MKL62 RF Module
Product Specification
MOKO TECHNOLOGY LTD.
Version 1.0 www.mokosmart.com
Version 1.0
Content
1 Instruction ......................................................................................................................................... 3
1.1 Product Introduction .............................................................................................................. 3
1.2 Features and benefits ............................................................................................................ 3
1.3 Application ............................................................................................................................. 3
2 Specifications .................................................................................................................................... 4
3 Circuit Design .................................................................................................................................... 5
3.1 Block Diagram ........................................................................................................................ 5
3.2 Hardware Design Reference .................................................................................................. 5
4 Mechanical Size ................................................................................................................................. 6
5 Pin Assignments ................................................................................................................................ 6
6 Cautions............................................................................................................................................. 7
6.1 Reflow soldering..................................................................................................................... 7
6.2 Usage Condition Notes........................................................................................................... 9
6.3 Storage Notes ....................................................................................................................... 10
7 Revision History ............................................................................................................................... 10
MKL62 RF Module
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1 Instruction
1.1 Product Introduction
MKL62 module is an RF module with SPI interface based on Smetech's high performance LoRa RF
chip SX1262. The maximum transmit power up to 22dBm, using LoRaTM modem, with long
communication distance, strong anti-interference, low power consumption, high sensitivity. The
module supports 868/915 MHz frequency band.
The module is mainly suitable for applications requiring long transmission distance, such as vehicle
tracking, smart agriculture, intelligent farm, industrial control, etc.
1.2 Features and benefits
1.3 Application
Security Monitoring
Logistics and Transportation
Smart Agriculture
Warehouse Management
Industrial Control
Smart Farm
Kinds of low-power sensor
Other scenarios that require long communication distance
➢ Support LoRaTM modem
➢ Compatible with 868MHZ/915MHZ
➢ Ultra-low power consumption
- Supply Voltage 1.8V to 3.7V
- TX Current < 115mA
- RX Current < 6mA
- Sleep Current < 2uA
➢ High transmit power
- Sensitivity: -137dBm@SF12 300bps
- Max LoRa Tx power: 22dBm
➢ SPI interface, easy to programming
➢ Standard shielding cover protection for
increased interference immunity
➢ Long communication distance, up to 10km
(In urban space, with 5 dBi antenna)
➢ Small size: 14.6*10.6*2.8mm (With shield)
➢ Industrial grade operating temperature: -40
to +85°C
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2 Specifications
Categories
Parameter
Value
General
Dimension
14.6mm*10.6mm*2.8mm
Package
SMT 24 Pin Half-hole
Communication
Interface
SPI
Antenna Interface
Stamp Hole
RF Performance
Region
868MHZ/ 915MHZ
LoRa TX power
22dBm
Sensitivity
-137dBm@SF12 300bps
SF
SF5 to SF12
BR
0.018 - 62.5 kb/s
LoRa Communication
distance
Up to 10km (In urban space, with 5 dBi antenna)
Hardware
Specification
Supply Voltage
1.8~3.7V
RX Current
<115mA
TX Current
<6mA
Sleep Current
<2uA
Application
Parameters
Operation Temperature
-40 ~ +85℃
Storage Temperature
-40 ~ +85℃
Certification
CE FCC in process
Miscellaneous
Lead-free and RoHS compliant
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3 Circuit Design
3.1 Block Diagram
3.2 Hardware Design Reference
The following diagram shows a typical application design:
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4 Mechanical Size
5 Pin Assignments
PIN Number
Name
Type
Function
P1
NC
/
NC (Float soldering, don’t connect to GND)
P2
RXEN
/
RX Enable
P3
GND
/
Ground
P4
VCC
/
Supply voltage
P5
NC
/
NC (Float soldering, don’t connect to GND)
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P6
NC
/
NC (Float soldering, don’t connect to GND)
P7
NC
/
NC (Float soldering, don’t connect to GND)
P8
NC
/
NC (Float soldering, don’t connect to GND)
P9
NC
/
NC (Float soldering, don’t connect to GND)
P10
NC
/
NC (Float soldering, don’t connect to GND)
P11
DIO2
I/O
Digital I/O
P12
TXEN
/
TX Enable
P13
NC
/
NC (Float soldering, don’t connect to GND)
P14
DIO1
I/O
Digital I/O
P15
BUSY
/
Occupancy Indicator
P16
NRESET
/
Reset pin, active low
P17
MISO
SPI
SPI Data Output
P18
MOSI
SPI
SPI Data Input
P19
SCK
SPI
SPI Clock Input
P20
NSS
SPI
SPI Chip select Input
P21
NC
/
NC (Float soldering, don’t connect to GND)
P22
GND
/
Ground
P23
RF
/
RF output
P24
GND
/
Ground
6 Cautions
6.1 Reflow soldering
Reflow soldering is a vitally important step in the SMT process. The temperature curve associated
with the reflow is an essential parameter to control to ensure the correct connection of parts. The
parameters of certain components will also directly impact the temperature curve selected for this
step in the process.
• The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, ④cooling. The
profile describes the ideal temperature curve of the top layer of the PCB.
• During reflow, modules should not be above 260°C and not for more than 30 seconds.
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Specification
Value
Temperature Increase Rate
<2.5°C/s
Temperature Decrease Rate
Free air cooling
Preheat Temperature
0-150°C
Preheat Period (Typical)
40-90s
Soak Temp Increase Rate
0.4-1°C/s
Soak Temperature
150-200°C
Soak Period
60-120s
Liquidus Temperature (SAC305)
220°C
Time Above Liquidous
45-90s
Reflow Temperature
230-250°C
Absolute Peak Temperature
260°C
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6.2 Usage Condition Notes
⚫ Follow the conditions written in this specification, especially the recommended condition
ratings about the power supply applied to this product.
⚫ The supply voltage has to be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a
ferrite in series connection and a bypass capacitor to ground of at least 47Uf directly at the
module).
⚫ Take measures to protect the unit against static electricity. If pulses or other transient loads (a
large load applied in a short time) are applied to the products, check and evaluate their
operation before assembly on the final products.
⚫ The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
⚫ This product away from other high frequency circuits.
⚫ Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
⚫ Avoid assembly and use of the target equipment in conditions where the products’
temperature may exceed the maximum tolerance.
⚫ This product should not be mechanically stressed when installed.
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⚫ Do not use dropped products.
⚫ Do not touch, damage or soil the pins.
⚫ Pressing on parts of the metal shield or fastening objects to the metal shield will cause
damage.
6.3 Storage Notes
⚫ The module should not be stressed mechanically during storage.
⚫ Do not store these products in the following conditions or the performance characteristics of
the product, such as RF performance will be adversely affected:
• Storage in salty air or in an environment with a high concentration of corrosive gas.
• Storage in direct sunlight
• Storage in an environment where the temperature may be outside the range specified.
• Storage of the products for more than one year after the date of delivery storage period.
⚫ Keep this product away from water, poisonous gas and corrosive gas.
⚫ This product should not be stressed or shocked when transported.
7 Revision History
Version
Description
Editor
Date
1.0
Initial version
Allen
2022-3-23
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