XP-SP30
US Model
Canadian Model
AEP Model
SERVICE MANUAL
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-141-02
2003J16-1
© 2003.10
SPECIFICATIONS
Ver 1.1 2003. 10
Model Name Using Similar Mechanism XP-ZV71
CD Mechanism Type CDM-3325ER
Optical Pick-up Name DAX-25E
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW (This output is the value
measured at a distance of 200 mm from the objective lens
surface on the optical pick-up block with 7 mm aperture.)
Power requirements
For the area code of the model you purchased, check the
upper left side of the bar code on the package.
• Two LR6 (size AA) batteries: 1.5 V DC × 2
• AC power adaptor (DC IN 4.5 V jack):
US, Canadian models: 120 V, 60 Hz
AEP model: 100 - 240 V, 50/60 Hz
• Two Ni-MH rechargeable batteries (size AA):
1.2 V DC × 2
Dimensions (w/h/d) (without projecting
parts and controls)
Approx. 133 × 34 × 151 mm (5
1
/
4
× 1
3
/
8
× 6 in.)
Mass (excluding accessories)
Approx. 333 g (11.7 oz)
Operating temperature
5°C - 35°C (41°F - 95°F)
Design and specifications are subject to change without
notice.
Supplied accessories
Headphones (1)
Hand strap (1)
AC power adaptor* (1)
* Not supplied with the U model. For the area code of the
model you purchased, check the upper left side of the
bar code on the package.
2
XP-SP30
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be damaged by heat.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
On AC power adaptor
• Use only the commercially-available AC power
adaptor whose rated output is 4.5 V DC, 500 mA.
Do not use any other AC power adaptor. It may
cause a malfunction.
Polarity of the plug
TABLE OF CONTENTS
1. SERVICING NOTE ·························································· 3
2. GENERAL ·········································································· 5
3. DISASSEMBLY
3-1. CABINET (UPPER) SUB ASSY,
PANEL (UPPER) LID ASSY········································ 6
3-2. CONTROL BOARD ·····················································7
3-3. CD MECHANISM (CDM-3325ER)····························· 7
3-4. MAIN BOARD ····························································· 8
3-5 MOTOR ASSY (SLED)(M902),
OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE)(M901) ···· 8
4. ELECTRICAL CHECKING··········································· 9
5. DIAGRAMS······································································10
5-1. BLOCK DIAGRAM ··················································· 11
5-2. PRINTED WIRING BOARDS
– MAIN BOARD (SIDE A) – ····································· 12
5-3. PRINTED WIRING BOARDS
– MAIN BOARD (SIDE B) – ····································· 13
5-4. SCHEMATIC DIAGRAMS
– MAIN BOARD (1/3) –············································· 14
5-5. SCHEMATIC DIAGRAMS
– MAIN BOARD (2/3) –············································· 15
5-6. SCHEMATIC DIAGRAMS
– MAIN BOARD (3/3) –············································· 16
5-7. PRINTED WIRING BOARDS
– CONTROL BOARD – ············································· 17
5-8. SCHEMATIC DIAGRAMS
– CONTROL BOARD – ············································· 18
5-9. IC BLOCK DIAGRAMS ············································ 19
5-10.IC PIN FUNCTION DESCRIPTION ························· 21
6. EXPLODED VIEWS
6-1. CABINET (UPPER) SECTION·································· 23
6-2. CABINET (LOWER) SECTION ································ 24
6-3. CD MECHANISM SECTION (CDM-3325ER) ········· 25
7. ELECTRICAL PARTS LIST ······································· 26
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
XP-SP30
SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the “Optical
Pick-Up Block Checking Procedures” (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S303. (push switch type)
The following checking method for the laser diode is operable.
• Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S303 with a screwdriver having a
thin tip as shown in Fig.1.
3. Press the u button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S303
S303
(OPEN/CLOSE switch)
4
XP-SP30
TEST MODE
The software version display and LCD test can be performed when
the test mode is activated.
Procedure:
1. Confirm the set is not powered on. (Remove two batteries and
disconnect the AC power adaptor.)
2. Short the solder land SL301 (TEST) on the MAIN board.
3. Turn on the main power. (Insert two batteries.)
4. Microcomputer version is displayed for about a second.
5. After that all segments of the liquid crystal display are turned on.
6. Turn off the main power. (Remove two batteries.)
7. Open the solder land SL301 (TEST) on the MAIN board.
Note : The solder should be removed clean.
IC301
IC402
IC403
IC401
SL301
(TEST)
MAIN BOARD (SIDE A)
5
XP-SP30
SECTION 2
GENERAL
This section is extracted
from instruction manual.
Display
* The button has a tactile dot.
A B
4 SOUND
\ (headphones) jack
7 HOLD
6 VOLUME +*/–
5 PLAY MODE/ (repeat)
OPEN/LOCK knob
8 E•A•S•S GP
Insert the ( end first
(for both batteries).
Play mode
Track number Playing time
Remaining battery power
Sound mode
CHG
DC IN 4.5 V (external power
input) jack
1 s(stop)/CHARGE
2 ca* (play/pause)/ENTER
3 r/t (skip/search)
Open the battery
compartment lid.
6
XP-SP30
SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
Note : Follow the disassembly procedure in the numerical order given.
3-1. CABINET (UPPER) SUB ASSY, PANEL (UPPER) LID ASSY
CD MECHANISM
(CDM-3325ER)
CABINET (UPPER) SUB ASSY,
PANEL (UPPER) LID ASSY
CONTROL BOARD
MAIN BOARD
SET
MOTOR ASSY (SLED) (M902),
OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE) (M901)
7
flexible flat cable
(26P) (CN301)
4
two hooks
5
eight screws (1.7)
2
screw (case)
3
screw (case)
6
cabinet (upper) sub assy
8
panel (upper) lid assy
1
7
XP-SP30
3-2. CONTROL BOARD
2
two hooks
1
eleven screw
s
3
plate (control)
4
CONTROL board
3-3. CD MECHANISM (CDM-3325ER)
5
CD mechanism
(CDM-3325ER
)
1
flexible board
(15P) (CN401)
4
three insulators
3
connector (4P)
(CN402)
2
connector (2P)
(CN403)
8
XP-SP30
3-4. MAIN BOARD
2
battery terminal (+
)
3
MAIN board
1
battery terminal (-)
When installing it,
align the switch position
as shown.
S304
3-5. MOTOR ASSY (SLED)(M902), OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE)(M901)
1
three screws
(B1.7x4)
2
gear cover
4
optical pick-u
p
(DAX-25E)
chassis
5
three screws
(B1.7x4)
6
turn table motor assy
(spindle) (M901)
3
motor assy
(sled) (M902)
9
XP-SP30
SECTION 4
ELECTRICAL CHECKING
The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5 V in DC IN jack.
(J201)
VOLUME button : Minimum
HOLD switch : OFF
E
.
A
.
S
.
S
GP switch : OFF
RF Level Check
Condition:
• Hold the set in horizontal state.
Connection:
Procedure:
1. Connect the oscilloscope to the test points TJ401 (RF) and
TJ403 (RFGND) on the MAIN board.
2. Set a disc. (YEDS-18)
3. Press the u button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy watch-
ing.
5. Stop revolving of the disc motor by pressing the x button.
RF level
0.35 to 0.60 Vp-p
oscilloscope
(AC range)
+
–
MAIN board
TJ401 (RF)
TJ403 (RFGND)
Checking Location:
IC301
IC402
IC401
IC403
TJ403
(AGND
)
TJ401
(RF)
MAIN BOARD (SIDE A)
10
XP-SP30
SECTION 5
DIAGRAMS
Note on Printed Wiring Board
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• MAIN board is multi-layer printed board. However, the pat-
terns of intermediate-layer have not been included in the dia-
gram.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side B) the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise specified.
•%: indicates tolerance.
• C : panel designation.
• A : B+ Line.
•Total current is measured with CD installed.
•Power voltage is dc 4.5 V and fed with regulated dc power supply
from DC IN jack (J201).
•Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
• WAVEFORMS
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
550 mVp-p
1 IC402 if RFAC
100mV/DIV, 400ns/DIV
2 IC402 rk XTAO
1V/DIV, 20ns/DIV
3 IC301 2 XIN
1V/DIV, 100ns/DIV
4 IC301 qk MSCK-O
1V/DIV, 400ns/DIV
59ns
932us
2.5 Vp-p
2.3 Vp-p
236ns
2.3 Vp-p
5 IC201 ef SYNC
1V/DIV, 2us/DIV
5.6us
2.2 Vp-p
1111
XP-SP30
5-1. BLOCK DIAGRAM
: CD
• Signal Path
OPTICAL PICK-UP
BLOCK
(DAX-25E)
RF
A
B
E
F
LD
VCC
GND
PD
VR
FOCUS
C0IL
TRACKING
COIL
MOTOR/COIL DRIVER
IC201(1/2)
FO2
48
RO2
46
44
42
SLED
MOTOR
52
50
M
F+
F-
T+
T-
58
FIN2
57
RIN2
60
59
72
70
56
SFDR
100
MDS
102
SYNC
104
TRDR
97
TFDR
98
FRDR
95
FFDR
96
DSP,DSSP,DAC,
DRAM CONTROLLER
IC402
RFDC
88
RFAC
84
A
92
B
91
E
89
51
AOUT1
56
AOUT2
21
SQTO_I
20
CLOK_I
23
XLAT_I
24
XSOE_I
22
SENS_O
27
SCOR_O
65
FOK
28
XRST_I
X401
16.934MHz
32
R4M
SEM
23
SEO
VCC1
22
55
SRDR
99
34
SYNC
FO3
RO3
FIN3
RIN3
PWM
BRK
FO1
RO1
FIN1
RIN1
S+
S-
MDP
103
3
1
4
IC401
COMPARATOR
XTAO
48
XTAI
47
F
90
J701
DRY BATTERY
RECHARGEABLE
BATTERY
NH-WM2AA
2PCS, 2.4V
SIZE "AA"
OR
(IEC DESIGNATION LR6)
2PCS, 3.0V
DC IN 4.5V
J201
116
113
17
.
15
13
.
11
9
12
14
.
18
5
.
24
25
1
2
.
.
.
2
XWE
9
XCAS
1
XRAS
XWE
3
XCAS
23
XRAS
4
6
5
4
3
.
.
.
A0
A9
A0
A9
D0
D3
4M BIT DRAM
IC403
D0
D3
25
SYSM_I
SYSTEM CONTROLLER
IC301
CLOSE
28
HOLD_I
40
VCPU_2.0V
S303
(OPEN/CLOSE)
S304
MSCK_O
18
MSDTO_O
17
XLAT_O
15
XSOE_O
14
MSDTI_I
16
SCOR_I
11
FOK_I
9
XIN
2
AMUTE_O
13
XRESET_O
79
XPOWLT
75
AD_KEY_223
39
DATA
38
CLOCK
40
LATCH
61
LRMU
30
BEEP_O
74
PWRSW_O
LIN
14
RIN
15
8
LOUT
HEADPHONE AMP
IC701
MUTE
19
BEEP
17
PWRSW
20
6
ROUT
56
42
60
57
SEG0
SEG14
COM0
COM3
25
STNG
20VCC
16
VCCO
REGB
61
DCIN
63
DET
68
BATM1
53
VM1
5
SPVCC2
1
SPVCC1
64
DCIN_S
12
VIN
8
LG
WAKEUP37
VMMNT
66
22
AD_BATTMNT
POWER CONTROL
IC201(2/2)
APC
Q207
SPINDLE
M901
M902
MOTOR
80
COM
77 WI
2
U_OUT
4
V_OUT
6
W_OUT
VCC2
OPSTB
OPGSW
36
XRST
74
FG
ESP_I
38
S305
HOLD
ON
OFF
E·A·S·S GP
AD_KEY
LCD001
S1 - 4
FUNCTION
KEY
LIQUID
CRYSTAL
DISPLAY
25
FG_I
72
OPGSW_O
78
XOPSTBY_O
77
D202
CHGMNT
67
21
AD_CHGMNT
SEP
24
70
CD_ON
D204
65
CHGB
41
VM3
45
VM23
49
VM12
VCC3
11
VCPU_2.0V
19
VCC3
VCPU_2,0V
VCC2
18
VCC2
VCC1
17
SSW
10
VCC1
69
BATM2
RESET_O
35
8
RESET_I
66XWAKEUP_O
27
AD_DCINMNT
ON
OFF
62
78 VI
79 UI
Q206
SWITCH
Q204
SWITCH
Q202,203
REG
Q201
CHARGE
SWITCH
S5 - 8
FUNCTION
KEY
1212
XP-SP30
5-2. PRINTED WIRING BOARDS – MAIN BOARD (SIDE A) –
• : Uses unleaded solder.
CN302
IC403
IC402
IC401
IC301
MAIN BOARD (SIDE A)
S303
(OPEN/CLOSE)
S305
NOT USED
ON OFF
J701
2
J201
DC IN 4.5V
TJ305
TJ306
10 1
TJ304
TAP302
TAP301
TP310
TP309
TP308
TP440
TP443
SL401
TP438
TP439
TP441
TP436
TP435TP434
TP437
TP433
TP432
TP431
TP429
TP428
TP430
TP427
TP202
TP201
TP410 TP412
TP409
TP411
FB203
TJ211
TJ212
TJ205
TJ703
TJ701
TJ702
TJ307
TJ204
TJ206
TJ202
TJ210
TJ213
TP442
TJ303
TP304
TP301
TP306
TAP303
D301
C319
SL302
TJ302 TJ301
SL701
SL303
C320
C315
C313
C314
R337
R309
R316
R304
C312
R322
C303
R311
R303
R334
R332
R404
R423
R405
R402
R409
R408
R433
R410
R321
TJ711
TP302
R313
R412
R411
R419
R302
R342
R314
R305
R306
R307
R308
R310
C306
C301
C302
C311
D401D402
C316
C304
C310
R315
R319
R320
R323
R312
R326
R325
R327
R328
SL301
R321
R414
R429
R431
R421
R413
R427
C407
C420C413C421
C432
C403
C406
C440
C430
C404
C417
C416
C409
C415
C410
C408
C418
C419
C411
C412
R301
R432
R415R416
R428
R426
R420
R418
R425
TP415
TP303
TP408
TP426
TP416
TP425
TP702
TJ401
(RF)
TJ402
TJ403
(AGND)
TP423
TP424
TP701
TP422
TP421
TP419
TP418
TP417
TP420
TP402
TP401
C436
R439
R438
R437
TJ209
TJ208
SL201
SL203
TJ207
FB207
FB206
FB202
FB205
FB204
TJ203
L213
C435
C222
R441
R440
L215
L214
R716
C211
C223
Q204
C431
R445
X401
R443
R436
C226
C225
R217
R218
R212
D205
C715
FB702
R434
R720
C429
R214
R708
R718
R717
4
5
3
1
C228
C220
Q202
EBC
C221
1-689-410-
(11)
11
12
A
B
C
D
E
F
G
H
I
345678910
Ref. No. Location
D205 F-8
D301 B-4
D401 D-4
D402 D-4
IC301 B-6
IC401 D-4
IC402 E-5
IC403 E-4
Q202 E-9
Q204 G-7
• Semiconductor
Location
1313
XP-SP30
5-3. PRINTED WIRING BOARDS – MAIN BOARD (SIDE B) –
• : Uses unleaded solder.
IC701
IC201
A
TO
CONTROL BOARD
CN1
(Page 17)
OPTICAL
PICK-UP
BLOCK
(DAX-25E)
MAIN BOARD (SIDE B)
M902
SLED
MOTOR
M901
SPINDLE
MOTOR
S304
HOLD
OFF
ON
DRY BATTERY SIZE "AA"
(IEC DESIGNATION LR6)
2PCS, 3.0V
OR
RECHARGEABLE BATTERY
NH-WM2AA
2PCS, 2.4V
TAP304
C322
R339
R341
R444
R233
C439
L405
SL202
C434
C224
C227
C231
C230
R435
L404
L402
L212
Q207
R442
C437
C234
R234
R228
R226
R223
R229
R220
R221
R227
C233
C228
L206
C220
C221
L209
CN402
L207
TP203
TP204
R222
C239
C238
C235
C422
C229
L211
C424
C423
C425
C414
C237
D207
L403
Q206
C240
L401
C433
C428
C207
D203
C210
S304
R340
R210
D202
C217
C218
C214
R207
R205
R206
C219
C213
R208
R209
L203
L201
L204 L202
C206
C216
C215
R211
R216
R709
R707
R714
R712
C716
C712
R703
R704
R753
R752
R702
R701
C402
C701
C708
C751
C714
C710
R715
FB703
TP406
TP403
C232
TP405
TP404
TP407
TP414
TP413
CN403
2
15
1
1
CN301
CN401
C706 C709
C705
C707
C702
C750
R721
R705
R722
R750
R751
R706
TP703
VDR704
R215
FB701
D206
C717
L210
L208
Q203
C205
C208
C721
C718
C722
C713
Q201
D204
Q201
VDR201
C212
VDR202
L205
BT204
14
1-689-410-
(11)
11
12
A
B
C
D
E
F
G
H
I
345678910
Ref. No. Location
D202 G-2
D203 I-3
D204 E-1
D206 E-2
D207 E-5
IC201 F-3
IC701 D-2
Q201 F-1
Q203 E-2
Q206 E-5
Q207 F-5
• Semiconductor
Location
1414
XP-SP30
5-4. SCHEMATIC DIAGRAMS – MAIN BOARD (1/3) –
IC402
IC401
TP427
TP428
TP418
TP417
TP419
TP420
TP421
TP422
TP423
TP424
TP434
TP435
TP436
TP437
CN402
C422
C423 C424
R445
C429
C431
L403
R434
TP432
TP431
TP430
TP429
R435
L404
TP433
R436
R443C435
R442
R437
R438
R439
R440
R441
C436
C437
C428 C430
C432
C433
C440
R433
TP443
TP442
TP441
TP440
TP439
TP438
L401
C414
R425
R418
R420
C407
C408
C410
R431C415
R428
C416
R426R419
C411R411
C419
C418
C417
R427
R432
R412
C409
R421 R429
C420C412
R413
TP425
TP415
R414
C413 C421
TP426
R416
TP416
C404
C403
R405
SL401
R402
R408
C402
TJ403
CN401
TP407
TP408
TJ401
TJ402
TP404
TP405
CN403
TP413
TP414
R410
R423
L405
R720
TP409
TP410
TP411
TP412
TP401
TP402
TP403
TP406
C425
C406
C434
D402
D401
R404
X401
IC403
C439
R415
R444
L402
R409
CXD3048R
TC75S57F(TE85R)
4P
47
6.3V
0.1 0.1
2.2k
1
1
220
2.2k
100k
100k0.47
0
1k
1k
1k
1k
1k
100p
0.1
100
6.3V
0.1
1
47
6.3V
0.1
0
SFDR
SRDR
TFDR
TRDR
FFDR
FRDR
0.1
2.2k
2.2k
10k
0.1
4700p
0.47
10k0.47
470k
100p
220k1M
2200p0
0.1
47 6.3V
22p
47k
47k
22k
2200p
100k 100k
470p470p
22k
22k
470p 470p
22k
47p
4.7
470k
47k
22k
4.7
RF GND
15P
2P
0
4.7
47
U
V
W
COM
E+
T-
T+
F-
47 6.3V
0.1
47p
MA111-TX
MA111-TX
0
16.934MHz
IC41UV4105 -100T(T&R)
1
22k
0
0
22k
• See page 10 for Waveforms. • See page 20 for IC Block Diagrams.
1515
XP-SP30
5-5. SCHEMATIC DIAGRAMS – MAIN BOARD (2/3) –
Q203
Q206
C239
C238
C233
TP203
TP204
TJ211
TJ213
TP201
TJ212
C237
C235
C240
FB205
FB207
TJ207
TJ208
C226
C223
C222
C221
FB202
FB203
FB204
TJ206
C212
C211
TJ205
C206
C205
TJ202
TJ203
TJ204
BT201
BT202
BT203
BT204
J201
C217
C218
C219
C214
C215
C216
C208
TJ209
TJ210
FB206
IC201
R215
R216
D206
Q202
Q204
Q207
L208
L210
L211
R227
R228
R222
R220
R223
R226
D207
R221
R234
R233
L212
SL202
SL203
C231
C230
C228
C224
C227
L209
L206
R217
R218
R210
R209
R208
D205
D203
D202
R212
L201
L204
L202
R213
R214
L205
C220
R206R205
R207
D204
R211
Q201
VDR202
L203
VDR201
SL201
L207
C225
C229
C207
C210
R229
C234
2SC4116GL-TE85L
2SC4081T106
0.047
1000p
2200p
LD-
PD
DC+
LD+(VCC1)
1
0.22
0.1
0
0
VCC2
VCPU
1
1
10
220 6.3V
0
0
0
MAIN_GND
0.22
1
DC+
1000p
1
B+
BATC
B-
0.01
0.01
0.01
1
0.022
0.022
4.7
A_GND
AU_GND
0
BH6580KV
100k
100k
MA111-TX
2SB1237TV2PQR
2SB167900LSO
2SB167900LSO
0
0
0
10k
2.2k
100k
2.2
MA111-TX
10k
470k
100k
47
6.3V
47
6.3V
220
4V
47
6.3V
100
6.3V
0
100k
47k
22k
100k
UDZSTE-175.1B
RB160M-30TR
MA2H735-(TX).SO
100k
0
22k
0
220
6.3V
2.21
100
MA2YD2300LS0
470
2SD1781K-T146-QR
0
470p
220
C232
0.1
6.3V
1
1
4.7
10
4V
• See page 10 for Waveforms. • See page 19 for IC Block Diagrams.
1616
XP-SP30
5-6. SCHEMATIC DIAGRAMS – MAIN BOARD (3/3) –
TP302
TP303
C317
C316
C321
TP308
TP309
TP310
C319
C320
TP306
TJ303
TP304
TJ302
TJ301
C315
C313
C312
C314
TP301
TP202
C306
C301
C310
C302
C311
C304
TJ305
TJ307
TJ304
C322
TJ306
TP703
C712
C716
C721
C722
TJ701
TJ702
TJ703
C715
C706
TJ711
C701
C702
C750
C751
TP702
TP701
CN301
IC701
J701
R313
R314
R342
R302
R305
R306
R307
R308
R310
R315
R320
R321
R325
R326
R327
R312
SL301
R328
R332
R334
TAP301
SL302 D301
R337
TAP303
TAP302
SL303
C303
R311
R316
R309
R304
L215
L214
L213
R322
TAP304
R340
R341
R339
C714
R709
R718
C718
R712
R717
R715
R716
C713
R708
C710
C708
R752
R753
SL701
R721
R722
R704
R701
R702
R751
R750
VDR704
C709
C707
100P
C705
100P
FB701
FB702
FB703
R705
R706
R703
C717
IC301
R714
R707
CN302
S304
S303
S305
R303
R323
R319
R301
0.1
4700p
0.22
0.22
0.22
XRST
OPGSW
OPSTB
PWRSW
0.220.1
0.1
0.1
D_GND(UCOM)
D_GND(DSP)
4700p
0.1
4700p
4700p
4700p
4700p
OPEN
HOLD
ESP
4700p
OPEN_B
0.1
0.1
10p
10p
HP
R OUT
HP
L OUT
HP GND
0.1
0.1
2.2
2.2
470p
470p
RCH
LCH
26P
TA2120FN(EL)
100k
100k
10k
0
100k
100k
100k
100k
100k
1M
0
10k
0
47k
100k
22k
TEST
100k
0
0
MA2ZD14001S0
10k
10
6.3V
1k
1k
22k
100k
10uF
10uF
0
0
0
0
220k
47
6.3V
4.7
0
220
2.5V
0
0
470
470
22
6.3V
4.7
22
6.3V
22
6.3V
10k
4.7k
100k
100k
47k
22k
22k
4.7k
4.7k
0.47
*
1
*
1
*
1: 22K : US, CND
10K : AEP
47k
220 2.5V
T5AW5-4RR7
1k
4.7
10P
(OPEN/CLOSE)
100k
0
0
0
• See page 10 for Waveforms. • See page 20 for IC Block Diagrams.
Ver 1.1 2003.10
1717
XP-SP30
5-7. PRINTED WIRING BOARDS – CONTROL BOARD –
R10
R12
R11 R13
R14
R9
S5
S6
S7
S8
S1
S2
S3
S4
LCD001
LIQUID CRYSTAL DISPLAY
R5
R7
R8
R4
R6
R2
R16
R15
R1
R3
TP1
TP2
TP3
CN1
CONTROL BOARD
A
TO
MAIN BOARD
CN301
(Page 13)
PLAY MODE/
f
SOUND
VOLUME
+
-
+
+
1-689-411-
(11)
11
12
A
B
C
D
E
F
G
H
3456789
• : Uses unleaded solder.
1818
XP-SP30
5-8. SCHEMATIC DIAGRAMS – CONTROL BOARD –
S4
CN1
TP3
R15R16R2R1R3R4
R5R7R8
R6
R14 R13
R12
R11
R10 R9
S1 S2
S3 S5
S6 S7 S8
TP5
TP1
TP2
LCD001
26P
KEY2
2.2k10k2.2k10k2.2k2.2k
10k2.2k22k
47k
2.2k 2.2k
47k
10k 2.2k 22k
GND
KEY1
VCPU
LIQUID CRYSTAL DISPLAY
19
XP-SP30
5-9. IC BLOCK DIAGRAMS
IC201 BH6580KV
+
−
+
−
+
−
PRE DRIVE
VG
RESET
HV PROT
VCC3
VCC
VG
VG
VCC
LOGIC
SLOPE
SIGNAL
10m SEC
DELAY
INTERFACE
CH3
H BRIDGE
LEVEL
SHIFT
CONTROLLER
CH2
H BRIDGE
INPUT
SELECT
MONITOR
AMP
+
−
+
−
+
−
CH1
H BRIDGE
VCC
VM
VGVCC
+
−
VG
VCC2
VCC4
CLK
SAWGEN
CHARGE
78
77
80
VI
79
UI
WI
75
CSL2
76
CSL1
COM
74
FG
72
PWM
71
PREGND
70
BRK
73
SOFTPWM
68
BATM1
67
CHGMNT
69
BATM2
65
CHGB
64
DCIN S
63
DET
66
VMMNT
61
DCIN
21
U_OUT
SPVCC1
3
SPGND1
4
V_OUT
1312
DSW
VIN
1110
VCC3
SSW
14
POWERGND
15
USW
5
SPVCC2
16
VCC0
17
VCC1
18
VCC2
19
VCPU_2.0V
20
VCC
6
W_OUT
7
SPGND2
9
VG
8
LG
23
24
SEM
SEP
22 SEO
21 GSW
31 SLOW
32 SOFT
33 PREGND
34 SYNC
35 RESET_0
36 XRST
38 CLOCK
37 WAKEUP
39 DATA
40 LATCH
28 VCC2NF
27 VCPUNF
26 PMG
25 STNG
30 EI
29 EO
4244
RO3
FO3
43
PGND3
45
VM23
41
VM3
4648
RO2
FO2
47
PGND2
49
VM12
53
VM1
54
DGND
55
RIN1
56
FIN1
57
RIN2
58
FIN2
59
RIN3
60
FIN3
5052
RO1
FO1
51
PGND1
62
REGB
20
XP-SP30
IC402 CXD3048R
IC701 TA2120FN (EL)
21
22
23 24 25 26 27
28 29
30
2
3
5
4
6
7
8
9
10
1
11
12
13
14
15
16
17
18
19
20
31
32
33
34
35
36
37
38
39
40
51
52
53
54
55
56
57
58
59
60
61
62
6364
65
6667
68
6970
41
42
43
44
45
46
47
48
49
50
7172
73
747576
77
78
7980
81
82
838485
86
8768
89
90
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
91
92
93
94
95
96
97
98
99
AVDD
F
E
RFDC
AVSS0
IGEN
AVDD0
RFAC
AVDD3
BIAS
ASY_I
ASY_O
AVSS3
VPCO
CVTL
CVTV
FILO
FILI
PCO
VDDI
XPCK
XUGF
GFS
CZPO
COUT
MIRR
FOK
DFCK
ATSK
DOUT
LRMU
VSSI
TEST
TEST1
AVDD2
AOUT2
VREFR
AVSS2
AVSS1
VREFL
AOUT1
AVDD1
XVSS
XTAO
XTAI
XVDD
HPVDD
HPR
HPL
HVSS
XTSL
EXCK
SBSO
XWIH
XEMP
SQSO
SCLK
BQCK
VSS0
R4M
XWRE
B
A
VC
VSS2
FRDR
FFDR
TRDR
TFDR
SRDR
SFDR
SSTP
MDS
MDP
SYNC
VDD2
LRCK_O
LRCK_I
PCMD_O
PCMD_I
BCK_O
BCK_I
DVDD
A3
A2
A1
A0
A10
A11
A12
A13
XRAS
XWE
D1
D0
D3
D2
DCLK
DCKE
XCAS
WFCK/DQM
A9
A8
A7
DVSS
A6
A5
A4
XRDE
VDD0
CLOCK_I
SQTO_I
SENS_O
XLAT_I
XSOE_I
SYSM_I
WQCK_O
SCOR_O
XRST_I
PWMI
XQOK
ANALOG SW
A/D
ASYMMETRY
CORRECTOR
FOCUS
PWM
SLED
PWM
PWM GENERATOR
SERVO DSP
TRACKING
PWM
VDD
AVDD
DIGITAL
PLL
DIGITAL
OUT
MIRR
DFCT
FOK
TEST
TES1
LPF
LPF
DAC
CLOCK
GENERATOR
EFM
DEMODULATOR
D/A
INTERFACE
ERROR
CORRECTOR
32K
RAM
SUB CODE
PROCESSOR
DIGITAL
CLV
VDD
VDD
SELECTOR
SERVO
INTERFACE
MDS
SYNC
SERVO
AUTO
SEQUENCER
MEMORY
CONTROLER
TEST
3, 4
TEST
1, 2
CPU
INTERFACE
VDD
XRST
R4M
AVDD
VDD
VDD
+
–
+
–
+
–
23
18
17
16
15
14
13
2
3
4
5
6
7
8
9
11
12
1
24
BIAS
BEEP
PW
SW
MT
SW
ALC
DET
ATT
SW
PWC
SW
ROUT
LOUT
BEEPMUTE MUTEC
BST
PW
B
PW
C
BST
NF
ADDO RF IN OCL ROUT VREF LOUT PGND MIXO ALC
IN
ALC
DET
ATT
LINRINGND
PWR
SW
BIAS
BIASI
BB
SW
BSTO
VCC
ADD
A
ADDB
21
22
PW
A
ALC ALC
20 19
10
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