HS- 2190
COLOUR TELEVISION
Service Manual
Haier group
1. Technical specifications &
Safety precautions.....................................
2. Servicing precautions................................
3. Functions & Location of controls...............
4. Brief operation instructions........................
5. Disassembly instructions...........................
6. Specific information..................................
7. Electrical adjustment..................................
8. Information of Resistors and capacitors.....
9. Damageable parts list................................
10Appendix......................................................
2
4
10
14
15
17
37
39
40
42
Features
Contents
1
Technical specifications & Safety precautions …… ……..….
2
2
Servicing precautions…………………………………….……….
4
3
Functions & Location of controls …………………………..….
10
4
Brief operation instructions………………………………… ….
14
5
Disassembly instructions………………………………………...
15
A. Important notes………………………………………......15
B. Precautions for handling of picture tube…… ……....15
C. Exploded of cabinet parts………… ………………..….16
6
Specific informations……………………………………………...
17
A. Principle integrated circuits…………………………….17
B. Service mode and adjusting items and datas…….....
27
C. Error detection process…………………………………
32
7
Electrical adjustment………………………………………..….....
37
8
Information of Resistors and capacitors……………………....
39
Terminal view of transistors……………………………….…....40
9
Damageable parts list
Replacement parts list…..……………………………….…….…
41
10 Appendix…………………………………………..………………....
42
A. Circuit block diagram
B. Circuit diagrams
2
1. TECHNICAL SPECIFICATION & SAFETY
PRECAUTIONS
POWER SUPPLY: AC 160~250V, 50/60Hz
Tuning system: voltage synthesized type auto-search fine tuning system
PIF: 38.9MHz
Soud output: 3W
Power consumption: 70W
Antenna input impedance: 75Ω
Receiving system:
a) Color system: PAL SECAM AV: NTSC3.58MHz/4.43MHz
b) Broadcast TV system: B/G D/K
Language displayed: English /Arabic
Video input: 1.0V
P-P
(75Ω)
Video output: 1.0V
P-P
(75Ω)
Audio input: 436m Vrms (40KΩ)
Audio output: 436m Vrms (more than 600KΩ)
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
These parts are identified by many electrical and mechanical parts in this chassis
have special safety-related characteristics.
! in the Schematic Diagram and
Replacement Parts List.
It is essential that these special safety parts should be replaced with the same
components as recommended in this manual to prevent X-RADIATION, Shock, Fire,
or other Hazards.
Do not modify the original design without permission of the manufacturer.
General Guidance
An Isolation Transformer should always be used during the servicing of a receiver
whose chassis is not isolated from the AC power line. Use a transformer of adequate
power rating as this protects the technician from accidents that might result in
personal injury caused by electrical shocks.
It will also protect the receiver and it’s components from being damaged by
accidental shorts of the circuitry that might be inadvertently introduced during the
service operation.
3
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a
specified one.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep
the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to the high vacuum and large surface area of the picture tube, extreme care
should be taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.
X-RAY Radiation
Warning:
The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and
the Picture Tube.
For continued X-RAY RADIATION protection, the replacement tube must be of the
same type as specified in the Replacement Parts List.
Before returning the receiver to the customer,
Always perform an AC leakage current check on the exposed metallic parts of the
cabinet, such as antennas, terminals, etc., to make sure that the set is safe to
operate without any danger of electrical shock.
4
2. SERVICING PRECAUTIONS
Warning and Cautions
Explanation on the display tube
1. When you clean the TV set, please pull
out the power plug from AC outlet. Don't
clean the cabinet and the screen with
benzene, petrol and other chemicals.
4. To prevent the TV set from firing and
electric shock, don't
make the TV set rain
or moisture.
2.
In order to prolong the using life of the
TV set, please place it on a ventilated
place.
5. Don't open the back cover, otherwise it is
possible to damage the components in the
TV set and harm you.
3.
Don't place the
TV set in the
sunshine or near
heat source.
6. When the TV set isn't going to be used
for long time or it is in thunder and
lightening, please pull out the plug from AC
outlet and the antenna plug from the cover
of the TV set.
Generally, it is not needed to clean the tube surface. However, if necessary, its
surface can be cleaned with a dry cotton cloth after cutting off the power. Don’t use
any cleanser. If using hard cloth, the tube surface will be damaged.
5
CAUTION: Before servicing receivers covered by this service manual and its
supplements and addenda, read and follow the SAFETY PRECAUTIONS.
NOTE: If unforeseen circumstances create conflict between the following servicing
precautions and any of the safety precautions, always follow the safety precautions.
Remember : Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before:
a. Removing or reinstalling any component, circuit board module or any other
assembly of the receiver.
b. Disconnecting or reconnecting any receiver electrical plug or other electrical
connection.
c. Connecting a test substitute in parallel with an electrolytic capacitor in the
receiver.
CAUTION: A wrong substitution part or incorrect installation polarity of
electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high voltage meter or
other voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable
high voltage probe. Do not test high voltage by “drawing an arc”.
3. Discharge the picture tube anode only by (a) first connecting one end of an
insulated clip lead to the degaussing or kine aquadag grounding system shield at
the point where the picture tube socket ground lead is connected, and then (b)
touch the other end of the insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its assemblies.
5. Unless specified otherwise in this service manual, clean electrical contacts only
by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped
stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90%
(by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of contacts is not
required.
6. Do not defeat any plug / socket B+ voltage interlocks with which receivers
covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its electrical assemblies
unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the receiver chassis ground
before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
6
9. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this
receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components are usually called Electrostatically Sensitive (ES) Devices.
Examples of typical ES devices are integrated circuits and some field effect
transistors and semiconductor “chip” components. The following techniques should
be used to help reduce the incidence of component damage caused by static
electricity.
1. Immediately before handling any semiconductor component or semiconductor-
equipped assembly, drain off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to prevent potential
shock prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the
assembly on a conductive surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type folder removal device. Some solder removal devices
not classified as “anti-static” can generate electrical charges sufficient to damage
ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges
sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until
immediately before you are ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by conductive foam, aluminum
foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a
replacement ES device, touch the protective material to the chassis or circuit
assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all
other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices.
(Otherwise even some normally harmless motions such as mutual brushing of
your clothes’ fabric or lifting of your foot from a carpeted floor might generate
static electricity sufficient to damage an ES device.)
7
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and
shape that will maintain tip temperature within the range of 500
o
F to 600
o
F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40
parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or
1.25cm) brush with a metal handle. Do not use freon-propelled spay-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.(500
o
F to 600
o
F)
b. Heating the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-type solder removal
device with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.(500
o
F to 600
o
F )
b. First, hold the soldering iron tip and solder the strand against the component
lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and
the printed circuit foil, and hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder
with a small wire-bristle brush.
Remove /Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC
leads are inserted and then bent flat against the circuit foil. When holes are of slotted
type, the following technique should be used to remove and replace the IC. When
working with boards using the familiar round hole, use the standard technique as
outlined .
Removal
Desolder and straighten each IC lead in one operation by gently prying up on the
lead with the soldering iron tip as the solder melts.
Draw away the melted solder with an anti-static suction-type solder removal device
(or with solder braid) before removing the IC.
8
Replacement
Carefully insert the replacement IC in the circuit board.
Carefully bend each IC lead against the circuit foil pad and solder it.
Clean the soldered areas with a small wire-bristle brush.(It is not necessary to
reapply acrylic coating to the areas).
“Small-Signal” Discrete Transistor
Removal/Replacement
Remove the defective transistor by clipping its leads as close as possible to the
component body.
Bend into a “U” shape the end of each of three leads remaining on the circuit board.
Bend into a “U” shape the replacement transistor leads.
Connect the replacement transistor leads to the corresponding leads extending from
the circuit board and crimp the “U” with long nose pliers to insure metal to metal
contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
Heat and remove all solder from around the transistor leads.
Remove the heat sink mounting screw (if so equipped).
Carefully remove the transistor from the heat sink of the circuit board.
Insert new transistor in the circuit board.
Solder each transistor lead, and clip off excess lead.
Replace heat sink.
Diode Removal/Replacement
Remove defective diode by clipping its leads as close as possible to diode body.
Bend the two remaining leads perpendicularly to the circuit board.
Observing diode polarity, wrap each lead of the new diode round the corresponding
lead on the circuit board.
Securely crimp each connection and solder it.
Inspect (on the circuit board copper side) the solder joints of the two “original” leads.
If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections
9
CAUTION: Maintain original spacing between the replaced component and
adjacent components and the circuit board to prevent excessive component
temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds
foil to the circuit board causing the foil to separate from or “lift-off” the board. The following guidelines
and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to
install a jumper wire on the copper pattern side of the circuit board.(Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only
as much copper as absolutely necessary).
2. Carefully scratch away the solder resist and acrylic coating (if used) from the end
of the remaining copper pattern.
3. Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it
around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it
overlap the previously scraped end of the good copper pattern. Solder the
overlapped area and clip off any excess jumper wire.
At other connections
Use the following technique to repair the defective copper pattern at connections
other than IC Pins. This technique involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to insure that a hazardous condition will not
exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate
the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component
on one side of the pattern break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so that it does not touch
components or sharp edges.
10
3. FUNCTIONS & LOCATION OF CONTROLS
I
2
C bus control with digital technology
Slide curtain power on/off display.
Complete frequency range CATV (470MHz)
218 programs stored
Multiple picture modes and volume modes
Screen display of menu in English or Arabic
Turn on/off the TV on defined time
Program scan
Child-lock
Sleep timer
11
Location of controls
Front panel of the TV set
2
4
56
7
3
1
MENU TV/AV
P
Main power
Power indicator
Channel adjustment button
Volume adjustment buttonMenu display button
TV/Video conversion
When using S terminal, please pull out video 1 input terminal
Power indicator, the indicator is dim in normal stztus, the indicator lights in standby
status(red), the indicator lights in sleep status(green), the indicator glints when you use
remote comtroller.
Rear panel of the TV set
2
1
3
AUDIO
IN
VIDEO
OUT
Antenna input socket
Video/audio input socket
Video/audio output socket
12
Remote Controller
PP
V.S
TV/AV
SCAN
DISP
123
456
789
0
ALT
SYS
VOL PRO
SLEEP
+
-
+
-
Mute
Digit direct select
Call of menu
Call of system menu
Channel alternate
Timing off
(sleep function)
Picture memory mode
Program scan
Volume mode select
Call of screen displa
y
/
child-lock
Power on / standby
TV/ video conversion
Menu item select
Pro
g
ram number control
Volume control
Menu item adjust
One-digit / two-digit
/ three-digit select
HYF-30A
13
4. BRIEF OPERATION INSTRUCTIONS
Insert the power plug into the power line socket and insert the antenna plug into the
antenna socket on the rear panel. Press down the power switch of the TV set. The
red indicator light goes on. Follow the steps below.
A
Program preset
1. Auto searching and storing program
Press MENU to enter the POS.MEMORY Menu. Press PROGRAM up/down
buttons to select AUTO MEMORY and press VOLUME buttons to search
automatically. When the search finishes, all the programs will be stored
automatically and the TV returns to normal status.
2. Manual search and fine tune
Press MENU repeatedly to enter the POS.MEMORY Menu. Press PROGRAM
up/down buttons to select POSITION and BAND ,then press VOLUME buttons to
set and Program up/down buttons to select SEARCH item. Press VOLUME
buttons to search manually. When the search finishes, all the programs will be
stored automatically and the TV returns to normal status. If the effect is not good,
press PROGRAM up/down buttons to select MFT and press VOLUME buttons
until the optimum effect is achieved.
3. Deleting channel number
Press MENU enter the POS.MEMORY Menu. Press PROGRAM up/down buttons
to select SKIP. Press VOLUME buttons to set this item to be OFF. Now the
program number is deleted.When you change the program using PROGRAM
up/down ,the program number skipped off will disappear,but if you select the
program number skipped off use direct digital number ,you can see the program.
B
Volume tuning
Press VOLUME buttons to increase or decrease the volume.
C Personal preference settingss
1. Picture effect
Press PP repeatedly to change among BRIGHT, STANDARD, SOFT ,PERSONAL
and PICTURE MUTE.
2. Sound effect
Press V.S repeatedly to change among HIGH VOL,NORMAL and LOW VOL.
Note:
a. The character marked color
means button on remote controller,
b.The character marked color means menu item on display ,
14
5. DISASSEMBLY INSTRUCTIONS
A. Important note
This set is disconnected from the power supply through the converter transformer.
An isolating transformer is necessary to service operations on the primary side of the
converter transformer.
Back Cabinet Removal
Remove the screw residing on the back cabinet and carefully separate the back
cabinet from the front cabinet.
B. Picture tube handling caution
Due to high vacuum and large surface area of picture tube, great care must be
exercised when handling picture tube. Always lift picture tube by grasping it firmly
around faceplate.
NEVER LIFT TUBE BY ITS NECK! The picture tube must not be scratched or
subjected to excessive pressure as fracture of glass may result in an implosion of
considerable violence which can cause personal injury or property damage.
15
C.EXPLODED VIEW OF CABINET PARTS
Model: HS-2190
1
4
6
5
NO.
Part No.
Description
QTY.
1
0090200717 Front frame
1
2
0094000221 SPEAKER
3
0094000221 SPEAKER
1
4
0094000748 Color picture tube
1
5
0090200725 Bracket base board
1
6
0090200722 Rear cover
1
1
16
6.
SPECIFIC INFORMATIONS
A. Principle integrated circuits
A1. HS-2190 color TV set composed of the following sections
(1) Microprocessor control: microprocessor N901 (TMP87CM38N V2.0)and
memory N902 (AT24C08).
(2) Small signal processing: super monolithic integrated circuits N201
(TB1238AN)
(3) Sound processing and power a mplifying: integrated circuits N701
(TA8213K)
(4) Line and field scan output integrated circuits: field output integrated
circuits N402(TA8403K), line output transistor V432 (2SD1879), line
output transformer T402 (JF0501-90812)
(5) Switch power supply: switch transformer T501 (BCK-08A6), power
transistor V503 (2SC4584),
A2. Main integrated circuits:
(1) TMP87CM38N Microprocessor
(2) TB1238AN Picture IF/sound IF/video processing/line and
field
scan/color decoding
(3) TA8403K Field output integrated circuits
(4) TA8213K Sound power amplifying integrated circuits
(5) TA1275AZ SECAM decoding IC
A3. Electrical circuit analysis
1.The integrated circuit used in this set
(1) TB1238AN: Picture intermediate frequency, sound intermediate frequency, video
signal processing, chrominance signal processing, RGB output circuit and horizontal
and vertical vibration scanning circuit.
(2) TMP87CM38N: Super central microprocessor
(3) TA8403K: Vertical scanning circuit.
(4) TA8213K: Sound amplifier circuit.
(5) LA7910: Band alternating selection switch
17
2. Functions and parameters of integrated circuit
N402 TA8403K
Reference resistance
(KΩ)
Item
No.
Function Reference
voltage (V)
Forward Reverse
1 Grounding terminal 0 0 0
2 Output terminal 13 1.6 1.5
3 Pump power output terminal 26 0
∞
4
Vertical scanning saw-tooth wave signal
input terminal
0.95 2 2
5
Vertical scanning saw-tooth wave signal
generating terminal
0.9
∞ ∞
6 Vertical power terminal 26 3.9 2
7 Vertical power input terminal 1.8 33.5 35
N701 TA8213K
Reference resistance
(KΩ)
Item
No.
Function Reference
voltage (V)
Forward Reverse
1 Power supply 20 1.8 0.7
2 Amplifier output 10 4.3 2.2
3 Ground 0 0 2.8
4 Ripple filtering 7 12.9 12.5
5 Ground 0 0 0
6 Audio input 2
∞ ∞
7 feedback 2 34 30
18
N202 TN1275AZ
Reference resistance
(KΩ)
Reference voltage (V)
Pin Function
With
signal
Without
signal
Forward
(black
grounding)
Reverse
(red
grounding)
1 Y output
3.0 2.9
5.1k
4.2k
2 Delay switch
4.1 4.1 11.6 11.6
3 R-Y output
2.6 2.5 5.2k 4.3k
4 R-Y output
2.6 2.6 132 132
5 B-Y output
2.6 2.5 5.0k 4.3k
6 B-Y blanking control
2.6 2.6 132 132
7 Recognition filter
2.1 2.1 5.2k 4.4k
8 Vacant
2.6 2.6 56.7 56.7
9 Power supply
5.1 5.1 1.7 1.7
10 Vacant
2.6 2.6 57.3 57.3
11 B-Y input
0 0 0 0
12 Frequency filter
2.7 2.8 2.6k 1.4k
13 S/chrominance low pass filter
4.4 4.4 48 48
14 Clock filter
2.5 2.4 4.6k 4.4k
15 Y input
2.9 2.6 2.3k 2.3k
16 Clock control
5.1 5.1 1.7 1.7
17 Sandcastle impulse input
0.7 0.7 7.6 7.6
18 Power supply
5.1 5.1 1.7 1.7
19 4.43 threshold input
1.4 1.4 21 21
20 Ground
0 0 0 0
21 System recognition switch
3.5 1.6 5.2k 4.2k
19
N201 TB1238AN
Reference Voltage(V) Reference
Resistance(KΩ )
Pin Function
With signal
Without signal
Forward Backward
1 Unweighted 4.9 4.9 6.7K 2.2K
2 Audio signal output 3.5 3.5 7.4 7.4
3 PIF circuit power supply 8.9 8.9 1.3 0.9
4
AFT output and auto-adjusting
3.0 3.0 50.4 50.4
5 PIF circuit grounding 0 0 0 0
6 IF signal input pin 1.9 1.9 115 115
7 IF signal input pin 2.0 2.0 115 115
8 RF AGC output 4.2 6.1 48.3 48.3
9 IF AGC filtering 4.2 6.6 7.8K 5.0K
10
Color demodulation APC filtering
2.5 2.1 6.6K 4.9K
11 4.43MHz crystal oscillator 3.6 3.6 27 4.8K
12 Y/C circuit grounding 0 0 0 0
13
Analog RGB and AKB
mode alternating
0 0 1.4 1.4
14 Analog R signal input 2.9 2.9 7K 5.1K
15 Analog G signal input 2.9 2.9 7K
5.1K
16 Analog B signal input 2.9 2.9 7K
5.1K
17
RGB(image and message circuit)
power supply
8.9 8.9 0.86 0.86
18 R signal output 2.9 1.8 4.7K 4.6K
19 G signal output 2.8
1.8
4.7K
4.6K
20 B signal output 2.9
1.8
4.7K
4.6K
21 ABCL control pin 5.9 5.9 1.7K 4.8K
22 Field sawtooth wave forming 4.2 4.2 7.8K 4.8K
23 Field feedback signal 4.9 4.9 13.9 13.9
24 Field driving signal output 1.0 1.0 1.0 1.0
25 Field AGC 1.7 1.7 7.8K 5.1K
26 Bus clock signal 3.0 3.2 12 11
27 Bus data signal 3.2 3.3 636 400
28
Deflection circuit power supply
8.9 8.9 1.5 1.2
29
PAL/NTSC identification signal output
SECAM identification signal input
3.5 1.7 5.3K 4.2K
30 Line feedback pulse input 0.7 0.7 7.6K 2.8K
31 Composite synchronizing
pulse signal output
4.7 3.9 4.8K 5.2K
32 Line driving signal 1.8 1.8 0.6 0.6
33 Deflection circuit grounding
pin
0 0 0 0
20
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