Adlink LEC-RB5 Owner's manual

LEC-iMX8MM User’s Guide SMARC R2.1

LEC-RB5(N)

Revision: Rev. 0.1

Date: 2023-09-21

Part Number: 50M-72515-1000

User’s Guide

Revision History

Revision

Description

Date

Author

0.1

Preliminary release

2023-09-21

CC

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Preface

Disclaimer

Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any

intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK

assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including

liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property

right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without

limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product

descriptions at any time, without notice.

Environmental Responsibility

ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of

Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for

ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the

environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product

disposal and/or recovery programs prescribed by their nation or company.

California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-

dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to

the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC,

and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to

www.P65Warnings.ca.gov.

Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any

mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Safety Instructions

For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment

before handling/operating the equipment.

• Read these safety instructions carefully.

• Keep this manual for future reference.

• Read the specifications section of this manual for detailed information on the operating environment of this equipment.

• Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.

• To avoid electrical shock and/or damage to equipment:

• Keep equipment away from water or liquid sources;

• Keep equipment away from high heat or high humidity;

• Keep equipment properly ventilated (do not block or cover ventilation openings);

• Make sure to use recommended voltage and power source settings;

• Always install and operate equipment near an easily accessible electrical socket outlet;

• Secure the power cord (do not place any object on/over the power cord);

• Only install/attach and operate equipment on stable surfaces and/or recommended mountings;

• If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

Conventions

The following conventions may be used throughout this manual, denoting special levels of information

Note: This information adds clarity or specifics to text and illustrations.

Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.

Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Getting Service

Ask an Expert: https://www.adlinktech.com/en/Askanexpert

ADLINK Technology, Inc.

No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan

Tel: +886-3-216-5088

Fax: +886-3-328-5706

Email: service@adlinktech.com

Ampro ADLINK Technology, Inc.

6450 Via Del Oro, San Jose, CA 95119-1208, USA

Tel: +1-408-360-0200

Toll Free: +1-800-966-5200 (USA only)

Fax: +1-408-600-1189

Email: [email protected]m

ADLINK Technology (China) Co., Ltd.

300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China

Tel: +86-21-5132-8988

Fax: +86-21-5132-3588

Email: [email protected]m

ADLINK Technology GmbH

Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany

Tel: +49-621-43214-0

Fax: +49-621 43214-30

Email: [email protected]

Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Preface

Disclaimer

Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any

intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products,

ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products

including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright

or other intellectual property right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory

compliance, including, without limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any.

ADLINK may make changes to specifications and product descriptions at any time, without notice.

Environmental Responsibility

ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of

Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for

ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the

environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product

disposal and/or recovery programs prescribed by their nation or company.

Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective

companies.

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any

mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Table of Contents

Revision History ................................................................................................................................................................................................................................................................................................................ 2

Preface .................................................................................................................................................................................................................................................................................................................................. 3

List of Figures ..................................................................................................................................................................................................................................................................................................................... 9

1. Introduction ............................................................................................................................................................................................................................................................................................................... 10

1.1 LEC-RB5(N) ..................................................................................................................................................................................................................................................................................................................................... 10

1.2 The SMARC Form Factor ........................................................................................................................................................................................................................................................................................................... 10

2. Specifications ............................................................................................................................................................................................................................................................................................................. 11

2.1 Core System ................................................................................................................................................................................................................................................................................................................................... 11

2.2 Video ................................................................................................................................................................................................................................................................................................................................................ 12

2.2.1 DPU / GPU / VPU ............................................................................................................................................................................................................................................................................................................. 12

2.2.2 Display Interfaces ............................................................................................................................................................................................................................................................................................................. 12

2.3 Camera ............................................................................................................................................................................................................................................................................................................................................. 13

2.4 Audio ................................................................................................................................................................................................................................................................................................................................................ 13

2.5 Dual Wired Ethernet ................................................................................................................................................................................................................................................................................................................... 13

2.6 Wi-Fi / Bluetooth .......................................................................................................................................................................................................................................................................................................................... 14

2.7 Extension Busses .......................................................................................................................................................................................................................................................................................................................... 14

2.8 System Storage ............................................................................................................................................................................................................................................................................................................................. 15

2.9 Board Controller ........................................................................................................................................................................................................................................................................................................................... 15

2.10 Debug Header DB30 ................................................................................................................................................................................................................................................................................................................... 16

2.11 Power ................................................................................................................................................................................................................................................................................................................................................ 16

3. Block Diagram ........................................................................................................................................................................................................................................................................................................... 18

4. Pinout and Signal Descriptions .......................................................................................................................................................................................................................................................................... 19

4.1 Pin Summary .................................................................................................................................................................................................................................................................................................................................. 19

4.2 Signal Terminology Descriptions ........................................................................................................................................................................................................................................................................................... 23

4.3 Signal Description by function ................................................................................................................................................................................................................................................................................................ 24

4.3.1 Primary Display Interface .............................................................................................................................................................................................................................................................................................. 24

4.4 Secondary Display Interface ..................................................................................................................................................................................................................................................................................................... 26

4.4.1 HDMI Mode ....................................................................................................................................................................................................................................................................................................................... 26

4.4.2 MIPI Camera Support ..................................................................................................................................................................................................................................................................................................... 27

LEC-RB5 User’s Guide SGET SMARC R2.1.1

4.4.3 CSI Feature Connectors ................................................................................................................................................................................................................................................................................................. 29

4.5 Audio Interfaces ........................................................................................................................................................................................................................................................................................................................... 30

4.5.1 I2S0 ....................................................................................................................................................................................................................................................................................................................................... 30

4.5.2 I2S2 mode .......................................................................................................................................................................................................................................................................................................................... 31

4.6 USB Ports ........................................................................................................................................................................................................................................................................................................................................ 32

4.7 PCIe Ports ........................................................................................................................................................................................................................................................................................................................................ 34

4.8 Dual LAN Ports .............................................................................................................................................................................................................................................................................................................................. 36

4.8.1 GBE0 ..................................................................................................................................................................................................................................................................................................................................... 36

4.8.2 GBE1 ..................................................................................................................................................................................................................................................................................................................................... 37

4.9 SDIO Card (4-bit) .......................................................................................................................................................................................................................................................................................................................... 38

4.10 SPI interfaces ................................................................................................................................................................................................................................................................................................................................. 39

4.10.1 SPI0 ....................................................................................................................................................................................................................................................................................................................................... 39

4.10.2 SPI1 ....................................................................................................................................................................................................................................................................................................................................... 39

4.11 GPIO .................................................................................................................................................................................................................................................................................................................................................. 40

4.12 CAN bus .......................................................................................................................................................................................................................................................................................................................................... 41

4.13 Miscellaneous ................................................................................................................................................................................................................................................................................................................................ 41

4.14 Power and System Management ........................................................................................................................................................................................................................................................................................... 42

4.14.1 Boot Select ......................................................................................................................................................................................................................................................................................................................... 44

4.14.2 Power ................................................................................................................................................................................................................................................................................................................................... 45

5. Software Support ..................................................................................................................................................................................................................................................................................................... 46

5.1 Early Access .................................................................................................................................................................................................................................................................................................................................... 46

5.2 Yocto................................................................................................................................................................................................................................................................................................................................................. 46

5.3 Ubuntu ............................................................................................................................................................................................................................................................................................................................................. 46

6. Mechanical .................................................................................................................................................................................................................................................................................................................. 47

6.1 Module Dimensions .................................................................................................................................................................................................................................................................................................................... 47

7. Thermal Solutions .................................................................................................................................................................................................................................................................................................... 48

7.1 Heatspreader – HTS .................................................................................................................................................................................................................................................................................................................... 48

7.2 Heatsink – THS .............................................................................................................................................................................................................................................................................................................................. 49

LEC-RB5 User’s Guide SGET SMARC R2.1.1

List of Figures

Figure 1 – Module functional block diagram ...................................................................................................................................................................................................................................................... 18

Figure 2 – Module top/botom side pin numbering ......................................................................................................................................................................................................................................... 19

Figure 3 – Module dimensions .................................................................................................................................................................................................................................................................................. 47

Figure 4 – Heatspreader HTS ..................................................................................................................................................................................................................................................................................... 48

Figure 5 – Heatsink THS ............................................................................................................................................................................................................................................................................................... 49

LEC-RB5 User’s Guide SGET SMARC R2.1.1

1. Introduction

1.1 LEC-RB5(N)

ADLINK LEC-RB5(N) is a SMARC R2.1-compliant module that features Qualcomm® Kyro™ 585 CPU, with 8x Arm Cortex-A77 cores, and offers exceptional

performance per watt. It includes Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS and supports 4K HDMI/MIPI DSI display, MIPI

CSI cameras, 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0, 4x USB 2.0, GPIO/SD and UFS.

1.2 The SMARC Form Factor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor Computer on Module definition targeting applications that require low power

and high performance at low costs. Typically under 6W, the modules often utilize ARM and other alternative low-power option CPUs, and are used in

many familiar handheld devices, such as tablet computers and smart phones.

Two module sizes are defined in SMARC: 82 mm x 50 mm and 82 mm x 80 mm.

The module PCBs have 314 edge fingers that mate with a low-profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified

as a 321 pin connector, with 7 pins used by the key).

SMARC modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot

flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the module. Modules are used with

application-specific carrier boards that implement other features such as audio codecs, touch controllers, wireless devices, etc.

The modular approach allows scalability, faster time to market and upgradability while still maintaining low costs, low power, and small physical size.

SMARC module and carrier specifications are available online at: https://www.sget.org/standards/smarc.html

LEC-RB5 User’s Guide SGET SMARC R2.1.1

2. Specifications

2.1 Core System

SoC

QRB5165

Kryo™ 585 Octa-core CPU:

• Kryo Gold prime @ 2.84GHZ

• 3 Kryo Gold @ 2.42GHz

• 4 Kryo Silver @ 1.81GHz

Memory

• Four-channel PoP high speed memory LPDDR4 SDRAM @ 2133MHz, up to 8GB

• Four-channel PoP high speed memory LPDDR5 SDRAM @ 2750MHz, up to 8GB

L2 Cache

System L2 cache (ECC)

• Gold core 256 KB

• Gold Prime core 512 KB

• Silver core 128 KB

Security

Qualcomm Secure Processing Unit

LEC-RB5 User’s Guide SGET SMARC R2.1.1

2.2 Video

2.2.1 DPU / GPU / VPU

DPU Core

Adreno DPU 995, supports up to 3x 4K display, up to 5040 × 2160 at 60Hz

GPU Core

Adreno GPU 650, Fmax at 587MHz – 4K 60 fps UI or 2X 2K 60 fps UI OpenGL ES 3.2, Vulkan 1.1, DX12 FL 12_1OpenCL 2.0 full profile

VPU Core

Adreno VPU 665 – 5th gen UHD video processing unit Video, decode up to 4K240/8K60 Video, encode up to 4K120/8K30

2.2.2 Display Interfaces

MIPI DSI

1x MIPI DSI 4 lane, compliant with MIPI-DSI standard v1.2

Maximum resolution 1K p60 with 24-bit RGB

HDMI

• HDMI interface is obtained from DSI0/1 over a DSI2HDMI chip (need 8 lanes)

• HDMI 2.0B complaint

• Supports a maximum display resolution of 1K p60

LEC-RB5 User’s Guide SGET SMARC R2.1.1

2.3 Camera

Supports CSI0 2Lane and CSI1 4-lane MIPI CSI2 camera input.

CSI2/3/4/5 on module feature connector (4 lanes)

Note: Only 4x RGB and 2x YUV camera modules supported.

2.4 Audio

Supports I2S audio codec on carrier

2.5 Dual Wired Ethernet

Primary LAN

10/100/1000 Ethernet Controller over USB 3.1

Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex

Secondary LAN

10/100/1000 Ethernet Controller over USB 3.1

Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex

LEC-RB5 User’s Guide SGET SMARC R2.1.1

2.6 Wi-Fi / Bluetooth

Optional M.2 1216 industry standard footprint with support for PCIe solder down modules

2.7 Extension Busses

PCIe

2x 2-lane R3.0

USB

2x USB 3.1 Gen 1, 4x USB 2.0

UART

3x UART interfaces SER0,1,2

CANbus

Optional CAN0 Supports CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps (Optional over SPI1)

SPI

2x SPI

I2S / Sound Wire

1x I2S with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

LEC-RB5 User’s Guide SGET SMARC R2.1.1

I2C

3x I2C interfaces

• Support for 7-bit mode

• Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode, or 1 Mbit/s in Fast-mode Plus

GPIO

14x GPIO with interrupt, one GPIO with PWM

2.8 System Storage

SDIO

1x SDIO (4-bit) compatible with SD3.0, MMC ver. 4.51 to edge connector

Storage

Up to 256 GB on-module UFS

2.9 Board Controller

BMC lite for power sequence

LEC-RB5 User’s Guide SGET SMARC R2.1.1

2.10 Debug Header DB30

Multipurpose Connector: ADLINK standard 30-pin FPC with the following pins

• Boot Select strap pins

• Serial port

• LITE BMC

2.11 Power

Power Modes: ON / OFF / SUSPEND

Power on / off Behavior AT (always boot)

Voltage Input: 5.0V +/- 5%

Operating Temperatures

Standard Operating Temperature: 0 to 60°C commercial grade BOM (memory, eMMC, USB hub, SoC)

Rugged Operating Temperature: -20 to 70°C industrial grade BOM (memory, eMMC, USB hub, SoC)

Humidity: 5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating).

EMI: EN55022 Class B inside an enclosure

LEC-RB5 User’s Guide SGET SMARC R2.1.1

Shock and Vibration: HALT testing, with test report that confirms Extended Operating Temp range during and after vibration.

Separate Shock test report to MIL-STD-202F, Method 213B, Table 213-I, Condition A.

In addition, when installed on baseboard shall operate under 18 sawtooth mechanical shocks (3 shocks in each

direction) with a peak acceleration of 40g for a duration of 18 msec each and 75g for a duration of 6 msec each.

Capable of supporting Random Vibration: MIL-STD-202F, Method 214A, Table 214-I, Condition D.

If HALT testing shows equal or better performance, a separate vibration test report is not necessary.

MTBF: 300,000 hrs (at 40°C), 100,000 hrs (at 70°C),

LEC-RB5 User’s Guide SGET SMARC R2.1.1

3. Block Diagram

QRB5165

BMC_Lite

Mipi

switch

HDMI

DSI0

CSI0

CSI1

PCIe Port 0

PCIe Port 1

PCIe Port 2

PCIe Port 3

Ethernet 0

Ethernet 1

USB2- Port1

USB2- Port 4,5

USB3- Port 2,3

USB0_OTG

SER0

SER1

SER2

SD/SDIO

SPI 0

SPI 1

CAN

GPIO x14

I2S_SND

I2C x3

UFS

DSI1

Debug

port/

console

build option

USB1 / 3.1 SS

CAN FD

MCP25 18FDT

DSI0

BT/WIFI

M.2_1216

USB

PCIe

SPI_0

SPI_3

SPI_1

UART3 / 4W

UART1 / 2W

UART2 / 4W

i2S / SoundWi re

CSI0 /2L

CSI1 /4L

DSI2HDMI

LT9611UXC

PCIe_1 GEN3

PCIe_2 GEN3

Vi sion

connect

CSI2_4L

SDIO_3.0

Uart

GPIO

LAN7800

USB HUB

Microchip

US B58 07T/KD

LAN7800

USB0

CSI3_4L

CSI4_4L

CSI5_4L

UFS

64/12 8/25 6 GB

LPDDR4 /

LPDDR5(N)

4GB/8GB

POP

I2C

Figure 1 – Module functional block diagram

LEC-RB5 User’s Guide SGET SMARC R2.1.1

4. Pinout and Signal Descriptions

4.1 Pin Summary

The below table is a comprehensible list of all signal pins on the MXM 3 connector in the standard specification SMARC 2.1.

Not all signals are available in each design, for specific product specs check the detailed tables in this document.

Top Side

P1 P74 P75

Key

P156

Bottom Side

S156 S76 S75

Key

S1

Figure 2 – Module top/botom side pin numbering

LEC-RB5 User’s Guide SGET SMARC R2.1.1

P-Pin

Primary (Top) Side

S-Pin

Secondary (Bottom) Side

S1

CSI1_TX+ / I2C_CAM1_CK

P1

SMB_ALERT_1V8#

S2

CSI1_TX- / I2C_CAM1_DAT

P2

GND

S3

GND

P3

CSI1_CK+

S4

RSVD

P4

CSI1_CK-

S5

CSI0_TX- / I2C_CAM0_CK

P5

GBE1_SDP

S6

CAM_MCK

P6

GBE0_SDP

S7

CSI0_TX+ / I2C_CAM0_DAT

P7

CSI1_RX0+

S8

CSI0_CK+

P8

CSI1_RX0-

S9

CSI0_CK-

P9

GND

S10

GND

P10

CSI1_RX1+

S11

CSI0_RX0+

P11

CSI1_RX1-

S12

CSI0_RX0-

P12

GND

S13

GND

P13

CSI1_RX2+

S14

CSI0_RX1+

P14

CSI1_RX2-

S15

CSI0_RX1-

P15

GND

S16

GND

P16

CSI1_RX3+

S17

GBE1_MDI0+

P17

CSI1_RX3-

S18

GBE1_MDI0-

P18

GND

S19

GBE1_LINK100#

P19

GBE0_MDI3-

S20

GBE1_MDI1+

P20

GBE0_MDI3+

S21

GBE1_MDI1-

P21

GBE0_LINK100#

S22

GBE1_LINK1000#

P22

GBE0_LINK1000#

S23

GBE1_MDI2+

P23

GBE0_MDI2-

S24

GBE1_MDI2-

P24

GBE0_MDI2+

S25

GND

P25

GBE0_LINK_ACT#

S26

GBE1_MDI3+

P26

GBE0_MDI1-

S27

GBE1_MDI3-

P27

GBE0_MDI1+

S28

GBE1_CTREF

P28

GBE0_CTREF

S29

PCIE_D_TX+ / SERDES_1_TX+

P29

GBE0_MDI0-

S30

PCIE_D_TX- / SERDES_1_TX-

P30

GBE0_MDI0+

S31

GBE1_LINK_ACT# (build option)

P31

SPI0_CS1#

S32

PCIE_D_RX+ / SERDES_1_RX+

P32

GND

S33

PCIE_D_RX- / SERDES_1_RX-

P33

SDIO_WP

S34

GND

P-Pin

Primary (Top) Side

S-Pin

Secondary (Bottom) Side

P34

SDIO_CMD

S35

USB4+

P35

SDIO_CD#

S36

USB4-

P36

SDIO_CK

S37

USB3_VBUS_DET

P37

SDIO_PWR_EN

S38

AUDIO_MCK

P38

GND

S39

I2S0_LRCK

P39

SDIO_D0

S40

I2S0_SDOUT

P40

SDIO_D1

S41

I2S0_SDIN

P41

SDIO_D2

S42

I2S0_CK

P42

SDIO_D3

S43

ESPI_ALERT0#

P43

SPI0_CS0#

S44

ESPI_ALERT1#

P44

SPI0_CK

S45

MDIO_CLK

P45

SPI0_DIN

S46

MDIO_DAT

P46

SPI0_DO

S47

GND

P47

GND

S48

I2C_GP_CK

P48

SATA_TX+

S49

I2C_GP_DAT

P49

SATA_TX-

S50

HDA_SYNC / I2S2_LRCK

P50

GND

S51

HDA_SDO / I2S2_SDOUT

P51

SATA_RX+

S52

HDA_SDI / I2S2_SDIN

P52

SATA_RX-

S53

HDA_CK / I2S2_CK

P53

GND

S54

SATA_ACT#

P54

ESPI_CS0# / SPI1_CS0#

S55

USB5_EN_OC#

P55

ESPI_CS1# / SPI1_CS1#

S56

ESPI_IO_2

P56

ESPI_CK / SPI1_CK

S57

ESPI_IO_3

P57

ESPI_IO_1 / SPI1_DIN

S58

ESPI_RESET#

P58

ESPI_IO_0 / SPI1_DO

S59

USB5+

P59

GND

S60

USB5-

P60

USB0+

S61

GND

P61

USB0-

S62

USB3_SSTX+

P62

USB0_EN_OC#

S63

USB3_SSTX-

P63

USB0_VBUS_DET

S64

GND

P64

USB0_OTG_ID

S65

USB3_SSRX+

P65

USB1+

S66

USB3_SSRX-

P66

USB1-

S67

GND

P67

USB1_EN_OC#

S68

USB3+

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