Hitachi VK-U174E User manual

SERVICE MANUAL

SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT

Digital Media Division,Tokai

COLOR VIDEO CAMERA

2003October

TK No. 8304E

VK-U174

VK-U174E

Table of Contents

1 Safety Precaution for Repair ............. 1-1

1-1 Cautions ................................................... 1-1

1-2 Electrostatic Protection Measures ............ 1-1

1-3 Lead-Free Solder ...................................... 1-2

1-4 Notes When Using Service Manual .......... 1-3

2 General Description ........................... 2-1

2-1 Overview .................................................. 2-1

2-1-1 Servicing method................................... 2-1

2-2 Features ................................................... 2-2

2-3 Specifications ........................................... 2-3

2-4 Comparison from Previous Models........... 2-5

2-5 Comparison of Main Control ICs............... 2-6

2-6 List of Abbreviations and Terms for

Surveillance System ................................. 2-7

3 Description of Operation ................... 3-1

3-1 Structure Schematics ............................... 3-1

3-2 Microprocessor Pin Function Tables ......... 3-2

3-2-1 Camera microprocessor

(IC2507: Camera µP)............................. 3-2

4 Troubleshooting.................................. 4-1

4-1 Trouble Diagnosis ..................................... 4-1

4-1-1 Setting to service position...................... 4-1

4-1-2 Trouble diagnosis flowchart ................... 4-2

5 Disassembly and Reassembly .......... 5-1

5-1 Order of Disassembly ............................... 5-1

5-2 Disassembly ............................................. 5-1

6 Adjustment.......................................... 6-1

6-1 Preparations for Adjustment ..................... 6-1

6-1-1 List of equipment and jigs ...................... 6-1

6-1-2 List of test equipment and charts ........... 6-1

6-1-3 Connections for adjustment ................... 6-2

6-1-4 Setting test equipment ........................... 6-3

6-1-5 Starting adjustment program (ZMAP) .... 6-3

6-2 List of Adjustment Items ........................... 6-5

6-2-1 List of adjustments needed after

replacing major ...................................... 6-5

6-2-2 Adjustment flowchart ............................. 6-6

6-3 Data Initialize ............................................ 6-7

6-4 Electronic Volume ..................................... 6-7

6-4-1 CDS sampling pulse adjustment............ 6-8

6-5 Adjustment (Camera Adjustment)............. 6-8

6-5-1 Auto iris control adjustment ................... 6-9

6-5-2 White balance adjustment ..................... 6-9

6-5-3 Chroma gain adjustment ....................... 6-10

6-6 Auto Focus ............................................... 6-11

6-6-1 Zoom/focus tracking adjustment ............ 6-11

6-6-2 AF noise level adjustment...................... 6-12

6-6-3 Check of zoom/focus trace .................... 6-12

6-7 Spot Noise ................................................ 6-13

6-8 Error Messages and Countermeasure...... 6-14

7 Exploded View and Parts List ............ 7-1

7-1 Exploded View .......................................... 7-1

7-2 Replacement Parts List ............................ 7-2

7-2-1 Mechanical parts list .............................. 7-2

7-2-2 Electrical parts list ................................. 7-2

Schematic, Circuit Board and Block

Diagrams .................................................... 1

1 Wiring Diagram .............................................. 1

2 Schematic Diagrams ..................................... 2

2-1 SP Schematic Diagram ............................. 2

2-2 PC Schematic Diagram ............................. 3

2-3 CSR Schematic Diagram ........................... 6

2-4 IC Block Diagrams ..................................... 9

3 Circuit Board Diagram ................................... 10

3-1 SP Circuit Board Diagram.......................... 10

3-2 PC Circuit Board Diagram ......................... 11

3-3 CSR Circuit Board Diagram ....................... 12

3-4 Identification Parts Location....................... 13

4 Block Diagrams ............................................. 14

4-1 Overall Block Diagram ............................... 14

4-2 Power Block Diagram ................................ 15

1 - 1

Safety Precaution for Repair

1

1-1 Cautions

Many electrical and mechanical parts have special safety-related characteristics. These are often not

evident from visual inspection nor can the protection afforded by them necessarily be obtained by using

replacement components rated for a higher voltage, wattage, etc. Replacement parts which have these

special safety characteristics are identified in this Service Manual. Electrical components having such

features are identified by marking with a on the schematics and the parts list in this Service Manual.

The use of a substitute replacement component which does not have the same safety characteristics as

the HITACHI recommended replacement one, shown in the parts list in this Service Manual, may create

shock, fire, or other hazards. Product safety is continuously under review and new instructions are issued

from time to time. For the latest information, always consult the current HITACHI Service Manual. A

subscription to, or additional copies for, HITACHI Service Manual may be obtained at a nominal charge

from HITACHI SALES CORPORATION.

PRODUCT SAFETY NOTICE

1-2 Electrostatic Protection Measures

Semiconductor components can be damaged by static electricity charged on clothes, human body,

etc. Take great care when handling components to avoid electrostatic damage, and perform

servicing in an environment where grounding is complete.

(1) Grounding work bench (Fig. 1-2-1)

Lay out an antistatic mat on work bench, and then use the ground plate to ground the work bench.

(2) Grounding human body (Fig. 1-2-2)

Use an antistatic wrist strap to discharge any static electricity charged on the body. Also, use a

tester for wrist strap to make sure that the wrist strap is working normally. Note, however, that

static electricity charged on clothes will not be discharged by wrist strap: Therefore do not allow

your clothes to touch the semiconductor components.

Fig. 1-2-1 Grounding Work Bench Fig. 1-2-2 Grounding Human Body

Antistatic mat

Ground

1M ohm

Antistatic wrist strap

1 - 2

Safety Precaution for Repair > Lead-Free Solder

Point to be soldered

For reflow

For dip

Composition of alloy (wt%)

Solder paste: Sn-3Ag-0.5Cu

Bar solder: Sn-0.6Cu

1-3 Lead-Free Solder

The printed circuit board that uses lead-free solder is adopted. To protect the global environment,

use the recommended lead-free solder also during servicing.

Read and observe the following before soldering:

Caution

ALWAYS wear protective goggles during soldering so that no solder smoke or scattered solder

enters the eye. Lead-free solder may scatter at high temperatures of 600°C.

(1) Identification of circuit boards that use lead-free solder

“F” is stamped or noted with pattern letter on circuit boards that use lead-free solder.

(2) Characteristics of lead-free solder

The components of lead-free solder used are as follows. The melting point of lead-free solder is 30-

40°C higher than that of lead based solder:

Melting temperature: Approx. 220°C

Point to be soldered

Surface-mounted (chip) parts [other than

those shown below]

Surface-mounted (chip) parts [for DVD

cameras, cellular phones only]

Discrete parts

Chassis, metal shield, etc.

Tip temperature

320 ± 30°C

[heating time: less than 5 seconds]

350 ± 10°C

[heating time: less than 3 seconds]

380 ± 30°C

420 ± 30°C

(3) Lead-free solder for servicing

Use the following lead-free solder for servicing:

Recommended lead-free solder and composition of alloy (wt%): Sn-3.0Ag-0.5Cu or equivalent

Information:

For composition of alloy, Sn is tin; Ag is silver; Cu is copper; Bi is bismuth; Pb is lead.

(4) Soldering iron for servicing

The temperature of soldering iron tip must be adjusted according to the points to be soldered: Use

an antistatic soldering iron with thermal control function.

When removing components, take care not to damage any surrounding component or pattern. When

attaching components, observe the heating time in the following table so that the components are

not destroyed by heat.

Tip temperatures for different soldering points:

1 - 3

Safety Precaution for Repair > Lead-Free Solder / Notes When Using Service Manual

1-4 Notes When Using Service Manual

(1) Value units used in parts list

Certain symbols are indicated as shown below for value units of resistors, capacitors and coils in

parts list. When you read them, note the following regular indications:

Indication in list Regular indication

KOHM

.........................................

k

UF

................................................

µF

PF

................................................

pF

UH

...............................................

µH

MH

..............................................

mH

Parts

Resistor

Capacitor

Coil

(5) Cautions when using lead based solder

It is recommended that you use lead-free solder when servicing, but it is also possible to service

using lead based solder. However, if lead based solder is used for servicing, take care with the

following:

1) Before using lead based solder, remove the lead-free solder completely from the point to be

soldered.

2) For additional soldering for repair, set the soldering iron tip temperature for lead-free solder, mix

lead based solder and lead-free solder sufficiently. Do not perform any repair using the bare

soldering iron tip without adding solder, since it will cause secondary failure due to lack of

strength.

(2) Values in schematic diagrams

The values, dielectric strength (power capacitance) and tolerances of the resistors (excluding

variable resistors) and capacitors are indicated in the schematic diagrams using abbreviations.

Certain symbols are indicated for value units: When you read them note the regular indications in

tables below:

[Resistors] [Capacitors]

[Coils]

Item

Value

Tolerance

Power

capacitance

Indication

No indication

..............................

K

..................................................

k

M

.................................................

M

No indication

..............................

±5%

(All tolerances other than ±5% are

indicated in schematic diagrams)

No indication

..............................

1/8W

(1/16 W for leadless resistors with no

indication)

All capacitances other than the above

are indicated in schematic diagrams.

Item

Value

Dielectric

strength

Indication

No indication

..............................

µF

P

..................................................

pF

No indication

..............................

50V

(All dielectric strengths other than

50 V are indicated in schematic

diagrams)

Item

Value

Indication

µ

...................................................

µH

m

..................................................

mH

1 - 4

Safety Precaution for Repair > Notes When Using Service Manual

(4) Table for indexing locations of parts

This table shows locations of each part on circuit board diagrams. The locations are indicated using

the guide scales on the external lines of diagrams.

2) Two diagrams indicated for each board1) One diagram indicated for each board

Parts

Location

A - 2 A

Symbol

No.

IC

IC1201

Zone "2" on board

diagram

A: Shows side A

B: Shows side B

Zone "A" on board

diagram

Parts

Location

2 A

Symbol

No.

IC

IC1201

Type of part

Zone "A" on circuit board

diagram

Symbol no.

Zone "2" on circuit board

diagram

(3) Identifications of sides A/B in circuit board diagrams

1) Board with a pattern on one side and parts on both sides:

Side A: Shows discrete parts, viewed from the pattern side.

Side B: Shows leadless parts, viewed from the pattern side.

2) Board with patterns on both sides and parts on both sides:

Side A: Shows parts and patterns which can be seen when the case is opened.

Side B: Shows parts and the pattern on the back of side A.

2 - 1

General Description

2

2-1 Overview

VK-U174/U174E is a newly developed, high-performance, compact chassis video camera with an

optical 10-power zoom lens.

A 1/4-inch CCD is used for image sensor, and a digital signal processor (DSP6) is the main

component of the signal processing circuit.

2-1-1 Servicing method

Basically, components are replaced when servicing the VK-U174/U174E. However, the service

method is different for high-density packaging circuit board.

Refer to the following table and perform the designated, appropriate servicing. Any changes that

occur in the service method will be published using service bulletin, etc.

Do not perform any servicing other than that described in this manual.

Circuit board

CSR circuit board

SP circuit board

PC circuit board

Servicing method

Component replacement.

Component replacement or

Circuit board assembly

replacement (Order format).

*1

Fig. 2-1-1 Locations of Circuit Boards

PC CIRCUIT

BOARD

SP CIRCUIT

BOARD

CSR CIRCUIT

BOARD

*1: Since IC2052 mounted on the PC circuit board

is CSP type, replacement is not possible:

Replace the whole PC circuit board when

IC2052 becomes faulty. Other components on

the PC circuit board can be replaced.

Table 2-1-1

2 - 2

General Description > Features

2-2 Features

Compact and lightweight

Since a compact zoom lens is used and the

density of parts mounted on circuit boards is

thereby increased, the volume and weight of

camera body can be reduced to approx. 28% and

approx. 45% of VK-S274R, respectively.

Built-in Optical Power Zoom Lens

A highly reliable optical 10-power zoom lens is mounted, and it is equipped with auto-focus and auto

iris functions.

12-Power Digital Zoom Function

The 12-power digital zoom, combined with the 10-power optical zoom, makes possible up to 120-

power zooming.

Remote Control via RS-232C

Focus, iris and zoom can be remotely operated via RS-232C.

External Synchronization with AC-Line Pulse Signal

This chassis camera is compatible with external sync using AC-line pulse signal, as well as with

internal sync.

Fig 2-2-1 Reduced Body Volume

VK-S274R/S274ER

VK-U174/U174E

2 - 3

2-3 Specifications

The specifications in shaded columns are different from those of previous models.

Design and specifications are subject to change without notice.

Item

Signal Format

Scanning System

Scanning

Frequency

Image Sensor

Lens

Signal Processing Circuit

Sync. System

Camera Functions

(Control through

RS-232C)

VK-U174/U174E

VK-U174: NTSC

VK-U174E: PAL

2:1 Interlacing

VK-U174: 15.734 kHz

VK-U174E: 15.625 kHz

VK-U174: 59.94 Hz

VK-U174E: 50 Hz

1/4-inch CCD

VK-U174: 811 (H) × 508 (V), 410k

VK-U174E: 795 (H) × 596 (V), 470k

VK-U174: 768 (H) × 494 (V), 380k

VK-U174E: 752 (H) × 582 (V), 440k

f = 3.8 - 38.0 mm

Horizontal 50.7°(Wide), 5.4°(Tele)

F1.8 (Wide) - F2.4 (Tele)

1.0m (Tele), 0.01m (Wide)

DSP6

Internal/External

Wide* - Tele 10× (Zoom speed: 3.2s

*

/4.3s)

Off

*

/On (Up to 12×)

Auto

*

/Manual (Near - Far/Fix)

Auto

*

/Manual (Red/Blue Gain: Up-Down/Fix)

VK-U174: 1/1 - 1/60s

VK-U174E: 1/0.75 - 1/50s

VK-U174: 1/60 - 1/4000s

VK-U174E: 1/50 - 1/4000s

VK-U174: 1/1 - 1/4* - 1/4000s

VK-U174E: 1/0.75 - 1/3* - 1/4000s

VK-U174: Shutter priority (1/1 - 1/4000s)/

Exposure priority (F1.8 - F28.8)/

AGC priority (0 - 32dB)

VK-U174E: Shutter priority (1/0.75 - 1/4000s)/

Exposure priority (F1.8 - F28.8)/

AGC priority (0 - 32dB)

Off*/On

Auto*

Off/On* (2 zone 2-D/8 zone 3-D)

Off

*

/On

Selective

(4.8k*/9.6k/19.2k/38.4/57.6k bps)

No-Trace preset/Trace preset

(Memory: max. 64 position)

*: Default settings

General Description > Specifications

Horizontal

Vertical

Total Pixels

Effective Pixels

Focal Length

Angle of View

F-Value

Min. Distance

Optical Zoom

Digital Zoom

Video Focus

White Balance

Digital Slow Shutter

(DSS)

Shutter

Speed

Mosaic

Reverse

Mirror

Iris

Privacy Zone Masking

Scene Memory (Freeze)

Communication Speed of

RS-232C

Position Preset

Pro-AE mode

(Auto)

Pro-AE+* mode

(Pro-AE + DSS)

Manual

2 - 4

Item VK-U174/U174E

Horizontal Resolution

Luminance S/N Ratio

Sensitivity

Video output

Supplied Voltage

Power Requirement

Operating Temperature

Operating Humidity

Dimensions

Weight

VK-U174: More than 470 TV lines

VK-U174E: More than 460 TV lines

More than 50dB

1.0 lx

0.1 lx

Composite: 1.0 ± 0.2Vp-p

9 V - 12 V DC ± 0.5 V

2.6 W (When suppling 9 V DC)

0 - 50° (Recommended: 0 - 40°)

10 - 90%

34.6 (W) × 39.7 (H) × 54.7 (D) mm

Approx. 100g

General Description > Specifications

*: Default settings

Pro-AE mode (1/60s or 1/50s,

F1.8, AGC gain: 32.0dB)

Pro-AE+* mode (1/4s or 1/3s)

2 - 5

General Description > Comparison from Previous Models

2-4 Comparison from Previous Models

Item

Image Sensor

Lens

Signal Processing Circuit

Camera

Functions

(Control

through

RS-232C)

Horizontal Resolution

Luminance S/N Ratio

Sensitivity

Supplied Voltage

Power Requirement

Weight

Dimensions

VK-U174/U174E

1/4-inch CCD

VK-U174: 811 (H) × 805 (V),

410k

VK-U174E: 795 (H) × 596 (V),

470k

VK-U174: 768 (H) × 494 (V),

380k

VK-U174E: 752 (H) × 582 (V),

440k

f = 3.8 - 38.0 mm

Horizontal 50.7°(Wide), 5.4°(Tele)

F1.8 (Wide) - F2.4 (Tele)

1.0m (Tele), 0.01m (Wide)

DSP6

10× (Zoom speed: 3.2s/4.3s)

Off/On (Up to 12×)

Auto/Manual (Red/Blue Gain: Up-

Down/Fix)

VK-U174: 1/1 - 1/4 - 1/4000s

VK-U174E: 1/0.75 - 1/3 - 1/4000s

Off/On

Auto

Off/On (2 zone 2-D/8 zone 3-D)

Off/On

Selective

(4.8k/9.6k/19.2k/38.4/57.6k bps)

No-Trace preset/Trace preset

(Memory: max. 64 position)

VK-U174: More than 470 TV lines

VK-U174E: More than 460 TV lines

More than 50dB

1.0 lx

0.1 lx

9 V - 12 V DC ± 0.5 V

2.6 W (When suppling 9 V DC)

Approx. 100g

VK-S274R/S274ER

VK-S274R:

VK-S274ER:

VK-S274R:

VK-S274ER:

f = 4 - 88 mm

Horizontal 47°(Wide), 2.2°(Tele)

F1.6 (Wide) - F3.8 (Tele)

DSP5

22× (Zoom speed: 3.9s/6.3s)

VK-S274R: 1/2 - 1/4 - 1/4000s

VK-S274ER:1/1.5 - 1/4 - 1/4000s

Not Provided

VK-S274R:

VK-S274ER:

0.06 lx

3.65 W (When suppling 9 V DC)

Approx. 222g

: Same as on left

Total Pixels

Effective Pixels

Focal Length

Angle of View

F-Value

Min. Distance

Optical Zoom

Digital Zoom

White Balance

Shutter Speed

Reverse

Mirror

Mosaic

Iris

Privacy Zone Masking

Scene Memory (Freeze)

Communication Speed

of RS-232C

Position Preset

Pro-AE mode

Pro-AE+ mode

60mm

89.5mm

50mm

39.7mm

54.7mm

34.6mm

2 - 6

2-5 Comparison of Main Control ICs

Item

Image Sensor

Sensor Drive

CDS AGC & A/D Conv.

Clock Gen.

Camera DSP

SDRAM

Reset Pulse Gen.

EEPROM1

EEPROM2

4fsc Gen.

Camera µP

FV Det.

Level Shift

Phase Compa.

PWM

6V Reg.

7.2V Reg.

Y/C Mix. & Video Amp

Zoom/Focus Motor Drive

F-Det.

Iris Drive

Gain Switch

VK-U174/U174E

VK-U174: ICX278AK-L (IC1001)

VK-U174E: ICX279AK-L (IC1001)

µPD16510GR (IC1002)

HD49334ANP (IC2001)

TC7SHU04FUL (IC2051)

HG75C015ABT (IC2052)

W986432DH (IC2101)

BD5227FVE (IC2302)

BA9016RFV (IC2303)

BA9016RFV (IC2304)

TC7SHU04FUL (IC2305)

HD64F2238RTF13 (IC2507)

SN74AHC1G08HDCK (IC2508)

SN74AHCT125PW (IC2509)

74VHC4046MTCX (IC2510)

TL1464IPT (IC3001)

PQ20WZ51 (IC3002)

Not provided

BA7665FS (IC3104)

UPD16878GS-BGG (IC4001)

NJM13403V-TE (IC4101)

NJM13404R (IC4103)

SN74AHC1G66HDCK (IC4102)

VK-S274R/S274ER

VK-S274R: (IC1001)

VK-S274ER: (IC1001)

(IC1002)

HD49323AF (IC1101)

(IC1174)

HG73C053FE (IC1121)

IC41LV16100S-50G (IC1122)

NC7SZ14P5 (IC1204)

NC7SZ14P5 (IC1205)

SN74AHC1G08HDCK (IC1206)

RN5VD27AA (IC1251)

(IC1202)

(IC1203)

TC7SU04FU (IC1173)

HD6432238RN41FA (IC1201)

(IC1604)

(IC1602)

(IC1603)

(IC1501)

Not provided

PQ20WZ51 (IC1502)

(IC1601)

TB6512AF (IC1301 & IC1302)

µPC5023GS-147-GJG (IC1351)

Not provided

General Description > Comparison of Main Control ICs

: Same as on left

2 - 7

2-6 List of Abbreviations and Terms for Surveillance System

General Description > List of Abbreviations and Terms for Surveillance System

Index

Abbreviation/

Term

Explanation

ANSI

ATA

ATA card

Category

Category 5

CCTV

CF

C mount

Compact

Flash

CS mount

CSP

Daisy chain

DSS

D-SUB

EIA

EIAJ

Ethernet

Flange Back

Hard Disk

Drive

HDD

IDE

IEEE

Interlaced

CCD

Sensor

IR

JEIDA

JEITA

JPEG

American National Standard Institute: This organization establishes industrial product

specifications for US.

AT Attachment interface: Formal standard of IDE standardized by ANSI.

A kind of PC card. It incorporates a flash memory and hard disk: The format of

connecting to PC conforms to the ATA standard.

Division of twisted pair cables for communications depending on the frequency

bandwidth. Categories 1-6 are available.

Twisted pair cable for communications whose frequency bandwidth is 100 MHz.

Closed Circuit Television: System for sending video signals to subscribers only.

See "Compact Flash".

Type of lens mount for video cameras. A mount with flange back of 17.526 mm is referred

to as a C mount.

Abbreviated and referred to as CF. Compact memory card, 36.4 mm long × 42.8 mm wide

× 3.3 mm thick.

Type of lens mount for video cameras. A mount with flange back of 12.5 mm is referred to

as a CS mount.

Chip Scale Package or Chip Size Package: This IC was made compact by arranging pins

under the package.

To connect multiple devices together.

Digital Slow Shutter.

A "D"-shaped trapezoidal connector.

Electronic Industries Alliance: This US electronic industrial organization oversees the

electronic industry in US and standardizes various technologies and techniques.

See "JEITA".

Standard for communication format established by IEEE: This specifies the transmission

rate, cable used and data exchange format. 10Base-T and 100Base-TX are also included

in this standard.

Distance from the lens installation surface to recording surface of image sensor.

Abbreviated and referred to as HDD. This device uses a motor to rotate at high speed a

disk coated with magnetic substance on its surface, and brings a magnetic head to the

disk to read and write data.

See "Hard Disk Drive".

Integrated Device Electronics: One of the formats for connecting PC and hard disk that

was established by hard disk manufacturers. ANSI currently refers to it as the ATA

standard.

Institute of Electrical and Electronic Engineers in US: The world largest institute related

to electronics; has over 320,000 members in more than 130 countries in the world.

This CCD image sensor scans an image twice to create a one-image signal. It scans

roughly once and then interpolates between first scanning lines the second time to

interlace the image.

Infrared Ray.

See "JEITA".

Japan Electronics and Information Technology Industries Association: came into

existence when JEIDA (Japan Electronic Industry Development Association) merged

with EIAJ (Electronic Industries Association of Japan) in November, 2000.

Joint Photographic Expert Group: International standard format for compressing still

images.

A

C

D

E

F

H

I

J

2 - 8

General Description > List of Abbreviations and Terms for Surveillance System

L

M

P

R

S

T

U

V

LAN

MPEG

MPEG2

MPEG Audio

Layer II

PC card

Progressive

scan CCD

Sensor

Protocol

RAID

RJ-45

RS-232C

RS-485

SCSI

ScTP

SIF

STP

SXGA

Twisted Pair

Cable

UTP

VBR

VGA

Local Area Network: A network within a limited area, such as in company or school.

Moving Picture Experts Group: Standard related to compression of video (movie) and

audio. There are four types of MPEG - MPEG1, MPEG2, MPEG4 and MPEG 7 -

depending on the compression method and image quality.

Moving Picture Experts Group Phase 2: A higher standard of MPEG which is applied to

video (movie) requiring higher quality.

One of three audio compression standards (layers I-III) defined by MPEG.

Standard card type expansion device that is inserted into a slot for PC card. JEITA and

PCMCIA (Personal Computer Memory Card International Association) are cooperating to

perform standardization. There are three types of cards - TYPE I, II and III - depending

on differences in functions and thickness. The PC card is also referred to as a PCMCIA

card.

This CCD image sensor scans an image once to create a one-image signal. Also referred

to as a non-interlaced CCD sensor.

Procedure, regulations and conventions for data communications.

Redundant Array of Independent Disks: This technique arrays multiple hard disks and

then uses them as one disk to decentralize accesses, thereby enhancing reliability and

process speed. There are seven types of RAID - RAID0-RAID6.

8-pole, 8-core connector used for communication cable.

Recommended Standard 232 version C: One of the serial communication standards

established by EIA. Communication standard for one-to-one connections only. 25-pin or

9-pin D-SUB connectors are used.

Recommended Standard 485: One of serial communication standards established by EIA.

This standard complies with multiple-to-multiple connections of up to 32 units. 25-pin D-

SUB connectors are normally used.

Small Computer System Interface: A standard for connecting computer and peripheral

devices. The number, First, Ultra, Wide, etc., prefixed or suffixed to SCSI indicates the

data transfer rate and connector specifications.

Screened Twisted Pair: One type of twisted pair cables. Only the inside of the outermost

sheath in this twisted pair cable is shielded. Noise resistance characteristics are superior

to UTP.

Standard Image Format: This format delivers the resolution of 320 horizontal × 240

vertical pixels.

Shielded Twisted Pair: One type of twisted pair cables, with each pair shielded. Noise

resistance characteristics are superior to UTP or ScTP.

Super eXtended Graphics Array: An expanded specification of XGA, with resolution of

1280 horizontal × 1024 vertical pixels.

One type of communication cables: Two sheathed cables are twisted into one pair, which

is further sheathed. 4 pairs of cables twisted and sheathed are normally used for

communication cables.

Unshielded Twisted Pair: One type of twisted pair cables, without shield. Noise

resistance characteristics are inferior to ScTP.

Variable Bit Rate: This format of coding audio and video varies the amount of data

depending on the subject image.

Video Graphics Array: The resolution is 640 horizontal × 480 vertical pixels.

Index

Abbreviation/

Term

Explanation

2 - 9

Index

Abbreviation/

Term

Explanation

W

X

0-9

WDR

XGA

10Base-T

100Base-T

100Base-TX

Wide Dynamic Range: The Hitachi wide dynamic range technique lets a video camera

with progressive scan CCD record an image at a shutter speed suitable for brighter object

and another image at a shutter speed suitable for darker object. It then synthesizes the

two images, thereby reproducing a clear picture.

eXtended Graphics Array: Extended VGA specifications with the resolution of 1024

horizontal × 768 vertical pixels.

Ethernet specifications using twisted pair cables. The number indicates data transfer

rate; T after a hyphen indicates the use of a twisted pair cable. The data transfer rate of

10Base-T is 10 Mbps, and the data transfer rate of 10Base-T/TX is 100 Mbps.

General Description > List of Abbreviations and Terms for Surveillance System

3 - 1

3-1 Structure Schematics

Fig. 3-1-1

Description of Operation

3

34.6mm

54mm

52mm

2

9

m

16.1mm

18.5mm

40mm

19.6mm

20.4mm

2mm

32mm

2mm

0mm

12.9mm

34.4mm

14mm

2mm

0mm

12.9mm

34.4mm

14mm

4-M2 SCREWS

(These screws are limit of height

keep as being less than 2mm for 'C' )

4-M2 SCREWS

(These screws are limit of height

keep as being less than 2mm for 'C' )

M2 SCREWS

(These screws

are limit of height

keep as being less

than 2mm for 'C' )

M2 SCREWS

0.6mm

C

CHASSIS

3 - 2

Description of Operation > Microprocessor Pin Function Table

3-2 Microprocessor Pin Function Table

3-2-1 Camera microprocessor (IC2507: Camera µP)

No.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

I/O

O

-----

O

-----

I

-----

I

-----

O

-----

O

I

O

-----

O

I

Active

Level

Pulse

-----

Pulse

-----

Hi/Lo

-----

0V-3V

-----

Hi

Pulse

-----

Pulse

-----

Pulse

-----

Pulse

Abbreviation

LD-DSP

4800ST

NC1

GYRO-RST

NC2

NC3

RDOEB

ZDOEB

RDCK

ZDCK

IRDCK

VCC1

LINE-SW

GND1

KEY-IN0

KEY-IN1

KEY-IN2

KEY-IN3

KEY-IN4

KEY-IN5

NC4

NC5

TEST0

TEST1

CHECK8

ZD-RST

RD-RST

IRIS-PWM

LD-JIG

ZOOM-LED

TXD2

RXD2

FCS-LED

ZDCW

ZD-PWMA

RDCW

RD-PWMA

FV

Function

Activates data communication with IC2502 (CAMERA DSP).

Not used. Open.

Outputs focus motor drive signal to IC4001 (ZOOM/FOCUS MOTOR

DRIVE).

Not used. Open.

3V power input.

External sync detection input. When "Hi" is input, the unit will be

driven in the external sync mode; when "Lo" is input, it will be driven

in the internal sync mode.

Ground.

Operation switch detection input.

Not used. Open.

Reset signal output. Resets IC4001 (ZOOM/FOCUS MOTOR DRIVE).

Output pulses to drive the iris motor in the lens block via IC4103

(IRIS DRIVE).

Not used. Open.

Output pulses to drive the ZOOM LED in the lens block via Q4001

(LED DRIVE).

Pins for reading/writing microprocessor program: Exclusive use at the

factory.

Output pulses to drive the FOCUS LED in the lens block via Q4001

(LED DRIVE).

Not used. Open.

Issues a command which determines with IC4001 (ZOOM/FOCUS

MOTOR DRIVE).

Not used. Open.

Receives the vertical sync pulses that detect the iris detection area,

from IC2502 (CAMERA DSP).

3 - 3

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

65

64

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

I

-----

I

-----

O

I

-----

I

-----

I

O

I

-----

O

-----

I

-----

I

O

I

-----

Pulse

-----

Pulse

-----

0V-3V

0V-9V

0V-3V

-----

Lo

-----

Pulse

-----

0V-3V

-----

Hi

-----

Pulse

-----

Pulse

-----

FCUS-SEN

NC5

ZOOM-SEN

GND2

HALL-ADJ1

HALL-ADJ0

BATTERY

KEY-AD0

KEY-AD1

+B-DET

TEMP-ADJ

KEY-AD2

KEY-AD3

FDET

AVCC1

AVCC2

VCC2

VCC3

NC7

NC8

RESET-IN

VCC4

STBY

VCC5

XTAL

EXTAL

GND3

FWE

MD2

NC9

HALL-G

NC10

NC11

HD

NC12

NC13

FP

SD

RD

EP3

NC14

NC15

Focus motor position detection input.

Not used. Open.

Zoom motor position detection input.

Ground.

Controls the offset voltage of IC4101 (F-DET).

Controls the bias voltage of the Hall devices via Q4101 (BIAS GEN.)

and Q4103 (BIAS DRIVE)

Not used. Connected to 3V line and ground via resistors.

Operation switch detection input.

Power voltage (+B) detection input. Monitors the +B line voltage.

Temperature change detection input. Detects variations in the

forward voltage at the connected diode to correct the back-focus.

Operation switch detection input.

F-value detection input. Receives the F-DET voltage detected by

IC4101 (F-DET) and compares this with the reference voltage input

via pin 53 to detect the F-value.

Reference 3V power input.

A/D reference voltage input (connected to 3V power supply).

3V power input.

Not used. Open.

Not used. Connect to ground.

Reset signal input from IC2302 (RESET PULSE GEN.).

3V power input.

Not used. Connect to 3V power supply.

3V power input.

Drive X2301 to generate 13.5MHz main clock pulses.

Grounded.

Pins for writing microprocessor program: Exclusive use at the factory.

Not used. Open.

Controls the amplification (gain of Hall device) of IC4102 (HALL

AMP).

Not used. Open.

Inputs horizontal sync from IC2052 (CAMERA DSP).

Not used. Open.

Inputs field discrimination pulse from IC2052 (CAMERA DSP).

Used for initial settings and adjustment. For data communications

with personal computer.

Receives pulses which discriminate the iris detection area.

Not used. Open.

No.

I/O

Active

Level

Abbreviation

Function

Description of Operation > Microprocessor Pin Function Table

3 - 4

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

-----

O

I

O

-----

O

-----

Pulse

-----

Hi/Lo

Pulse

Not used. Open.

For data communications with IC2052 (CAMERA DSP), IC2303

(EEPROM1), IC2304 (EEPROM2).

Not used. Open.

Power circuit control output. Controls the IC3001 (PWM).

Transfer data to IC2001 (CDS/AGC & A/D CONV. ).

Activates data communications with IC2001 (CDS/AGC & A/D

CONV. ).

Activates data communications with IC2303 (EEPROM1).

Activates data communications with IC2304 (EEPROM2).

NC16

NC17

SDO

SDI

SCLK

NC18

NC19

NC20

NC21

NC22

NC23

NC24

NC25

SYS-RST

STBY-5V

CK-CDS

SDO-CDS

CS-CDS

CS-EE1

CS-EE2

No.

I/O

Active

Level

Abbreviation

Function

Description of Operation > Microprocessor Pin Function Table

4 - 1

4

Troubleshooting

Fig. 4-1-1 Connections for Trouble Diagnosis

4-1 Trouble Diagnosis

4-1-1 Setting to service position

Remove bracket R and bracket L, referring to “5. Disassembly and Reassembly”, and connect the

camera as shown in Fig. 4-1-1.

Note:

To prevent short-circuit, always perform trouble diagnosis of camera on insulated mat.

PG3501

9PIN FLAT CABLE

(ACCESSORY)

COLOR MONITOR

VIDEO IN

DSP INTERFACE CONNECT JIG

(Parts No. 7069179)

+

DC POWER

SUPPLY

(9V/3A)

GND

PC CIRCUIT

BOARD

CSR CIRCUIT

BOARD

1

9

RD WHT

SD BRW

GND BRW

+B BRW

GND BRW

VIDEO BRW

GND(VIDEO) BRW

EX-FV BRW

GND(EX-FV) BRW

1

2

3

4

5

6

7

8

9

1

2345

6

78

9

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