset Development Kit, visit:

http://developer.intel.com/design/intarch/devkits/index.htm

For design documents related to this platform please visit:

Processor: http://developer.intel.com/design/intarch/core2duo/tech_docs.htm

Chipset: http://www.intel.com/products/embedded/chipsets.htm

1.1 Content Overview

Chapter 1.0, “About This Manual” — This chapter contains a description of conventions

used in this manual. The last few sections explain how to obtain literature and contact

customer support.

Chapter 2.0, “Getting Started”— Provides complete instructions on how to configure

the development board and processor assembly by setting jumpers, connecting

peripherals and providing power.

Chapter 3.0, “Theory of Operation” — This chapter provides information on the system

design.

Chapter 4.0, “Hardware Reference”— This chapter provides a description of jumper

settings and functions, development board debug capabilities, and pinout information

for connectors.

Appendix A, “Heatsink Installation Instructions” gives detailed installation instructions

for the Intel

®

Core

TM

2 Duo processor heatsink.

1.2 Text Conventions

The notations listed in Table 1 may be used throughout this manual.

About This Manual

316704-001 / Development Kit User’s Manual 7

Table 1. Text Conventions

Notation Definition

# The pound symbol (#) appended to a signal name indicates that the signal

is active low. (e.g., PRSNT1#)

Variables Variables are shown in italics. Variables must be replaced with correct

values.

Instructions Instruction mnemonics are shown in uppercase. When you are

programming, instructions are not case-sensitive. You may use either

uppercase or lowercase.

Numbers Hexadecimal numbers are represented by a string of hexadecimal digits

followed by the character H. A zero prefix is added to numbers that begin

with A through F. (For example, FF is shown as 0FFH.) Decimal and binary

numbers are represented by their customary notations. (That is, 255 is a

decimal number and 1111 is a binary number. In some cases, the letter B

is added for clarity.)

Units of Measure

A

GByte

KByte

KΩ

mA

MByte

MHz

ms

mW

ns

pF

W

V

µA

µF

µs

µW

The following abbreviations are used to represent units of measure:

amps, amperes

gigabytes

kilobytes

kilo-ohms

milliamps, milliamperes

megabytes

megahertz

milliseconds

milliwatts

nanoseconds

picofarads

watts

volts

microamps, microamperes

microfarads

microseconds

microwatts

Signal Names Signal names are shown in uppercase. When several signals share a

common name, an individual signal is represented by the signal name

followed by a number, while the group is represented by the signal name

followed by a variable (n). For example, the lower chip-select signals are

named CS0#, CS1#, CS2#, and so on; they are collectively called CSn#.

A pound symbol (#) appended to a signal name identifies an active-low

signal. Port pins are represented by the port abbreviation, a period, and

the pin number (e.g., P1.0).

About This Manual

8 316704-001 / Development Kit User’s Manual

1.3 Glossary of Terms and Acronyms

Table 2 defines conventions and terminology used throughout this document.

Table 2. Terms and Acronyms

Term/Acronym Definition

Aggressor A network that transmits a coupled signal to another network.

Anti-etch Any plane-split, void or cutout in a VCC or GND plane.

Assisted Gunning

Transceiver Logic+

The front-side bus uses a bus technology called AGTL+, or Assisted

Gunning Transceiver Logic. AGTL+ buffers are open-drain, and require

pull-up resistors to provide the high logic level and termination. AGTL+

output buffers differ from GTL+ buffers with the addition of an active

pMOS pull-up transistor to assist the pull-up resistors during the first clock

of a low-to-high voltage transition.

Asynchronous

GTL+

The processor does not utilize CMOS voltage levels on any signals that

connect to the processor. As a result, legacy input signals such as A20M#,

IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PWRGOOD, SMI#, SLP#, and

STPCLK# utilize GTL+ input buffers. Legacy output signals (FERR# and

IERR#) and non-AGTL+ signals (THERMTRIP# and PROCHOT#) also

utilize GTL+ output buffers. All of these signals follow the same DC

requirements as AGTL+ signals, however the outputs are not actively

driven high (during a logical 0 to 1 transition) by the processor (the major

difference between GTL+ and AGTL+). These signals do not have setup or

hold time specifications in relation to BCLK[1:0], and are therefore

referred to as “Asynchronous GTL+ Signals”. However, all of the

Asynchronous GTL+ signals are required to be asserted for at least two

BCLKs in order for the processor to recognize them.

Bus Agent A component or group of components that, when combined, represent a

single load on the AGTL+ bus.

Crosstalk The reception on a victim network of a signal imposed by aggressor

network(s) through inductive and capacitive coupling between the

networks.

Backward Crosstalk - Coupling that creates a signal in a victim network

that travels in the opposite direction as the aggressor’s signal.

Forward Crosstalk - Coupling that creates a signal in a victim network that

travels in the same direction as the aggressor’s signal.

Even Mode Crosstalk - Coupling from a signal or multiple aggressors when

all the aggressors switch in the same direction that the victim is switching.

Odd Mode Crosstalk - Coupling from a signal or multiple aggressors when

all the aggressors switch in the opposite direction that the victim is

switching.

Flight Time Flight time is a term in the timing equation that includes the signal

propagation delay, any effects the system has on the T

CO

(time from

clock-in to data-out) of the driver, plus any adjustments to the signal at

the receiver needed to ensure the setup time of the receiver. More

precisely, flight time is defined as:

The time difference between a signal at the input pin of a receiving agent

crossing the switching voltage (adjusted to meet the receiver

About This Manual

316704-001 / Development Kit User’s Manual 9

Term/Acronym Definition

manufacturer’s conditions required for AC timing specifications; i.e.,

ringback, etc.) and the output pin of the driving agent crossing the

switching voltage when the driver is driving a test load used to specify the

driver’s AC timings.

Maximum and Minimum Flight Time - Flight time variations are caused by

many different parameters. The more obvious causes include variation of

the board dielectric constant, changes in load condition, crosstalk, power

noise, variation in termination resistance, and differences in I/O buffer

performance as a function of temperature, voltage, and manufacturing

process. Some less obvious causes include effects of Simultaneous

Switching Output (SSO) and packaging effects.

Maximum flight time is the largest acceptable flight time a network will

experience under all conditions.

Minimum flight time is the smallest acceptable flight time a network will

experience under all conditions.

Infrared Data

Assoc.

The Infrared Data Association (IrDA) has outlined a specification for serial

communication between two devices via a bi-directional infrared data

port. The development board has such a port and it is located on the rear

of the platform between the two USB connectors.

IMVP6+ The Intel Mobile Voltage Positioning specification for the Intel® Core™ 2

Duo Processor. It is a DC-DC converter module that supplies the required

voltage and current to a single processor.

Inter-Symbol

Interference

Inter-symbol interference is the effect of a previous signal (or transition)

on the interconnect delay. For example, when a signal is transmitted down

a line and the reflections due to the transition have not completely

dissipated, the following data transition launched onto the bus is affected.

ISI is dependent upon frequency, time delay of the line, and the reflection

coefficient at the driver and receiver. ISI may impact both timing and

signal integrity.

Media Expansion

Card

The Media Expansion Card (MEC) provides digital display options through

the SDVO interface. The MEC card also incorporates video-in via a x1 PCI

Express* port.

Network The network is the trace of a Printed Circuit Board (PCB) that completes

an electrical connection between two or more components.

Overshoot The maximum voltage observed for a signal at the device pad, measured

with respect to VCC.

Pad The electrical contact point of a semiconductor die to the package

substrate. A pad is only observable in simulations.

Pin The contact point of a component package to the traces on a substrate,

such as the motherboard. Signal quality and timings may be measured at

the pin.

Power-Good “Power-Good,” “PWRGOOD,” or “CPUPWRGOOD” (an active high signal)

indicates that all of the system power supplies and clocks are stable.

PWRGOOD should go active at a predetermined time after system

voltages are stable and should go inactive as soon as any of these

voltages fail their specifications.

Ringback The voltage to which a signal changes after reaching its maximum

absolute value. Ringback may be caused by reflections, driver oscillations,

or other transmission line phenomena.

About This Manual

10 316704-001 / Development Kit User’s Manual

Term/Acronym Definition

System Bus The System Bus is the microprocessor bus of the processor.

Setup Window The time between the beginning of Setup to Clock (TSU_MIN) and the

arrival of a valid clock edge. This window may be different for each type of

bus agent in the system.

Simultaneous

Switching Output

Simultaneous Switching Output (SSO) effects are differences in electrical

timing parameters and degradation in signal quality caused by multiple

signal outputs simultaneously switching voltage levels in the opposite

direction from a single signal or in the same direction. These are called

odd mode and even mode switching, respectively. This simultaneous

switching of multiple outputs creates higher current swings that may

cause additional propagation delay (“push-out”) or a decrease in

propagation delay (“pull-in”). These SSO effects may impact the setup

and/or hold times and are not always taken into account by simulations.

System timing budgets should include margin for SSO effects.

Stub The branch from the bus trunk terminating at the pad of an agent.

Trunk The main connection, excluding interconnect branches, from one end.

System

Management Bus

A two-wire interface through which various system components may

communicate.

Undershoot The minimum voltage extending below VSS observed for a signal at the

device pad.

VCC (CPU core) VCC (CPU core) is the core power for the processor. The system bus is

terminated to VCC (CPU core).

Victim A network that receives a coupled crosstalk signal from another network is

called the victim network.

Table 3 defines the acronyms used throughout this document.

Table 3. Acronyms

Acronym Definition

AC Audio Codec

ACPI Advanced Configuration and Power Interface

ADD2 Advanced Digital Display 2

ADD2N Advanced Digital Display 2 Normal

AGTL Assisted Gunning Transceiver Logic

AMC Audio/Modem Codec.

ASF Alert Standard Format

AMI American Megatrends Inc. (BIOS developer)

ATA Advanced Technology Attachment (disk drive interface)

ATX Advance Technology Extended (motherboard form factor)

BGA Ball Grid Array

About This Manual

316704-001 / Development Kit User’s Manual 11

Acronym Definition

BIOS Basic Input/Output System

CK-SSCD Spread Spectrum Differential Clock

CMC Common Mode Choke

CMOS Complementary Metal-Oxide-Semiconductor

CPU Central Processing Unit (processor)

DDR Double Data Rate

DMI Direct Memory Interface

ECC Error Correcting Code

EEPROM Electrically Erasable Programmable Read-Only Memory

EHCI Enhanced Host Controller Interface

EMA Extended Media Access

EMI Electro Magnetic Interference

ESD Electrostatic Discharge

EV Engineering Validation

EVMC Electrical Validation Margining Card

FCBGA Flip Chip Ball Grid Array

FCPGA Flip Chip Pin Grid Array

FIFO First In First Out - describes a type of buffer

FS Full-speed. Refers to USB

FSB Front Side Bus

FWH Firmware Hub

GMCH Graphics Memory Controller Hub

HDA High Definition Audio

HDMI High Definition Media Interface

HS High-speed. Refers to USB

ICH I/O Controller Hub

IDE Integrated Drive Electronics

IMVP Intel Mobile Voltage Positioning

IP/IPv6 Internet Protocol/Internet Protocol version 6

IrDA Infrared Data Association

ISI Inter-Symbol Interference

KBC Keyboard Controller

LAI Logic Analyzer Interface

LAN Local Area Network

LED Light Emitting Diode

About This Manual

12 316704-001 / Development Kit User’s Manual

Acronym Definition

LOM LAN on Motherboard

LPC Low Pin Count

LS Low-speed. Refers to USB

LVDS Low Voltage Differential Signaling

mBGA Mini Ball Grid Array

MC Modem Codec

MEC Media Expansion Card

MHz Mega-Hertz

OEM Original Equipment Manufacturer

PCIe PCI Express*

PCM Pulse Code Modulation

POST Power On Self Test

PLC Platform LAN Connect

RAID Redundant Array of Inexpensive Disks

RTC Real Time Clock

SATA Serial ATA

SIO Super Input/Output

SKU StockKeeping Unit

SMBus System Management Bus

SODIMM Small Outline Dual In-line Memory Module

SPD Serial Presence Detect

SPI Serial Peripheral Interface

SPWG Standard Panels Working Group - http://www.spwg.org/

SSO Simultaneous Switching Output

STR Suspend To RAM

TCO Total Cost of Ownership

TCP Transmission Control Protocol

TDM Time Division Multiplexed

TDR Time Domain Reflectometry

µBGA Micro Ball Grid Array

UDP User Datagram Protocol

UHCI Universal Host Controller Interface

USB Universal Serial Bus

VGA Video Graphics Adapter

VID Voltage Identification

About This Manual

316704-001 / Development Kit User’s Manual 13

Acronym Definition

VREG Voltage Regulator

XDP eXtended Debug Port

1.4 Support Options

1.4.1 Electronic Support Systems

Intel’s web site (http://www.intel.com/) provides up-to-date technical information and

product support. This information is available 24 hours per day, 7 days per week,

providing technical information whenever you need it.

1.4.2 Additional Technical Support

If you require additional technical support, please contact your Intel Representative or

local distributor.

1.5 Product Literature

In order to order hard copies of product literature the following instructions should be

followed:

1. Determine the SKU Number

If you do not know the SKU # of the document you are ordering, please select

the back button to view the document again. The SKU # is the first 6 digits of

the number on the PDF file, such as: 12345612.pdf or at the bottom of the

download page for that document.

2. Call, Mail or Email a request

Call: To place an order for a publication or text in hardcopy or CD form,

please contact our Intel® Literature Fulfillment Centers listed in Table 4

.

Table 4. Intel Literature Centers

Location Telephone Number

U.S. and Canada 1-800-548-4725

International 1-303-675-2148

Fax 1-303-675-2120

Mail a request to:

About This Manual

14 316704-001 / Development Kit User’s Manual

Intel Literature Fulfilment Center

P.O. Box 5937

Denver, Colorado 80217-9808

USA

Email a request to: [email protected]

Please make sure to include in your mailed/emailed request:

SKU #

Company Name

Your Name (first, last)

Full mailing address

Daytime Phone Number in case of questions

Note: Please be aware not all documents are available in all media types. Some may only be

available as a download.

1.6 Related Documents

Table 5 provides a summary of publicly available documents related to this

development kit. For additional documentation, please contact your Intel

Representative.

Table 5. Related Documents

Document Title Location

Intel® Core™2 Duo Processor for Mobile

Intel® 965 Express Chipset Family

Datasheet

http://www.intel.com/design/mobile/datashts/316

745.htm

Mobile Intel

®

965 Express Chipset Family

Datasheet

http://www.intel.com/design/mobile/datashts/316

273.htm

Intel

®

I/O Controller Hub 8 (ICH8) Family

Datasheet

http://www.intel.com/design/chipsets/datashts/3

13056.htm

Intel® Centrino® Pro processor technology

and Intel® Centrino® Duo processor

technology Design Guide For Intel®

Core™2 Duo Mobile Processor, Mobile

Intel® 965 Express Chipset Family and

Intel® 82801HBM ICH8M & Intel®

82801HEM ICH8M-E I/O Controller Hub

Based Systems

Contact your Intel representative for access to

this document

Intel

®

Core™2 Duo Mobile Processor,

Mobile Intel

®

965 Express Chipset Family

and ICH8M I/O Controller Hub Schematics

Contact your Intel representative for access to

this document

§

Getting Started

316704-001 / Development Kit User’s Manual 15

2 Getting Started

This chapter identifies the development kit’s key components, features and

specifications. It also details basic development board setup and operation.

2.1 Overview

The development board consists of a baseboard populated with the Intel

®

Core

TM

2

Duo processor, the Mobile Intel

®

GME965 Express Chipset, other system board

components and peripheral connectors.

Note: The development board is shipped as an open system allowing for maximum flexibility

in changing hardware configuration and peripherals. Since the board is not in a

protective chassis, take extra precaution when handling and operating the system.

2.1.1 Development Board Features

Features of the development board are summarized in Table 6.

Table 6. Development Board feature Set Summary

Development Board

Implementation

Comments

Processor

Intel

®

Core

TM

2 Duo processor with

4 MByte L2 Cache on 65nm process

FSB 533/667/800 MHz support

478 pin Flip Chip Pin Grid Array (Micro-

FCPGA) package

Mobile Intel

®

GME965 Express

Chipset (GMCH)

1299-pin Micro-FCBGA Package

Chipset

Intel

®

I/O Controller Hub 8-M

Enhanced (ICH8M-E)

676-pin BGA Package

Memory

Two DDR2 RAM SO-DIMM slots. Maximum 4GB of DDR2 Memory (RAM)

using 1Gb technology and stacked SO-

DIMMs.

Supports DDR2 frequency of 533 or

667MHz

Video

One PCI Express* Graphics Slot

One dual channel LVDS Connector

One VGA Connector

One TV D-Connector supporting S-

Video, Composite video and

Component video

The Mobile Intel

®

GME965 Express Chipset

(GMCH) has 2 video pipes which allows

support of dual independent display.

18-bpp and 24-bpp LVDS panel support

Support for two SDVO channels via x16

PCIe connector (through ADD2 or MEC

cards)

F

E

A

T

U

R

E

PCI One 5V PCI slot PCI revision 2.3 compliant (33MHz)

Getting Started

16 316704-001 / Development Kit User’s Manual

Development Board

Implementation

Comments

PCI Express*

Three x1 connectors

One x16 connector

Revision 1.1 compliant

There are Five x1 PCI Express* slots but

slots 2 and 4 are not intended for use with

PCI Express* add-in cards. Only slots 1, 3

and 5 are supported.

On-Board LAN

10/100/1000 Mbps connectivity

from the Intel

®

82566MM Gigabit

Platform LAN Connect component

The 82566MM is connected to the ICH via

the ICH’s GLCI and LCI interfaces.

SPI Two 16Mbit devices

PATA 33/66/100 1 Channel

ATA/Storage

3 SATA Ports 2 Cable Connector and 1 Direct Connect

Connector. RAID 0/1 support.

USB

10 USB 2.0/1.1 Ports Five ports provided on rear-panel, four

provided via headers (J6H3, J6H3) and

one via the PCI Express* docking

connector

LPC One LPC slot Includes sideband headers

BIOS AMI BIOS installed in an 8Mb FWH 40-pin TSOP socket

SMC/KBC

Hitachi H8S/2104 micro-controller

Two PS/2 ports

One scan matrix keyboard

connector

ACPI compliant

F

E

A

T

U

R

E

Clocks

CK-505 clock synthesizer and

DB800M clock buffer

Super I/O SMSC SIO1007-JV Supports IrDA and UART serial interfaces

RTC Battery-backed Real Time Clock

Thermal

Monitoring

Processor temperature sensor

Processor

Voltage

Regulator

IMVP-6+ for processor core

Desktop Mode ATX Power Supply

Power Supply

Mobile Mode Battery Pack (smart battery support)

AC Mobile Brick

Port 80 display Through Add-in card. Four seven-segment

displays

Debug

Interfaces

Extended Debug Port (XDP) XDP connector

Intel

®

AMT

support

Intel

®

Active Management

Technology 2.5

Supported on the development board with

M0, M1, and M-off management states

Getting Started

316704-001 / Development Kit User’s Manual 17

Development Board

Implementation

Comments

Power

Management

ACPI Compliant S0 – Power On

S3 – Suspend to RAM

S4 – Suspend to Disk

S5 – Soft Off

M0 – All Wells powered

M1 – Main Well down. Only ME power on

M-off – ME powered off

Form Factor ATX 2.2 like form factor 10 layer board – 12” x 10.2”

Note: Review the document provided with the Development Kit titled “Important Safety and

Regulatory Information”. This document contains safety warnings and cautions that

must be observed when using this development kit.

2.2 Included Hardware and Documentation

The following hardware and documentation is included in the development kit:

• One development board

• One Intel

®

Core

TM

2 Duo processor with 4 MB L2 Cache on 65nm process in

the 478 pin Flip-Chip Pin Grid Array (Micro-FCPGA) package (Installed)

• One Firmware Hub (FWH) (Installed)

• One GMCH (GME965) heatsink (Installed)

• One Type 2032, socketed 3 V lithium coin cell battery (Installed)

• One 256 MByte DDR2 SODIMM (200 Pin)

• One CPU thermal solution and CPU back plate (included in kit box – not

populated on board)

• One cable kit

• One Development Kit User’s Manual

• One Port 80 add-in card

2.3 Software Key Features

The driver CD included in the kit contains all of the software drivers necessary for

basic system functionality under the following operating systems: Windows* XP/XP

Embedded, Vista and Linux*.

Getting Started

18 316704-001 / Development Kit User’s Manual

Note: While every care was taken to ensure the latest versions of drivers were provided on

the enclosed CD at time of publication, newer revisions may be available. Updated

drivers for Intel components can be found at:

http://developer.intel.com/design/intarch/software/index.htm

For all third-party components, please contact the appropriate vendor for updated

drivers.

Note: Software in the kit is provided free by the vendor and is only licensed for evaluation

purposes. Refer to the documentation in your evaluation kit for further details on any

terms and conditions that may be applicable to the granted licenses. Customers using

the tools that work with Microsoft* products must license those products. Any targets

created by those tools should also have appropriate licenses. Software included in the

kit is subject to change.

Refer to http://developer.intel.com/design/intarch/devkits

for details on additional

software from other third-party vendors.

2.3.1 AMI BIOS

This development kit ships with AMI* BIOS pre-boot firmware from AMI* pre-

installed. AMI* BIOS provides an industry-standard BIOS platform to run most

standard operating systems, including Windows* XP/XP Embedded, Linux*, and

others.

The AMI* BIOS Application Kit (available through AMI*) includes complete source

code, a reference manual, and a Windows-based expert system, BIOStart*, to enable

easy and rapid configuration of customized firmware for your system.

The following features of AMI* BIOS are enabled in the development board:

• DDR2 SDRAM detection, configuration, and initialization

• Mobile Intel

®

GME965 Express Chipset configuration

• POST codes displayed to port 80h

• PCI/PCI Express* device enumeration and configuration

• Integrated video configuration and initialization

• Super I/O configuration

• CPU microcode update

• Active Management Technology

• RAID 0/1 Support

2.4 Before You Begin

The following additional hardware may be necessary to successfully set up and

operate the development board.

Getting Started

316704-001 / Development Kit User’s Manual 19

VGA Monitor: Any standard VGA or multi-resolution monitor may be used. The setup

instructions in this chapter assume the use of a standard VGA monitor, TV, or flat

panel monitor.

Keyboard: The development board can support either a PS/2 or USB style keyboard.

Mouse: The development board can support either a PS/2 or USB style mouse.

Hard Drives and Optical Disc Drives: Up to Three SATA drives and two IDE devices

(master and slave) may be connected to the development board. An optical disc drive

may be used to load the OS. All these storage devices may be attached to the board

simultaneously.

Video Adapter: Integrated video is output from the VGA connector on the back panel

of the development board. Alternately, a standard PCI Express* video adapter, ADD2

card or MEC video adapter may be used for additional display flexibility. Please contact

the respective vendors for drivers and necessary software for adapters not provided

with this development kit. Check the BIOS and the graphics driver, where appropriate,

for the proper video output settings.

Note: The enclosed driver CD includes drivers necessary for LAN, Integrated graphics, and

system INF utilities.

Network Adapter: A Gigabit network interface is provided on the development

board. The network interface will not be operational until after all the necessary

drivers have been installed. A standard PCI/PCI Express* adapter may be used in

conjunction with, or in place of, the onboard network adapter. Please contact the

respective vendors for drivers and necessary software for adapters not provided with

this development kit.

You must supply appropriate network cables to utilize the LAN connector or any other

installed network cards.

Power Supply: The development board has the option to be powered from two

different power sources: an ATX power supply or AC to DC adapter. The development

board contains all of the voltage regulators necessary to power the system.

There are two main supported power supply configurations, Desktop and Mobile. The

Desktop solution consists of only using the ATX power supply. The Mobile solution

consists of only using the AC to DC adapter.

Warning: The power supply cord is the main disconnect device to mains (AC power). The socket

outlet shall be installed near the equipment and shall be readily accessible.

Note: Desktop peripherals, including add-in cards, will not work in mobile power mode. If

desktop peripherals are used, the development board must be powered using desktop

power mode.

If using an ATX power supply, select a power supply that complies with the "ATX12V"

1.1 specification. For more information, refer to http://www.formfactors.org

.

Note: If the power button on the ATX power supply is used to shut down the system, wait at

least five seconds before turning the system on again to avoid damaging the system.

Getting Started

20 316704-001 / Development Kit User’s Manual

Other Devices and Adapters: The development board functions much like a

standard desktop computer motherboard. Most PC-compatible peripherals can be

attached and configured to work with the development board.

2.5 Setting Up the Development Board

Once the necessary hardware (described in Section 2.4) has been gathered, follow the

steps below to set up the development board.

Note: To locate items discussed in the procedure below, please refer to Chapter

4.

1. Create a safe work environment.

Ensure a static-free work environment before removing any components from

their anti-static packaging. The development board is susceptible to

electrostatic discharge (ESD) damage, and such damage may cause product

failure or unpredictable operation. A flame retardant work surface must also

be used.

Caution: It is recommended that an ESD wrist strap be used when handling the

development board.

2. Inspect the contents of your kit.

Check for damage that may have occurred during shipment. Contact your

sales representative if any items are missing or damaged.

Caution: Since the development board is not in a protective chassis, use caution

when connecting cables to this product.

Caution: Standby voltage is constantly applied to the development board. Remove

power before any hardware (peripherals, keyboards, mice, monitors,

accessories, add-in cards, etc) is added or removed from the board.

Note: The development board is a standard ATX form factor. An ATX chassis may

be used if a protected environment is desired. If a chassis is not used,

standoffs must be used to elevate the development board off the working

surface to protect the memory and board components from any

accidental contact to metal objects.

3. Check the jumper default position setting. Refer to Figure 7

for jumper location.

Jumper J5H2 is used to clear the CMOS memory. Make sure this jumper is set to

1-x for normal operation.

4. Be sure to populate the following hardware on your development board:

• One Intel

®

Core

TM

2 Duo processor

• One processor thermal solution

• One 256 MByte DDR2 667 SODIMM (200-pin) into connector J5P1.

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