Hitachi VK-S454R User manual

Type
User manual

This manual is also suitable for

SERVICE MANUAL
SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT
Digital Media Division
COLOR VIDEO CAMERA
August 2003
SM8303
VK-S454R
VK-S454ER
Table of Contents
1 Safety Precaution for Repair ............. 1-1
1-1 Cautions ................................................... 1-1
1-2 lectrostatic Protection Measures............... 1-1
1-3 Lead-Free Solder ...................................... 1-2
1-4 Notes When Using Service Manual .......... 1-3
2 General Description ........................... 2-1
2-1 Overview .................................................. 2-1
2-1-1 Servicing method................................... 2-1
2-2 Features ................................................... 2-2
2-3 Specifications ........................................... 2-3
2-4 Comparison from Previous Models........... 2-5
2-5 Comparison of Main Control ICs............... 2-6
2-6 List of Abbreviations and Terms for
Surveillance System ................................. 2-7
3 Description of Operation ................... 3-1
3-1 Structure Schematics ............................... 3-1
3-2 Microprocessor Pin Function Tables ......... 3-2
3-2-1 Camera microprocessor
(IC1201: Camera µP)............................. 3-2
4 Troubleshooting.................................. 4-1
4-1 Trouble Diagnosis ..................................... 4-1
4-1-1 Setting to service position...................... 4-1
4-1-2 Trouble diagnosis flowchart ................... 4-2
5 Disassembly and Reassembly .......... 5-1
5-1 Order of Disassembly ............................... 5-1
5-2 Disassembly ............................................. 5-1
6 Adjustment.......................................... 6-1
6-1 Preparations for Adjustment ..................... 6-1
6-1-1 List of equipment and jigs ...................... 6-1
6-1-2 List of test equipment and charts ........... 6-1
6-1-3 Connections for adjustment ................... 6-2
6-1-4 Setting test equipment ........................... 6-3
6-1-5 Starting adjustment program (ZMAP) .... 6-3
6-2 List of Adjustment Items ........................... 6-5
6-2-1 List of adjustments needed after
replacing major ...................................... 6-5
6-2-2 Adjustment flowchart ............................. 6-6
6-3 Data Initialize ............................................ 6-7
6-4 Electronic Volume ..................................... 6-7
6-4-1 CDS sampling pulse adjustment............ 6-8
6-5 Adjustment (Camera Adjustment)............. 6-8
6-5-1 Auto iris control adjustment ................... 6-9
6-5-2 White balance adjustment ..................... 6-9
6-5-3 Chroma gain adjustment ....................... 6-10
6-6 Auto Focus ............................................... 6-11
6-6-1 Zoom/focus tracking adjustment ............ 6-11
6-6-2 AF noise level adjustment...................... 6-12
6-6-3 Check of zoom/focus trace .................... 6-12
6-7 Spot Noise ................................................ 6-13
6-8 IR Control ................................................. 6-14
6-9 Error Messages and Countermeasure...... 6-15
7 Exploded View and Parts List............ 7-1
7-1 Exploded View .......................................... 7-1
7-2 Replacement Parts List ............................ 7-2
7-2-1 Mechanical parts list .............................. 7-2
7-2-2 Electrical parts list ................................. 7-2
Schematic, Circuit Board and Block
Diagrams....................................................1
1 Wiring Diagram .............................................. 1
2 Schematic Diagrams ..................................... 2
2-1 Sensor [SP] Schematic Diagram ............... 2
2-2 Process [PC] Schematic Diagram ............. 3
2-3 Switching Reg. [CSR] ................................ 6
3 Circuit Board Diagram ................................... 7
3-1 PC Circuit Board Diagram ......................... 7
3-2 SP Circuit Board Diagram.......................... 8
3-3 CSR Circuit Board Diagram ....................... 8
3-4 Identification Parts Location....................... 9
4 Block Diagrams ............................................. 10
4-1 Overall Block Diagram ............................... 10
4-2 Power Block Diagram ................................ 11
1 - 1
Safety Precaution for Repair
1
1-1 Cautions
Many electrical and mechanical parts have special safety-related characteristics. These are often not
evident from visual inspection nor can the protection afforded by them necessarily be obtained by using
replacement components rated for a higher voltage, wattage, etc. Replacement parts which have these
special safety characteristics are identified in this Service Manual. Electrical components having such
features are identified by marking with a on the schematics and the parts list in this Service Manual.
The use of a substitute replacement component which does not have the same safety characteristics as
the HITACHI recommended replacement one, shown in the parts list in this Service Manual, may create
shock, fire, or other hazards. Product safety is continuously under review and new instructions are issued
from time to time. For the latest information, always consult the current HITACHI Service Manual. A
subscription to, or additional copies for, HITACHI Service Manual may be obtained at a nominal charge
from HITACHI SALES CORPORATION.
PRODUCT SAFETY NOTICE
1-2 Electrostatic Protection Measures
Semiconductor components can be damaged by static electricity charged on clothes, human body,
etc. Take great care when handling components to avoid electrostatic damage, and perform
servicing in an environment where grounding is complete.
(1) Grounding work bench (Fig. 1-2-1)
Lay out an antistatic mat on work bench, and then use the ground plate to ground the work bench.
(2) Grounding human body (Fig. 1-2-2)
Use an antistatic wrist strap to discharge any static electricity charged on the body. Also, use a
tester for wrist strap to make sure that the wrist strap is working normally. Note, however, that
static electricity charged on clothes will not be discharged by wrist strap: Therefore do not allow
your clothes to touch the semiconductor components.
Fig. 1-2-1 Grounding Work Bench Fig. 1-2-2 Grounding Human Body
Antistatic mat
Ground
1M ohm
Antistatic wrist strap
1 - 2
Point to be soldered
For reflow
For dip
Composition of alloy (wt%)
Solder paste: Sn-3Ag-0.5Cu
Bar solder: Sn-0.6Cu
1-3 Lead-Free Solder
The printed circuit board that uses lead-free solder is adopted. To protect the global environment,
use the recommended lead-free solder also during servicing.
Read and observe the following before soldering:
Caution
ALWAYS wear protective goggles during soldering so that no solder smoke or scattered solder
enters the eye. Lead-free solder may scatter at high temperatures of 600°C.
(1) Identification of circuit boards that use lead-free solder
“F” is stamped or noted with pattern letter on circuit boards that use lead-free solder.
(2) Characteristics of lead-free solder
The components of lead-free solder used are as follows. The melting point of lead-free solder is 30-
40°C higher than that of lead based solder:
Melting temperature: Approx. 220°C
Point to be soldered
Surface-mounted (chip) parts [other than
those shown below]
Surface-mounted (chip) parts [for DVD
cameras, cellular phones only]
Discrete parts
Chassis, metal shield, etc.
Tip temperature
320 ± 30°C
[heating time: less than 5 seconds]
350 ± 10°C
[heating time: less than 3 seconds]
380 ± 30°C
420 ± 30°C
(3) Lead-free solder for servicing
Use the following lead-free solder for servicing:
Recommended lead-free solder and composition of alloy (wt%): Sn-3.0Ag-0.5Cu or equivalent
Information:
For composition of alloy, Sn is tin; Ag is silver; Cu is copper; Bi is bismuth; Pb is lead.
(4) Soldering iron for servicing
The temperature of soldering iron tip must be adjusted according to the points to be soldered: Use
an antistatic soldering iron with thermal control function.
When removing components, take care not to damage any surrounding component or pattern. When
attaching components, observe the heating time in the following table so that the components are
not destroyed by heat.
Tip temperatures for different soldering points:
Safety Precaution for Repair > Lead-Free Solder
1 - 3
(5) Cautions when using lead based solder
It is recommended that you use lead-free solder when servicing, but it is also possible to service
using lead based solder. However, if lead based solder is used for servicing, take care with the
following:
1) Before using lead based solder, remove the lead-free solder completely from the point to be
soldered.
2) For additional soldering for repair, set the soldering iron tip temperature for lead-free solder, mix
lead based solder and lead-free solder sufficiently. Do not perform any repair using the bare
soldering iron tip without adding solder, since it will cause secondary failure due to lack of
strength.
Safety Precaution for Repair > Lead-Free Solder / Notes When Using Service Manual
1-4 Notes When Using Service Manual
(1) Value units used in parts list
Certain symbols are indicated as shown below for value units of resistors, capacitors and coils in
parts list. When you read them, note the following regular indications:
(2) Values in schematic diagrams
The values, dielectric strength (power capacitance) and tolerances of the resistors (excluding
variable resistors) and capacitors are indicated in the schematic diagrams using abbreviations.
Certain symbols are indicated for value units: When you read them note the regular indications in
tables below:
[Resistors] [Capacitors]
[Coils]
Indication in list Regular indication
KOHM
.........................................
k
UF
................................................
µF
PF
................................................
pF
UH
...............................................
µH
MH
..............................................
mH
Parts
Resistor
Capacitor
Coil
Item
Value
Tolerance
Power
capacitance
Indication
No indication
..............................
K
..................................................
k
M
.................................................
M
No indication
..............................
±5%
(All tolerances other than ±5% are
indicated in schematic diagrams)
No indication
..............................
1/8W
(1/16 W for leadless resistors with no
indication)
All capacitances other than the above
are indicated in schematic diagrams.
Item
Value
Dielectric
strength
Indication
No indication
..............................
µF
P
..................................................
pF
No indication
..............................
50V
(All dielectric strengths other than
50 V are indicated in schematic
diagrams)
Item
Value
Indication
µ
...................................................
µH
m
..................................................
mH
1 - 4
(4) Table for indexing locations of parts
This table shows locations of each part on circuit board diagrams. The locations are indicated using
the guide scales on the external lines of diagrams.
2) Two diagrams indicated for each board1) One diagram indicated for each board
Safety Precaution for Repair > Notes When Using Service Manual
(3) Identifications of sides A/B in circuit board diagrams
1) Board with a pattern on one side and parts on both sides:
Side A: Shows discrete parts, viewed from the pattern side.
Side B: Shows leadless parts, viewed from the pattern side.
2) Board with patterns on both sides and parts on both sides:
Side A: Shows parts and patterns which can be seen when the case is opened.
Side B: Shows parts and the pattern on the back of side A.
Parts
Location
2 A
Symbol
No.
IC
IC1201
Type of part
Zone "A" on circuit board
diagram
Symbol no.
Zone "2" on circuit board
diagram
Parts
Location
A - 2 A
Symbol
No.
IC
IC1201
Zone "2" on board
diagram
A: Shows side A
B: Shows side B
Zone "A" on board
diagram
2 - 1
General Description
2
2-1 Overview
VK-S454R/S454ER is a color chassis video camera: All these models incorporate an optical 23-power
compact zoom lens.
The signal process circuit is equipped with a digital signal processor (D.S.P.6) that is the same as
that of VK-S454/S454E.
The external appearance is identical to VK-S454/S454E.
2-1-1 Servicing method
Table 2-1-1 shows the method for servicing each circuit board.
Refer to "4 Troubleshooting" for the method of judging defects in each circuit board.
Information:
These servicing methods are subject to change without notice for the purpose of facilitating service
procedures.
Circuit board
CSR circuit board
SP circuit board
PC circuit board
Table 2-1-1 Circuit Board Servicing Method
Servicing method
Component replacement.
Component replacement or
Circuit board assembly
replacement (Order format).
*1
Fig. 2-1-1 Locations of Circuit Boards
PC CIRCUIT
BOARD
SP
CIRCUIT
BOARD
CSR CIRCUIT
BOARD
IC1121
*1: Since IC1121 mounted on the PC circuit board
is CSP type, replacement is not possible:
Replace the whole PC circuit board when
IC1121 becomes faulty. Other components on
the PC circuit board can be replaced.
2 - 2
2-2 Features
Progressive Scan CCD Image Sensor
The VK-S454R/S454ER has a high-performance 1/4-inch progressive scan CCD.
Wide Dynamic Range
A wide dynamic range is achieved by the progressive synthesis function, which records an image at
a shutter speed suitable for brighter object and another image at a shutter speed suitable for darker
object, then and synthesizes the two images, thereby reproducing a clear picture.
Removable IR Cut Filter
The IR cut filter that is fixed on other video cameras can be detached in low illumination. Removing
the IR cut filter in low illumination will make it possible to use the infrared rays as a light source, so
recording even in 0.02 lx will be possible.
Built-in Optical Power Zoom Lens
A highly reliable optical 23-power zoom lens is mounted, and it is equipped with auto-focus, auto iris
and removable IR cut filter functions.
12-Power Digital Zoom Function
The 12-power digital zoom, combined with the 23-power optical zoom, makes possible up to 276-
power zooming.
Remote Control via RS-232C
Focus, iris and zoom can be remotely operated via RS-232C.
External Synchronization with AC-Line Pulse Signal
This chassis camera is compatible with external sync using AC-line pulse signal, as well as with
internal sync.
General Description > Features
2 - 3
2-3 Specifications
The specifications in shaded columns are different from those of previous models.
Design and specifications are subject to change without notice.
Item
Signal Format
Scanning System
Scanning
Frequency
Image Sensor
Lens
Signal Processing Circuit
Sync. System
Camera Functions
(Control through
RS-232C)
VK-S454R/S454ER
VK-S454R: NTSC
VK-S454ER: PAL
2:1 Interlacing
VK-S454R: 15.734 kHz
VK-S454ER:15.625 kHz
VK-S454R: 59.94 Hz
VK-S454ER:50 Hz
1/4-inch CCD
VK-S454R: 758 (H) × 504 (V), 380k
VK-S454ER:758 (H) × 592 (V), 450k
VK-S454R: 724 (H) × 494 (V), 360k
VK-S454ER:724 (H) × 582 (V), 420k
f = 3.6 - 82.8 mm
Horizontal 54°(Wide), 2.5°(Tele)
F1.6 (Wide) - F3.7 (Tele)
1.0m (Tele), 0.01m (Wide)
Provided
DSP6
Internal/External
Wide* - Tele 23× (Zoom speed: 4.2s
*
/5.8s)
Off
*
/On (Up to 12×)
Auto
*
/Manual (Near - Far/Fix)
Auto
*
/Manual (Red/Blue Gain: Up-Down/Fix)
VK-S454R: 1/2 - 1/60s
VK-S454ER:1/1.5 - 1/50s
VK-S454R: 1/60 - 1/4000s
VK-S454ER:1/50 - 1/4000s
VK-S454R: 1/2 - 1/4* - 1/4000s
VK-S454ER:1/1.5 - 1/3* - 1/4000s
VK-S454R: 1/60 - 1/4000s
VK-S454ER:1/50 - 1/4000s
VK-S454R: 1/2 - 1/4 - 1/4000s
VK-S454ER:1/1.5 - 1/3 - 1/4000s
VK-S454R: Shutter priority (1/2 - 1/4000s)/
Exposure priority (F1.6 - F34)/
AGC priority (0 - 27dB)
VK-S454ER:Shutter priority (1/1.5 - 1/4000s)/
Exposure priority (F1.6 - F34)/
AGC priority (0 - 27dB)
Auto*/Manual (Off/On)
Off*/On (Auto/Manual)
Off*/On
Off*/On
*: Default settings
General Description > Specifications
Horizontal
Vertical
Total Pixels
Effective Pixels
Focal Length
Angle of View
F-Value
Min. Distance
Removable IR cut filter
(IRcf) Function
Optical Zoom
Digital Zoom
Video Focus
White Balance
Digital Slow Shutter
(DSS)
Shutter
Speed
Removable IR cut filter
(IRcf)
Wide Dynamic Range (WDR)
Reverse
Mirror
Pro-AE mode
(Auto)
Pro-AE+* mode
(Pro-AE + DSS)
Pro-AER mode
(Pro-AE + IRcf)
Pro-AER+ mode
(Pro-AE+ + IRcf)
Manual
2 - 4
Item VK-S454R/S454ER
Camera Functions
(Control through
RS-232C)
Horizontal Resolution
Luminance S/N Ratio
Sensitivity
Video output
Supplied Voltage
Power Requirement
Operating Temperature
Operating Humidity
Dimensions
Weight
Auto*
Off/On* (2 zone 2-D/8 zone 3-D)
Off
*
/On
Selective
(4.8k*/9.6k/19.2k/38.4/57.6k bps)
No-Trace preset/Trace preset
(Memory: max. 111 position)
More than 470 TV lines
More than 50dB
3.0 lx
0.2 lx
0.02 lx
Composite: 1.0 ± 0.2Vp-p
9 V - 12 V DC ± 0.5 V
4.7 W (When suppling 9 V DC)
0 - 60° (Recommended: 0 - 40°)
10 - 90%
50 (W) × 60 (H) × 89.5 (D) mm
Approx. 230g
General Description > Specifications
*: Default settings
Iris
Privacy Zone Masking
Scene Memory (Freeze)
Communication Speed of
RS-232C
Position Preset
Pro-AE mode (1/60s or 1/50s,
F1.6, AGC gain: 28.0dB)
Pro-AE+* mode (1/4s or 1/3s)
Pro-AER+ mode (IRcf: Off)
2 - 5
General Description > Comparison from Previous Models
2-4 Comparison from Previous Models
Item
Image Sensor
Lens
Signal Processing Circuit
Sync. System
Camera
Functions
(Control
through
RS-232C)
Horizontal Resolution
Luminance S/N Ratio
Sensitivity
Supplied Voltage
Power Requirement
Dimensions
Weight
VK-S454R/S454ER
1/4-inch CCD
VK-S454R: 758 (H) × 504 (V),
380k
VK-S454ER:758 (H) × 592 (V),
450k
VK-S454R: 724 (H) × 494 (V),
360k
VK-S454ER:724 (H) × 582 (V),
420k
f = 3.6 - 82.8 mm
Horizontal 54°(Wide), 2.5°(Tele)
F1.6 (Wide) - F3.7 (Tele)
1.0m (Tele), 0.01m (Wide)
Provided
DSP6
Internal/External
23× (Zoom speed: 4.2s/5.8s)
Off/On (Up to 12×)
Auto/Manual (Red/Blue Gain: Up-
Down/Fix)
VK-S454R: 1/2 - 1/4 - 1/4000s
VK-S454ER:1/1.5 - 1/3 - 1/4000s
Auto/Manual (Off/On)
Off/On (Auto/Manual)
Off/On
Off/On
Auto
Off/On (2 zone 2-D/8 zone 3-D)
Off/On
Selective
(4.8k/9.6k/19.2k/38.4/57.6k bps)
No-Trace preset/Trace preset
(Memory: max. 111 position)
More than 470 TV lines
More than 50dB
3.0 lx
0.2 lx
0.02 lx
9 V - 12 V DC ± 0.5 V
4.7 W (When suppling 9 V DC)
50 (W) × 60 (H) × 89.5 (D) mm
Approx. 230g
VK-S454/S454E
VK-S454:
VK-S454E:
VK-S454:
VK-S454E:
VK-S454:
VK-S454E:
Not Provided
Off/On (2 zone 2-D)
Selective
(2.4k/4.8k/9.6k bps)
Not Provided
9 V DC ± 0.5 V
4.6 W
: Same as on left
Total Pixels
Effective Pixels
Focal Length
Angle of View
F-Value
Min. Distance
Removable IR cut filter
(IRcf) Function
Optical Zoom
Digital Zoom
White Balance
Shutter Speed
Removable IR cut filter
(IRcf)
Wide Dynamic Range
(WDR)
Reverse
Mirror
Iris
Privacy Zone Masking
Scene Memory (Freeze)
Communication Speed
of RS-232C
Position Preset
Pro-AE mode
Pro-AE+* mode
Pro-AER+ mode
2 - 6
2-5 Comparison of Main Control ICs
Item
Image Sensor
Sensor Drive
Buf.
CDS AGC & A/D Conv.
Camera DSP
SD RAM
Inv.
Clock Gen.
Camera µP
Adj. EEPROM
Reset EEPROM
Reset Pulse Gen.
Zoom Motor Drive
Focus Motor Drive
IR Motor Drive
F.Det./Iris Drive
PWM
7.2V Reg.
Y/C Mix. & Video Amp
Level Shift
VCO/Phase Compa.
FV Pulse Gen.
Inv.
NTSC/PAL Switch
VK-S454R/S454ER
VK-S454R: ICX216AN (IC1001)
VK-S454ER:ICX217AN (IC1001)
µPD16510GR (IC1002)
HD74AC244 (IC1003)
HD49325BF (IC1101)
HG75C015ABT (IC1121)
W986432DH-7 (IC1150)
TC7SHU04FU (IC1171)
MJU6321P (IC1173)
HD6432238RN46FA (IC1201)
BA9016RFV (IC1202)
BA9016RFV (IC1250)
RN5VD27AA (IC1251)
TB6512AF (IC1301)
TB6512AF (IC1302)
TB6512AF (IC1380)
µPD5023GS-147-GJG (IC1351)
TL1464IPT (IC1501)
PQ20WZ51 (IC1502)
BA7665FS (IC1601)
SN74AHCT125PW (IC1602)
74VHC4046MTCX (IC1603)
SN74AHC1G08HDCK (IC1604)
Not provided
Not provided
VK-S454/S454E
VK-S454:
VK-S454E:
HD49325BHF (IC1101)
µPD456323G5-A10BL-9JH (IC1150)
HD6432238RN33FA (IC1201)
Not provided
X25097V1-2.7 (IC1250)
RN5VD27AA (IC1251)
TC7S08FU (IC1206)
MPC17AT85VMEL (IC1301)
MPC17AT85VMEL (IC1302)
MPC17AT85VMEL (IC1380)
Not provided
BA7664FV (IC1601)
HD74HCT125T (IC1602)
TC7S08 (IC1604)
TC7SHU04FU (IC1605)
NJM2533V (IC1606)
General Description > Comparison of Main Control ICs
: Same as on left
2 - 7
2-6 List of Abbreviations and Terms for Surveillance System
General Description > List of Abbreviations and Terms for Surveillance System
Index
Abbreviation/
Term
Explanation
ANSI
ATA
ATA card
Category
Category 5
CCTV
CF
C mount
Compact
Flash
CS mount
CSP
Daisy chain
D-SUB
EIA
EIAJ
Ethernet
Flange Back
Hard Disk
Drive
HDD
IDE
IEEE
Interlaced
CCD
Sensor
IR
JEIDA
JEITA
JPEG
LAN
American National Standard Institute: This organization establishes industrial product
specifications for US.
AT Attachment interface: Formal standard of IDE standardized by ANSI.
A kind of PC card. It incorporates a flash memory and hard disk: The format of
connecting to PC conforms to the ATA standard.
Division of twisted pair cables for communications depending on the frequency
bandwidth. Categories 1-6 are available.
Twisted pair cable for communications whose frequency bandwidth is 100 MHz.
Closed Circuit Television: System for sending video signals to subscribers only.
See "Compact Flash".
Type of lens mount for video cameras. A mount with flange back of 17.526 mm is referred
to as a C mount.
Abbreviated and referred to as CF. Compact memory card, 36.4 mm long × 42.8 mm wide
× 3.3 mm thick.
Type of lens mount for video cameras. A mount with flange back of 12.5 mm is referred to
as a CS mount.
Chip Scale Package or Chip Size Package: This IC was made compact by arranging pins
under the package.
To connect multiple devices together.
A "D"-shaped trapezoidal connector.
Electronic Industries Alliance: This US electronic industrial organization oversees the
electronic industry in US and standardizes various technologies and techniques.
See "JEITA".
Standard for communication format established by IEEE: This specifies the transmission
rate, cable used and data exchange format. 10Base-T and 100Base-TX are also included
in this standard.
Distance from the lens installation surface to recording surface of image sensor.
Abbreviated and referred to as HDD. This device uses a motor to rotate at high speed a
disk coated with magnetic substance on its surface, and brings a magnetic head to the
disk to read and write data.
See "Hard Disk Drive".
Integrated Device Electronics: One of the formats for connecting PC and hard disk that
was established by hard disk manufacturers. ANSI currently refers to it as the ATA
standard.
Institute of Electrical and Electronic Engineers in US: The world largest institute related
to electronics; has over 320,000 members in more than 130 countries in the world.
This CCD image sensor scans an image twice to create a one-image signal. It scans
roughly once and then interpolates between first scanning lines the second time to
interlace the image.
Infrared Ray.
See "JEITA".
Japan Electronics and Information Technology Industries Association: came into
existence when JEIDA (Japan Electronic Industry Development Association) merged
with EIAJ (Electronic Industries Association of Japan) in November, 2000.
Joint Photographic Expert Group: International standard format for compressing still
images.
Local Area Network: A network within a limited area, such as in company or school.
A
C
D
E
F
H
I
J
L
2 - 8
General Description > List of Abbreviations and Terms for Surveillance System
M
P
R
S
T
U
V
MPEG
MPEG2
MPEG Audio
Layer II
PC card
Progressive
scan CCD
Sensor
Protocol
RAID
RJ-45
RS-232C
RS-485
SCSI
ScTP
SIF
STP
SXGA
Twisted Pair
Cable
UTP
VBR
VGA
Moving Picture Experts Group: Standard related to compression of video (movie) and
audio. There are four types of MPEG - MPEG1, MPEG2, MPEG4 and MPEG 7 -
depending on the compression method and image quality.
Moving Picture Experts Group Phase 2: A higher standard of MPEG which is applied to
video (movie) requiring higher quality.
One of three audio compression standards (layers I-III) defined by MPEG.
Standard card type expansion device that is inserted into a slot for PC card. JEITA and
PCMCIA (Personal Computer Memory Card International Association) are cooperating to
perform standardization. There are three types of cards - TYPE I, II and III - depending
on differences in functions and thickness. The PC card is also referred to as a PCMCIA
card.
This CCD image sensor scans an image once to create a one-image signal. Also referred
to as a non-interlaced CCD sensor.
Procedure, regulations and conventions for data communications.
Redundant Array of Independent Disks: This technique arrays multiple hard disks and
then uses them as one disk to decentralize accesses, thereby enhancing reliability and
process speed. There are seven types of RAID - RAID0-RAID6.
8-pole, 8-core connector used for communication cable.
Recommended Standard 232 version C: One of the serial communication standards
established by EIA. Communication standard for one-to-one connections only. 25-pin or
9-pin D-SUB connectors are used.
Recommended Standard 485: One of serial communication standards established by EIA.
This standard complies with multiple-to-multiple connections of up to 32 units. 25-pin D-
SUB connectors are normally used.
Small Computer System Interface: A standard for connecting computer and peripheral
devices. The number, First, Ultra, Wide, etc., prefixed or suffixed to SCSI indicates the
data transfer rate and connector specifications.
Screened Twisted Pair: One type of twisted pair cables. Only the inside of the outermost
sheath in this twisted pair cable is shielded. Noise resistance characteristics are superior
to UTP.
Standard Image Format: This format delivers the resolution of 320 horizontal × 240
vertical pixels.
Shielded Twisted Pair: One type of twisted pair cables, with each pair shielded. Noise
resistance characteristics are superior to UTP or ScTP.
Super eXtended Graphics Array: An expanded specification of XGA, with resolution of
1280 horizontal × 1024 vertical pixels.
One type of communication cables: Two sheathed cables are twisted into one pair, which
is further sheathed. 4 pairs of cables twisted and sheathed are normally used for
communication cables.
Unshielded Twisted Pair: One type of twisted pair cables, without shield. Noise
resistance characteristics are inferior to ScTP.
Variable Bit Rate: This format of coding audio and video varies the amount of data
depending on the subject image.
Video Graphics Array: The resolution is 640 horizontal × 480 vertical pixels.
Index
Abbreviation/
Term
Explanation
2 - 9
Index
Abbreviation/
Term
Explanation
W
X
0-9
WDR
XGA
10Base-T
100Base-T
100Base-TX
Wide Dynamic Range: The Hitachi wide dynamic range technique lets a video camera
with progressive scan CCD record an image at a shutter speed suitable for brighter object
and another image at a shutter speed suitable for darker object. It then synthesizes the
two images, thereby reproducing a clear picture.
eXtended Graphics Array: Extended VGA specifications with the resolution of 1024
horizontal × 768 vertical pixels.
Ethernet specifications using twisted pair cables. The number indicates data transfer
rate; T after a hyphen indicates the use of a twisted pair cable. The data transfer rate of
10Base-T is 10 Mbps, and the data transfer rate of 10Base-T/TX is 100 Mbps.
General Description > List of Abbreviations and Terms for Surveillance System
3 - 1
3-1 Structure Schematics
Fig. 3-1-1 Structure Schematics
Description of Operation
3
0.8mm
A
24mm
0
16mm
53mm
24mm
0
53mm
16Ø32.2mm
60mm
30mm
11.5mm
37mm
8mm
89.5mm
77mm
12.5mm
Ø
5
0
m
m
90˚
50mm
25mm
4 - M2 SCREWS for
TRIPOD PLATE
(These screws are limit of height
keep as being less than 2 mm for "A")
M2 SCREW
4 - M2 SCREWS
M2 SCREW
4 - M2 SCREWS for
TRIPOD PLATE
(These screws are limit of height
keep as being less than 2 mm for "A")
CHASSIS
13.5
mm
33mm
7.3mm
61.4mm
2 - M2 SCREWS
43.08mm
26mm
29mm
3 - 2
Description of Operation > Microprocessor Pin Function Table
3-2 Microprocessor Pin Function Table
3-2-1 Camera microprocessor (IC1201: Camera µP)
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
I/O
O
-----
-----
O
-----
-----
O
O
O
O
O
-----
I
-----
O
O
O
I
O
-----
-----
-----
-----
-----
-----
O
O
O
-----
O
-----
-----
O
O
-----
O
Active
Level
(Pulse)
-----
-----
Hi
-----
-----
Lo
Lo
(Pulse)
(Pulse)
(Pulse)
-----
Hi/Lo
-----
Hi/Lo
(Pulse)
Hi
(Pulse)
-----
-----
-----
-----
-----
-----
-----
Hi
Hi
(Pulse)
-----
(Pulse)
-----
-----
(Pulse)
Hi/Lo
-----
(Pulse)
Abbreviation
LD-DSP
4800ST
-----
GYRO-RST
-----
-----
RDOEB
ZDOEB
RDCK
ZDCK
IRDCK
VCC(3V)
LINE-SW
GND
IRDCW
IROREB
IR-RESET
IR-SENS
IR-LED
-----
-----
-----
TEST0
TEST1
CHECK8
ZD-RESET
RD-RESET
IRIS-PWM
LD-JIG
ZOOM-LED
TXD2
RXD2
FCUS-LED
ZDCW
ZD-PWMA
RDCW
Function
Activates data communication with IC1121 (CAMERA DSP).
Not used. Open.
Activates focus drive data communications with IC1302 (FOCUS
MOTOR DRIVE).
Activates zoom drive data communications with IC1301 (ZOOM
MOTOR DRIVE).
Outputs focus motor drive signal to IC1302 (FOCUS MOTOR DRIVE).
Outputs zoom motor drive signal to IC1301 (ZOOM MOTOR DRIVE).
Outputs IR motor drive signal to IC1380 (IR MOTOR DRIVE)
3V power input.
External sync detection input. When "Hi" is input, the unit will be
driven in the external sync mode; when "Lo" is input, it will be driven
in the internal sync mode.
Ground.
Issues a command which determines with IC1380 (IR MOTOR
DRIVE)
Activates focus drive data communications with IC1380 (IR MOTOR
DRIVE)
Resets IC1380 (IR MOTOR DRIVE)
IR motor position detection input.
Not used. Open.
Resets IC1301 (ZOOM MOTOR DRIVE).
Resets IC1302 (FOCUS MOTOR DRIVE).
Iris motor drive output .
Not used. Open.
Output pulses to drive the ZOOM LED in the lens block via Q1201
(LED DRIVE).
Not used. Connected to 3V line via resistor.
Output pulses to drive the FOCUS LED in the lens block via Q1201
(LED DRIVE).
Issues a command which determines with IC1301 (ZOOM MOTOR
DRIVE).
Not used. Open.
Issues a command which determines with IC1302 (FOCUS MOTOR
DRIVE).
3 - 3
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
O
I
I
-----
I
-----
O
O
I
I
I
I
I
I
I
I
-----
-----
-----
-----
-----
-----
I
-----
-----
-----
-----
-----
I
-----
-----
-----
O
-----
-----
I
-----
-----
I
O
I
-----
(Pulse)
(Pulse)
-----
(Pulse)
-----
0V-3V
0V-3V
0V-5V
0V-3V
0V-3V
0V-3V
0V-3V
0V-3V
0V-3V
0V-3V
-----
-----
-----
-----
-----
-----
Lo
-----
-----
-----
-----
-----
-----
-----
-----
-----
Hi
-----
-----
(Pulse)
-----
-----
(Pulse)
(Pulse)
(Pulse)
RD-PWMA
FV
FCUS-SEN
-----
ZOM-SEN
GND
HAL-ADJ1
HAL-ADJ0
BATTERY
ZOOM-SW
FOCUS-SW
+B-DET
TEMP-ADJ
V-GYRO
H-GYRO
FDET
AVCC
AVCC
VCC
VCC
-----
-----
RESET-IN
VCC
STBY
VCC
-----
GND3
SYS-CLK
FWE
MD2
-----
HALL-G
-----
-----
HD
-----
-----
FP
SD(232C)
RD(232C)
Not used. Open.
Receives the vertical sync pulses that detect the iris detection area,
from IC1121 (CAMERA DSP).
Focus motor position detection input.
Not used. Open.
Zoom motor position detection input.
Ground.
Controls the offset voltage of IC1351 (F.DET/IRIS DRIVE).
Drives bias generator in IC1351 (F.DET/IRIS DRIVE) via Q1351
(BIAS DRIVE) to control the bias voltage of the Hall devices.
Not used. Connected to 3V line and ground via resistors.
Not used. Connected to 3V line and ground via resistors and capacitor.
Power voltage (+B) detection input. Monitors the +B line voltage.
Temperature change detection input. Detects variations in the
forward voltage at the connected diode to correct the back-focus.
Not used. Connect to ground.
F-value detection input. Receives the F.DET voltage detected by
IC1351 (F.DET/IRIS DRIVE) and compares this with the reference
voltage input via pin 53 to detect the F-value.
Reference 3V power input.
A/D reference voltage input (connected to 3V power supply).
3V power input.
Not used. Open.
Not used. Connect to ground.
Reset signal input from IC1251 (RESET PULSE GEN.).
3V power input.
Not used. Connect to 3V power supply.
3V power input.
Not used. Open.
Grounded.
Inputs control pulses from IC1211 (CAMERA DSP).
Not used. Connected to ground via resistors.
Not used. Connected to 3V line via resistors.
Not used. Open.
Controls the amplification (gain of Hall device) of IC1351 (F.DET/IRIS
DRIVE).
Not used. Open.
Inputs horizontal sync from IC1121 (CAMERA DSP).
Not used. Open.
Inputs field discrimination pulse from IC1121 (CAMERA DSP).
Used for initial settings and adjustment. For data communications
with personal computer.
Pin
No.
I/O
Active
Level
Abbreviation
Function
Description of Operation > Microprocessor Pin Function Table
3 - 4
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
I
-----
-----
-----
-----
O
I
O
-----
-----
-----
-----
-----
-----
-----
-----
-----
O
O
O
O
O
O
(Pulse)
-----
-----
-----
-----
(Pulse)
(Pulse)
(Pulse)
-----
-----
-----
-----
-----
-----
-----
-----
-----
Hi/Lo
(Pulse)
(Pulse)
(Pulse)
(Pulse)
(Pulse)
Receives pulses which discriminate the iris detection area.
Not used. Open.
For data communications with IC1121 (CAMERA DSP), IC1202 (ADJ
EEPROM), IC1250 (RESET EEPROM).
Not used. Open.
5V regulator control output. (Hi: On/Lo:Off)
Transfer data to IC1101 (CDS/AGC & A/D CONV. ).
Activates data communications with IC1101 (CDS/AGC & A/D
CONV. ).
Activates data communications with IC1202 (ADJ EEPROM).
Activates data communications with IC1203 (RESET EEPROM).
EP3
-----
-----
-----
-----
SDO
SDI
SCLK
-----
-----
-----
-----
-----
-----
-----
-----
SYS-RST
STBY_5V
CK-CDS
SDO-CDS
CS-CDS
CS-EE1
CS-EE2
Pin
No.
I/O
Active
Level
Abbreviation
Function
Description of Operation > Microprocessor Pin Function Table
4 - 1
4
Troubleshooting
Fig. 4-1-1 Connections for Trouble Diagnosis
4-1 Trouble Diagnosis
4-1-1 Setting to service position
Remove chassis R and chassis L, referring to “5. Disassembly and Reassembly”, and connect the
camera as shown in Fig. 4-1-1.
Note:
To prevent short-circuit, always perform trouble diagnosis of camera on insulated mat.
PG1601
9PIN FLAT CABLE
(ACCESSORY)
COLOR MONITOR
VIDEO IN
1
9
DSP INTERFACE CONNECT JIG
(Parts No. 7069179)
1
2345
6
78
9
RD WHT
SD BRW
GND BRW
+B BRW
GND BRW
VIDEO BRW
GND(VIDEO) BRW
EX. FV BRW
GND BRW
1
2
3
4
5
6
7
8
9
+
DC POWER
SUPPLY
(9V/3A)
GND
PC CIRCUIT
BOARD
SP CIRCUIT
BOARD
CSR CIRCUIT
BOARD
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Hitachi VK-S454R User manual

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